V DSS R DS(on) max Qg 30V GS = 10V 44nC
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1 pplications l Synchronous MOSFET for Notebook Processor Power l Synchronous Rectifier MOSFET for Isolated C-C Converters P HEXFET Power MOSFET V SS R S(on) max Qg 30V 2.8m:@V GS = V 44nC Benefits l Very Low Gate Charge l Very Low R S(on) at 4.5V V GS l Ultra-Low Gate Impedance l Fully Characterized valanche Voltage and Current l 20V V GS Max. Gate Rating l % tested for Rg l Lead-Free S S S G Top View SO-8 escription The incorporates the latest HEXFET Power MOSFET Silicon Technology into the industry standard SO-8 package. The has been optimized for parameters that are critical in synchronous buck operation including Rds(on) and gate charge to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency C-C converters that power the latest generation of processors for notebook and Netcom applications. bsolute Maximum Ratings Parameter V S V GS T = 25 C T = 70 C I M = 25 C = 70 C T J T STG rain-to-source Voltage Gate-to-Source Voltage Continuous rain Current, V V Continuous rain Current, V V Pulsed rain Current c Power issipation Power issipation Linear erating Factor Operating Junction and Storage Temperature Range Max. 30 ± to 50 Units V W W/ C C Thermal Resistance Parameter Typ. Max. Units R θjl Junction-to-rain Lead g 20 C/W R θj Junction-to-mbient fg 50 Notes through are on page 9 8/8/08
2 T J = 25 C (unless otherwise specified) Parameter Min. Typ. Max. Units BV SS rain-to-source Breakdown Voltage 30 V V GS = 0V, I = 250μ ΔΒV SS /ΔT J Breakdown Voltage Temp. Coefficient V/ C Reference to 25 C, I = m R S(on) Static rain-to-source On-Resistance V GS = V, I = 24 e mω V GS = 4.5V, I = 9 e V GS(th) Gate Threshold Voltage V V S = V GS, I = μ ΔV GS(th) Gate Threshold Voltage Coefficient mv/ C I SS rain-to-source Leakage Current.0 V μ S = 24V, V GS = 0V 50 V S = 24V, V GS = 0V, T J = 25 C I GSS Gate-to-Source Forward Leakage V n GS = 20V Gate-to-Source Reverse Leakage - V GS = -20V gfs Forward Transconductance 95 S V S = 5V, I = 9 Q g Total Gate Charge Q gs Pre-Vth Gate-to-Source Charge 2 V S = 5V Q gs2 Post-Vth Gate-to-Source Charge 4.7 V nc GS = 4.5V Q gd Gate-to-rain Charge 4 I = 9 Q godr Gate Charge Overdrive 3.3 See Figs. 7a & 7b Q sw Switch Charge (Q gs2 Q gd ) 8.7 Q oss Output Charge 22 nc V S = 6V, V GS = 0V R g Gate Resistance Ω t d(on) Turn-On elay Time 23 V = 5V, V GS = 4.5V t r Rise Time 24 I ns = 9 t d(off) Turn-Off elay Time 23 R G =.8Ω t f Fall Time See Fig. 5a & 5b C iss Input Capacitance 5720 V GS = 0V C oss Output Capacitance 980 pf V S = 5V C rss Reverse Transfer Capacitance 450 ƒ =.0MHz valanche Characteristics Parameter Typ. Max. Units E S Single Pulse valanche Energy d 230 mj I R valanche Current c 9 iode Characteristics Parameter Min. Typ. Max. Units Conditions Conditions I S Continuous Source Current 3. MOSFET symbol (Body iode) showing the G I SM Pulsed Source Current integral reverse 90 (Body iode)c S p-n junction diode. V S iode Forward Voltage.0 V T J = 25 C, I S = 9, V GS = 0V e 0.75 V T J = 25 C, I S = 2.2, V GS = 0V e t rr Reverse Recovery Time ns T J = 25 C, I F = 9, V = 5V Q rr Reverse Recovery Charge nc di/dt = 230/μs e t on Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LSL) 2
3 I, rain-to-source Current () R S(on), rain-to-source On Resistance (Normalized) I, rain-to-source Current () I, rain-to-source Current () 0 VGS TOP V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V BOTTOM 2.3V 0 VGS TOP V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V BOTTOM 2.3V V 60μs PULSE WITH Tj = 25 C V S, rain-to-source Voltage (V) 2.3V 60μs PULSE WITH Tj = 50 C 0. V S, rain-to-source Voltage (V) Fig. Typical Output Characteristics Fig 2. Typical Output Characteristics 0 V S = 5V 60μs PULSE WITH 2.0 I = 24 V GS = V.5 T J = 50 C T J = 25 C V GS, Gate-to-Source Voltage (V) T J, Junction Temperature ( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance vs. Temperature 3
4 I S, Reverse rain Current () I, rain-to-source Current () C, Capacitance (pf) V GS, Gate-to-Source Voltage (V) 000 V GS = 0V, f = MHZ C iss = C gs C gd, C ds SHORTE C rss = C gd C oss = C ds C gd 6 2 I = 9 V S = 24V V S = 5V 00 C iss 8 C oss 0 C rss 4 V S, rain-to-source Voltage (V) Q g, Total Gate Charge (nc) Fig 5. Typical Capacitance vs. rain-to-source Voltage Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage 0 0 OPERTION IN THIS RE LIMITE BY R S (on) T J = 50 C μsec T J = 25 C V GS = 0V V S, Source-to-rain Voltage (V) 0. T = 25 C Tj = 50 C Single Pulse msec msec 0 V S, rain-to-source Voltage (V) Fig 7. Typical Source-rain iode Forward Voltage Fig 8. Maximum Safe Operating rea 4
5 I, rain Current () V GS(th), Gate Threshold Voltage (V) I = 250μ I = μ T, mbient Temperature ( C) T J, Temperature ( C ) Fig 9. Maximum rain Current vs. mbient Temperature Fig. Threshold Voltage vs. Temperature = 0.50 Thermal Response ( Z thj ) SINGLE PULSE ( THERML RESPONSE ) τj τj τ τ Ci= τi/ri R R E-006 E τ2 τ2 R2 R2 R3 R3 t, Rectangular Pulse uration (sec) τ3 τ3 R4 R4 τ4 τ4 R5 R5 τ5 τ5 R6 R6 τ6 τ6 R7 R7 τ7 τ7 R8 R8 τ8 τ8 τa Ri ( C/W) τι (sec) Notes:. uty Factor = t/t2 2. Peak Tj = P dm x Zthja Tc Fig. Maximum Effective Transient Thermal Impedance, Junction-to-mbient 5
6 R S (on), rain-to -Source On Resistance (mω) E S, Single Pulse valanche Energy (mj) 7 6 I = I TOP BOTTOM T J = 25 C T J = 25 C V GS, Gate-to-Source Voltage (V) Starting T J, Junction Temperature ( C) Fig 2. On-Resistance vs. Gate Voltage Fig 3. Maximum valanche Energy vs. rain Current 5V tp V (BR)SS V S L RIVER R G 20V V GS tp.u.t I S 0.0Ω - V Fig 4a. Unclamped Inductive Test Circuit I S Fig 4b. Unclamped Inductive Waveforms V S R V S 90% V GS.U.T. R G - V V GS Pulse Width µs uty Factor 0. % % V GS t d(on) t r t d(off) t f Fig 5a. Switching Time Test Circuit Fig 5b. Switching Time Waveforms 6
7 -.U.T ƒ - Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - Reverse Recovery Current river Gate rive Period P.W..U.T. I S Waveform Body iode Forward Current di/dt.u.t. V S Waveform iode Recovery dv/dt = P.W. Period V GS =V V * R G dv/dt controlled by RG river same type as.u.t. I S controlled by uty Factor "".U.T. - evice Under Test V - Re-pplied Voltage Inductor Curent Body iode Forward rop Ripple 5% I S * V GS = 5V for Logic Level evices Fig 6. Peak iode Recovery dv/dt Test Circuit for N-Channel HEXFET Power MOSFETs Id Vds Vgs 0 20K K UT L VCC Vgs(th) Qgodr Qgd Qgs2 Qgs Fig 7a. Gate Charge Test Circuit Fig 7b. Gate Charge Waveform 7
8 SO-8 Package Outline imensions are shown in milimeters (inches) E 6 6X e B H 0.25 [.0] IM INCHES MILLIME T E RS MIN MX MIN MX b c E e e H K L y BS IC.27 BS IC.025 BS IC BSIC e C y K x 45 8X b 0.25 [.0] C B 0. [.004] 8X L 7 8X c F OOT PRINT NOTES :. IMENSIONING & TOLERNCING PER SME Y4.5M CONTROLLING IMENSION: MILLIMETER 3. IMENSIONS RE SHOWN IN MILLIMETERS [INCHES ]. 4. OUTLINE CONFORMS TO JEEC OUTLINE MS IMENSION OES NOT INCLUE MOL PROTRUSIONS. MOL PROTRUSIONS NOT TO EXCEE 0.5 [.006]. 6 IMENSION OES NOT INCLUE MOL PROTRUSIONS. MOL PROTRUSIONS NOT TO EXCEE 0.25 [.0]. 7 IMENSION IS THE LENGTH OF LE FOR SOLERING TO SUBSTRTE [.255] 8X 0.72 [.028] SO-8 Part Marking Information EXMPLE: THIS IS N IRF7 (MOSFET) INTERNTIONL RECTIFIER LOGO 3X.27 [.050] XXXX F7 TE COE (YWW) P = ISGNTES LE - FREE PROUCT (OPTIONL) Y = LST IGIT OF THE YER WW = WEEK = SSEMBLY SITE COE LOT COE PRT NUMBER 8X.78 [.070] Note: For the most current drawing please refer to IR website at 8
9 SO-8 Tape and Reel imensions are shown in milimeters (inches) TERMINL NUMBER 2.3 (.484 ).7 (.46 ) 8. (.38 ) 7.9 (.32 ) FEE IRECTION NOTES:. CONTROLLING IMENSION : MILLIMETER. 2. LL IMENSIONS RE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EI-48 & EI (2.992) MX. NOTES :. CONTROLLING IMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EI-48 & EI (.566 ) 2.40 (.488 ) Notes: Repetitive rating; pulse width limited by max. junction temperature. Starting T J = 25 C, L =.25mH, R G = 25Ω, I S = 9. ƒ Pulse width 400μs; duty cycle 2%. When mounted on inch square copper board. R θ is measured at T J of approximately 90 C. Note: For the most current drawing please refer to IR website at ata and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR s Web site. IR WORL HEQURTERS: 233 Kansas St., El Segundo, California 90245, US Tel: (3) TC Fax: (3) Visit us at for sales contact information.08/08 9
V DSS R DS(on) max I D. 20V GS = 10V 20A. 160 P A = 25 C Power Dissipation 2.5 P A = 70 C Power Dissipation Linear Derating Factor
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V DS 4 V PD -9778 IRLH734PbF HEXFET Power MOSFET R DS(on) max (@V GS = V) 3.3 mω Q g (typical) 39 nc I D (@T c(bottom) = 25 C) 5 i PQFN 5X6 mm pplications Secondary Side Synchronous Rectification Inverters
More informationStorage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
l l l l l l Surface Mount (IRLR20N) Straight Lead (IRLU20N) dvanced Process Technology Fast Switching Fully valanche Rated Lead-Free Description Fifth Generation HEXFETs from International Rectifier utilize
More informationDescription Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Ratings Parameter Typ. Max. Units
HEXFET Power MOSFET P - 9576 IRF730PbF Generation V Technoogy Utra Low On-Resistance ua N-Channe Mosfet Surface Mount vaiabe in Tape & Ree ynamic dv/dt Rating Fast Switching Lead-Free escription Fifth
More informationV DSS R DS(on) max Qg (typ.) 30V GS = 10V 57nC
PD - 97407 Applications l Optimized for UPS/Inverter Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Power Tools HEXFET Power MOSFET
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
More informationDescription. 1
dvanced Process Technoogy Utra Low OnResistance P Channe MOSFET Surface Mount vaiabe in Tape & Ree 50 C Operating Temperature LeadFree S S S G 2 3 IRF746QPbF 8 7 6 4 5 HEXFET Power MOSFET P 9624 V SS =
More informationIRLR3717 IRLU3717 HEXFET Power MOSFET
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use PD - 94718B
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
More informationSMPS MOSFET. Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
P-93896 IRF7465 SMPS MOSFET HEXFET Power MOSFET Applications V SS R S(on) max I l High frequency C-C converters 50V 0.28Ω@V GS = 0V.9A Benefits l Low Gate to rain Charge to Reduce Switching Losses l Fully
More informationV DSS R DS(on) max Qg 30V GS = 10V 20nC
Applications l l Control MOSFET of Sync-Buck Converters used for Notebook Processor Power Control MOSFET for Isolated DC-DC Converters in Networking Systems Benefits l Very low R DS(ON) at 4.5V V GS l
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
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Typical R S(on) (mω) V S, ate-to-source Voltage (V) l RoHS Compliant and Halogen Free l Low Profile (
More informationmj I AR Avalanche Currentg 7.6
Typical R DS (on) (mω), Gate-to-Source Voltage (V) l RoHS Compliant l Lead-Free (Qualified up to 260 C Reflow) l pplication Specific MOSFETs l Ideal for High Performance Isolated Converter Primary Switch
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
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Typical R S(on) (m ) V GS, GatetoSource Voltage (V) l RoHs Compliant and Halgen Free l Low Profile (
More informationDescription Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units
l Logic-Level Gate Drive l Surface Mount l dvanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l Fast Switching l Fully valanche Rated Description G PD - 9376C HEXFET Power MOSFET
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Typical R DS(on) (mω) V GS, Gate-to-Source Voltage (V) l RoHs Compliant l Lead-Free (Qualified up to 260 C Reflow) l pplication Specific MOSFETs l Ideal for High Performance Isolated Converter Primary
More informationStorage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
l Logic-Level Gate Drive l Ultra Low On-Resistance l Surface Mount (IRLR33) l Straight Lead (IRLU33) l dvanced Process Technology l Fast Switching l Fully valanche Rated l Lead-Free Description Fifth Generation
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PD - 9729A IRFR8EPbF IRFU8EPbF Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits
More informationV DSS R DS(on) max Qg 30V GS = 10V 5.4nC
PD - 96227B Applications l Synchronous Buck Converter for Computer Processor Power l Isolated DC to DC Converters for Network and Telecom l Buck Converters for Set-Top Boxes l System/load switch Benefits
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Typical R DS(on) (Ω) V GS, Gate-to-Source Voltage (V) l RoHS compliant containing no lead or bromide l Low Profile (
More informationAbsolute Maximum Ratings. Thermal Resistance Ratings. 1 SO-8. Top View. 100% R G Tested. Symbol Parameter Typ Max Units
Generation V Technoogy Utra Low On-Resistance N-Channe Mosfet Surface Mount vaiabe in Tape & Ree ynamic dv/dt Rating Fast Switching 00% R G Tested Lead-Free escription Fifth Generation HEXFETs from Internationa
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P 9604 IRF7304QPbF dvanced Process Technoogy Utra Low OnResistance ua P Channe MOSFET Surface Mount vaiabe in Tape & Ree 50 C Operating Temperature LeadFree S G S2 G2 8 2 3 4 5 HEXFET Power MOSFET 7 V
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l Application Specific MOSFETs l Ideal for CPU Core C-C Converters l Low Conduction Losses l High Cdv/dt Immunity l Low Profile (
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Typical R S(on) (mω), atetosource Voltage (V) l RoHs Compliant l LeadFree (Qualified up to 260 C Reflow) l pplication Specific MOSFETs l Ideal for CPU Core CC Converters l Low Conduction Losses l High
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l Logic-Level Gate Drive l dvanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Fully valanche Rated l Lead-Free Description Fifth
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l dvanced Process Technology l Ultra Low On-Resistance l ynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Ease of Paralleling escription Fifth Generation HEXFETs from International Rectifier
More informationDescription Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units
l l l l l dvanced Process Technology Isolated Package High Voltage Isolation = 2.5KVRMS Sink to Lead Creepage ist. = 4.8mm Fully valanche Rated escription Fifth Generation HEXFETs from International Rectifier
More informationIRLMS1503. HEXFET Power MOSFET V DSS = 30V. R DS(on) = 0.10Ω. 1. Top View
P - 9508 IRLMS503 HEXFET Power MOSFET l l l l Generation V Technology Micro6 Package Style Ultra Low R S(on) N-Channel MOSFET 2 6 5 A V SS = 30V escription Fifth Generation HEXFET power MOSFETs from International
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l Logic-Level Gate Drive l dvanced Process Technology l Surface Mount (IRLZ24NS) l Low-profile through-hole (IRLZ24NL) l 75 C Operating Temperature l Fast Switching l Fully valanche Rated l Lead-Free Description
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
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PD - 95836 IRF3709ZCS IRF3709ZCL Applications l High Frequency Synchronous Buck Converters for Computer Processor Power HEXFET Power MOSFET V DSS R DSon) max Qg 30V 6.3m: 7nC Benefits l l l Low R DSon)
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查询 供应商 捷多邦, 专业 PCB 打样工厂,24 小时加急出货 P- 94243 HEXFET Power MOSFET l l l l Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in Tape & Reel S S S 2 3 8 7 6 A V SS = -30V G 4 5 R S(on) = 0.020Ω
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UTOMOTIVE GRE UIRF746Q Features dvanced Process Technology Low On-Resistance Logic Level Gate rive P Channel MOSFET ynamic dv/dt Rating 50 C Operating Temperature Fast Switching Fully valanche Rated Lead-Free,
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UTOMOTIVE GRE UIRF7207Q Features dvanced Process Technology Low On-Resistance Logic Level Gate rive P-Channel MOSFET ynamic dv/dt Rating 50 C Operating Temperature Fast Switching Fully valanche Rated Lead-Free,
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
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P - 9480B IRF733 Generation V Technoogy Utra Low On-Resistance ua N-Channe MOSFET Surface Mount Fuy vaanche Rated S G S2 G2 HEXFET Power MOSFET 2 3 4 8 7 6 5 2 2 V SS = 30V R S(on) = 0.029Ω escription
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Applications l High Frequency Synchronous Buck Converters for Computer Processor Power PD - 94798 IRL3714Z IRL3714ZS IRL3714ZL HEXFET Power MOSFET V DSS R DS(on) max Qg 20V 16m: 4.8nC Benefits l l l Low
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PD 9752 IRF9388PbF HEXFET Power MOSFET V DS 3 V V GS max ±25 V R DS(on) max (@V GS = V).9 mω I D (@T A = 25 C) 2 A * SO8 Applications Adaptor Input Switch for Notebook PC Features and Benefits Features
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PDP SWITCH PD - 97B IRFP4332PbF Features l dvanced Process Technology l Key Parameters Optimized for PDP Sustain, Energy Recovery and Pass Switch pplications l Low E PULSE Rating to Reduce Power Dissipation
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