IRF6646 DirectFET Power MOSFET
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- Edwin Clark
- 6 years ago
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1 Typical R DS(on) (Ω) V GS, Gate-to-Source Voltage (V) l RoHS compliant containing no lead or bromide l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible l Ultra Low Package Inductance l Optimized for High Frequency Switching l Ideal for High Performance Isolated Converter Primary Switch Socket l Optimized for Synchronous Rectification l Low Conduction Losses l Compatible with existing Surface Mount Techniques PD E IRF6646 DirectFET Power MOSFET Typical values (unless otherwise specified) V DSS V GS R DS(on) 80V max ±20V max 7.6mΩ@ V Q g tot Q gd V gs(th) 36nC 2nC 3.8V MN DirectFET ISOMETRIC Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details) SQ SX ST MQ MX MT MN Description The IRF6646 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-35 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6646 is optimized for primary side bridge topologies in isolated DC-DC applications, for 48V(±%) or 36V to 60V ETSI input voltage range systems, and is also ideal for secondary side synchronous rectification in regulated isolated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-DC converters. Absolute Maximum Ratings Parameter Max. Units V DS Drain-to-Source Voltage 80 V V GS Gate-to-Source Voltage ±20 I T A = 25 C Continuous Drain Current, V V e 2 I T A = 70 C Continuous Drain Current, V V e 9.6 A I T C = 25 C Continuous Drain Current, V V f 68 I DM Pulsed Drain Current g 96 E AS Single Pulse Avalanche Energy h 230 mj I AR Avalanche Currentg 7.2 A T J = 25 C T J = 25 C I D = 7.2A Q V GS, Gate -to -Source Voltage (V) G Total Gate Charge (nc) Fig 2. Typical Total Gate Charge vs. Gate-to-Source Fig. Typical On-Resistance vs. Gate Voltage Voltage Notes: Click on this section to link to the appropriate technical paper. T C measured with thermocouple mounted to top (Drain) of part. Click on this section to link to the DirectFET Website. Repetitive rating; pulse width limited by max. junction temperature. ƒ Surface mounted on in. square Cu board, steady state. Starting T J = 25 C, L = 8.8mH, R G = 25Ω, I AS = 7.2A I D = 7.2A V DS = 40V V DS = 6V /04/05
2 IRF6646 T J = 25 C (unless otherwise specified) Parameter Min. Typ. Max. Units BV DSS Drain-to-Source Breakdown Voltage 80 V Conditions V GS = 0V, I D = 250µA ΒV DSS / T J Breakdown Voltage Temp. Coefficient 0. V/ C Reference to 25 C, I D = ma R DS(on) Static Drain-to-Source On-Resistance mω V GS = V, I D = 2A c V GS(th) Gate Threshold Voltage V V DS = V GS, I D = 50µA V GS(th) / T J Gate Threshold Voltage Coefficient - mv/ C I DSS Drain-to-Source Leakage Current 20 µa V DS = 80V, V GS = 0V 250 V DS = 64V, V GS = 0V, T J = 25 C I GSS Gate-to-Source Forward Leakage 0 na V GS = 20V Gate-to-Source Reverse Leakage -0 V GS = -20V gfs Forward Transconductance 7 S V DS = V, I D = 7.2A Q g Total Gate Charge Q gs Pre-Vth Gate-to-Source Charge 7.6 V DS = 40V Q gs2 Post-Vth Gate-to-Source Charge 2.0 nc V GS = V Q gd Gate-to-Drain Charge 2 I D = 7.2A Q godr Gate Charge Overdrive 4 See Fig. 7 Q sw Switch Charge (Q gs2 Q gd ) 4 Q oss Output Charge 8 nc V DS = 6V, V GS = 0V R G Gate Resistance.0 Ω t d(on) Turn-On Delay Time 7 V DD = 40V, V GS = Vc t r Rise Time 20 I D = 7.2A t d(off) Turn-Off Delay Time 3 ns R G =6.2Ω t f Fall Time 2 C iss Input Capacitance 2060 V GS = 0V C oss Output Capacitance 480 pf V DS = 25V C rss Reverse Transfer Capacitance 20 ƒ =.0MHz C oss Output Capacitance 280 V GS = 0V, V DS =.0V, f=.0mhz C oss Output Capacitance 3 V GS = 0V, V DS = 64V, f=.0mhz Diode Characteristics Parameter Min. Typ. Max. Units Conditions I S Continuous Source Current 2.5e MOSFET symbol (Body Diode) A showing the I SM Pulsed Source Current 96 integral reverse (Body Diode)d p-n junction diode. V SD Diode Forward Voltage.3 V T J = 25 C, I S = 7.2A, V GS = 0V c t rr Reverse Recovery Time ns T J = 25 C, I F = 7.2A, V DD = 40V Q rr Reverse Recovery Charge nc di/dt = 0A/µs c Notes: Pulse width 400µs; duty cycle 2%. Repetitive rating; pulse width limited by max. junction temperature. ƒ Thermally limited and used R θja to calculate. 2
3 Absolute Maximum Ratings IRF6646 Parameter Max. Units P A = 25 C Power Dissipation c 2.8 W P A = 70 C Power Dissipation c.8 P C = 25 C Power Dissipation f 89 T P Peak Soldering Temperature 270 C T J Operating Junction and -40 to 50 Storage Temperature Range T STG Thermal Resistance Parameter Typ. Max. Units R θja Junction-to-Ambient cg 45 R θja Junction-to-Ambient dg 2.5 R θja Junction-to-Ambient eg 20 C/W R θjc Junction-to-Case fg.4 R θj-pcb Junction-to-PCB Mounted.0 0 Thermal Response ( Z thja ) D = E-006 E Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Notes: Surface mounted on in. square Cu board, steady state. Used double sided cooling, mounting pad. ƒ Mounted on minimum footprint full size board with metalized back and with small clip heatsink. R R R 2 R 2 R 3 R 3 τ J τ J τ τ τ 2 τ 2 τ 3 τ 3 Ci= τi/ri Ci= τi/ri SINGLE PULSE ( THERMAL RESPONSE ) Notes:. Duty Factor D = t/t2 2. Peak Tj = P dm x Zthja Tc t, Rectangular Pulse Duration (sec) R 4 R 4 τ 4 τ 4 τ A τ Ri ( C/W) τi (sec) T C measured with thermocouple incontact with top (Drain) of part. R θ is measured at T J of approximately 90 C. Surface mounted on in. square Cu ƒ Mounted to a PCB with ƒ Mounted on minimum board (still air). small clip heatsink (still air) footprint full size board with metalized back and with small clip heatsink (still air) 3
4 C, Capacitance(pF) Typical R DS (on) ( Ω) I D, Drain-to-Source Current (Α) Typical R DS(on) (Normalized) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) IRF VGS TOP 5V V 8.0V 7.0V BOTTOM 6.0V 0 6.0V VGS TOP 5V V 8.0V 7.0V BOTTOM 6.0V 6.0V 60µs PULSE WIDTH Tj = 25 C 0. 0 V DS, Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 60µs PULSE WIDTH Tj = 50 C 0. 0 V DS, Drain-to-Source Voltage (V) Fig 5. Typical Output Characteristics 00 V DS = V 60µs PULSE WIDTH 2.0 I D = 2A V GS = V 0.5 T J = 50 C T J = 25 C T J = -40 C V GS, Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics T J, Junction Temperature ( C) Fig 7. Normalized On-Resistance vs. Temperature V GS = 0V, f = MHZ C iss = C gs C gd, C ds SHORTED C rss = C gd C oss = C ds C gd C iss C oss T J = 25 C Vgs = 7.0V Vgs = 8.0V Vgs = V Vgs = 5V 5 C rss V DS, Drain-to-Source Voltage (V) Fig 8. Typical Capacitance vs.drain-to-source Voltage I D, Drain Current (A) Fig 9. Typical On-Resistance vs. Drain Current 4
5 E AS, Single Pulse Avalanche Energy (mj) I D, Drain Current (A) Typical V GS(th) Gate threshold Voltage (V) I SD, Reverse Drain Current (A) I D, Drain-to-Source Current (A) OPERATION IN THIS AREA LIMITED BY R DS (on) IRF6646 0µsec T J = 50 C T J = 25 C T J = -40 C V GS = 0V V SD, Source-to-Drain Voltage (V) Fig. Typical Source-Drain Diode Forward Voltage 0. T A = 25 C T J = 50 C msec msec Single Pulse V DS, Drain-to-Source Voltage (V) Fig. Maximum Safe Operating Area I D = 50µA I D = 250µA I D =.0mA I D =.0A T A, Ambient Temperature ( C) Fig 2. Maximum Drain Current vs. Ambient Temperature I D TOP 3.3A 4.0A BOTTOM 7.2A T J, Temperature ( C ) Fig 3. Typical Threshold Voltage vs. Junction Temperature Starting T J, Junction Temperature ( C) Fig 4. Maximum Avalanche Energy vs. Drain Current 5
6 IRF6646 Current Regulator Same Type as D.U.T. Vds Id 2V.2µF 50KΩ.3µF Vgs D.U.T. V - DS V GS Vgs(th) 3mA I G I D Current Sampling Resistors Qgs Qgs2 Qgd Qgodr Fig 5a. Gate Charge Test Circuit Fig 5b. Gate Charge Waveform V (BR)DSS 5V tp V DS L DRIVER R G 20V V GS tp D.U.T I AS 0.0Ω - V DD A I AS Fig 6a. Unclamped Inductive Test Circuit Fig 6b. Unclamped Inductive Waveforms V DS R D V DS 90% V GS D.U.T. R G - V DD % V GS V Pulse Width µs t d(on) t r t d(off) t f Duty Factor 0. % Fig 7a. Switching Time Test Circuit Fig 7b. Switching Time Waveforms 6
7 IRF D.U.T ƒ - Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - Reverse Recovery Current Driver Gate Drive Period P.W. D.U.T. I SD Waveform Body Diode Forward Current di/dt D.U.T. V DS Waveform Diode Recovery dv/dt D = P.W. Period V GS =V V DD * R G di/dt controlled by R G Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test V DD - Re-Applied Voltage Body Diode Inductor Curent Current Forward Drop Ripple 5% I SD * V GS = 5V for Logic Level Devices Fig 8. Diode Reverse Recovery Test Circuit for N-Channel HEXFET Power MOSFETs DirectFET Substrate and PCB Layout, MN Outline (Medium Size Can, N-Designation). Please see DirectFET application note AN-35 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. 7
8 IRF6646 DirectFET Outline Dimension, MN Outline (Medium Size Can, N-Designation). Please see DirectFET application note AN-35 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. 06'%64..0) &/'055#4'0// %&' Ã# Ã$ Ã% Ã& Ã' Ã( Ã) Ã* Ã, Ã- Ã. Ã/ Ã0 Ã2 &/'055 /'64% /0 /#: /2'4#. Ã/0 Ã/#: DirectFET Part Marking 8
9 DirectFET Tape & Reel Dimension (Showing component orientation). IRF6646 NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6646). For 00 parts on 7" reel, order IRF6646TR REEL DIMENSIONS STANDARD OPTION (QTY 4800) TR OPTION (QTY 00) METRIC IMPERIAL METRIC IMPERIAL CODE A B C D E F G H MIN MAX MIN MAX MIN MAX MIN MAX Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR s Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (3) TAC Fax: (3) Visit us at for sales contact information./05 9
10 Note: For the most current drawings please refer to the IR website at:
IRF6668PbF IRF6668TRPbF
Typical R DS(on) (mω) V GS, Gate-to-Source Voltage (V) l RoHs Compliant l Lead-Free (Qualified up to 260 C Reflow) l pplication Specific MOSFETs l Ideal for High Performance Isolated Converter Primary
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Features l Logic Level l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET Description Specifically
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Typical Applications Integrated Starter Alternator 42 Volts Automotive Electrical Systems Benefits Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating G 175 C Operating Temperature
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Applications l High frequency DC-DC converters l Lead-Free PD - 95473 SMPS MOSFET IRFB260NPbF HEXFET Power MOSFET Benefits Low Gate-to-Drain Charge to Reduce Switching Losses Fully Characterized Capacitance
More informationC Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Typical Applications l Industrial Motor Drive Benefits l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Repetitive Avalanche
More informationIRF6609. HEXFET Power MOSFET V DSS R DS(on) max Qg. 20V GS = 10V 46nC GS = 4.5V
l Low Conduction Losses l Low Switching Losses l Ideal Synchronous Rectifier MOSFET l Low Profile (
More informationIRFB3507PbF IRFS3507PbF IRFSL3507PbF
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits l Lead-Free G D S V DSS IRFB357PbF
More informationIRFR1018EPbF IRFU1018EPbF
PD - 9729A IRFR8EPbF IRFU8EPbF Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits
More informationSMPS MOSFET. V DSS R DS(on) max I D
PD - 95353A SMPS MOSFET IRFR12N25DPbF IRFU12N25DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 250V 0.26Ω 14A Benefits Low Gate-to-Drain Charge
More informationSMPS MOSFET. V DS 200 V V DS (Avalanche) min. 260 V R DS(ON) 10V 54 m: T J max 175 C TO-220AB. IRFB38N20DPbF
Applications High frequency DC-DC converters Plasma Display Panel Lead-Free l l l SMPS MOSFET Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including
More informationV DSS R DS(on) max Qg. 30V 3.3m: 34nC
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use Benefits
More informationSMPS MOSFET. V DSS R DS(on) max I D
PD - 95355A SMPS MOSFET IRFR5N20DPbF IRFU5N20DPbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D 200V 65Ω 7A Benefits Low Gate-to-Drain Charge to
More informationAUTOMOTIVE MOSFET TO-220AB IRL3705Z. A I T C = 25 C Continuous Drain Current, V 10V (Package Limited) W/ C V GS Gate-to-Source Voltage ± 16
Features l Logic Level l Advanced Process Technology l Ultra Low On-Resistance l 75 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET Description Specifically
More informationIRF3205S/L. HEXFET Power MOSFET V DSS = 55V. R DS(on) = 8.0mΩ I D = 110A
l l l l l l Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Fully Avalanche Rated Description Advanced HEXFET Power MOSFETs from International
More information1412 P C = 25 C Maximum Power Dissipation 300 Linear Derating Factor. V/ns T J. Thermal Resistance Symbol Parameter Typ. Max.
PD 9699A HEXFET Power MOSFET Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits G D
More informationA I T C = 25 C Continuous Drain Current, V 10V (Package Limited) 560 P C = 25 C Power Dissipation 330 Linear Derating Factor
PD - 95758A Features l Designed to support Linear Gate Drive Applications l 175 C Operating Temperature l Low Thermal Resistance Junction - Case l Rugged Process Technology and Design l Fully Avalanche
More informationV DSS R DS(on) max Qg 30V GS = 10V 20nC
Applications l l Control MOSFET of Sync-Buck Converters used for Notebook Processor Power Control MOSFET for Isolated DC-DC Converters in Networking Systems Benefits l Very low R DS(ON) at 4.5V V GS l
More informationIRFS4127PbF IRFSL4127PbF
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
More information100% Rg tested Increased Reliability. Easier Manufacturing RoHS Compliant Containing no Lead, no Bromide and no Halogen
PD -96276 V DS 3 V R DS(on) max (@V GS = V).85 mω Q g (typical) 37 nc R G (typical).5 Ω I D (@T c(bottom) = 25 C) h IRFH53PbF HEXFET Power MOSFET PQFN 5X6 mm pplications OR-ing MOSFET for 2V (typical)
More informationDirect Drive at High V GS. IRF9388PbF SO8 Tube/Bulk 95 IRF9388TRPbF SO8 Tape and Reel 4000
PD 9752 IRF9388PbF HEXFET Power MOSFET V DS 3 V V GS max ±25 V R DS(on) max (@V GS = V).9 mω I D (@T A = 25 C) 2 A * SO8 Applications Adaptor Input Switch for Notebook PC Features and Benefits Features
More informationV DSS R DS(on) max I D
PD - 95258A IRFL435PbF HEXFET Power MOSFET Applications l High frequency DC-DC converters V DSS R DS(on) max I D 50V 85mW@V GS = V 2.6A Benefits l Low Gate to Drain Charge to Reduce Switching Losses l
More informationP C = 100 C Power Dissipation Linear Derating Factor
PDP SWITCH PD - 97228 IRFI4228PbF Features l dvanced Process Technology l Key Parameters Optimized for PDP Sustain, Energy Recovery and Pass Switch pplications l Low E PULSE Rating to Reduce Power Dissipation
More informationV DSS R DS(on) max Qg
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l Lead-Free
More informationIRL8113 IRL8113S IRL8113L
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power V DSS PD - 95821 IRL8113 IRL8113S IRL8113L HEXFET Power MOSFET R DS(on) max Qg (Typ.) 30V 6.0m: 23nC Benefits l l
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET Applications l Switch Mode Power Supply (SMPS) l Motor Drive l Bridge Converters l All Zero Voltage Switching l Lead-Free Benefits l Low Gate Charge Qg results in Simple Drive Requirement l
More informationIRFR3710ZPbF IRFU3710ZPbF HEXFET Power MOSFET
Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free AUTOMOTIVE MOSFET Description Specifically
More informationV DSS R DS(on) max I D
PD - 95514A IRFR34PbF IRFU34PbF HEXFET Power MOSFET Applications High frequency DC-DC converters Lead-Free l l V DSS R DS(on) max I D V 39mΩ 31A Benefits Low Gate-to-Drain Charge to Reduce Switching Losses
More informationAUTOMOTIVE MOSFET. I D = 140A Fast Switching
IRF3808 AUTOMOTIVE MOSFET Typical Applications HEXFET Power MOSFET Integrated Starter Alternator D 42 Volts Automotive Electrical Systems V DSS = 75V Benefits Advanced Process Technology R DS(on) = 0.007Ω
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET Applications l Switch Mode Power Supply (SMPS) l Motor Drive l Bridge Converters l All Zero Voltage Switching Benefits l Low Gate Charge Qg results in Simple Drive Requirement l Improved Gate,
More informationAUTOMOTIVE MOSFET. A I T C = 25 C Continuous Drain Current, V 10V (Package Limited)
Features Logic Level Advanced Process Technology Ultra Low On-Resistance 75 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET Description Specifically designed
More informationIRFR4105ZPbF IRFU4105ZPbF
Features l Advanced Process Technology l Ultra Low On-Resistance l 75 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free Description This HEXFET Power MOSFET
More informationW/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 5.3
PD 9638 Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits l LeadFree Benefits l Improved
More informationIRF6691PbF IRF6691TRPbF
Typical R S(on) (mω) V GS, Gate-to-Source Voltage (V) l RoHs Compliant l Lead-Free (Qualified up to 260 C Reflow) l pplication Specific MOSFETs l Ideal for CPU Core C-C Converters l Low Conduction Losses
More informationV DSS R DS(on) max Qg
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Consumer Use l Lead-Free
More informationAUTOMOTIVE MOSFET. 240 P C = 25 C Power Dissipation 110 Linear Derating Factor V GS Gate-to-Source Voltage ± 20
Features Advanced Process Technology Ultra Low On-Resistance 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET Description Specifically designed for
More informationSMPS MOSFET. V DSS R DS(on) max I D
SMPS MOSFET PD 93917A IRFP3703 Applications Synchronous Rectification Active ORing l l HEXFET Power MOSFET V DSS R DS(on) max I D 30V 0.0028Ω 2A Benefits l Ultra Low OnResistance l Low Gate Impedance to
More informationIRFR540ZPbF IRFU540ZPbF
PD - 964B Features l Advanced Process Technology l Ultra Low On-Resistance l 75 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free l Halogen-Free Description
More informationC Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Mounting Torque, 6-32 or M3 screw 1.1 (10) N m (lbf in)
Typical Applications l Industrial Motor Drive Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax
More information30V GS = 10V 48nC GS = 4.5V
l Application Specific MOSFETs l Ideal for CPU Core C-C Converters l Low Conduction Losses l High Cdv/dt Immunity l Low Profile (
More informationV DSS R DS(on) max (mw)
Typical Applications Relay replacement Anti-lock Braking System Air Bag Benefits Advanced Process Technology Ultra Low On-Resistance Fast Switching Repetitive Avalanche Allowed up to Tjmax AUTOMOTIVE MOSFET
More informationTO-220AB IRFB3307. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 11. V/ns T J Operating Junction and -55 to
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
More information8 S1, D2. Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Co-Pack Dual N-channel HEXFET Power MOSFET and Schottky Diode Ideal for Synchronous Buck DC-DC Converters Up to A Peak Output Low Conduction Losses Low Switching Losses Low Vf Schottky Rectifier D D 2
More informationEasier Manufacturing RoHS Compliant Containing no Lead, no Bromide and no Halogen
V DS 4 V PD -9778 IRLH734PbF HEXFET Power MOSFET R DS(on) max (@V GS = V) 3.3 mω Q g (typical) 39 nc I D (@T c(bottom) = 25 C) 5 i PQFN 5X6 mm pplications Secondary Side Synchronous Rectification Inverters
More informationSMPS MOSFET. V DSS R DS(on) max I D
Absolute Maximum Ratings SMPS MOSFET Applications l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use l High Frequency Buck Converters for Server Processor
More informationIRL3714ZPbF IRL3714ZSPbF IRL3714ZLPbF
Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l Lead-Free PD - 95661 IRL3714ZPbF IRL3714ZSPbF IRL3714ZLPbF HEXFET Power MOSFET V DSS R DS(on) max Qg 20V 16m: 4.8nC
More informationV DSS. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175
PD 976 Applications l Motion Control Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l Hard Switched and High Frequency Circuits Benefits l Low R DSON Reduces
More information