AUTOMOTIVE GRADE A I DM P C = 25 C Power Dissipation 200 Linear Derating Factor. V/ns T J. Thermal Resistance Parameter Typ. Max.
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1 UTOMOTIVE GRE P Features l dvanced Planar Technology l Low OnResistance l ynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Fully valanche Rated l Repetitive valanche llowed up to Tjmax l LeadFree, RoHS Compliant l utomotive Qualified * G S HEXFET Power MOSFET V (BR)SS 55V R S(on) max. 0.02Ω I 74 escription Specifically designed for utomotive applications, this cellular design of HEXFET Power MOSFETs utilizes the latest processing techniques to achieve low onresistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in utomotive and a wide variety of other applications. S G TO220B G S Gate rain Source bsolute Maximum Ratings Stresses beyond those listed under bsolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.exposure to absolutemaximumrated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. mbient temperature (T ) is 25 C, unless otherwise specified. Parameter Max. Units T C = 25 C Continuous rain Current, V 0V 74 T C = 00 C Continuous rain Current, V 0V 52 I M Pulsed rain Current c 260 C = 25 C Power issipation 200 W Linear erating Factor.3 W/ C V GS GatetoSource Voltage ± 20 V E S Single Pulse valanche Energy(Thermally limited) d 930 mj I R valanche Currentc 38 E R Repetitive valanche Energy c 20 mj dv/dt Peak iode Recovery dv/dt e 5.0 V/ns T J Operating Junction and 55 to + 75 T STG Storage Temperature Range Soldering Temperature, for 0 seconds(.6mm from case ) Mounting Torque, 632 or M3 screw lbfyin (.Nym) C Thermal Resistance Parameter Typ. Max. Units R θjc JunctiontoCase i 0.75 R θcs CasetoSink, Flat, Greased Surface 0.50 C/W R θj Junctiontombient 62 HEXFET is a registered trademark of International Rectifier. *Qualification standards can be found at /0/0
2 Static Electrical T J = 25 C (unless otherwise specified) Parameter Min. Typ. Max. Units V (BR)SS raintosource Breakdown Voltage 55 V V (BR)SS / T J Breakdown Voltage Temp. Coefficient 0.05 V/ C R S(on) Static raintosource OnResistance 0.02 Ω V GS(th) Gate Threshold Voltage V gfs Forward Transconductance 2 S I SS raintosource Leakage Current 25 µ 250 I GSS GatetoSource Forward Leakage 00 n GatetoSource Reverse Leakage 00 Conditions V GS = 0V, I = 250µ Reference to 25 C, I = m V GS = 0V, I = 38 f V S = V GS, I = 250µ V S = 25V, I = 38 V S = 55V, V GS = 0V V S = 44V, V GS = 0V, T J = 50 C V GS = 20V V GS = 20V ynamic Electrical T J = 25 C (unless otherwise specified) Q g Total Gate Charge 80 I = 38 Q gs GatetoSource Charge 32 nc V S = 44V Q gd Gatetorain ("Miller") Charge 86 V GS = 0V, See Fig.6 and 3Ãf t d(on) TurnOn elay Time 8 V = 28V t r Rise Time 99 I = 38 t d(off) TurnOff elay Time 6 ns R G = 2.5 Ω t f Fall Time 96 R =0.72 Ω See Fig. 0Ãf L Internal rain Inductance Between lead, 4.5 nh 6mm (0.25in.) G L S Internal Source Inductance from package 7.5 C iss Input Capacitance 3400 C oss Output Capacitance 400 C rss Reverse Transfer Capacitance 640 pf and center of die contact V GS = 0V V S = 25V ƒ =.0MHz, See Fig.5 S iode Characteristics Parameter Min. Typ. Max. Units Conditions I S Continuous Source Current MOSFET symbol 74 (Body iode) showing the I SM Pulsed Source Current integral reverse G 260 (Body iode)ãc pn junction diode. V S iode Forward Voltage.6 V T J = 25 C, I S =38, V GS = 0V f t rr Reverse Recovery Time ns T J = 25 C, I F =38 Q rr Reverse Recovery Charge nc di/dt = 00/µs f t on Forward TurnOn Time Intrinsic turnon time is negligible (turnon is dominated by LS+L) S Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. ) Starting T J = 25 C, L =.3mH R G = 25Ω, I S = 38. (See Figure 2) ƒ I S 38, di/dt 270/µs, V V (BR)SS, T J 75 C Pulse width 300µs; duty cycle 2%. 2
3 Qualification Information utomotive (per ECQ0) Qualification Level Comments: This part number(s) passed utomotive qualification. IR s Industrial and Consumer qualification level is granted by extension of the higher utomotive level. Moisture Sensitivity Level 3LTO220 N/ Machine Model ES Human Body Model Charged evice Model RoHS Compliant Class M4 (425V) (per ECQ0002) Class H2 (4000V) (per ECQ000) Class C5 (25V) (per ECQ0005) Yes Qualification standards can be found at International Rectifier s web site: http// Exceptions to ECQ0 requirements are noted in the qualification report. 3
4 I, raintosource Current () 00 0 VGS TOP 5V 0V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 4.5V 20µs PULSE WITH T c = 25 C V S, raintosource Voltage (V) I, raintosource Current () 00 0 VGS TOP 5V 0V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 4.5V 20µs PULSE WITH T C = 75 C V S, raintosource Voltage (V) Fig. Typical Output Characteristics Fig 2. Typical Output Characteristics I, raintosource Current () 00 0 T = 25 C J V S = 25V 20µs PULSE WITH V, GatetoSource Voltage (V) GS T = 75 C J Fig 3. Typical Transfer Characteristics R S(on), raintosource On Resistance (Normalized) I = 64 V GS = 0V T J, Junction Temperature ( C) Fig 4. Normalized OnResistance Vs. Temperature 4
5 C, Capacitance (pf) 7000 V GS = 0V, f = MHz C iss = C gs + C gd, C ds SHORTE 6000 C rss = Cgd C oss = C ds + Cgd 5000 C iss 4000 C oss C rss V S, raintosource Voltage (V) V GS, GatetoSource Voltage (V) I = 38 V S = 44V V S = 28V FOR TEST CIRCUIT 0 SEE FIGURE Q G, Total Gate Charge (nc) Fig 5. Typical Capacitance Vs. raintosource Voltage Fig 6. Typical Gate Charge Vs. GatetoSource Voltage I S, Reverse rain Current () 00 0 T = 75 C J T = 25 C J V GS = 0V V S, Sourcetorain Voltage (V) Fig 7. Typical Sourcerain iode Forward Voltage I, rain Current () 00 0 OPERTION IN THIS RE LIMITE BY RS(on) 0ms T C = 25 C T J = 75 C Single Pulse 0 00 V, raintosource Voltage (V) S 00µs ms Fig 8. Maximum Safe Operating rea 5
6 80 V S R I, rain Current () R G V GS 0V Pulse Width µs uty Factor 0. %.U.T. Fig 0a. Switching Time Test Circuit + V T C, Case Temperature ( C) V GS t d(on) t r t d(off) t f 0% Fig 9. Maximum rain Current Vs. Case Temperature 90% V S Fig 0b. Switching Time Waveforms Thermal Response (Z thjc ) 0. = t 0.02 SINGLE PULSE t2 0.0 (THERML RESPONSE) Notes:. uty factor = t / t Peak T J= P M x Z thjc + TC t, Rectangular Pulse uration (sec) PM Fig. Maximum Effective Transient Thermal Impedance, JunctiontoCase 6
7 Fig 2a. Unclamped Inductive Test Circuit I S V S L R G.U.T V IS 20V RIVER tp 0.0Ω 5V E S, Single Pulse valanche Energy (mj) I TOP 6 27 BOTTOM Starting T J, Junction Temperature ( C) Fig 2c. Maximum valanche Energy Vs. rain Current tp V (BR)SS Fig 2b. Unclamped Inductive Waveforms Current Regulator Same Type as.u.t. 50KΩ 0V Q G 2V.2µF.3µF.U.T. + V S Q GS Q G V GS V G 3m Charge I G I Current Sampling Resistors Fig 3a. Basic Gate Charge Waveform Fig 3b. Gate Charge Test Circuit 7
8 Peak iode Recovery dv/dt Test Circuit.U.T* + ƒ Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer + + R G dv/dt controlled by R G I S controlled by uty Factor "".U.T. evice Under Test + V V GS * Reverse Polarity of.u.t for PChannel river Gate rive P.W. Period = P.W. Period V[ GS =0V] ***.U.T. I S Waveform Reverse Recovery Current Body iode Forward Current di/dt.u.t. V S Waveform iode Recovery dv/dt [ ] V Repplied Voltage Inductor Curent Body iode Forward rop Ripple 5% [ I S ] *** V GS = 5.0V for Logic Level and 3V rive evices Fig 4. For PChannel HEXFETS 8
9 TO220B Package Outline imensions are shown in millimeters (inches) TO220B Part Marking Information Part Number IR Logo UF4905 YWW XX or XX ate Code Y= Year WW= Work Week = utomotive, Lead Free Lot Code Note: For the most current drawing please refer to IR website at 9
10 Ordering Information Base part Package Type Standard Pack Complete Part Number Form Quantity TO220 Tube
11 IMPORTNT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. Part numbers designated with the U prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process change notification. ll products are sold subject to IR s terms and conditions of sale supplied at the time of order acknowledgment. IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR s standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using IR components. To minimize the risks with customer products and applications, customers should provide adequate design and operating safeguards. Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alterations is an unfair and deceptive business practice. IR is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product or service voids all express and any implied warranties for the associated IR product or service and is an unfair and deceptive business practice. IR is not responsible or liable for any such statements. IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of the IR product could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for any such unintended or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that IR was negligent regarding the design or manufacture of the product. IR products are neither designed nor intended for use in military/aerospace applications or environments unless the IR products are specifically designated by IR as militarygrade or enhanced plastic. Only products designated by IR as militarygrade meet military specifications. Buyers acknowledge and agree that any such use of IR products which IR has not designated as militarygrade is solely at the Buyer s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR products are designated by IR as compliant with ISO/TS 6949 requirements and bear a part number including the designation U. Buyers acknowledge and agree that, if they use any nondesignated products in automotive applications, IR will not be responsible for any failure to meet such requirements For technical support, please contact IR s Technical ssistance Center WORL HEQURTERS: 233 Kansas St., El Segundo, California Tel: (30)
AUTOMOTIVE MOSFET P C = 25 C Power Dissipation 110 Linear Derating Factor
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Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche
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l Logic-Level Gate Drive l dvanced Process Technology l Surface Mount (IRLZ24NS) l Low-profile through-hole (IRLZ24NL) l 75 C Operating Temperature l Fast Switching l Fully valanche Rated l Lead-Free Description
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Applications l High frequency DC-DC converters l UPS and Motor Control l Lead-Free Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including Effective C
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Features l Advanced Process Technology l Key Parameters Optimized for PP Sustain, Energy Recovery and Pass Switch Applications l Low E PULSE Rating to Reduce Power issipation in PP Sustain, Energy Recovery
More informationC Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Mounting Torque, 6-32 or M3 screw 1.1 (10) N m (lbf in)
Typical Applications l Industrial Motor Drive Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax
More informationIRLMS1503. HEXFET Power MOSFET V DSS = 30V. R DS(on) = 0.10Ω. 1. Top View
P - 9508 IRLMS503 HEXFET Power MOSFET l l l l Generation V Technology Micro6 Package Style Ultra Low R S(on) N-Channel MOSFET 2 6 5 A V SS = 30V escription Fifth Generation HEXFET power MOSFETs from International
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l PChannel l Surface Mount (IRFR930) l Straight Lead (IRFU930) l Advanced Process Technology l Fast Switching l Fully Avalanche Rated l LeadFree Description Third Generation HEXFETs from International
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l l l l l dvanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Fully valanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced
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Applications Zero Voltage Switching SMPS Telecom and Server Power Supplies Uninterruptible Power Supplies Motor Control applications SMPS MOSFET PD - 9445A HEXFET Power MOSFET V DSS R DS(on) typ. Trr typ.
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SMPS MOSFET PD 93917A IRFP3703 Applications Synchronous Rectification Active ORing l l HEXFET Power MOSFET V DSS R DS(on) max I D 30V 0.0028Ω 2A Benefits l Ultra Low OnResistance l Low Gate Impedance to
More informationPower MOSFET FEATURES. Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) IPAK (TO-251)
Power MOSFET PROUCT SUMMARY (V) 60 R S(on) (Ω) V GS = 10 V 0.10 Q g (Max.) (nc) 25 Q gs (nc) 5.8 Q gd (nc) 11 Configuration Single PAK (TO252) G S IPAK (TO251) G S G S NChannel MOSFET FEATURES ynamic dv/dt
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PD 94270 SMPS MOSFET IRFB260N HEXFET Power MOSFET Applications l High frequency DCDC converters V DSS R DS(on) max I D 200V 0.040Ω 56A Benefits Low GatetoDrain Charge to Reduce Switching Losses Fully Characterized
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l Ultra Low OnResistance l PChannel l Surface Mount (IRFR54) l Straight Lead (IRFU54) l Advanced Process Technology l Fast Switching G l Fully Avalanche Rated l LeadFree Description Fifth Generation HEXFETs
More informationAUTOMOTIVE GRADE. -70 I T C = 100 C Continuous Drain Current, 10V (Silicon Limited) -42 I DM
Features l Advanced Planar Technology l P-Channel MOSFET l Low On-Resistance l 150 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free, RoHS Compliant l Automotive
More informationAbsolute Maximum Ratings Max. A I T C = 25 C Continuous Drain Current, V 10V (Package Limited)
PD -9697A Features l Advanced Process Technology l Ultra Low On-Resistance l 175 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free Description This HEXFET
More informationAbsolute Maximum Ratings. Thermal Resistance Ratings. 1 SO-8. Top View. 100% R G Tested. Symbol Parameter Typ Max Units
Generation V Technoogy Utra Low On-Resistance N-Channe Mosfet Surface Mount vaiabe in Tape & Ree ynamic dv/dt Rating Fast Switching 00% R G Tested Lead-Free escription Fifth Generation HEXFETs from Internationa
More informationIRLIZ44N. HEXFET Power MOSFET V DSS = 55V. R DS(on) = 0.022Ω I D = 30A. Description. Thermal Resistance PD A TO-220 FULLPAK
l Logic-Level Gate rive l dvanced Process Technology l Isolated Package l High Voltage Isolation = 2.5KVRMS l Sink to Lead Creepage ist. = 4.8mm l Fully valanche Rated escription Fifth Generation HEXFETs
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SMPS MOSFET PD 93918 IRF3703 Applications Synchronous Rectification Active ORing l l HEXFET Power MOSFET V DSS R DS(on) max I D 30V 2.8mΩ 2A Benefits l Ultra Low OnResistance l Low Gate Impedance to Reduce
More informationC Soldering Temperature, for 10 seconds 300 (1.6mm from case )
PD -95487A Typical Applications l Industrial Motor Drive Benefits l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax
More informationAUTOMOTIVE MOSFET. I D = 140A Fast Switching
IRF3808 AUTOMOTIVE MOSFET Typical Applications HEXFET Power MOSFET Integrated Starter Alternator D 42 Volts Automotive Electrical Systems V DSS = 75V Benefits Advanced Process Technology R DS(on) = 0.007Ω
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P - 9540C IRLMS902 HEXFET Power MOSFET l l l l Generation V Technology Micro6 Package Style Ultra Low R S(on) N-Channel MOSFET 2 6 5 A V SS = 20V escription Fifth Generation HEXFET power MOSFETs from International
More informationA I T C = 25 C Continuous Drain Current, V 10V (Package Limited) 560 P C = 25 C Power Dissipation 330 Linear Derating Factor
PD - 95758A Features l Designed to support Linear Gate Drive Applications l 175 C Operating Temperature l Low Thermal Resistance Junction - Case l Rugged Process Technology and Design l Fully Avalanche
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Power MOSFET PROUCT SUMMARY (V) 60 R S(on) () = 10 V 0.50 Q g (Max.) (nc) 12 Q gs (nc) 3.8 Q gd (nc) 5.1 Configuration Single S SOT223 G G S Marking code: FE PChannel MOSFET FEATURES Surface mount Available
More informationPRELIMINARY. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )
l LogicLevel Gate rive l dvanced Process Technology l Isolated Package l High Voltage Isolation = 2.5KVRMS l Sink to Lead Creepage ist. = 4.8mm l Fully valanche Rated escription Fifth Generation HEXFETs
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l l l l l Advanced Process Technology Dynamic dv/dt Rating 75 C Operating Temperature Fast Switching Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced
More informationTO-220AB low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
l Logic-Level Gate Drive l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description Fifth
More informationSMPS MOSFET. V DSS R DS(on) typ. I D
SMPS MOSFET Applications l Switch Mode Power Supply (SMPS) l Uninterruptible Power Supply l High Speed Power Switching l ZVS and High Frequency Circuit l PWM Inverters Benefits l Low Gate Charge Qg results
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Absolute Maximum Ratings SMPS MOSFET PD 93923B IRFPS40N50L Applications HEXFET Power MOSFET l Switch Mode Power Supply (SMPS) l UninterruptIble Power Supply V DSS R DS(on) typ. I D l High Speed Power Switching
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P 95823C IRF6620 l pplication Specific MOSFETs l Ideal for CPU Core CC Converters l Low Conduction Losses l Low Switching Losses l Low Profile (
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l Advanced Process Technology l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l Fully Avalanche Rated l Ease of Paralleling l Simple Drive Requirements l Lead-Free Description Fifth
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P 9.44B IRLMS6702 HEXFET Power MOSFET l l l l Generation V Technology Micro6 Package Style Ultra Low Rds(on) PChannel MOSFET 2 6 5 V SS = 20V escription Fifth Generation HEXFETs from International Rectifier
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Power MOSFET PROUCT SUMMARY (V) 100 R S(on) () V GS = 5.0 V 0.54 Q g (Max.) (nc) 6.1 Q gs (nc) 2.6 Q gd (nc) 3.3 Configuration SOT223 G G S Marking code: LB Single S NChannel MOSFET FEATURES Surface mount
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dvanced Process Technoogy Utra Low OnResistance P Channe MOSFET Surface Mount vaiabe in Tape & Ree 50 C Operating Temperature LeadFree S S S G 2 3 IRF746QPbF 8 7 6 4 5 HEXFET Power MOSFET P 9624 V SS =
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Typical R S(on) (mω) RoHs Compliant Lead-Free (Qualified up to 260 C Reflow) pplication Specific MOSFETs Ideal for CPU Core C-C Converters Low Conduction Losses High Cdv/dt Immunity Low Profile (
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Typical R S (on) (mω) V GS, Gate-to-Source Voltage (V) l RoHs Compliant Containing No Lead and Bromide l Low Profile (
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Power MOSFET PROUCT SUMMARY V S (V) 60 R S(on) () V GS = 10 V 0.20 Q g max. (nc) 11 Q gs (nc) 3.1 Q gd (nc) 5.8 Configuration Single SOT223 G G S S Marking code: FA NChannel MOSFET FEATURES Surface mount
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pplications l Synchronous MOSFET for Notebook Processor Power l Synchronous Rectifier MOSFET for Isolated C-C Converters in Networking Systems l Lead-Free S S 2 IRF377PbF HEXFET Power MOSFET 8 7 P - 9579
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P-900 IRF7809V N-Channel pplication-specific MOSFETs Ideal for CPU Core C-C Converters Low Conduction Losses Low Switching Losses Minimizes Parallel MOSFETs for high current applications % Tested for R
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l l l l l Surface Mount (IRFR20N) Straight Lead (IRFU20N) dvanced Process Technology Fast Switching Fully valanche Rated escription Fifth Generation HEXFETs from International Rectifier utilize advanced
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Typical Applications l Telecom applications requiring soft start Benefits l Advanced Process Technology l Ultra Low On-Resistance l Dynamic dv/dt Rating l 75 C Operating Temperature l Fast Switching l
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HEXFET Power MOSFET l Generation V Technology l Ultra Low On-Resistance 8 S l ual N-Channel Mosfet 2 7 l Surface Mount G l vailable in Tape & Reel 3 6 S2 2 l ynamic dv/dt Rating 4 5 G2 2 l Fast Switching
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Typical R S(on) (m ) V GS, GatetoSource Voltage (V) l RoHs Compliant and Halgen Free l Low Profile (
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Applications Switch Mode Power Supply ( SMPS ) Uninterruptable Power Supply High speed power switching Lead-Free Benefits Low Gate Charge Qg results in Simple Drive Requirement Improved Gate, Avalanche
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