MC1496, MC1496B. Balanced Modulators/ Demodulators
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1 MC96, MC96B Balanced Modulators/ Demodulators These devices were designed for use where the output voltage is a product of an input voltage (signal) and a switching function (carrier). Typical applications include suppressed carrier and amplitude modulation, synchronous detection, FM detection, phase detection, and chopper applications. See ON Semiconductor Application Note AN53 for additional design information. Features Excellent Carrier Suppression 65 db 0.5 MHz 50 db 0 MHz Adjustable Gain and Signal Handling Balanced Inputs and Outputs High Common Mode Rejection 85 db Typical This Device Contains 8 Active Transistors PbFree Package is Available* SOIC D SUFFIX CASE 75A PDIP P SUFFIX CASE 646 PIN CONNECTIONS Signal Input Gain Adjust 2 Gain Adjust 3 Signal Input 4 Bias 5 Output 6 N/C V EE N/C Output N/C Carrier Input N/C Input Carrier ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2006 Publication Order Number: MC96/D
2 MC96, MC96B 0 I C = 500 khz I S =.0 khz Log Scale Id 20 I C = 500 khz, I S =.0 khz Figure. Suppressed Carrier Output Waveform khz 500 khz 50 khz Figure 2. Suppressed Carrier Spectrum I C = 500 khz I S =.0 khz Linear Scale I C = 500 khz I S =.0 khz khz 500 khz 50 khz Figure 3. Amplitude Modulation Output Waveform Figure 4. AmplitudeModulation Spectrum MAXIMUM RATINGS (T A = 25 C, unless otherwise noted.) Rating Symbol Value Unit Applied Voltage V 30 Vdc (V6V8, V0V, V2V8, V2V0, V8V4, V8V, V0V4, V6V0, V2V5, V3V5) Differential Input Signal V8 V Vdc V4 V ±(5+I5R e ) Maximum Bias Current I 5 0 ma Thermal Resistance, JunctiontoAir Plastic Dual InLine Package R JA 00 C/W Operating Ambient Temperature Range MC96 T A 0 to +70 C MC96B to +25 Storage Temperature Range T stg 65 to +50 C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ESD V 2
3 MC96, MC96B ELECTRICAL CHARACTERISTICS (V CC = 2 Vdc, V EE = 8.0 Vdc, I5 =.0 madc, R L = 3.9 k, R e =.0 k, T A = T low to T high, all input and output characteristics are singleended, unless otherwise noted.) (Note ) Characteristic Fig. Note Symbol Min Typ Max Unit Carrier Feedthrough V C = 60 mvrms sine wave and offset adjusted to zero V C = 300 mvpp square wave: offset adjusted to zero offset not adjusted f C =.0 khz f C = 0 MHz f C =.0 khz f C =.0 khz CFT Vrms mvrms Carrier Suppression f S = 0 khz, 300 mvrms f C = 500 khz, 60 mvrms sine wave f C = 0 MHz, 60 mvrms sine wave 5 2 V CS db k Transadmittance Bandwidth (Magnitude) (R L = 50 ) Carrier Input Port, V C = 60 mvrms sine wave f S =.0 khz, 300 mvrms sine wave Signal Input Port, V S = 300 mvrms sine wave V C = 0.5 Vdc 8 8 BW 3dB MHz Signal Gain (V S = 00 mvrms, f =.0 khz; V C = 0.5 Vdc) 0 3 A VS V/V SingleEnded Input Impedance, Signal Port, f = 5.0 MHz Parallel Input Resistance Parallel Input Capacitance 6 r ip c ip k pf SingleEnded Output Impedance, f = 0 MHz Parallel Output Resistance Parallel Output Capacitance 6 r op c oo 5.0 k pf Input Bias Current 7 I I I4 ;I I8 I0 bs 2 bc 2 I bs I bc A Input Offset Current I ios = II4; I ioc = I8I0 7 I ios I ioc A Average Temperature Coefficient of Input Offset Current (T A = 55 C to +25 C) 7 TC Iio 2.0 na/ C Output Offset Current (I6I9) 7 I oo 80 A Average Temperature Coefficient of Output Offset Current (T A = 55 C to +25 C) 7 TC Ioo 90 na/ C CommonMode Input Swing, Signal Port, f S =.0 khz 9 4 CMV 5.0 Vpp CommonMode Gain, Signal Port, f S =.0 khz, V C = 0.5 Vdc 9 ACM 85 db CommonMode Quiescent Output Voltage (Pin 6 or Pin 9) 0 V out 8.0 Vpp Differential Output Voltage Swing Capability 0 V out 8.0 Vpp Power Supply Current I6 +I2 Power Supply Current I 7 6 I CC I EE madc DC Power Dissipation 7 5 P D 33 mw. T low = 0 C for MC96 T high = +70 C for MC96 = C for MC96B = +25 C for MC96B 3
4 MC96, MC96B ORDERING INFORMATION MC96D MC96DG Device Package Shipping SOIC SOIC (PbFree) 55 Units/Rail MC96DR2 MC96DR2G MC96P MC96PG MC96P MC96PG MC96BD MC96BDG MC96BDR2 MC96BDR2G SOIC SOIC (PbFree) PDIP PDIP (PbFree) PDIP PDIP (PbFree) SOIC SOIC (PbFree) SOIC SOIC (PbFree) 2500 Tape & Reel 25 Units/Rail 55 Units/Rail 2500 Tape & Reel MC96BP MC96BPG PDIP PDIP (PbFree) 25 Units/Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. MARKING DIAGRAMS SOIC D SUFFIX CASE 75A PDIP P SUFFIX CASE 646 MC96DG AWLYWW MC96BDG AWLYWW MC96P AWLYYWWG MC96BP AWLYYWWG A WL YY, Y WW G = Assembly Location = Wafer Lot = Year = Work Week = PbFree Package 2
5 MC96, MC96B PACKAGE DIMENSIONS SOIC CASE 75A03 ISSUE H T SEATING PLANE A 8 G 7 B P 7 PL 0.25 (0.00) M B M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.27 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES C R X 45 F DIM MIN MAX MIN MAX A B C D D PL K M J F G.27 BSC BSC 0.25 (0.00) M T B S A S J K M P R SOLDERING FOOTPRINT* X X 7.04 X PITCH DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 3
6 MC96, MC96B PDIP CASE ISSUE P 8 7 B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. N T SEATING PLANE A INCHES MILLIMETERS DIM MIN MAX MIN MAX A B F L C D C F G 0.00 BSC 2.54 BSC H J K K J L M 0 0 H G D PL M N (0.005) M MC96/D
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