MC34164, MC33164, NCV33164

Transcription

1 MC3464, MC3364, NC3364 Micropower Undervoltage Sensing Circuits The MC3464 series are undervoltage sensing circuits specifically designed for use as reset controllers in portable microprocessor based systems where extended battery life is required. These devices offer the designer an economical solution for low voltage detection with a single external resistor. The MC3464 series features a bandgap reference, a comparator with precise thresholds and builtin hysteresis to prevent erratic reset operation, an open collector reset output capable of sinking in excess of 6. ma, and guaranteed operation down to. input with extremely low standby current. The MC devices are packaged in 3pin TO226AA, micro size TSOP5, 8pin and surface mount packages. The NC device is packaged in. Applications include direct monitoring of the 3. or 5. MPU/logic power supply used in appliance, automotive, consumer, and industrial equipment. Features Temperature Compensated Reference Monitors 3. (MC34643) or 5. (MC34645) Power Supplies Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 6. ma Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation With. Input Extremely Low Standby Current: As Low as 9. Economical TO226AA, TSOP5, and Surface Mount Packages NC Prefix for Automotive and Other Applications Requiring Site and Control Changes PbFree Packages are Available Input Reset STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK TSOP5 SN SUFFIX CASE 483 Pin TSOP5 TO226AA P SUFFIX CASE 29 8 D SUFFIX CASE 75 PIN CONNECTIONS Reset 8 N.C. Input 2 7 N.C. N.C. Ground N.C. N.C.. Ground 2. Input 3. Reset 4. NC 5. NC (Top iew) 8 DM SUFFIX CASE 846A TO226AA Pin. Reset 2. Input 3. Ground.2 ref GND Figure. Representative Block Diagram This device contains 28 active transistors. = Sink Only Positive True Logic ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. Semiconductor Components Industries, LLC, 28 Publication Order Number: MC3464/D

2 MC3464, MC3364, NC3364 MAXIMUM RATINGS Rating Symbol alue Unit Power Input Supply oltage in. to 2 Reset Output oltage O. to 2 Reset Output Sink Current I Sink Internally Limited Clamp Diode Forward Current, Reset to Input Pin (Note ) IF ma ma Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power T A = 25 C Thermal Resistance, JunctiontoAir D Suffix, Plastic Package Maximum Power T A = 25 C Thermal Resistance, JunctiontoAir DM Suffix, Plastic Package Maximum Power T A = 25 C Thermal Resistance, JunctiontoAir P D R JA P D R JA P D R JA mw C/W mw C/W mw C/W Operating Junction Temperature T J +5 C Operating Ambient Temperature Range MC3464 Series MC3364 Series, NC3364 T A to +7 4 to +25 Storage Temperature Range T stg 65 to +5 C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. MC34643, MC33643 SERIES, NC33643 ELECTRICAL CHARACTERISTICS (For typical values T A = 25 C, for min/max values T A is the operating ambient temperature range that applies [Notes 2 & 3], unless otherwise noted.) COMPARATOR Threshold oltage High State Output ( in Increasing) Low State Output ( in Decreasing) Hysteresis (I Sink = ) RESET OUTPUT Output Sink Saturation ( in = 2.4, I Sink =. ma) ( in =., I Sink =.25 ma) Characteristic Symbol Min Typ Max Unit Output Sink Current ( in, Reset = 2.4 ) I Sink ma Output OffState Leakage ( in, Reset = 3. ) ( in, Reset = ) IH IL H OL I R(leak) Clamp Diode Forward oltage, Reset to Input Pin (I F = 5. ma) F TOTAL DEICE Operating Input oltage Range in. to Quiescent Input Current in = 3. in = 6.. Maximum package power dissipation limits must be observed. 2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 3. T low = C for MC3464 T high = +7 C for MC3464 = 4 C for MC3364, NC3364 = +25 C for MC3364, NC3364 I in ESD C 2

3 MC3464, MC3364, NC3364 MC34645, MC33645 SERIES, NC33645 ELECTRICAL CHARACTERISTICS (For typical values T A = 25 C, for min/max values T A is the operating ambient temperature range that applies [Notes 5 & 6], unless otherwise noted.) COMPARATOR Threshold oltage High State Output ( in Increasing) Low State Output ( in Decreasing) Hysteresis (I Sink = ) RESET OUTPUT Output Sink Saturation ( in = 4., I Sink =. ma) ( in =., I Sink =.25 ma) Characteristic Symbol Min Typ Max Unit Output Sink Current ( in, Reset = 4. ) I Sink ma Output OffState Leakage ( in, Reset = 5. ) ( in, Reset = ) IH IL H OL I R(leak) Clamp Diode Forward oltage, Reset to Input Pin (I F = 5. ma) F TOTAL DEICE Operating Input oltage Range in. to Quiescent Input Current in = 5. in = 4. Maximum package power dissipation limits must be observed. 5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 6. T low = C for MC3464 T high = +7 C for MC3464 = 4 C for MC3364, NC3364 = +25 C for MC3364, NC NC prefix is for automotive and other applications requiring site and change control. I in O, OUTPUT OLTAGE () R L = 82 k to in T A = 25 C O, OUTPUT OLTAGE () R L = 82 k to in T A = 25 C in, INPUT OLTAGE () in, INPUT OLTAGE () Figure 2. MC3X643 Reset Output oltage versus Input oltage Figure 3. MC3X645 Reset Output oltage versus Input oltage 3

4 MC3464, MC3364, NC3364 ORDERING INFORMATION MC3364D3G MC3364D3R2G NC3364D3R2* NC3364D3R2G* MC3364DM3R2 MC3364DM3R2G MC3364P3G MC3364P3RAG MC3364P3RPG MC3364D5G MC3364D5R2 MC3364D5R2G NC3364D5R2G* MC3364DM5R2G MC3364P5G MC3364P5RAG MC3364P5RPG MC3464D3G MC3464D3R2G MC3464DM3R2G MC3464P3G MC3464P3RPG MC3464D5G MC3464D5R2G MC3464DM5R2G MC3464SN5TG MC3464P5G MC3464P5RAG MC3464P5RPG Device Package Shipping TO92 TO92 TO92 TO92 TO92 TO92 TO92 TO92 TSOP5 TO92 TO92 TO92 25 Units / Tape & Reel 4 Units / Tape & Reel 2 Units / Box 2 Units / Tape & Reel 25 Units / Tape & Reel 4 Units / Tape & Reel 2 Units / Box 2 Units / Tape & Reel 25 Units / Tape & Reel 4 Units / Tape & Reel 2 Units / Box 25 Units / Tape & Reel 4 Units / Tape & Reel 3 Units / Tape & Reel 2 Units / Box 2 Units / Tape & Reel *NC3364: T low = 4 C, T high = +25 C. Guaranteed by design. NC prefix is for automotive and other applications requiring site and change control. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. 7

5 MC3464, MC3364, NC3364 PACKAGE DIMENSIONS R A N B TO226AA P SUFFIX CASE 29 ISSUE AM STRAIGHT LEAD BULK PACK NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A B C D X X D G H G J H J K C L N P SECTION XX R N R A B BENT LEAD TAPE & REEL AMMO PACK NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P T MILLIMETERS SEATING PLANE K DIM MIN MAX A B C D.4.54 G X X D G J.39.5 K J N P.5 4. C R SECTION XX N 9

6 MC3464, MC3364, NC3364 PACKAGE DIMENSIONS D SUFFIX CASE 757 ISSUE AJ Y B X 8 A 5 4 S.25 (.) M Y M K NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION.5 (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION THRU 756 ARE OBSOLETE. NEW STANDARD IS 757. Z H G D C.25 (.) M Z Y S X S SEATING PLANE. (.4) N X 45 M J MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D G.27 BSC.5 BSC H J K M 8 8 N S SOLDERING FOOTPRINT* SCALE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.