NGB18N40CLB, NGB18N40ACLB. Ignition IGBT 18 Amps, 400 Volts. N Channel D 2 PAK. 18 AMPS, 400 VOLTS V CE(on) 2.0 I C = 10 A, V GE 4.

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1 NGB8N4CLB, NGB8N4ACLB Ignition IGBT 8 Amps, 4 Volts N Channel D PAK This Logic Level Insulated Gate Bipolar Transistor (IGBT) features monolithic circuitry integrating ESD and Over Voltage clamped protection for use in inductive coil drivers applications. Primary uses include Ignition, Direct Fuel Injection, or wherever high voltage and high current switching is required. 8 AMPS, 4 VOLTS V CE(on). I C = A, V GE 4.5 V Features Ideal for Coil on Plug Applications Gate Emitter ESD Protection Temperature Compensated Gate Collector Voltage Clamp Limits Stress Applied to Load Integrated ESD Diode Protection New Design Increases Unclamped Inductive Switching (UIS) Energy Per Area Low Threshold Voltage to Interface Power Loads to Logic or Microprocessor Devices Low Saturation Voltage High Pulsed Current Capability Integrated Gate Emitter Resistor (R GE ) Emitter Ballasting for Short Circuit Capability These are Pb Free Devices MAXIMUM RATINGS (T J = 5 C unless otherwise noted) Rating Symbol Value Unit Collector Emitter Voltage V CES 43 V DC G R GE C E D PAK CASE 48B STYLE 4 MARKING DIAGRAM 4 Collector GB 8N4xG AYWW Collector Gate Voltage V CER 43 V DC Gate Emitter Voltage V GE 8 V DC Collector Current T C = 5 C Pulsed ESD (Human Body Model) R = 5, C = pf I C 8 5 ESD ESD (Machine Model) R =, C = pf ESD 8 V Total Power T C = 5 C Derate above 5 C 8. P D 5.77 A DC A AC kv W W/ C Operating and Storage Temperature Range T J, T stg 55 to +75 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Gate GB8N4x x A Y WW G Collector 3 Emitter = Device Code = B or A = Assembly Location = Year = Work Week = Pb Free Package ORDERING INFORMATION Device Package Shipping NGB8N4CLBT4G D PAK 8/Tape & Reel NGB8N4ACLBT4G (Pb Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. Semiconductor Components Industries, LLC, 5 April, 5 Rev. 5 Publication Order Number: NGB8N4CLB/D

2 NGB8N4CLB, NGB8N4ACLB UNCLAMPED COLLECTOR TO EMITTER AVALANCHE CHARACTERISTICS ( 55 T J 75 C) Characteristic Symbol Value Unit Single Pulse Collector to Emitter Avalanche Energy E AS mj V CC = 5 V, V GE = 5. V, Pk I L =. A, L =.8 mh, Starting T J = 5 C V CC = 5 V, V GE = 5. V, Pk I L = 8.3 A, L =.8 mh, Starting T J = 5 C 4 3 Reverse Avalanche Energy V CC = V, V GE = V, Pk I L = 5.8 A, L = 6. mh, Starting T J = 5 C E AS(R) mj MAXIMUM SHORT CIRCUIT TIMES ( 55 C T J 5 C) Characteristic Symbol Value Unit Short Circuit Withstand Time (See Figure 7, 3 Pulses with ms Period) t sc 75 s Short Circuit Withstand Time (See Figure 8, 3 Pulses with ms Period) t sc 5. ms THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction to Case R JC.3 C/W Thermal Resistance, Junction to Ambient D PAK (Note ) R JA 5 C/W Maximum Lead Temperature for Soldering Purposes, /8 from case for 5 seconds T L 75 C ELECTRICAL CHARACTERISTICS Characteristic Symbol Test Conditions Temperature Min Typ Max Unit OFF CHARACTERISTICS Collector Emitter Clamp Voltage BV CES I C =. ma T J = 4 C to 5 C V Zero Gate Voltage Collector Current I CES V CE = 35 V, V GE = V Reverse Collector Emitter Leakage Current Reverse Collector Emitter Clamp Voltage I ECS B VCES(R) I C = ma T J = 4 C to 5 C V CE = 4 V I C = 75 ma T J = 5 C. A T J = 5 C 4* T J = 4 C. T J = 5 C.7. ma T J = 5 C 5* T J = 4 C.. T J = 5 C V T J = 5 C T J = 4 C Gate Emitter Clamp Voltage BV GES I G = 5. ma T J = 4 C to 5 C 3 5 V Gate Emitter Leakage Current I GES V GE = V T J = 4 C to 5 C Gate Emitter Resistor R GE T J = 4 C to 5 C 6 6 k ON CHARACTERISTICS (Note ) Gate Threshold Voltage V GE(th) I C =. ma, V GE = V CE Threshold Temperature Coefficient (Negative) *Maximum Value of Characteristic across Temperature Range.. When surface mounted to an FR4 board using the minimum recommended pad size.. Pulse Test: Pulse Width 3 S, Duty Cycle %. T J = 5 C..4.9 V T J = 5 C T J = 4 C..6.* 3.4 mv/ C A

3 NGB8N4CLB, NGB8N4ACLB ELECTRICAL CHARACTERISTICS Characteristic Symbol Test Conditions ON CHARACTERISTICS (Note ) Collector to Emitter On Voltage V CE(on) I C = 6. A, V GE = 4. V I C = 8. A, V GE = 4. V I C = A, V GE = 4. V I C = 5 A, V GE = 4. V I C = A, V GE = 4.5 V Temperature Min Typ Max Unit T J = 5 C..4.6 V T J = 5 C T J = 4 C..45.7* T J = 5 C.3.6.9* T J = 5 C T J = 4 C.4.6.9* T J = 5 C T J = 5 C.5.8. T J = 4 C.4.8.* T J = 5 C.6.9. T J = 5 C.7..3* T J = 4 C.6.8. T J = 5 C.3.8.* T J = 5 C.3.75.* T J = 4 C.4.8.* Forward Transconductance gfs V CE = 5. V, I C = 6. A T J = 4 C to 5 C Mhos DYNAMIC CHARACTERISTICS Input Capacitance C ISS 4 8 V CC = 5 V, V GE = V T J = 4 C to 5 C Output Capacitance C OSS f =. MHz 5 75 Transfer Capacitance C RSS SWITCHING CHARACTERISTICS Turn Off Delay Time (Resistive) t d(off) V CC = 3 V, I C = 6.5 A R G =. k, R L = 46, pf T J = 5 C 4. s Fall Time (Resistive) t f V CC = 3 V, I C = 6.5 A R G =. k, R L = 46, Turn On Delay Time t d(on) V CC = V, I C = 6.5 A R G =. k, R L =.5 Rise Time t r V CC = V, I C = 6.5 A R G =. k, R L =.5 T J = 5 C 9. 5 T J = 5 C.7 4. s T J = 5 C *Maximum Value of Characteristic across Temperature Range.. When surface mounted to an FR4 board using the minimum recommended pad size.. Pulse Test: Pulse Width 3 S, Duty Cycle %. 3

4 NGB8N4CLB, NGB8N4ACLB TYPICAL ELECTRICAL CHARACTERISTICS I C, COLLECTOR CURRENT (AMPS) V GE = V 5 V 4.5 V 4 V T J = 5 C 3.5 V 3 V.5 V I C, COLLECTOR CURRENT (AMPS) V GE = V 5 V 4.5 V T J = 4 C 4 V 3.5 V 3 V.5 V Figure. Output Characteristics Figure. Output Characteristics I C, COLLECTOR CURRENT (AMPS) V GE = V 5 V T J = 5 C 4.5 V 4 V 3.5 V 3 V.5 V I C, COLLECTOR CURRENT (AMPS) V CE = V T J = 4 C T J = 5 C T J = 5 C V GE, GATE TO EMITTER VOLTAGE (VOLTS) Figure 3. Output Characteristics Figure 4. Transfer Characteristics V GE = 5 V T J, JUNCTION TEMPERATURE ( C) I C = 5 A I C = A I C = 5 A I C = A I C = 5 A 5 COLLECTOR TO EMITTER VOLTAGE (VOLTS) I C = 5 A I C = A I C = 5 A T J = 5 C GATE TO EMITTER VOLTAGE (VOLTS) Figure 5. Collector to Emitter Saturation Voltage versus Junction Temperature Figure 6. Collector to Emitter Voltage versus Gate to Emitter Voltage 4

5 NGB8N4CLB, NGB8N4ACLB TYPICAL ELECTRICAL CHARACTERISTICS COLLECTOR TO EMITTER VOLTAGE (VOLTS) I C = 5 A I C = A I C = 5 A T J = 5 C GATE TO EMITTER VOLTAGE (VOLTS) Figure 7. Collector to Emitter Voltage versus Gate to Emitter Voltage C, CAPACITANCE (pf) C iss C oss C rss Figure 8. Capacitance Variation GATE THRESHOLD VOLTAGE (VOLTS) V TH + 4 V TH 4 V TH I L, LATCH CURRENT (AMPS) L = mh L = 3 mh L = 6 mh V CC = 5 V V GE = 5. V R G = 5 75 TEMPERATURE ( C) Figure 9. Gate Threshold Voltage versus Temperature TEMPERATURE ( C) Figure. Minimum Open Secondary Latch Current versus Temperature 3 I L, LATCH CURRENT (AMPS) L = mh L = 3 mh L = 6 mh V CC = 5 V V GE = 5. V R G = SWITCHING TIME ( s) V CC = 3 V V GE = 5. V R G = I C = A L = 3 H t f t d(off) TEMPERATURE ( C) 5 Figure. Typical Open Secondary Latch Current versus Temperature TEMPERATURE ( C) Figure. Inductive Switching Fall Time versus Temperature 5

6 NGB8N4CLB, NGB8N4ACLB TYPICAL ELECTRICAL CHARACTERISTICS COLLECTOR CURRENT (AMPS). DC ms ms ms s COLLECTOR CURRENT (AMPS). DC ms s ms ms. COLLECTOR EMITTER VOLTAGE (VOLTS) Figure 3. Single Pulse Safe Operating Area (Mounted on an Infinite Heatsink at T A = 5 C). COLLECTOR EMITTER VOLTAGE (VOLTS) Figure 4. Single Pulse Safe Operating Area (Mounted on an Infinite Heatsink at T A = 5 C) COLLECTOR CURRENT (AMPS). t = ms, D =.5 t = ms, D =. t = 3 ms, D =.3 COLLECTOR CURRENT (AMPS). t = ms, D =.5 t = ms, D =. t = 3 ms, D =.3. COLLECTOR EMITTER VOLTAGE (VOLTS) Figure 5. Pulse Train Safe Operating Area (Mounted on an Infinite Heatsink at T C = 5 C). COLLECTOR EMITTER VOLTAGE (VOLTS) Figure 6. Pulse Train Safe Operating Area (Mounted on an Infinite Heatsink at T C = 5 C) V BATT = 6 V V BATT = 6 V R L =. R L =. L = H L = H 5. V V IN R G = k 5. V V IN R G = k R S = 55 m Figure 7. Circuit Configuration for Short Circuit Test # Figure 8. Circuit Configuration for Short Circuit Test # 6

7 NGB8N4CLB, NGB8N4ACLB TYPICAL ELECTRICAL CHARACTERISTICS Duty Cycle =.5 R(t), TRANSIENT THERMAL RESISTANCE ( C/Watt) Single Pulse P (pk) t t DUTY CYCLE, D = t /t D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T J(pk) T A = P (pk) R JA (t) R JC R(t) for t. s t,time (S) Figure 9. Transient Thermal Resistance (Non normalized Junction to Ambient mounted on minimum pad area) 7

8 NGB8N4CLB, NGB8N4ACLB PACKAGE DIMENSIONS D PAK 3 CASE 48B 4 ISSUE L T SEATING PLANE B 4 3 G S D 3 PL.3 (.5) M T B M K C H E V W A W J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: INCH B THRU 48B 3 OBSOLETE, NEW STANDARD 48B 4. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D E F G. BSC.54 BSC H J K L M N.97 REF 5. REF P.79 REF. REF R.39 REF.99 REF S V VARIABLE CONFIGURATION ZONE R N U P STYLE 4: PIN. GATE. COLLECTOR 3. EMITTER 4. COLLECTOR L L L M M M F F F VIEW W W VIEW W W VIEW W W 3 SOLDERING FOOTPRINT* X 3.54 X PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 8

9 NGB8N4CLB, NGB8N4ACLB ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 87 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative NGB8N4CLB/D

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