MC33201, MC33202, MC33204, NCV33202, NCV Low Voltage, Rail-to-Rail Operational Amplifiers

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MC332, MC3322, MC3324, NCV3322, NCV3324 Low Voltage, Rail-to-Rail Operational Amplifiers The MC332/2/4 family of operational amplifiers provide railtorail operation on both the input and output.

1 MC332, MC3322, MC3324, NCV3322, NCV3324 Low Voltage, Rail-to-Rail Operational Amplifiers The MC332/2/4 family of operational amplifiers provide railtorail operation on both the input and output. The inputs can be driven as high as 2 mv beyond the supply rails without phase reversal on the outputs, and the output can swing within 5 mv of each rail. This railtorail operation enables the user to make full use of the supply voltage range available. It is designed to work at very low supply voltages (±.9 V) yet can operate with a supply of up to +2 V and ground. Output current boosting techniques provide a high output current capability while keeping the drain current of the amplifier to a minimum. Also, the combination of low noise and distortion with a high slew rate and drive capability make this an ideal amplifier for audio applications. Features Low Voltage, Single Supply Operation (+. V and Ground to +2 V and Ground) Input Voltage Range Includes both Supply Rails Output Voltage Swings within 5 mv of both Rails No Phase Reversal on the Output for Overdriven Input Signals High Output Current (I SC = ma, Typ) Low Supply Current (I D =.9 ma, Typ) 6 Output Drive Capability Extended Operating Temperature Ranges (4 to +5 C and 55 to +25 C) Typical Gain Bandwidth Product = 2.2 MHz NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements PbFree Packages are Available PDIP P, VP SUFFIX CASE 626 SOIC D, VD SUFFIX CASE 75 Micro DM SUFFIX CASE 46A PDIP4 P, VP SUFFIX CASE 646 SOIC4 D, VD SUFFIX CASE 75A TSSOP4 DTB SUFFIX CASE 94G ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2 December, 2 Rev. 6 Publication Order Number: MC332/D

2 MC332, MC3322, MC3324, NCV3322, NCV3324 PIN CONNECTIONS Inputs NC V EE MC332 All Case Styles (Top View) MC3322 All Case Styles NC V CC Output NC Output Inputs V CC MC3324 All Case Styles Inputs (Top View) Output Output 4 Inputs 4 V EE Inputs 3 Output 3 Output V CC Inputs V EE Output 2 Inputs 2 (Top View) V CC V CC V EE V CC V in- V out V in+ V CC V EE This device contains 7 active transistors (each amplifier). Figure. Circuit Schematic (Each Amplifier) 2

3 MC332, MC3322, MC3324, NCV3322, NCV3324 MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage (V CC to V EE ) V S +3 V Input Differential Voltage Range V IDR Note V Common Mode Input Voltage Range (Note 2) V CM V CC +.5 V to V EE.5 V Output Short Circuit Duration t s Note 3 sec Maximum Junction Temperature T J +5 C Storage Temperature T stg 65 to +5 C Maximum Power Dissipation P D Note 3 mw V DC ELECTRICAL CHARACTERISTICS () Characteristic V CC = 2. V V CC = 3.3 V V CC = 5. V Unit Input Offset Voltage V IO (max) MC332 MC3322, NCV3322 MC3324, NCV3324 ±. ± ±2 ±. ± ±2 ± 6. ±. ± mv Output Voltage Swing V OH (R L = k) V OL (R L = k).9. Power Supply Current per Amplifier (I D ) Specifications at V CC = 3.3 V are guaranteed by the 2. V and 5. V tests. V EE = GND V min V max ma DC ELECTRICAL CHARACTERISTICS (V CC = + 5. V, V EE = Ground,, unless otherwise noted.) Characteristic Figure Symbol Min Typ Max Unit Input Offset Voltage (V CM V to.5 V, V CM. V to 5. V) 3 V IO mv MC332: T A = + 25 C 6. MC332: T A = 4 to +5 C 9. MC332V: T A = 55 to +25 C 3 MC3322/NCV3322: T A = + 25 C. MC3322/NCV3322: T A = 4 to +5 C MC3322V: T A = 55 to +25 C 4 NCV3322V: T A = 55 to +25 C (Note 4) 4 MC3324: T A = + 25 C MC3324: T A = 4 to +5 C 3 MC3324V: T A = 55 to +25 C 7 NCV3324: T A = 55 to +25 C 7 Input Offset Voltage Temperature Coefficient (R S = 5 ) T A = 4 to +5 C T A = 55 to +25 C Input Bias Current (V CM = V to.5 V, V CM =. V to 5. V) T A = + 25 C T A = 4 to +5 C T A = 55 to +25 C 4 V IO /T 5, 6 I IB Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. The differential input voltage of each amplifier is limited by two internal parallel backtoback diodes. For additional differential input voltage range, use current limiting resistors in series with the input pins. 2. The input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. Therefore, the voltage on either input must not exceed either supply rail by more than 5 mv. 3. Power dissipation must be considered to ensure maximum junction temperature (T J ) is not exceeded. (See Figure 2) 4. All NCV devices are qualified for Automotive use V/ C na 3

4 MC332, MC3322, MC3324, NCV3322, NCV3324 DC ELECTRICAL CHARACTERISTICS (cont.) (V CC = + 5. V, V EE = Ground,, unless otherwise noted.) Characteristic Figure Symbol Min Typ Max Unit Input Offset Current (V CM = V to.5 V, V CM =. V to 5. V) T A = + 25 C T A = 4 to +5 C T A = 55 to +25 C Common Mode Input Voltage Range V ICR V EE V CC V Large Signal Voltage Gain (V CC = + 5. V, V EE = 5. V) R L = k R L = 6 Output Voltage Swing (V ID = ±.2 V) R L = k R L = k R L = 6 R L = 6 I IO 7 A VOL 5 25, 9, Common Mode Rejection (V in = V to 5. V) CMR 6 9 db Power Supply Rejection Ratio V CC /V EE = 5. V/GND to 3. V/GND V OH V OL V OH V OL 2 PSRR Output Short Circuit Current (Source and Sink) 3, 4 I SC 5 ma na kv/v V V/V Power Supply Current per Amplifier (V O = V) T A = 4 to +5 C T A = 55 to +25 C 5 I D ma AC ELECTRICAL CHARACTERISTICS (V CC = + 5. V, V EE = Ground,, unless otherwise noted.) Characteristic Figure Symbol Min Typ Max Unit Slew Rate 6, 26 SR V/s (V S = ± 2.5 V, V O = 2. V to + 2. V, R L = 2. k, A V = +.).5. Gain Bandwidth Product (f = khz) 7 GBW 2.2 MHz Gain Margin (R L = 6, C L = pf) 2, 2, 22 A M 2 db Phase Margin (R L = 6, C L = pf) 2, 2, 22 M 65 Deg Channel Separation (f =. Hz to 2 khz, A V = ) 23 CS 9 db Power Bandwidth (V O = 4. V pp, R L = 6, THD %) BW P 2 khz Total Harmonic Distortion (R L = 6, V O =. V pp, A V =.) f =. khz f = khz 24 THD.2. % Open Loop Output Impedance (V O = V, f = 2. MHz, A V = ) Z O Differential Input Resistance (V CM = V) R in 2 k Differential Input Capacitance (V CM = V) C in. pf Equivalent Input Noise Voltage (R S = ) f = Hz f =. khz 25 e n 25 2 nv/ Hz Equivalent Input Noise Current f = Hz f =. khz 25 i n..2 pa/ Hz 4

5 MC332, MC3322, MC3324, NCV3322, NCV3324 P D(max), MAXIMUM POWER DISSIPATION (mw and 4 Pin DIP Pkg SOIC- Pkg TSSOP-4 Pkg SO-4 Pkg T A, AMBIENT TEMPERATURE ( C) PERCENTAGE OF AMPLIFIERS (%) V IO, INPUT OFFSET VOLTAGE (mv) 36 amplifiers tested from 3 (MC3324) wafer lots V CC = +5. V V EE = Gnd DIP Package Figure 2. Maximum Power Dissipation versus Temperature Figure 3. Input Offset Voltage Distribution PERCENTAGE OF AMPLIFIERS (%) amplifiers tested from 3 (MC3324) wafer lots V CC = +5. V V EE = Gnd DIP Package TC V, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (V/ C) IO I IB, INPUT BIAS CURRENT (na) V CM >. V V CM = V to.5 V T A, AMBIENT TEMPERATURE ( C) V CC = +5. V V EE = Gnd Figure 4. Input Offset Voltage Temperature Coefficient Distribution Figure 5. Input Bias Current versus Temperature I IB, INPUT BIAS CURRENT (na) V CC = 2 V V EE = Gnd V CM, INPUT COMMON MODE VOLTAGE (V) T A, AMBIENT TEMPERATURE ( C) A VOL, OPEN LOOP VOLTAGE GAIN (kv/v) V CC = +5. V V EE = Gnd R L = 6 V O =.5 V to 4.5 V Figure 6. Input Bias Current versus Common Mode Voltage Figure 7. Open Loop Voltage Gain versus Temperature 5

6 MC332, MC3322, MC3324, NCV3322, NCV3324 V O, OUTPUT VOLTAGE (V pp ) V O, OUTPUT VOLTAGE (V pp ) 2 V CC R L = 6 T A = -55 C V CC -.2 V. V CC -.4 V V CC = +5. V V EE +.4 V V EE = -5. V 2. V EE +.2 V T A = -55 C V EE ±. ±2. ±3. ±4. ±5. ± V CC, V EE SUPPLY VOLTAGE (V) I L, LOAD CURRENT (ma) V CC = +6. V V EE = -6. V R L = 6 A V = +. Figure. Output Voltage Swing versus Supply Voltage. k k k. M f, FREQUENCY (Hz), OUTPUT SATURATION VOLTAGE (V) SAT V CMR, COMMON MODE REJECTION (db) Figure 9. Output Saturation Voltage versus Load Current V CC = +6. V V EE = -6. V T A = -55 to +25 C. k k k. M f, FREQUENCY (Hz) Figure. Output Voltage versus Frequency Figure. Common Mode Rejection versus Frequency PSR, POWER SUPPLY REJECTION (db) 2 Source PSR+ 6 6 Sink PSR V CC = +6. V 2 V CC = +6. V V EE = -6. V V EE = -6. V T A = -55 to +25 C. k k k. M f, FREQUENCY (Hz) I SC, OUTPUT SHORT CIRCUIT CURRENT (ma) V out, OUTPUT VOLTAGE (V) Figure 2. Power Supply Rejection versus Frequency Figure 3. Output Short Circuit Current versus Output Voltage 6

7 I MC332, MC3322, MC3324, NCV3322, NCV3324 I SC, OUTPUT SHORT CIRCUIT CURRENT (ma) V CC = +5. V V EE = Gnd Source Sink ± T A, AMBIENT TEMPERATURE ( C) Figure 4. Output Short Circuit Current versus Temperature, SUPPLY CURRENT PER AMPLIFIER (ma) CC T A = -55 C ±. ±2. ±3. ±4. ±5. ±6. V CC, V EE, SUPPLY VOLTAGE (V) Figure 5. Supply Current per Amplifier versus Supply Voltage with No Load SR, SLEW RATE (V/ μ s) V CC = +2.5 V V EE = -2.5 V V O = ±2. V +Slew Rate -Slew Rate T A, AMBIENT TEMPERATURE ( C) GBW, GAIN BANDWIDTH PRODUCT (MHz) V CC = +2.5 V V EE = -2.5 V f = khz T A, AMBIENT TEMPERATURE ( C) Figure 6. Slew Rate versus Temperature Figure 7. Gain Bandwidth Product versus Temperature A, OPEN LOOP VOLTAGE GAIN (db) VOL 7 5 V S = ±6. V R L = A 2A 2B A - Phase, C L = pf 6 - B - Gain, C L = pf B 2A - Phase, C L = 3 pf 2 2B - Gain, C L = 3 pf k k. M M f, FREQUENCY (Hz) 4, EXCESS PHASE (DEGREES) A VOL, OPEN LOOP VOLTAGE GAIN (db) f, FREQUENCY (Hz) C L = pf R L = 6 - A - Phase, V S = ±6. V 2B B - Gain, V S = ±6. V 2A - Phase, V S = ±. V 2B - Gain, V S = ±. V k k. M M 2A B A 4 2 6, EXCESS PHASE (DEGREES) Figure. Voltage Gain and Phase versus Frequency Figure 9. Voltage Gain and Phase versus Frequency 7

8 MC332, MC3322, MC3324, NCV3322, NCV3324, PHASE MARGIN (DEGREES) M, PHASE MARGIN (DEGREES) M Gain Margin T A, AMBIENT TEMPERATURE ( C) V CC = +6. V V EE = -6. V R L = 6 C L = pf Figure 2. Gain and Phase Margin versus Temperature Phase Margin Gain Margin Phase Margin C L, CAPACITIVE LOAD (pf) V CC = +6. V V EE = -6. V R L = 6 A V = A M, GAIN MARGIN (db) A M, GAIN MARGIN (db), PHASE MARGIN (DEGREES) M R T, DIFFERENTIAL SOURCE RESISTANCE () Figure 2. Gain and Phase Margin versus Differential Source Resistance 4. A V = V CC = +6. V V EE = -6. V V 2. O =. V pp. k. k k CS, CHANNEL SEPARATION (db) Phase Margin V CC = +6. V V EE = -6. V Gain Margin. k k k A V = f, FREQUENCY (Hz) A M, GAIN MARGIN (db) Figure 22. Gain and Phase Margin versus Capacitive Load Figure 23. Channel Separation versus Frequency THD, TOTAL HARMONIC DISTORTION (%)... V CC = +5. V V O = 2. V pp A V = A V = A V = V EE = -5. V R L = 6 e, EQUIVALENT INPUT NOISE VOLTAGE (nv/ Hz) A V =. Noise Current.. k k k. k k k f, FREQUENCY (Hz) Figure 24. Total Harmonic Distortion versus Frequency n f, FREQUENCY (Hz) Noise Voltage V CC = +6. V V EE = -6. V Figure 25. Equivalent Input Noise Voltage and Current versus Frequency i, INPUT REFERRED NOISE CURRENT (pa/ Hz) n

MC332, MC3322, MC3324, NCV3322, NCV3324 DETAILED OPERATING DESCRIPTION General Information The MC332/2/4 family of operational amplifiers are unique in their ability to swing railtorail on both the

Operation is guaranteed over an extended temperature range and at supply voltages of 2. V, 3.3 V and 5. V and ground.

The MC332/2/4 are guaranteed not to latch or phase reverse over the entire common mode range, however, the inputs should not be allowed to exceed maximum ratings.

9 MC332, MC3322, MC3324, NCV3322, NCV3324 DETAILED OPERATING DESCRIPTION General Information The MC332/2/4 family of operational amplifiers are unique in their ability to swing railtorail on both the input and the output with a completely bipolar design. This offers low noise, high output current capability and a wide common mode input voltage range even with low supply voltages. Operation is guaranteed over an extended temperature range and at supply voltages of 2. V, 3.3 V and 5. V and ground. Since the common mode input voltage range extends from V CC to V EE, it can be operated with either single or split voltage supplies. The MC332/2/4 are guaranteed not to latch or phase reverse over the entire common mode range, however, the inputs should not be allowed to exceed maximum ratings. Circuit Information Railtorail performance is achieved at the input of the amplifiers by using parallel NPNPNP differential input stages. When the inputs are within mv of the negative rail, the PNP stage is on. When the inputs are more than mv greater than V EE, the NPN stage is on. This switching of input pairs will cause a reversal of input bias currents (see Figure 6). Also, slight differences in offset voltage may be noted between the NPN and PNP pairs. Crosscoupling techniques have been used to keep this change to a minimum. In addition to its railtorail performance, the output stage is current boosted to provide ma of output current, enabling the op amp to drive 6 loads. Because of this high output current capability, care should be taken not to exceed the 5 C maximum junction temperature., OUTPUT VOLTAGE (2. mv/div) V CC = +6. V V EE = -6. V R L = 6 C L = pf, OUTPUT VOLTAGE (5 mv/div) V CC = +6. V V EE = -6. V R L = 6 C L = pf V O V O t, TIME (5. s/div) t, TIME ( s/div) Figure 26. Noninverting Amplifier Slew Rate Figure 27. Small Signal Transient Response, OUTPUT VOLTAGE (2. V/DIV) V CC = +6. V V EE = -6. V R L = 6 C L = pf A V =. V O t, TIME ( s/div) Figure 2. Large Signal Transient Response Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will selfalign when subjected to a solder reflow process. 9

10 MC332, MC3322, MC3324, NCV3322, NCV3324 ORDERING INFORMATION Operational Amplifier Function Device Operating Temperature Range Package Shipping MC332DG SOIC (PbFree) 9 Units / Rail MC332DR2G SOIC (PbFree) 25 / Tape & Reel Single MC332P MC332PG T A = 4 to +5 C PDIP PDIP (PbFree) 5 Units / Rail MC332VDR2G SOIC (PbFree) 25 / Tape & Reel MC332VDG MC3322DG T A = 55 to 25 C SOIC (PbFree) SOIC (PbFree) 9 Units / Rail MC3322DR2G SOIC (PbFree) 25 / Tape & Reel MC3322DMR2G NCV3322DMR2G* T A = 4 to +5 C Micro (PbFree) 4 / Tape & Reel MC3322P PDIP Dual MC3322PG MC3322VDG PDIP (PbFree) SOIC (PbFree) 5 Units / Rail 9 Units / Rail MC3322VDR2G NCV3322VDR2G* T A = 55 to 25 C SOIC (PbFree) SOIC (PbFree) 25 / Tape & Reel MC3322VP MC3322VPG PDIP PDIP (PbFree) 5 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *All NCV devices are qualified for automotive use.

11 MC332, MC3322, MC3324, NCV3322, NCV3324 ORDERING INFORMATION (continued) Operational Amplifier Function Device Operating Temperature Range Package Shipping MC3324DG SO4 (PbFree) 55 Units / Rail Quad MC3324DR2G SO4 25 Units / Tape & Reel (PbFree) T A = 4 to +5 C MC3324DTBG TSSOP4* 96 Units / Rail MC3324DTBR2G TSSOP4* 25 Units / Tape & Reel MC3324PG MC3324VDG PDIP4 (PbFree) SO4 (PbFree) 25 Units / Rail 55 Units / Rail MC3324VDR2G SO4 (PbFree) NCV3324DR2G** T A = 55 to 25 C SO4 (PbFree) 25 Units / Tape & Reel NCV3324DTBR2G** MC3324VPG TSSOP4* PDIP4 (PbFree) 25 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *This package is inherently PbFree. **NCV3322 and NCV3324 are qualified for automotive use.

12 MC332, MC3322, MC3324, NCV3322, NCV3324 MARKING DIAGRAMS SOIC D SUFFIX CASE x ALYW SOIC VD SUFFIX CASE 75 32xV ALYW * PDIP P SUFFIX CASE 626 MC332xP AWL YYWWG PDIP VP SUFFIX CASE 626 MC3322VP AWL YYWWG Micro DM SUFFIX CASE 46A 322 AYW ** 4 SO4 D SUFFIX CASE 75A MC3324DG AWLYWW 4 SO4 VD SUFFIX CASE 75A 4 PDIP4 P SUFFIX CASE PDIP4 VP SUFFIX CASE TSSOP4 DTB SUFFIX CASE 94G 4 MC3324VDG AWLYWW * MC3324P AWLYYWWG MC3324VP AWLYYWWG MC33 24 ALYW MC33 24V ALYW * x = or 2 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = PbFree Package = PbFree Package (Note: Microdot may be in either location) *This marking diagram applies to NCV332xV **This marking diagram applies to NCV3322DMR2G 2

13 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS PDIP P, VP SUFFIX CASE 6265 ISSUE M D D 5 A E NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, CONTROLLING DIMENSION: INCHES. 3. DIMENSION E IS MEASURED WITH THE LEADS RE- STRAINED PARALLEL AT WIDTH E2. 4. DIMENSION E DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. NOTE 5 4 F TOP VIEW e/2 A E c E2 END VIEW NOTE 3 INCHES DIM MIN NOM MAX A.2 A.5 b C...4 D D.5 E MILLIMETERS MIN NOM MAX E E2.3 BSC 7.62 BSC E e. BSC 2.54 BSC L L A e SIDE VIEW C SEATING PLANE X b. M C A E3 END VIEW 3

14 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS SOIC NB CASE 757 ISSUE AK X B Y Z H G A D 5 4 S C.25 (.) M Z Y S X S.25 (.) M SEATING PLANE Y. (.4) M N X 45 M SOLDERING FOOTPRINT* K J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION.5 (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION THRU 756 ARE OBSOLETE. NEW STANDARD IS 757. MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D G.27 BSC.5 BSC H J K M N S SCALE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 4

15 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS Micro DM SUFFIX CASE 46A2 ISSUE H H E D E NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED.5 (.6) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED.25 (.) PER SIDE A- OBSOLETE, NEW STANDARD 46A-2. PIN ID T SEATING PLANE.3 (.5) e b PL. (.3) M T B S A S A A c L MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A..43 A b c D E e.65 BSC.26 BSC L H E X.4 SOLDERING FOOTPRINT*.3 X X.256 SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5

16 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS PDIP4 CASE 6466 ISSUE P 4 7 B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. T N SEATING PLANE A INCHES MILLIMETERS DIM MIN MAX MIN MAX A B F L C D C F G. BSC 2.54 BSC H J K K J L M H G D 4 PL M N (.5) M 6

17 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS.5 (.6) T.5 (.6) T L. (.4) T SEATING PLANE U U S 2X L/2 PIN IDENT. S D C 4 G 4X K REF A V. (.4) M T U S V S 7 B U H TSSOP4 CASE 94G ISSUE B N N J J F DETAIL E DETAIL E.25 (.) K K M ÇÇÇ ÉÉÉ ÇÇÇ SECTION NN W NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED.5 (.6) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED.25 (.) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE. (.3) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C.2.47 D F G.65 BSC.26 BSC H J J K K L 6.4 BSC.252 BSC M SOLDERING FOOTPRINT* PITCH 4X.36 4X.26 DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7

18 MC332, MC3322, MC3324, NCV3322, NCV3324 PACKAGE DIMENSIONS T SEATING PLANE G A 4 D 4 PL 7 B K P 7 PL C.25 (.) M T B S A S SOIC4 CASE 75A3 ISSUE J.25 (.) M B M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION.5 (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES R X 45 F DIM MIN MAX MIN MAX A B C D M J F G.27 BSC.5 BSC J K M 7 7 P R SOLDERING FOOTPRINT* 4X.5 7X 7.4 4X PITCH Micro is a trademark of International Rectifier. DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 27 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: 3575 ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MC332/D

ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.

ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. The MC3320/2/4 family of operational amplifiers provide railtorail operation on both the input and output. The inputs can be driven as high as 200 mv beyond the supply rails without phase reversal on the