LM321. Single Channel Operational Amplifier

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1 Single Channel Operational Amplifier LM32 is a general purpose, single channel op amp with internal compensation and a true differential input stage. This op amp features a wide supply voltage ranging from 3 V to 32 V for single supplies and ±.5 to ±6 V for split supplies, suiting a variety of applications. LM32 is unity gain stable even with large capacitive loads up to.5 nf. LM32 is available in a space-saving TSOP5/SOT235 package. Features Wide Supply Voltage Range: 3 V to 32 V Short Circuit Protected Outputs True Differential Input Stage Low Input Bias Currents Internally Compensated Single and Split Supply Operation Unity Gain Stable with.5 nf Capacitive Load This Device is Pb-Free, Halogen Free/BFR Free and is RoHS Compliant IN+ VEE IN TSOP5 CASE 483 PIN CONNECTION VCC OUT Typical Applications Gain Stage Active Filter Signal Processing MARKING DIAGRAM 5 ADYAYW ADY = Specific Device Code A = Assembly Location Y = Year W = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping LM32SN3TG TSOP5 (PbFree) 3 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8/D. Semiconductor Components Industries, LLC, 25 June, 27 Rev. 3 Publication Order Number: LM32/D

2 Table. ABSOLUTE MAXIMUM RATINGS (Over operating free-air temperature, unless otherwise stated) Parameter Rating Unit Supply Voltage 36 V INPUT AND OUTPUT PINS Input Voltage V EE.3 to 32 V Input Current ± ma Output Short Circuit Duration (Note ) Continuous TEMPERATURE Operating Temperature 4 to +25 C Storage Temperature 65 to +5 C Junction Temperature 65 to +5 C ESD RATINGS (Note 2) Human Body Model (HBM) 2 V Charged Device Model (CDM) 8 V Machine Model (MM) V OTHER RATINGS Latch-Up Current (Note 3) ma MSL Level Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. Short circuits can cause excessive heating and eventual destruction. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JEDEC standard: JESD22A4 ESD Machine Model tested per JEDEC standard: JESD22A5 3. Latch-up Current tested per JEDEC standard: JESD78 Table 2. THERMAL INFORMATION (Note 4) Parameter Symbol Package Value Unit Junction to Ambient JA TSOP5/SOT C/W 4. As mounted on an mm FR4 PCB with 65 mm 2 and 2 oz (.34 mm) thick copper heat spreader. Following JEDEC JESD/EIA 5., 5.2, 5.3 test guidelines. Table 3. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Range Unit Supply Voltage (V CC V EE ) V S 3 to 32 V Specified Operating Range T A 4 to 85 C Common Mode Input Voltage Range V CM V EE to V CC.7 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2

3 Table 4. ELECTRICAL CHARACTERISTICS (At T A = +25 C, R L = k connected to mid-supply, V CM = V OUT = mid-supply, unless otherwise noted. Boldface limits apply over the specified temperature range, T A = 4 C to 85 C, guaranteed by characterization and/or design.) Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage V OS, V CM =V EE to V CC.7 V T A = 25 C T A = 4 C to 85 C mv Offset Voltage Drift vs Temp V OS / T T A = 4 C to 85 C 7 V/ C Input Bias Current I IB T A = 25 C T A = 4 C to 85 C 5 na Input Offset Current I OS T A = 25 C T A = 4 C to 85 C 5 na Common Mode Rejection Ratio CMRR V CM = V EE to V CC.7 V db Input Resistance R IN Differential Common Mode 85 3 G Input Capacitance C IN Differential Common Mode.6.6 pf OUTPUT CHARACTERISTICS Open Loop Voltage Gain A VOL db Open Loop Output Impedance Z OUT_OL f = UGBW, I O = ma,2 Output Voltage High V OH R L = 2 k to V EE V CC.8 R L = k to V EE V CC.8 V CC.4 V CC.4 V Output Voltage Low V OL R L = k to V CC V EE +.8 V EE +. V Output Current Capability I O Sinking Current V S = 5 V 2 2 ma Output Current Capability I O Sourcing Current V S = 5 V Capacitive Load Drive C L Phase Margin = 5,5 pf NOISE PERFORMANCE Voltage Noise Density e N f IN = khz 4 nv/ Hz DYNAMIC PERFORMANCE Gain Bandwidth Product GBWP C L = 25 pf, R L to V CC 75 khz Gain Margin A M C L = 25 pf, R L to V CC 4 db Phase Margin M C L = 25 pf, R L to V CC 6 Slew Rate SR C L = 25 pf, R L =.3 V/ s POWER SUPPLY Power Supply Rejection Ratio PSRR to 32 V 62 db Quiescent Current I Q No Load.25.5 ma Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions ma 3

4 Table 5. ELECTRICAL CHARACTERISTICS (At T A = +25 C, R L = k connected to mid-supply, V CM = V OUT = mid-supply, unless otherwise noted. Boldface limits apply over the specified temperature range, T A = 4 C to 85 C, guaranteed by characterization and/or design.) Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage V OS V S =32V, V CM =V EE to V CC.7 V T A = 25 C T A = 4 C to 85 C mv Offset Voltage Drift vs Temp V OS / T T A = 4 C to 85 C 7 V/ C Common Mode Rejection Ratio CMRR V CM = V EE to V CC.7 V db OUTPUT CHARACTERISTICS Open Loop Voltage Gain A VOL T A = 25 C T A = 4 C to 85 C 84 db Open Loop Output Impedance Z OUT_OL f = UGBW, I O = ma 2, Output Voltage High V OH R L = 2 k to V EE V CC 2.5 R L = k to V EE V CC 2.5 V CC 2. V CC.5 V Output Voltage Low V OL R L = k to V CC V EE +. V EE +.5 V Capacitive Load Drive C L Phase Margin = 5,5 pf NOISE PERFORMANCE Voltage Noise Density e N f IN = khz 4 nv/ Hz Total Harmonic Distortion + Noise THD+N V S =3V, f IN = khz, R L to V CC.2 % DYNAMIC PERFORMANCE Gain Bandwidth Product GBWP C L = 25 pf, R L to V CC 9 khz Gain Margin A M C L = 25 pf, R L to V CC 8 db Phase Margin M C L = 25 pf, R L to V CC 66 Slew Rate SR C L = 25 pf, R L =.4 V/ s POWER SUPPLY Power Supply Rejection Ratio PSRR to 32 V 62 db Quiescent Current I Q No Load, V S =32V.3.2 ma Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4

5 TYPICAL CHARACTERISTICS A VOL (db) R L = k C L = 25 pf PHASE MARGIN, Gain, Gain, Gain, Phase, Phase, Phase Phase Margin ( ) CMRR (db) k k k M M k k k M Frequency (Hz) Frequency (Hz) Figure. Open Loop Gain and Phase Margin vs. Frequency Figure 2. CMRR vs. Frequency Voltage (V) V S = V R L = k C L = 5 pf Input Output Voltage (V) V S = 5. V R L = k C L = 5 pf Input Output Time ( s) Time ( s) Figure 3. Inverting Large Signal Step Response Figure 4. Inverting Small Signal Step Response Phase Margin ( ) Voltage Noise Density (nv/ Hz) A V = V/V R L = k k k k Load Capacitance (pf) Frequency (Hz) Figure 5. Phase Margin vs. Load Capacitance Figure 6. Voltage Noise Density vs. Frequency 5

6 TYPICAL CHARACTERISTICS.35.3 THD+N (%) Quiescent Current (ma) k k k Frequency (Hz) Temperature ( C) Figure 7. THD+N vs. Frequency Figure 8. Quiescent Current vs. Temperature Input Offset Voltage (mv) T= 4 C Input Offset Voltage (mv) T= 4 C Common Mode Voltage (V) Common Mode Voltage (V) Figure 9. Input Offset Voltage vs. Common Mode Voltage at 3 V Supply Figure. Input Offset Voltage vs. Common Mode Voltage at 5 V Supply Input Offset Voltage (mv) T= 4 C Current (na) V CM = V S /2 I IB I IB+ I OS Common Mode Voltage (V) Temperature ( C) Figure. Input Offset Voltage vs. Common Mode Voltage at 32 V Supply Figure 2. Input Bias and Offset Current vs. Temperature 6

7 TYPICAL CHARACTERISTICS V CC V OH (V) T= 4 C V OL V EE (mv) T= 4 C Output Source Current (ma) Output Sink Current (ma) Figure 3. High Level Output Voltage Swing vs. Output Current at 3 V Supply Figure 4. Low Level Output Voltage Swing vs. Output Current at 3 V Supply 5. 8 V CC V OH (V) T= 4 C V OL V EE (mv) T= 4 C Output Source Current (ma) Output Sink Current (ma) Figure 5. High Level Output Voltage Swing vs. Output Current at 5 V Supply Figure 6. Low Level Output Voltage Swing vs. Output Current at 5 V Supply T= 4 C 7 6 T= 4 C V CC V OH (V) V OL V EE (V) Output Source Current (ma) Figure 7. High Level Output Voltage Swing vs. Output Current at 32 V Supply Output Sink Current (ma) Figure 8. Low Level Output Voltage Swing vs. Output Current at 5 V Supply32 7

8 APPLICATION INFORMATION CIRCUIT DESCRIPTION The LM32 is made using two internally compensated, twostage operational amplifiers. The first stage of each consists of differential input devices Q2 and Q8 with input buffer transistors Q2 and Q7 and the differential to single ended converter Q3 and Q4. The first stage performs not only the first stage gain function but also performs the level shifting and transconductance reduction functions. By reducing the transconductance, a smaller compensation capacitor (only 5. pf) can be employed, thus saving chip area. The transconductance reduction is accomplished by splitting the collectors of Q2 and Q8. Another feature of this input stage is that the input common mode range can include the negative supply or ground, in single supply operation, without saturating either the input devices or the differential to singleended converter. The second stage consists of a standard current source load amplifier stage. Each amplifier is biased from an internalvoltage regulator which has a low temperature coefficient thus giving each amplifier good temperature characteristics as well as excellent power supply rejection. Output Bias Circuitry Q6 Q5 Q4 Q3 Q22 V CC Q9 4 k 5. pf Q2 25 Q23 Q24 Q8 Q2 Inputs Q2 Q7 Q3 Q4 Q2 Q5 Q6 Q26 Q7 Q8 Q9 Q Q Q 2. k Q k V EE /Gnd Figure 9. LM32 Representative Schematic Diagram 8

9 LM32 has a class B output stage, which is comprised of pushpull transistors. This type of output is inherently subject to crossover distortion near midrail where neither push or pull transistors are conducting. Several techniques can be used to minimize crossover distortion. Connecting the output load to either the positive or negative supply rail instead of midrail can reduce the crossover distortion. Additionally, increasing the load resistance relatively decreases the amount of crossover distortion. VCC OUT VEE Figure 2. Simplified Class B Output Figure 2. Sine wave with crossover distortion 9

10 PACKAGE DIMENSIONS TSOP5 CASE 483 ISSUE L 2X 2X.2 NOTE 5 T. B.5 A T B H G A TOP VIEW SIDE VIEW C D 5X.2 C A B S C SEATING PLANE J K DETAIL Z END VIEW M DETAIL Z NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED.5 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN.2 FROM BODY. MILLIMETERS DIM MIN MAX A 3. BSC B.5 BSC C.9. D.25.5 G.95 BSC H.. J..26 K.2.6 M S SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at /site/pdf/patentmarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 952 E. 32nd Pkwy, Aurora, Colorado 8 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative LM32/D

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