MC78LC00 Series. Micropower Voltage Regulator

Transcription

1 Micropower Voltage Regulator The MC78LC00 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The MC78LC00 series features an ultralow quiescent current of. A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, and resistors for setting output voltage. The MC78LC00 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0. F. The device is housed in the microminiature Thin SOT35 surface mount package and SOT89, 3 pin. Standard voltage versions are.5,.8,.5,.7,.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in 00 mv steps. Features Low Quiescent Current of. A Typical Excellent Line and Load Regulation Maximum Operating Voltage of V Low Output Voltage Option High Accuracy Output Voltage of.5% Industrial Temperature Range of 40 C to 85 C Two Surface Mount Packages (SOT89, 3 Pin, or SOT3, 5 Pin) These are PbFree Devices TSOP5 NTR SUFFIX CASE MARKING DIAGRAMS AND PIN CONNECTIONS SOT89 H SUFFIX CASE 3 TAB 3 4 N/C 3 XXX AYW (Top View) XXAYW 5 N/C Tab Typical Applications Battery Powered Instruments HandHeld Instruments Camcorders and Cameras 3 V O (Top View) (Tab is connected to Pin ) XXX= Specific Device Code A = Assembly Location Y = Year W = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 0 of this data sheet. V ref This device contains 8 active transistors. Figure. Representative Block Diagram Semiconductor Components Industries, LLC, 009 Publication Order Number: MC78LC00/D

2 ÁÁÁ PIN FUNCTION DESCRIPTION Á ÁÁ Pin No. Pin Name ÁÁ Description Á ÁÁ ÁÁ Power supply ground Á ÁÁ ÁÁ Positive power supply input voltage Á 3 ÁÁ ÁÁ Regulated Output Á 4 ÁÁ N/C ÁÁ No Internal Connection Á 5 ÁÁ N/C ÁÁ No Internal Connection MAXIMUM RATINGS Rating Symbol Value Unit Á Input Voltage ÁÁÁ V Output Voltage 0.3 to +0.3 V Power Dissipation and Thermal Characteristics Case 4830 (Thin SOT35) NTR Suffix Power T A = 85 C Thermal Resistance, JunctiontoAmbient Case 3 (SOT89) H Suffix Power T A = 5 C Thermal Resistance, JunctiontoAmbient Á Operating Junction Temperature Á Operating Ambient Temperature Á Storage Temperature Á Lead Soldering 60 C P D R JA P D R JA T J T A T stg T solder mw C/W 900 mw C/W +5 C 40 to +85 C 55 to +50 C sec 0 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

3 ELECTRICAL CHARACTERISTICS ( = (nom.) +.0 V, C in =.0 F, C out =.0 F, T J = 5 C, unless otherwise noted.) (Note ) HT SUFFIX Output Voltage 30HT Suffix ( = 5.0 V) 33HT Suffix ( = 5.0 V) 40HT Suffix ( = 6.0 V) 50HT Suffix ( = 7.0 V) Characteristic Symbol Min Typ Max Unit V ÁÁÁ %/V Line Regulation Reg line Á = [V O +.0] V to 0 V, I O =.0 ma ÁÁÁ Load Regulation (I O =.0 to 0 ma) Reg 30HT Suffix ( = 5.0 V) load mv Á ÁÁÁ 33HT Suffix (V in = 6.0 V) HT Suffix ( Á = 7.0 V) HT Suffix ( = 8.0 V) Á ÁÁÁ Output Current (Note ) 30HT Suffix ( I O Á ma = 5.0 V) HT Suffix ( = 6.0 V) 35 Á 50 ÁÁÁ 40HT Suffix (V in = 7.0 V) HT Suffix ( = 8.0 V) 55 Á 80 ÁÁÁ Dropout Voltage V O Á mv 30HT Suffix (I O =.0 ma) HT Suffix (I O =.0 ma) Á ÁÁÁ 40HT Suffix (I O =.0 ma) HT Suffix (I O Á =.0 ma) 5 38 Quiescent Current I CC Á A 30HT Suffix ( = 5.0 V) 33HT Suffix ( Á. 3.3 ÁÁÁ = 5.0 V) HT Suffix ( = 6.0 V) Á. 3.6 ÁÁÁ 50HT Suffix ( = 7.0 V) ÁÁÁ Output Voltage Temperature Coefficient T C ±00 7. This device series contains ESD protection and exceeds the following tests: Human Body Model 000 V per MILSTD883, Method 305 Machine Model Method 00 V 8. Latch up capability (85 C) 00 ma 9. Maximum package power dissipation limits must be observed. PD T J(max) TA R JA 0. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible..output Current is measured when = V O 3% where V O = at I out = 0 ma. ppm/ C DEFINITIONS Load Regulation The change in output voltage for a change in output current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 5 C. Depending on the ambient power dissipation and thus the maximum available output current. 4

4 ORDERING INFORMATION Device Nominal Output Voltage Marking Package Shipping MC78LC5NTR.5 LAG Thin SOT35 MC78LC5NTRG.5 LAG Thin SOT35 MC78LC8NTR.8 LAH Thin SOT35 MC78LC8NTRG.8 LAH Thin SOT35 MC78LC5NTR.5 LAI Thin SOT35 MC78LC5NTRG.5 LAI Thin SOT35 MC78LC7NTR.7 LAJ Thin SOT35 MC78LC7NTRG.7 LAJ Thin SOT35 MC78LC8NTR.8 LAK Thin SOT35 MC78LC8NTRG.8 LAK Thin SOT Units/7 Tape & Reel MC78LC30NTR 3.0 LAL Thin SOT35 MC78LC30NTRG 3.0 LAL Thin SOT35 MC78LC33NTR 3.3 LAM Thin SOT35 MC78LC33NTRG 3.3 LAM Thin SOT35 MC78LC40NTR 4.0 LEC Thin SOT35 MC78LC40NTRG 4.0 LEC Thin SOT35 MC78LC50NTR 5.0 LAN Thin SOT35 MC78LC50NTRG 5.0 LAN Thin SOT35 MC78LC30HTG 3.0 0C SOT89 MC78LC33HTG 3.3 MC78LC40HTG 4.0 3C 0D SOT89 SOT Units Tape & Reel MC78LC50HTG 5.0 0E SOT89 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. Additional voltages in 00 mv steps are available upon request by contacting your ON Semiconductor representative. 0

5 PACKAGE DIMENSIONS SOT89 H SUFFIX CASE 30 ISSUE C A F C J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: MILLIMETERS OBSOLETE, NEW STANDARD 3-0. L K G H D B 0.0 M T B S E PL 0.0 M T B S A S A S T SEATING PLANE MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D E F G.50 BSC BSC H 3.00 BSC 0.8 BSC J K L MC78LC00/D