NCP ma, Low Dropout Voltage Regulator with Reverse Current Protection
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1 ma, Low Dropout Voltage Regulator with Reverse Current Protection The NCP66 is a CMOS ma low dropout linear regulator with a wide input voltage range of.5 V to 6 V, low supply current and high output voltage accuracy. Through an ECO mode selector pin the device can be operated in low power mode to reduce quiescent current or fast mode for better transient response and lower dropout. The NCP66 is suitable for applications where the VOUT pin voltage may be higher than the VIN pin voltage as it is protected against reverse current. The device has a maximum input voltage tolerance of 8 V, comes with or without an auto discharge feature on the output, and is available in a choice of XDFN, SOT89 and SOT packages. Features Operating Input Voltage Range:.5 V to 6. V Output Voltage Range:. to 5. V (available in. V steps) Low Quiescent current (6 ua typ.) in Low Power Mode Dropout Voltage: 55 mv typ. (I OUT = ma, V OUT = 5 V, Fast Mode) 7 mv typ. (I OUT = ma, V OUT = 5 V, Low Power Mode) Output Voltage Accuracy: ±.5% (Fast Mode) ±.5% (Low Power Mode) High PSRR: 6 db at khz Current Fold Back Protection Thermal Shutdown Protection Stable with a C IN =. F and C OUT =.7 F Ceramic Capacitors Available in.6x.6 XDFN6, SOT89 5 and SOT 5 Package These are Pb Free Devices Typical Applications Digital Home Appliances Audio Visual Equipment Battery backup circuits VIN C VIN CE AE NCP66x GND VOUT C 7 VOUT XDFN6 CASE 7AC 6 SOT 89 5 CASE 58AB SOT 5 CASE MARKING DIAGRAMS XXX, XXXX = Specific Device Code M, MM = Date Code A = Assembly Location Y = Year W = Work Week = Pb Free Package (*Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. XXX XMM XXX XMM XXXMM Figure. Typical Application Schematic Semiconductor Components Industries, LLC, August, Rev. Publication Order Number: NCP66/D
2 NCP66Hxxxxxxxx ECO Thermal Shutdown NCP66Dxxxxxxxx ECO Thermal Shutdown VIN VOUT VIN VOUT Vref Vref Short Protection Short Protection CE Peak Current Protection Reverse Detector GND CE Peak Current Protection Reverse Detector GND Figure. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN (Note ) Pin No. SOT89 Pin No. SOT Pin Name Description ECO Mode selector pin. H fast mode, L low power mode 5 5 VIN Input voltage pin VOUT Output voltage pin 5 GND Ground pin 6 CE Chip enable pin ( H enabled) NC No connection. Tab is connected to GND. Tab should be connected to GND, but leaving it unconnected is also acceptable
3 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note ) V IN. to 8. V Output Voltage VOUT. to 8. V Chip Enable Input VCE. to 8. V Mode Selector Input V ECO. to V IN V Output Current I OUT ma Power Dissipation XDFN P D 6 mw Power Dissipation SOT89 9 Power Dissipation SOT Maximum Junction Temperature T J(MAX) 5 C Operation Temperature Rnage T A to 85 C Storage Temperature T STG 55 to 5 C ESD Capability, Human Body Model (Note ) ESD HBM V ESD Capability, Machine Model (Note ) ESD MM V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC Q (EIA/JESD A) ESD Machine Model tested per AEC Q (EIA/JESD A5) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, XDFN6 Thermal Resistance, Junction to Air Thermal Characteristics, SOT 5 Thermal Resistance, Junction to Air Thermal Characteristics, SOT89 5 Thermal Resistance, Junction to Air R JA 56 C/W R JA 8 C/W R JA C/W ELECTRICAL CHARACTERISTICS C T A 85 C; V IN = V CE = V OUT(NOM) +. V; I OUT = ma, C IN =. F, C OUT =.7 F, unless otherwise noted. Typical values are at T A = +5 C Parameter Test Conditions Symbol Min Typ Max Unit Operating Input Voltage. V V OUT <. V VIN.5. V. V V OUT 6. Output Voltage Fast Mode, V ECO = V IN TA = +5 C VOUT x.985 x.5 V Low Power Mode, V ECO = GND T A = to 85 C x.97 x. TA = +5 C x.975 x.5 T A = to 85 C x.96 x. Output Voltage Deviation Fast mode to Low Power mode and back V OUT.5.5 % Output Voltage Temp. Coefficient T A = to 85 C ±8 ppm/ C Line Regulation V IN = VOUT +.5 V to 6 V (If V OUT <. V,.5 V to V) Line Reg.. %/V
4 ELECTRICAL CHARACTERISTICS C T A 85 C; V IN = V CE = V OUT(NOM) +. V; I OUT = ma, C IN =. F, C OUT =.7 F, unless otherwise noted. Typical values are at T A = +5 C Parameter Test Conditions Symbol Load Regulation IOUT = ma to ma Fast Mode, V ECO = V IN Load Reg 5 mv Dropout Voltage Low Power, V ECO = GND Min Typ Max 6 I OUT = ma, Fast. V V OUT <.5 V VDO..8 V Mode, V ECO = V IN.5 V V OUT <. V..5 I OUT = ma, Low Power Mode, V ECO = GND. V V OUT < 5. V V V OUT <. V V V OUT..6. V V OUT <.5 V.5..5 V V OUT <. V..5. V V OUT < 5. V V V OUT <. V.7.. V V OUT..6 Output Current IOUT ma Short Current Limit V OUT = V I SC 5 ma Quiescent Current V ECO = V IN, IOUT = ma IQ 5 A Standby Current CE and ECO Pin Threshold Voltage Power Supply Rejection Ratio VIN = V ECO = V OUT +. V, V IN =. V PP, f = khz Output Noise Voltage V ECO = GND, IOUT = ma 6 5 V IN = 6. V (If V OUT <. V, V IN =. V), T A = 5 C Unit ISTB. A CE Input Voltage H VCEH.6 V IN V CE Input Voltage L VCEL.6 V IN = 6. V, V OUT =. V, I OUT = ma, f = Hz to khz. V V OUT < 5. V PSRR 7 db 5. V V OUT 6 VN 9 V rms Thermal Shutdown Temperature T SD 5 C Thermal Shutdown Release Temperature T SDR C Reverse Current V OUT >.6 V, V V IN 6 V I REV. A Low Output Nch Tr. On Resistance D Version only, V IN = 5 V, V CE = V, V OUT =. V R LOW 5
5 V V 5.5 V V IN =.5 V V 5.5 V V IN =.5 V. 6. V.8 V..8 V Figure. Output Voltage vs. Output Current. V, Figure. Output Voltage vs. Output Current. V, V 6. V 5.5 V V IN =.8 V 5. V V 6.5 V 6. V V IN =.8 V 5. V Figure 5. Output Voltage vs. Output Current. V, Figure 6. Output Voltage vs. Output Current. V, V 7. V 6. V V IN = 5.7 V 5.5 V... V IN = 5.7 V 8. V 7. V 5.5 V 6. V Figure 7. Output Voltage vs. Output Current 5. V, Figure 8. Output Voltage vs. Output Current 5. V, 5
6 .5.5. T J = 85 C. V DO (V) C C V DO (V) C T J = 85 C.. C Figure 9. Dropout Voltage vs. Output Current. V Version, Figure. Dropout Voltage vs. Output Current. V Version, V DO (V) C T J = 85 C C V DO (V) C T J = 85 C.. C Figure. Dropout Voltage vs. Output Current. V Version, Figure. Dropout Voltage vs. Output Current. V Version, V DO (V).6. 5 C T J = 85 C V DO (V).6. 5 C T J = 85 C. C. C Figure. Dropout Voltage vs. Output Current 5. V Version, Figure. Dropout Voltage vs. Output Current 5. V Version, 6
7 .5.. V IN = 6. V I OUT = ma.5.. V IN = 6. V I OUT = ma T J, JUNCTION TEMPERATURE ( C) Figure 5. Output Voltage vs. Temperature,. V Version, T J, JUNCTION TEMPERATURE ( C) Figure 6. Output Voltage vs. Temperature,. V Version,.5.. V IN = 6. V I OUT = ma.5.. V IN = 6. V I OUT = ma T J, JUNCTION TEMPERATURE ( C) Figure 7. Output Voltage vs. Temperature,. V Version, T J, JUNCTION TEMPERATURE ( C) Figure 8. Output Voltage vs. Temperature,. V Version, V IN = 8. V I OUT = ma V IN = 8. V I OUT = ma T J, JUNCTION TEMPERATURE ( C) Figure 9. Output Voltage vs. Temperature, 5. V Version, T J, JUNCTION TEMPERATURE ( C) Figure. Output Voltage vs. Temperature, 5. V Version, 7
8 I GND ( A) I GND ( A) I GND ( A) V IN, INPUT VOLTAGE (V) Figure. Supply Current vs. Input Voltage,. V Version, V IN, INPUT VOLTAGE (V) Figure. Supply Current vs. Input Voltage,. V Version, V IN, INPUT VOLTAGE (V) Figure 5. Supply Current vs. Input Voltage, 5. V Version, I GND ( A) I GND ( A) I GND ( A) V IN, INPUT VOLTAGE (V) Figure. Supply Current vs. Input Voltage,. V Version, V IN, INPUT VOLTAGE (V) Figure. Supply Current vs. Input Voltage,. V Version, V IN, INPUT VOLTAGE (V) Figure 6. Supply Current vs. Input Voltage, 5. V Version, 8
9 9 8 7 V IN = 6. V V IN = 6. V I GND ( A) 6 5 I GND ( A) T J, JUNCTION TEMPERATURE ( C) Figure 7. Supply Current vs. Temperature,. V Version, T J, JUNCTION TEMPERATURE ( C) Figure 8. Supply Current vs. Temperature,. V Version, V IN = 6. V V IN = 6. V I GND ( A) 6 5 I GND ( A) T J, JUNCTION TEMPERATURE ( C) Figure 9. Supply Current vs. Temperature,. V Version, T J, JUNCTION TEMPERATURE ( C) Figure. Supply Current vs. Temperature,. V Version, V IN = 8. V V IN = 8. V I GND ( A) 6 5 I GND ( A) T J, JUNCTION TEMPERATURE ( C) Figure. Supply Current vs. Temperature, 5. V Version, T J, JUNCTION TEMPERATURE ( C) Figure. Supply Current vs. Temperature, 5. V Version, 9
10 I OUT = 5 ma ma ma ma I OUT = 5 ma ma ma ma V IN, INPUT VOLTAGE (V) V IN, INPUT VOLTAGE (V) Figure. Output Voltage vs. Input Voltage,. V Version, Figure. Output Voltage vs. Input Voltage,. V Version, I OUT = 5 ma..5 I OUT = 5 ma..5 ma ma ma..5 ma ma ma V IN, INPUT VOLTAGE (V) V IN, INPUT VOLTAGE (V) Figure 5. Output Voltage vs. Input Voltage,. V Version, Figure 6. Output Voltage vs. Input Voltage,. V Version, I OUT = 5 ma ma ma ma I OUT = 5 ma ma. ma ma V IN, INPUT VOLTAGE (V) V IN, INPUT VOLTAGE (V) Figure 7. Output Voltage vs. Input Voltage, 5. V Version, Figure 8. Output Voltage vs. Input Voltage, 5. V Version,
11 PSRR (db) I OUT = ma ma PSRR (db) ma I OUT = ma ma ma 5 ma 5 ma. FREQUENCY (khz) Figure 9. PSRR,. V Version, V IN = 6. V,. FREQUENCY (khz) Figure. PSRR,. V Version, V IN = 6. V, PSRR (db) I OUT = ma ma PSRR (db) ma I OUT = ma ma ma 5 ma 5 ma. FREQUENCY (khz) Figure. PSRR,. V Version, V IN = 6. V, 9. FREQUENCY (khz) Figure. PSRR,. V Version, V IN = 6. V, 9 PSRR (db) I OUT = ma ma PSRR (db) ma ma I OUT = ma ma 5 ma. FREQUENCY (khz) Figure. PSRR, 5. V Version, V IN = 8. V, 5 ma. FREQUENCY (khz) Figure. PSRR, 5. V Version, V IN = 8. V,
12 V N ( V rms / Hz)... V N ( V rms / Hz) FREQUENCY (khz) Figure 5. Output Voltage Noise,. V Version, V IN = 6. V, I OUT = ma,.. FREQUENCY (khz) Figure 6. Output Voltage Noise,. V Version, V IN = 6. V, I OUT = ma, V N ( V rms / Hz)... V N ( V rms / Hz) FREQUENCY (khz) Figure 7. Output Voltage Noise,. V version, V IN = 6. V, I OUT = ma,.. FREQUENCY (khz) Figure 8. Output Voltage Noise,. V Version, V IN = 6. V, I OUT = ma, V N ( V rms / Hz) V N ( V rms / Hz) FREQUENCY (khz) Figure 9. Output Voltage Noise, 5. V Version, V IN = 8. V, I OUT = ma, FREQUENCY (khz) Figure 5. Output Voltage Noise, 5. V Version, V IN = 8. V, I OUT = ma,
13 t ( s) Figure 5. Line Transients,. V Version, t R = t F = 5 s, I OUT = ma, V IN (V) t ( s) Figure 5. Line Transients,. V Version, t R = t F = 5 s, I OUT = ma, V IN (V) Figure 5. Line Transients,. V Version, t R = t F = 5 s, I OUT = ma, V IN (V)
14 t ( s) Figure 5. Line Transients,. V Version, t R = t F = 5 s, I OUT = ma, V IN (V) Figure 55. Line Transients, 5. V Version, t R = t F = 5 s, I OUT = ma, V IN (V) t ( s) Figure 56. Line Transients, 5. V Version, t R = t F = 5 s, I OUT = ma, V IN (V)
15 Figure 57. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, t ( s) Figure 58. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, Figure 59. Load transients,. V version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, 5 5 5
16 t ( s) Figure 6. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, Figure 6. Load Transients, 5. V Version, I OUT = ma, t R = t F =.5 s, V IN = 8. V, t ( s) Figure 6. Load Transients, 5. V Version, I OUT = ma, t R = t F =.5 s, V IN = 8. V,
17 Figure 6. Load Transients,. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 6. V, t ( s) Figure 6. Load Transients,. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 6. V, Figure 65. Load Transients,. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 6. V,
18 t ( s) Figure 66. Load Transients,. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 6. V, Figure 67. Load Transients, 5. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 8. V, t ( s) Figure 68. Load Transients, 5. V Version, I OUT = 5 ma, t R = t F =.5 s, V IN = 8. V,
19 Figure 69. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, Figure 7. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, Figure 7. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, 5 5 9
20 Figure 7. Load Transients,. V Version, I OUT = ma, t R = t F =.5 s, V IN = 6. V, Figure 7. Load Transients, 5. V Version, I OUT = ma, t R = t F =.5 s, V IN = 8. V, Figure 7. Load Transients, 5. V Version, I OUT = ma, t R = t F =.5 s, V IN = 8. V,
21 Chip Enable 9 6 I OUT = ma I OUT = 5 ma I OUT = ma Figure 75. Start up,. V Version, V IN = 6. V, V CE (V) Chip Enable 9 6 I OUT = ma I OUT = ma I OUT = 5 ma t ( s) Figure 76. Start up,. V Version, V IN = 6. V, V CE (V) Chip Enable I OUT = ma I OUT = ma I OUT = 5 ma Figure 77. Start up,. V Version, V IN = 6. V, V CE (V)
22 Chip Enable I OUT = ma I OUT = ma I OUT = 5 ma t ( s) Figure 78. Start up,. V Version, V IN = 6. V, I OUT = ma I OUT = ma I OUT = 5 ma Chip Enable Figure 79. Start-up, 5. V Version, V IN = 8. V, I OUT = ma Chip Enable I OUT = ma I OUT = 5 ma t ( s) Figure 8. Start-up, 5. V Version, V IN = 8. V, 8 8 V CE (V) V CE (V) V CE (V)
23 Chip Enable 9 6 I OUT = ma IOUT = ma I OUT = 5 ma Figure 8. Shutdown,. V Version D, V IN = 6. V Chip Enable I OUT = ma I OUT = ma I OUT = 5 ma Figure 8. Shutdown,. V Version D, V IN = 6. V I OUT = ma Chip Enable I OUT = ma I OUT = 5 ma Figure 8. Shutdown, 5. V Version D, V IN = 8. V V CE (V) V CE (V) V CE (V)
24 APPLICATION INFORMATION A typical application circuit for NCP66 series is shown in Figure 8. VIN C VIN CE AE NCP66x GND VOUT Figure 8. Typical Application Schematic C 7 VOUT Input Decoupling Capacitor (C) A. F (or larger) ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP66. Higher capacitor values and lower ESR improves line transient response. Output Decoupling Capacitor (C) A.7 F (or larger) ceramic output decoupling capacitor is sufficient to achieve stable operation of the IC. It is necessary to use a capacitor with good frequency characteristics and low ESR. The capacitor should be connected as close as possible to the output and ground pins. Larger capacitor values and lower ESR improves dynamic parameters. Enable Operation The enable pin CE may be used to turn the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down resistor. If the enable function is not needed, connect the CE pin to VIN. Output Discharger The D version of the NCP66 includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Current Limit This regulator includes fold-back type current limit circuit. This type of protection doesn t limit current up to current capability in normal operation, but when over current occurs, output voltage and current decrease until over current condition ends. Typical characteristics of this protection type can be observed in the Output Voltage versus Output Current graphs shown in the typical characteristics chapter of this datasheet. ECO Function The IC can be switched between two modes by ECO pin. One mode is low power mode, where IC s self current consumption is low, but IC has slower dynamic behavior or in to fast mode, where current consumption is higher, but the IC has better dynamic response and lower dropout voltage. Do not leave the ECO pin unconnected or between V CEH and V CEL voltage levels as this may cause indefinite and unexpected currents flows internally. Thermal Considerations As power across the IC increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature effect the rate of temperature rise for the part. That is to say, when the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The IC includes internal thermal shutdown circuit that stops the regulator operating if the junction temperature is higher than 5 C. After shutdown, when the junction temperature decreases below C, the voltage regulator would restarts. As long as the high power dissipation condition exists, the regulator will start and stop repeatedly to protect itself against overheating. Care should be taken in the PCB layout to try to avoid this temperature cycling condition. PCB Layout Make the VIN and GND lines as large as possible. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C and C as close as possible to the IC, and make wiring as short as possible. The tab under the XDFN package is internally connected to GND: it is best practice to connect it to GND on the PCB, but leaving it unconnected is also acceptable.
25 ORDERING INFORMATION Device Nominal Output Voltage Description Marking Package Shipping NCP66DSNTG. V Auto discharge 6 SOT / Tape & Reel NCP66DSNTG. V Auto discharge 6 SOT NCP66DSN5TG.5 V Auto discharge 65 SOT NCP66DSN5TG 5. V Auto discharge 65 SOT NCP66HSNTG. V Standard SOT NCP66HSNTG. V Standard SOT NCP66HSN5TG.5 V Standard 5 SOT NCP66HSN5TG 5. V Standard 5 SOT NCP66DMXTCG. V Auto discharge CH XDFN NCP66DMXTCG. V Auto discharge CH XDFN NCP66DMX5TCG.5 V Auto discharge CH6 XDFN NCP66DMX5TCG 5. V Auto discharge CH XDFN NCP66HMXTCG. V Standard CF XDFN NCP66HMXTCG. V Standard CF XDFN NCP66HMX5TCG.5 V Standard CF6 XDFN NCP66HMX5TCG 5. V Standard CF XDFN / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel 5 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. *To order other package and voltage variants, please contact your ON Semiconductor sales representative. 5
26 PACKAGE DIMENSIONS XDFN6.6x.6,.5P CASE 7AC ISSUE O X.5 C PIN ONE REFERENCE X NOTE.5 C.5 C D ÉÉÉ ÉÉÉ.5 C TOP VIEW SIDE VIEW D A B E A A C SEATING PLANE.5 M C A B L NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.5M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS DIM MIN MAX A. A..5 b.5.5 D.6 BSC D.5.5 E.6 BSC E E.5 REF e.5 BSC L.5.5 L.5 BSC RECOMMENDED MOUNTING FOOTPRINT*.7 X L X E E.5 M C A B 6 6X b e.5 M C A B BOTTOM VIEW 6X.8 PACKAGE OUTLINE.5 PITCH.77 6X.6.79 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6
27 PACKAGE DIMENSIONS SOT 89, 5 LEAD CASE 58AB ISSUE O E D H NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.5M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. LEAD THICKNESS INCLUDES LEAD FINISH.. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. DIMENSIONS L, L, L, L, L5, AND H ARE MEAS- URED AT DATUM PLANE C. C A TOP VIEW SIDE VIEW c. C MILLIMETERS DIM MIN MAX A..6 b..5 b.7.57 c..5 D..6 D..8 E..6 e..6 H.5.5 L..5 L.8. L.95.5 L.65.5 L5..6 e b e b L RECOMMENDED MOUNTING FOOTPRINT* L X L L 5 D BOTTOM VIEW L X.5 X.6 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7
28 PACKAGE DIMENSIONS SOT 5 LEAD CASE ISSUE A A E L e 5 D B E 5X b. M C B S A S A.5 S C C A RECOMMENDED SOLDERING FOOTPRINT* A L NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.5M, 99.. CONTROLLING DIMENSIONS: MILLIMETERS.. DATUM C IS THE SEATING PLANE. MILLIMETERS DIM MIN MAX A A.. A.. b..5 c..5 D.7. E.5. E.5.8 e.95 BSC L L X.85 5X PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 87 USA Phone: or 8 86 Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 79 9 Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative NCP66/D
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