id9309 Ultra-Low Noise Ultra-Fast 300mA LDO Regulator Features

Transcription

1 Ultra-Low Noise Ultra-Fast 300mA LDO Regulator General Description The id9309 is a 300mA, low dropout and low noise linear regulator with high ripple rejection ratio and fast turn-on time. It has fixed output voltage ranging from 1.5V to 3.3V. The id9309 includes a reference voltage source, an error amplifier, driver transistors and an internal current limiter. The current limiter s holdback circuit operates as a short protection. The id9309 works well with low ESR ceramic capacitors, suitable for portable RF and wireless battery-powered applications with stringent space requirements and demanding performance. It also offers ultra low noise output and has low quiescent current. Ordering Information id Packing R: Tape and Reel Package: A20:SOT-89-3 A21:SOT-89-3-L TYPE A30:SOT-23-3 B30-TSOT-23-3 A51:SOT-23-5 B51:TSOT-23-5 C40:SC-82 FA4:UDFN-4 Output Voltage Voltage Code Features Ultra-Low-Noise Application Wide 2.5V to 7V Operating Range Quick Start-up Current Limiting Protection Thermal Shutdown Protection Low Dropout : 300mA High Ripple Rejection 65dB@1kHz Standby Current Less Than 0.1μA Auto Discharge Applications Battery-Powered Equipment Portable Instruments Digital Camera WLAN Communication Hand-Held Instruments Marking Information For marking information, please contact our sales representative directly or through distributor around your location. Other voltage outputs may be available. For further details, please contact an idesyn sales or distributor. Feb Rev 1.1

2 Typical Application Circuit V IN C IN=1µF V IN V OUT C OUT =1µF V OUT Enable EN GND 100K Figure 1. SC-82 / UDFN-4 Package V IN C IN=1µF V IN V OUT C OUT =1µF V OUT Enable EN NC GND x 100K Figure 2. (T)SOT-23-5 Package V OUT C OUT =1µF V OUT V IN C IN=1µF V IN GND Figure 3. (T)SOT-23-3 and SOT-89-3 Package Feb Rev 1.1

3 Absolute Maximum Ratings (Note1) Recommended Operating Conditions Supply Voltage V IN 8V Input Voltage V IN 2.5V to 7V Power Dissipation, P T A =25 C EN Input Voltage 0V to 7V SOT mW Junction Temperature -40 C to 125 C SC mW Ambient Operating Temperature -40 C to 85 C (T)SOT-23-3 & (T)SOT mW UDFN-4 400mW Thermal Resistance, θ JA SOT C/W SC C/W (T)SOT-23-3 & (T)SOT C/W UDFN C/W Lead Temperature 260 C Storage Temperature -65 C to 150 C ESD Susceptibility HBM (Human Body Mode) 2kV MM (Machine Mode) 200V Feb Rev 1.1

4 Electrical Characteristics (Unless otherwise specified V IN =V OUT +1V, T A =25 C) Parameters Symbol Condition Min Typ Max Units Operating Voltage Range (Note 2) V IN 7 V Standby Current ISBY V EN = GND,Shutdown μa Supply Current Limit ILIMIT R LOAD = 1Ω 600 ma Quiescent Current I Q 85 μa V OUT = 1.5V mv V OUT = 1.8V mv V OUT = 2.5V mv Dropout Voltage (Note 3) VDROP I OUT = 300mA V OUT = 2.7V mv mv V OUT = 3.0V mv V OUT = 3.1V mv V OUT = 3.3V mv EN input Bias Current I IBSD V EN = GND or V IN na Line Regulation ΔV LINE V IN = (V OUT +1V) to 5.5V, I OUT = 1mA 10 mv/v Load Regulation ΔV LOAD 1mA < I OUT < 300mA mv 1mA < I OUT < 300mA (UDFN-4) mv Output Noise Voltage eno 10Hz to 100kHz, I OUT = 200mA, C OUT = 1μF 100 μv RMS Thermal Shutdown Temperature TSD 165 C Thermal Shutdown Temperature Hysteresis ΔTSD 30 C Output Voltage Accuracy ΔV OUT I OUT =1mA % Fast Discharge N-MOSFET Turn On Resistance RDISCHARGE VIN = 4V, VEN = 0V 35 Ω EN Threshold Logic-Low V V IL V IN = 3V to 5.5V,Shutdown 0.4 V Logic-High V V IH V IN = 3V to 5.5V,Start-up 1.2 V Power Supply f = 100Hz -70 PSRR C Rejection Rate OUT = 1μF, I OUT = 10mA f = 10kHz -55 db id9309 Note 1: Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2: VIN (MIN) =VOUT+VDROPOUT Note 3: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100mV below the target value of VOUT. Pin Configurations (Top View) SC-82 (T)SOT-23-3 SOT-89-3-L TYPE SOT-89-3 Feb Rev 1.1

5 Pin Configurations (Cont.) (Top View) (Top View) (Bottom View) (T)SOT-23-5 UDFN-4 UDFN-4 Pin Description Pin Name Pin Function EN GND VOUT VIN NC Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ resistor connected to GND when the control signal is floating. Ground Output Voltage Input Voltage No Internal Connection (Floating or Connecting to GND) Function Block Diagram EN Shutdown and Logic Control VIN V REF - + Error Amplifier MOS Driver Current-Limit and Thermal Protection VOUT GND Feb Rev 1.1

6 Typical Operating Characteristics (Unless otherwise specified V IN =V OUT +1V, T A =25 C) Quiescent Current vs. Input Voltage Current Limit vs. Input Voltage Quiescent Current (μa) I LOAD = 0mA Current Limit (ma) V OUT Connect 1Ω to GND Input Voltage (V) Input Voltage (V) Dropout Voltage vs. Load Current Shutdown Current vs. Input Voltage Dropout Voltage (mv) Shutdown Current (μa) EN = 0V Load Current (ma) Input Voltage (V) Load Regulation Line Regulation V IN = 5V 2.83 I LOAD = 1mA Output Voltage (V) V IN = 3.3V Output Voltage (V) I LOAD = 300 ma Load Current (ma) Input Voltage (V) Feb Rev 1.1

7 80 PSRR 100 Region of Stable C OUT ESR vs. Load Current PSRR (-db) V OUT 2.8V, I LOAD = 10mA V OUT 2.8V, I LOAD = 50mA COUT -ESR (Ω) Instable Stable V IN =3.8V DC +0.5V P-P ; C IN =C OUT =1 F K K 100K Instable C IN = C OUT =1 F Frequency (Hz) Load Current (ma) Enable Threshold Voltage (V) Enable Threshold Voltage vs. Temperature V OUT OFF to ON V OUT ON to OFF Temperature ( C) Enable Threshold Voltage (V) Enable Threshold Voltage vs. Input Voltage ON OFF Input Voltage (V) Start-up from EN Start-up from EN EN-DC (1V/Div) EN-DC (1V/Div) V OUT -DC (2V/Div) V IN = 3.8V I LOAD = 0mA V OUT -DC (1V/Div) V IN = 3.8V I LOAD = 300mA Time (20μs/Div) Time (200μs/Div) Feb Rev 1.1

8 Shutdown from EN Shutdown from EN EN -DC (1V/Div) EN -DC (1V/Div) V OUT -DC (2V/Div) V IN = 3.8V I LOAD = 0mA V OUT -DC (2V/Div) V IN = 3.8V I LOAD = 300mA Time (100μs/Div) Time (10μs/Div) Load Transient Response Load Transient Response V OUT -AC (20mV/Div) V OUT -AC (20mV/Div) 9mV 12.2mV I LOAD -DC (100mA/Div) V IN = EN = 3.8V I LOAD = 1mA to 150mA I LOAD -DC (200mA/Div) V IN = EN = 3.8V I LOAD = 1mA to 300mA Time (200μs/Div) Time (200μs/Div) Line Transient Response Line Transient Response 7.8 mv 7.6 mv V OUT (20mV/Div) V OUT (20mV/Div) V IN (1V/Div) V IN = 4.0V to 5.0V, I LOAD = 1mA V IN (1V/Div) VIN = 4.0V to 5.0V, I LOAD = 300mA Time (1ms/Div) Time (1ms/Div) Feb Rev 1.1

9 Application Information Capacitor Selection and Regulator Stability Input Capacitor An input capacitance of 1μF is required between the device input pin and ground directly (the amount of the capacitance may be increased without limit). The input capacitor MUST be located less than 1 cm from the device to assure input stability (see PCB Layout Section). A lower ESR capacitor allows the use of less capacitance, while higher ESR type (like aluminum electrolytic) requires more capacitance. Capacitor types (aluminum, ceramic and tantalum) can be mixed in parallel, but the total equivalent input capacitance/esr must be defined as above for stable operation. There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance is 1μF over the entire operating range. Output Capacitor The id9309 is designed specifically to work with very small ceramic output capacitors. The minimum capacitance recommended (temperature characteristics of X7R, X5R, Z5U or Y5V) is within the 1μF to 10μF range with 5mΩ to 50mΩ ESR range ceramic capacitor between LDO output and GND for transient stability, but it may be increased without limit. Higher capacitance values help to improve transient response. The output capacitor's ESR is critical because it forms a zero to provide phase lead which is required for loop drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics under VIH and VIL. The ON/OFF signal may come from either CMOS output, or an open-collector output with pull-up resistor to the device input voltage or another logic supply. The highlevel voltage may exceed the device input voltage, but must remain within the absolute maximum ratings for the EN pin. Operating Region and Power Dissipation Since the id9309 is a linear regulator, its power dissipation is always given by P = I OUT (V IN V OUT ). The maximum power dissipation is given by: P D(MAX) = (T J T A ) /θ JA =(125 C -25 C)/250 C /W = 400mW Where (T J T A ) is the temperature difference the id9309 die and the ambient air, θ JA is the thermal resistance of the chosen package to the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. In the case of a SOT-23-3 package, the thermal resistance is typically 250 C /Watt. Refer to Figure 4 & 5 for the id9309 valid operating region (Safe Operating Area) and refer to Figure 6 for maximum power dissipation information of SOT The die attachment area of the id9309 lead frame is connected to pin 2, which is the GND pin. Therefore, the GND pin of id9309 can dissipate the heat from the die very effectively. To improve the maximum power providing capability, connect the GND pin to ground using a large ground plane near the GND pin. stability. Enable Function The id9309 is shut down by pulling the EN pin low and turned on by driving the input high. If the shutdown feature is not required, the EN pin should be tied to VIN to keep the regulator on at all times (the EN pin MUST NOT be left floating). To assure proper operation, the signal source used to Feb Rev 1.1

10 Output Current IOUT (ma) Safe Operation Area of I OUT =150mA [Power Dissipation Limit] Still air SOT-23-3 package Mounted on recommended footprint (θ JA =250 C/W) T A =85 C T A =55 C T A =25 C Input-Output Voltage Differential V IN -V OUT (V) Fig. 4 Power Dissipation PD (W) Maximum Power Dissipation SOT SOT-23-3 / (T)SOT-23-5 / UDFN4 SC Ambient Temperature T A ( ) Fig Safe Operation Area of I OUT =300mA [Power Dissipation Limit] Still air SOT-23-3 package Mounted on recommended footprint (θ JA =250 C/W) Output Current IOUT (ma) T A =25 C 200 T A =55 C T A =85 C Input-Output Voltage Differential V IN -V OUT (V) Fig. 5 Feb Rev 1.1

11 Packaging SOT-89-3 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A b b C D D HE E e H S e Feb Rev 1.1

12 SOT-23-3 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A A b C D E e (TYP) H L Θ Feb Rev 1.1

13 TSOT-23-3 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A A b C D E e (TYP) H L Θ Feb Rev 1.1

14 SOT-23-5 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A A b C D E e (TYP) H L Θ e (TYP) Feb Rev 1.1

15 TSOT-23-5 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A A A b C D E e (TYP) (TYP) --- H L Θ e (TYP) Feb Rev 1.1

16 SC-82 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN NOM MAX MIN NOM MAX A A A b b C D E E e 0.65 BSC BSC. e BSC BSC. e BSC BSC. L REF REF. Feb Rev 1.1

17 UDFN-4 SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCH MIN. NOM. MAX. MIN. NOM. MAX. A A REF REF b D D E E e 0.65 BSC BSC L L Feb Rev 1.1

18 Footprints SOT-89-3 Number of Footprint Dimension (mm) Package Tolerance PIN P1 P2 A B B1 C D D1 D2 M SOT ±0.10 (T)SOT-23-3 Package Number of Footprint Dimension (mm) PIN P1 P2 A B C D M Tolerance SOT ±0.10 Feb Rev 1.1

19 (T)SOT-23-5 Package Number of Footprint Dimension (mm) PIN P1 P2 A B C D M Tolerance (T)SOT ±0.10 SC-82 Package Number of Footprint Dimension (mm) PIN P1 P2 A B C D D1 M Tolerance SC ±0.10 Feb Rev 1.1

20 UDFN-4 Number of Footprint Dimension (mm) Package Tolerance PIN P1 P2 P3 A B C D M UDFN ±0.10 Feb Rev 1.1