SGM mA, High Voltage Regulators

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1 Preliminary Datasheet SGM2203 GENERAL DESCRIPTION The SGM2203 series is a set of low power high voltage regulators implemented in CMOS technology which can provide 150mA output current. The device allows input voltage as high as 36V. The SGM2203 series is available in several fixed output voltages. CMOS technology ensures low dropout voltage and low quiescent current. Although designed primarily as fixed voltage regulators, the device can be used with external components to obtain variable output voltages. The SGM2203 series is available in Green SOT-23 and SOT-89-3 packages. It operates over an ambient temperature range of -40 to +85. FEATURES Low Power Consumption 150mA Nominal Output Current Low Dropout Voltage Low Temperature Coefficient High Input Voltage (up to 36V) Output Voltage Accuracy: 3% Fixed Output Voltage Versions: 0.8V to 4.7V with 0.1V per Step 5V to 12V with 0.25V per Step -40 to +85 Operating Temperature Range Available in Green SOT-23 and SOT-89-3 Packages APPLICATIONS Battery-Powered Equipment Communication Equipment Audio/Video Equipment TYPICAL APPLICATION V IN VIN SGM2203 VOUT C IN 1μF GND C OUT 1μF Common Common Figure 1. Typical Application Circuit September 16, 2015

2 PACKAGE/ORDERING INFORMATION MODEL (V) PACKAGE DESCRIPTION ORDERING NUMBER PACKAGE MARKING PACKING OPTION SGM SOT-23 SGM YN3LG/TR SW0XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW1XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW2XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW3XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW4XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW5XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW6XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW7XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW8XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SW9XX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SWAXX Tape and Reel, 3000 SGM SOT-23 SGM YN3LG/TR SWBXX Tape and Reel, 3000 SGM SOT-89-3 SGM YK3G/TR SWCXX Tape and Reel, 1000 SGM SOT-89-3 SGM YK3G/TR SWDXX Tape and Reel, 1000 SGM SOT-89-3 SGM YK3G/TR SWFXX Tape and Reel, 1000 SGM SOT-89-3 SGM YK3G/TR SWEXX Tape and Reel, 1000 SGM SOT-89-3 SGM YK3G/TR G74XX Tape and Reel, 1000 SGM SOT-89-3 SGM YK3G/TR G3FXX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR SX0XX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR G75XX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR SX1XX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR SX2XX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR SX3XX Tape and Reel, 1000 SGM SOT-89-3 (L-Type) SGM YK3LG/TR G40XX Tape and Reel, 1000 NOTES: 1. The devices are available in fixed output voltages from 0.8V to 4.7V with 0.1V per step, and from 5V to 12V with 0.25V per step. 2. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. MARKING INFORMATION YYY X X Date code - Month ("A" = Jan. "B" = Feb. "L" = Dec.) Date code - Year ("A" = 2010, "B" = 2011 ) Chip I.D. For example: SW0FA (2015, January) 2

3 ABSOLUTE MAXIMUM RATINGS VIN to GND V to 44V VOUT to GND V to Min(V IN + 0.3V, 15V) Power Dissipation, P T A = 25 SOT W SOT W Package Thermal Resistance SOT-89-3, θ JA /W SOT-23, θ JA /W Junction Temperature Storage Temperature Range to +150 Lead Temperature (Soldering, 10s) RECOMMENDED OPERATING CONDITIONS Input Voltage Range V to 36V Operating Temperature Range to +85 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. 3

4 PIN CONFIGURATIONS (TOP VIEW) GND 1 3 VIN VOUT 2 SOT-23 GND VIN VOUT GND VIN GND VIN VOUT SOT-89-3 SOT-89-3 (L-Type) PIN DESCRIPTION PIN SOT-23 SOT-89-3 SOT-89-3 (L-Type) NAME FUNCTION GND Ground VOUT VIN Regulator Output. Recommended output capacitor range: 1μF to 10μF. Regulator Input. Up to 36V input voltage. At least 1μF supply bypass capacitor is recommended. 4

5 ELECTRICAL CHARACTERISTICS (V IN = 15V, C IN = C OUT = 1μF, T A = 25, unless otherwise noted.) Input Voltage PARAMETER SYMBOL CONDITIONS TEMP MIN TYP MAX UNITS V IN = 0.8V to 3.2V = 3.3V to 12V Output Voltage Accuracy I OUT = 1mA % Ground Pin Current No load I OUT = 50mA 4.5 Maximum Output Current (1) V IN = + 2V or 4V, whichever is greater ma Dropout Voltage (2) V DROP I OUT = 150mA, 3.3V mv V = 0.8V to 5V OUT V Line Regulation IN = + 2V or 4V to 32V, +25 %/V V V I OUT = 1mA = 6V to 12V 0.05 Load Regulation IN Δ OUT V IN = + 2V or 4V to 32V, I OUT =1mA to 150mA Power Supply Rejection Ratio PSRR = 3.3V, I OUT = 10mA = 0.8V to 5V = 6V to 12V 160 f = 217Hz f = 1kHz 50 Output Voltage Noise e n f = 10Hz to 100kHz, = 3.3V, I OUT = 10mA μv RMS THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis T SHDN 150 ΔT SHDN 20 NOTES: 1. Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient temperature and the other environment factors of system. Attention should be paid to the dropout voltage when V IN < + V DROP. 2. The dropout voltage is defined as V IN -, when is 100mV below the value of for V IN = (NOMINAL) + 2V or 4V, whichever is greater. V μa mv db 5

6 TYPICAL PERFORMANCE CHARACTERISTICS V IN = (NOMINAL) + 2V or 4V, whichever is greater, = 3.3V, C IN = C OUT = 1μF, T A = 25, unless otherwise noted. Dropout Voltage vs. Temperature Dropout Voltage vs. Output Current I OUT = 50mA 2250 Dropout Voltage (mv) Dropout Voltage (mv) Temperature ( ) Output Current (ma) 4 Output Voltage vs. Temperature 500 Maximum Pulse Current vs. Headroom Voltage Output Voltage (mv) = 5.0V = 3.3V = 0.8V Temperature ( ) Maximum Pulse Current (ma) Headroom Voltage (V) Load-Transient Response Line-Transient Response I OUT = 10mA to 100mA V IN = 5.3V to 6.3V, I OUT = 50mA I OUT 100mV/div 50mA/div V IN 1V/div 100mV/div Time (2ms/div) Time (1ms/div) 6

7 TYPICAL PERFORMANCE CHARACTERISTICS V IN = (NOMINAL) + 2V or 4V, whichever is greater, = 3.3V, C IN = C OUT = 1μF, T A = 25, unless otherwise noted. Power-Up/Power-Down Output Waveform Power Ramp-Up/Ramp-Down Output Waveform V IN 2V/div 2V/div V IN 2V/div 2V/div V IN = 0V to 5.3V, I OUT = 50mA Time (2ms/div) V IN = 0V to 6.3V, I OUT = 50mA Time (10ms/div) Output Short Waveform Thermal Protection Waveform 2V/div 100mA/div I OUT 1V/div 100mA/div I OUT Time (50ms/div) Time (4ms/div) Pulse Load Current Output Waveform 100 Power Supply Rejection Ratio vs. Frequency I OUT 1V/div 100mA/div PSRR (db) V IN = 5.3V C IN = 1μF I OUT = 10mA V RIP = 0.2Vp-p 0 Time (20ms/div) Frequency (khz) 7

8 APPLICATION INFORMATION Input Capacitor and Output Capacitor For proper operation, place a ceramic capacitor (C IN ) between 1μF and 10μF between the input pin and ground. Larger values in this range will help improve line transient response. For stable operation, use a ceramic capacitor (C OUT ) between 1μF and 10μF. Larger values in this range will help improve load transient response and reduce noise. Output capacitors of other dielectric types may be used, but are not recommended as their capacitance can deviate greatly from their rated value over temperature. Thermal Considerations When the junction temperature is too high, the thermal protection circuitry sends a signal to the control logic that will shutdown the IC. The IC will restart when the temperature has sufficiently cooled down. The maximum power dissipation is dependent on the thermal resistance of the case and the circuit board, the temperature difference between the die junction and the ambient air, and the rate of air flow. The GND pin must be connected to the ground plane for proper dissipation. 8

9 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23 D b E1 E e e RECOMMENDED LAND PATTERN (Unit: mm) L1 L A A1 A2 θ 0.25 c Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A A b c D E E e BSC BSC e BSC BSC L REF REF L θ TX

10 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-89-3 D D1 A E1 E b L 1.5 e b e1 c RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A b b c D D REF REF E E e TYP TYP e TYP TYP L TX

11 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 P0 W Q1 Q2 Q1 Q2 Q1 Q2 B0 Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P1 A0 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 A0 B0 K0 P0 P1 P2 W Pin1 Quadrant SOT Q3 SOT Q3 DD0001 TX

12 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option) DD0002 TX

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