RT9008 SS. Low Dropout Linear Regulator Controller with Soft-Start. General Description. Features. Ordering Information.

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1 Low Dropout Linear Regulator Controller with Soft-Start General Description The RT98 is a wide input range, low dropout voltage regulator controller with soft-start function. The part drives an external N-MOSFET and can operate with VCC power range from 4.V to 13.V. With this flexible topology and wide input voltage range, the RT98 is suitable for various applications. The soft-start function can reduce the input inrush current by adjusting the external capacitor. The RT98 uses the small footprint package of the SOT Ordering Information RT98 Package Type E : SOT-23-6 Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free) Note : Richtek products are : RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-2. Suitable for use in SnPb or Pb-free soldering processes. Marking Information Features Programmable Output Voltage High Current Driver for High Current FET Adjustable Soft Start Time High Accuracy ±2% Reference Voltage Quick Line and Load Transient Response Enable Control Small Footprint Package SOT-23-6 RoHS Compliant and 1% Lead (Pb)-Free Applications Desktop/Notebook PC DSC Processor Power Sequencing Pin Configurations (TOP VIEW) VCC SS EN GND FB SOT-23-6 For marking information, contact our sales representative directly or through a Richtek distributor located in your area. Typical Application Circuit V CC V IN RT98 SS 6 VCC C CC 4 C SS Q1 C IN Chip Enable 1 EN 2 GND FB 3 R1 + = V REF x ( ) R1 C OUT 1

2 Test Circuit V CC V IN RT98 SS 4 6 VCC C CC 1µF/X7R Chip Enable 1 EN 2 GND FB 3 C SS 1pF/ Ceramic Q1 PHD3 R1 1k 2k C IN 1µF/EC C OUT 1µF/EC Figure 1. Typical Test Circuit Chip Enable V V CC 12V C CC 1µF RT98 6 VCC SS 4 1 EN FB 3 2 GND A C FB V V FB Figure 2. Source/Sink Current Test Circuit Functional Pin Description Pin No. Pin Name Pin Function 1 EN Enable Input Pin. (Active High) 2 GND Ground. 3 FB Output Voltage Feedback Reference Input. 4 SS Soft Start Control. Driver Output. 6 VCC Power Supply Input. Function Block Diagram EN Shutdown Logic.8V Reference + - VCC SS FB GND 2

3 Absolute Maximum Ratings (Note 1) Supply Input Voltage, V CC V Enable Voltage V Power Dissipation, P T A = 2 C SOT W Package Thermal Resistance (Note 2) SOT-23-6, θ JA C/W Lead Temperature (Soldering, 1 sec.) C Junction Temperature Range C Storage Temperature Range C to 1 C ESD Susceptibility (Note 3) HBM (Human Body Mode) kV MM (Machine Mode) V Recommended Operating Conditions (Note 4) Supply Input Voltage, V CC V to 13.V Enable Voltage V to.v Junction Temperature Range C to 12 C Ambient Temperature Range C to 8 C Electrical Characteristics (V CC = 12V, T A = 2 C, unless otherwise specified). Parameter Symbol Test Condition Min Typ Max Unit POR Threshold Voltage V CC_POR V CC Rising V POR Hysteresis V CC_PORHY V V CC Quiescent Current I Q V CC = 12V ma Driver Source Current I _SR V CC = 12V, V = 6V ma Driver Sink Current I _SK V CC = 12V, V = 6V ma Feedback Reference Voltage V REF V CC = 12V, V = V V Reference Line Regulation V REF_Line V CC = 4.V to 1V mv Amplifier Voltage Gain V CC = 12V, No Load -- 7 db PSRR at 1Hz, No Load PSRR V CC = 12V, No Load -- db Chip Enable EN Logic-High Voltage V IH Threshold Logic-Low Voltage V IL --.4 V Shutdown Current I SHDN V CC = 12V, V EN = V μa Soft-Start SS pin Source Current I SS V SS = V 2 1 μa Output Turn-On Rise Time = 1.2V, C OUT = 1μF, C SS = 4.7nF ms 3

4 Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θ JA is measured in the natural convection at T A = 2 C on a low effective thermal conductivity single layer test board of JEDEC 1-3 thermal measurement standard. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. 4

5 Typical Operating Characteristics Quiescent Current vs. Temperature Feedback Voltage vs. Temperature Quiescent Current (ma) VIN = 1.V, VCC = 12V Feedback Voltage (V) VIN = 1.V, VCC = 12V Source Current vs. Temperature 3 Sink Current vs. Temperature Source Current (ma) 4 4 Sink Current (ma) VFB =.6V, VCC = 12V, V = 6V 12 VFB = 1V, VCC = 12V, V = 6V Sink Current vs. Voltage Source Current vs. Voltage 2 Sink Current (ma) Refer to Test Circuit Figure 2 Source Current (ma) VFB = 1V, VCC = 12V VFB =.6V, VCC = 12V Voltage (V) Voltage (V)

6 Soft Start Time vs. C SS EN Threshold Voltage vs. Temperature 1..9 Soft Start Time (us) EN Threshold Voltage (V) Falling Rising C SS (nf) Power On from EN Power Off from EN VIN = V, VOUT = 1.2V, ILOAD = 8mA VEN (V/Div) V EN (V/Div) (mv/div) VIN = V, VOUT = 1.2V, ILOAD = 8mA Time (μs/div) (mv/div) Time (1ms/Div) Load Transient Response VIN = 2.V, VOUT = 1.2V, CIN = COUT = 1μF Line Transient Response VIN = 1.V to 2.V, ILOAD = 1mA CIN = 2.2μF, COUT = 1μF VOUT (mv/div) 2-2 (mv/div) 1-1 I LOAD (A/Div) VIN (V/Div) Time (2μs/Div) Time (1μs/Div) 6

7 Application Information Output Voltage Setting As shown in application circuit, the output voltage can be easy set by the external resistor divider of R1 and. V R1 OUT = V REF (1 + ) Where V REF is the feedback reference voltage (.8V typical). Chip Enable Operation Pull the EN pin low (<.4V) to shutdown the device. During shutdown mode, the standby current is lower than μa. The external capacitor and load current determine the output voltage decay rate. Drive the EN pin high (>1.4V) to turn on the device again. Soft-Start Soft-Start provides for the monotonic, glitch-free turn-on of the regulator. Soft-start limits the input inrush current which may cause a glitch, especially if the source impedance is high. The soft-start is achieved by the controller ramping up to the error amplifier reference input. The RT98 soft-start time is 19us when the soft-start capacitor is 1nF, 92μs for 4.7nF and 1.9ms for 1nF. Capacitors Selection Careful selection of the external capacitors is highly recommended for the best performance of the RT98. Regarding the supply voltage capacitor (C CC ) connecting a ceramic capacitor 1μF between the V CC and GND is a must. The capacitor C CC improves the supply voltage stability to provide chip normal operation. As to the input capacitor,c IN, connecting a 1μF between the V IN, and GND is recommended to increase stability. With large capacitor value could result in better performance for both PSRR and line transient response. When driving external pass element, a 1μF electrolytic capacitor on the output capacitor (C OUT ) is recommended for stability. With larger capacitor, the RT98 can reduce noise the improve load transient response and PSRR. MOSFET Selection and Thermal Consideration The RT98 is designed to drive an external N-MOSFET pass element. MOSFET selection criteria include threshold voltage V GS (V TH ), maximum continuous drain current I D, on-resistance R DS(ON), maximum drain-to-source voltage V DS and package thermal resistance θ JA. The most critical specification is the MOSFET R DS(ON). The maximum allowed R DS(ON) can be calculated by the following formula : R DS(ON) V = V I IN LOAD OUT For example, if the maximum load current is 2A, the input voltage is 1.V and the output voltage is 1.2V, then R DS(ON) = (1.V 1.2V)/2A = 1mΩ. The MOSFET's R DS(ON) have to be selected to be lower than 1mΩ. A Philips PHD3E MOSFET with an R DS(ON) of 12mΩ (typ.) is a good choice. After that, consider the thermal resistance from junction to ambient θ JA of the MOSFET's package. The power dissipation is calculated by : P D = (V IN ) x I LOAD The thermal resistance from junction to ambient θ JA can be calculated by : θ (JA) (T T = ) J A PD In this example, P D = (1.V 1.2V) x 2A =.6W. The PHD3E's θ JA is 7 C/W for its D-PAK package, which translates to a 4 C temperature rise above ambient. The package provides exposed backsides that directly transfer heat to the PCB board. The RT98 maximum power dissipation depends on the thermal resitance of the IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : P D(MAX) = (T J(MAX) T A) / θ JA 7

8 Where T J(MAX) is the maximum operation junction temperature, T A is the ambient temperature and the θ JA is the junction to ambient resistance. For recommended operating conditions specification of the RT98, the maximum junction temperature is 12 C. The junction to ambient thermal resistance θ JA for SOT package is 2 C/W on the standard JEDEC 1-3 single-layer thermal test board. The maximum allowed power dissipation at T A = 2 C can be calculated by following formula : For SOT-23-6 package, P D(MAX) = (12 C 2 C)/(2 C/W) =.4 W The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θ JA. For RT98 package, the Figure 3 of derating curve allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. Layout Considerations There are three critical layout considerations. One is the divider resistors should be located as close to the RT98 FB pin as possible to minimize noise The second is the placement of capacitors. The C IN and C OUT have to be placed near the N-MOSFET for improving performance. The third is the copper area for pass element, it should be as large as possible when the pass element operating under high power situation that could rise the junction temperature. Considering the package thermal resistance limitation, the copper area should be large enough to handle the power dissipation shown as Figure 4. V IN C IN..4 Single Layer PCB C OUT Power Dissipation (W) SOT-23-6 V CC C CC VCC SS EN GND FB R Ambient GND Figure 4. PCB Layout Guide GND Figure 3. Derating Curves for RT98 Package 8

9 Outline Dimension D H L C B b A A1 e Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A A B b C D e H L SOT-23-6 Surface Mount Package Richtek Technology Corporation Headquarter F, No. 2, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)26789 Fax: (8863)26611 Richtek Technology Corporation Taipei Office (Marketing) F, No. 9, Minchiuan Road, Hsintien City Taipei County, Taiwan, R.O.C. Tel: (8862) Fax: (8862) marketing@richtek.com Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. 9

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