NCP170. Ultra Low I Q 150 ma CMOS LDO Regulator

Transcription

1 Ultra Low I Q 15 ma CMOS LDO Regulator The series of CMOS low dropout regulators are designed specifically for portable battery-powered applications which require ultra-low quiescent current. The ultra-low consumption of typ. 5 na ensures long battery life and dynamic transient boost feature improves device transient response for wireless communication applications. The device is available in small 1 1 mm XDFN4, SOT-563 and TSOP-5 packages. Features Operating Input Voltage Range: 2.2 V to 5.5 V Output Voltage Range: 1.2 V to 3.6 V (.1 V Steps) Ultra-Low Quiescent Current Typ..5 A Low Dropout: 17 mv Typ. at 15 ma High Output Voltage Accuracy ±1% Stable with Ceramic Capacitors 1 F Over-Current Protection Thermal Shutdown Protection A for Active Discharge Option Available in Small 1 1 mm XDFN4, SOT 563 and TSOP-5 Packages These Devices are Pb Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications Battery Powered Equipments Portable Communication Equipments Cameras, Image Sensors and Camcorders 1 XDFN4 MX SUFFIX CASE 711AJ 1 SOT 563 XV SUFFIX CASE 463A MARKING DIAGRAMS XX M 1 6 XX M = Specific Device Code = Date Code 1 XDFN4 SOT 563 XX M XX = Specific Device Code M = Month Code = Pb-Free Package TSOP 5 SN SUFFIX CASE 483 *Pb-Free indicator, G or microdot, may or may not be present. 5 1 V IN C IN IN OUT 1 F EN C OUT 1 F GND V OUT 5 1 TSOP 5 XXXAYW Figure 1. Typical Application Schematic XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 21 of this data sheet. Semiconductor Components Industries, LLC, 217 October, 218 Rev Publication Order Number: /D

2 PIN FUNCTION DESCRIPTION Pin No. XDFN4 Pin No. SOT 563 Pin No. TSOP 5 Pin Name Description IN Power Supply Input Voltage GND Power Supply Ground EN Chip Enable Pin (Active H ) OUT Output Pin EPAD EPAD Internally Connected to GND 4 4 NC No Connect 5 GND Power Supply Ground ABSOLUTE MAXIMUM RATINGS Symbol Rating Value Unit V IN Input Voltage (Note 1) 6. V V OUT Output Voltage.3 to V IN +.3 V V CE Chip Enable Input.3 to 6. V T J(MAX) Maximum Junction Temperature 15 C T STG Storage Temperature 55 to 15 C ESD HBM ESD Capability, Human Body Model (Note 2) 2 V ESD MM ESD Capability, Machine Model (Note 2) 2 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q1-2 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q1-3 (EIA/JESD22-A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Symbol Rating Value Unit R JA Thermal Characteristics, Thermal Resistance, Junction-to-Air XDFN4 1 1mm SOT 563 TSOP C/W Figure 2. Simplified Block Diagram 2

3 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 1.2 V ( 4 C T J 85 C; V IN = 2.5 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 3) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 2.5 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 2.5 V mv V DO Dropout Voltage (Note 4) mv I OUT Output Current (Note 5) 15 ma I SC Short Circuit Current Limit V OUT = V 225 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pin Current V EN V IN 5.5 V (Note 6) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 2.2 V + 2 mvpp Modulation I OUT = 15 ma I OUT = 1 ma db V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma, f = 1 Hz to 1 MHz, C OUT = 1 F 85 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 6) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 6) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 6) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Not Characterized at V IN = 2.2 V, V OUT = 1.2 V, I OUT = 15 ma. 5. Respect SOA. 6. Guaranteed by design and characterization. 3

4 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 1.5 V ( 4 C T J 85 C; V IN = 2.5 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 7) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 4.3 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 4.3 V 2 2 mv V DO Dropout Voltage I OUT = 15 ma (Note 8) mv I OUT Output Current (Note 9) 15 ma I SC Short Circuit Current Limit V OUT = V 225 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pin Current V EN V IN 5.5 V (Note 1) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 2.5 V + 2 mvpp Modulation I OUT = 15 ma 57 db V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma, f = 1 Hz to 1 MHz, C OUT = 1 F 9 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 1) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 1) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 1) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Not Characterized at V IN = 2.2 V, V OUT = 1.5 V, I OUT = 15 ma. 9. Respect SOA. 1. Guaranteed by design and characterization. 4

5 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 1.8 V ( 4 C T J 85 C; V IN = 2.8 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 11) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V I OUT < 3 ma V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 2.8 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 2.8 V mv V DO Dropout Voltage I OUT = 15 ma (Note 12) mv I OUT Output Current (Note 13) 15 ma I SC Short Circuit Current Limit V OUT = V 225 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 14) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 2.8 V + 2 mvpp Modulation I OUT = 15 ma V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 57 db 95 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 14) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 14) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 14) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 11. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 12.Characterized when V OUT falls 54 mv below the regulated voltage and only for devices with V OUT = 1.8 V. 13. Respect SOA. 14. Guaranteed by design and characterization. 5

6 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 2.5 V ( 4 C T J 85 C; V IN = 3.5 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 15) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 3.5 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 3.5 V mv V DO Dropout Voltage I OUT = 15 ma (Note 16) mv I OUT Output Current (Note 17) 15 ma I SC Short Circuit Current Limit V OUT = V 225 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 18) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 3.5 V + 2 mvpp Modulation I OUT = 15 ma V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 57 db 125 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 18) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 18) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 18) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 15.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 16.Characterized when V OUT falls 75 mv below the regulated voltage and only for devices with V OUT = 2.5 V. 17. Respect SOA. 18. Guaranteed by design and characterization. 6

7 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 2.8 V ( 4 C T J 85 C; V IN = 3.8 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 19) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 3.8 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 3.8 V mv V DO Dropout Voltage I OUT = 15 ma (Note 2) 21 3 mv I OUT Output Current (Note 21) 15 ma I SC Short Circuit Current Limit V OUT = V 195 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 22) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 3.8 V + 2 mvpp Modulation I OUT = 15 ma V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 4 db 125 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 22) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 22) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 22) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 19.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 2.Characterized when V OUT falls 84 mv below the regulated voltage and only for devices with V OUT = 2.8 V. 21. Respect SOA. 22. Guaranteed by design and characterization. 7

8 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 3. V ( 4 C T J 85 C; V IN = 4. V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 23) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 4. V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 4 V mv V DO Dropout Voltage I OUT = 15 ma (Note 24) mv I OUT Output Current (Note 25) 15 ma I SC Short Circuit Current Limit V OUT = V 195 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 26) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 4. V + 2 mvpp Modulation I OUT = 15 ma V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 47 db 12 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 26) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 26) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 26) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 23.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 24.Characterized when V OUT falls 9 mv below the regulated voltage and only for devices with V OUT = 3. V. 25. Respect SOA. 26. Guaranteed by design and characterization. 8

9 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 3.3 V ( 4 C T J 85 C; V IN = 4.3 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 27) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 4.3 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 4.3 V mv V DO Dropout Voltage I OUT = 15 ma (Note 28) mv I OUT Output Current (Note 29) 15 ma I SC Short Circuit Current Limit V OUT = V 195 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 3) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 4.3 V + 2 mvpp Modulation I OUT = 15 ma V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 41 db 125 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 3) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 3) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 3) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 27.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J =T A =25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 28.Characterized when V OUT falls 99 mv below the regulated voltage and only for devices with V OUT = 3.3 V. 29. Respect SOA. 3. Guaranteed by design and characterization. 9

10 ELECTRICAL CHARACTERISTICS VOLTAGE VERSION 3.6 V ( 4 C T J 85 C; V IN = 4.6 V; I OUT = 1 ma, C IN = C OUT = 1. F, unless otherwise noted. Typical values are at T A = +25 C.) (Note 31) Symbol Parameter Test Conditions Min Typ Max Unit V IN Operating Input Voltage V V OUT Output Voltage T A = +25 C V 4 C T J 85 C Line Reg Line Regulation 4.6 V < V IN 5.5 V, I OUT = 1 ma.5.2 %/V Load Reg Load Regulation ma < I OUT 15 ma, V IN = 4.6 V mv V DO Dropout Voltage I OUT = 15 ma (Note 32) mv I OUT Output Current (Note 33) 15 ma I SC Short Circuit Current Limit V OUT = V 195 ma I Q Quiescent Current I OUT = ma.5.9 A I STB Standby Current V EN = V, T J = 25 C.1.5 A V ENH EN Pin Threshold Voltage EN Input Voltage H 1.2 V V ENL EN Pin Threshold Voltage EN Input Voltage L.4 V I EN EN Pull Down Current V EN V IN 5.5 V (Note 34) 1 na PSRR Power Supply Rejection Ratio f = 1 khz, V IN = 4.6 V + 2 mvpp Modulation I OUT = 15 ma 3 db V NOISE Output Noise Voltage V IN = 5.5 V, I OUT = 1 ma f = 1 Hz to 1 MHz, C OUT = 1 F 13 Vrms R LOW Active Output Discharge Resistance (A option only) V IN = 5.5 V, V EN = V (Note 34) 1 T SD Thermal Shutdown Temperature Temperature Increasing from T J = +25 C (Note 34) 175 C T SDH Thermal Shutdown Hysteresis Temperature Falling from T SD (Note 34) 25 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 31.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T J = T A = 25 C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 32.Characterized when V OUT falls 18 mv below the regulated voltage and only for devices with V OUT = 3.6 V. 33. Respect SOA. 34. Guaranteed by design and characterization. 1

11 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE (V) Vin = 2.2 V 4 Vin = 3. V xxx12tyg Iout = 1 ma 6 8 OUTPUT VOLTAGE (V) Vin = 2.8 V 4 Vin = 3.5 V xxx18tyg Iout = 1 ma 6 8 TEMPERATURE ( C) TEMPERATURE ( C) Figure 3. Output Voltage vs. Temperature, Vout = 1.2 V Figure 4. Output Voltage vs. Temperature, Vout = 1.8 V OUTPUT VOLTAGE (V) Vin = 5. V 2 4 TEMPERATURE ( C) Vin = V xxx3tyg Iout = 1 ma 6 Figure 5. Output Voltage vs. Temperature, Vout = 3. V 8 OUTPUT VOLTAGE (V) Vin = 5. V 2 4 TEMPERATURE ( C) Vin = V xxx36tyg Iout = 1 ma 6 Figure 6. Output Voltage vs. Temperature, Vout = 3.6 V 8 OUTPUT VOLTAGE (V) xxx12tyg Vin = 2.5 V Vin = 3. V Vin = 4. V OUTPUT VOLTAGE (V) xxx18tyg Vin = 4.5 V 8 1 Vin = 2.8 V Vin = 4. V OUTPUT CURRENT (ma) OUTPUT CURRENT (ma) Figure 7. Output Voltage vs. Output Current, Vout = 1.2 V Figure 8. Output Voltage vs. Output Current, Vout = 1.8 V 11

12 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE (V) xxx3tyg 2 4 Vin = 4.5 V 6 Vin = 5. V 1 OUTPUT CURRENT (ma) Figure 9. Output Voltage vs. Output Current, Vout = 3. V 8 Vin = 4. V OUTPUT VOLTAGE (V) xxx36tyg Vin = 4.6 V Vin = 5. V 1 OUTPUT CURRENT (ma) Figure 1. Output Voltage vs. Output Current, Vout = 3.6 V 8 Vin = 4.3 V DROPOUT VOLTAGE (mv) 45 3 xxx18tyg 4 T A = 85 C xxx25tyg OUTPUT CURRENT (ma) Figure 11. Dropout Voltage vs. Output Current, Vout = 1.8 V 8 T A = 4 C DROPOUT VOLTAGE (mv) OUTPUT CURRENT (ma) Figure 12. Dropout Voltage vs. Output Current, Vout = 2.5 V 8 T A = 85 C T A = 4 C DROPOUT VOLTAGE (mv) xxx3tyg OUTPUT CURRENT (ma) Figure 13. Dropout Voltage vs. Output Current, Vout = 3. V 8 T A = 85 C T A = 4 C DROPOUT VOLTAGE (mv) xxx36tyg OUTPUT CURRENT (ma) Figure 14. Dropout Voltage vs. Output Current, Vout = 3.6 V 8 T A = 85 C T A = 4 C 12

13 TYPICAL CHARACTERISTICS QUIESCENT CURRENT ( A) xxx12tyg Iout = Vout = 1.2 V Vin = 5. V Vin = V QUIESCENT CURRENT ( A) xxx25tyg Iout = Vout = 2.5 V Vin = 5. V Vin = V TEMPERATURE ( C) Figure 15. Quiescent Current vs. Temperature, Vout = 1.2 V TEMPERATURE ( C) Figure 16. Quiescent Current vs. Temperature, Vout = 2.5 V QUIESCENT CURRENT ( A) xxx36tyg Iout = Vout = 3.6 V Vin = 5. V Vin = 4. V GROUND CURRENT ( A) xxx12tyg Vout = 1.2 V Vin = 3.5 V Vin = 2.5 V TEMPERATURE ( C) OUTPUT CURRENT (ma) Figure 17. Quiescent Current vs. Temperature, Vout = 3.6 V Figure 18. Ground Current vs. Output Current, Vout = 1.2 V GROUND CURRENT ( A) xxx25tyg Vout = 2.5 V Vin = 4.5 V Vin = 3.5 V GROUND CURRENT ( A) xxx36tyg Vout = 3.6 V Vin = 5. V Vin = 4.6 V OUTPUT CURRENT (ma) OUTPUT CURRENT (ma) Figure 19. Ground Current vs. Output Current, Vout = 2.5 V Figure 2. Ground Current vs. Output Current, Vout = 3.6 V 13

14 TYPICAL CHARACTERISTICS Iout = 1 ma 7 6 Iout = 1 ma PSRR (db) ma 3 xxx12tyg 2 Cout = 1 F Vin = 2.2 V+ 2 mvpp modulation 1 Vout = 1.2 V 1 1k 1k 1k 1 ma 15 ma 1M PSRR (db) ma 3 xxx18tyg 2 Cout = 1 F Vin = 2.8 V+ 2 mvpp modulation 1 Vout = 1.8 V 1 1k 1k 1k 1 ma 15 ma 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 21. PSRR vs. Frequency, Vout = 1.2 V Figure 22. PSRR vs. Frequency, Vout = 1.8 V 7 Iout = 1 ma 7 Iout = 1 ma ma 1 ma 5 1 ma 1 ma PSRR (db) 4 3 xxx3tyg 2 Cout = 1 F Vin = 4. V+ 2 mvpp modulation 1 Vout = 3. V 1 1k 1k 1k 15 ma 1M PSRR (db) 4 3 xxx36tyg 2 Cout = 1 F Vin = 4.6 V+ 2 mvpp modulation 1 Vout = 3.6 V 1 1k 1k 1k 15 ma 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 23. PSRR vs. Frequency, Vout = 3. V Figure 24. PSRR vs. Frequency, Vout = 3.6 V OUTPUT VOLTAGE NOISE SPECTRAL DENSITY ( V/ Hz) xxx12tyg Vout = 1.2 V Iout = 1 ma OUTPUT VOLTAGE NOISE SPECTRAL DENSITY ( V/ Hz) xxx18tyg Vout = 1.8 V Iout = 1 ma 1 1 1k 1k 1k 1M 1 1 1k 1k 1k 1M FREQUENCY (Hz) Figure 25. Output Voltage Noise Spectral Density, Vout = 1.2 V FREQUENCY (Hz) Figure 26. Output Voltage Noise Spectral Density, Vout = 1.8 V 14

15 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE NOISE SPECTRAL DENSITY ( V/ Hz) k 1k FREQUENCY (Hz) xxx3tyg Vout = 3. V Iout = 1 ma 1k Figure 27. Output Voltage Noise Spectral Density, Vout = 3. V 1M OUTPUT VOLTAGE NOISE SPECTRAL DENSITY ( V/ Hz) k 1k FREQUENCY (Hz) xxx36tyg Vout = 3.6 V Iout = 1 ma 1k Figure 28. Output Voltage Noise Spectral Density, Vout = 3.6 V 1M 15

16 TYPICAL CHARACTERISTICS Figure 29. Load Transient Response at Load Step from 1 ma to 5 ma, Vout = 1.2 V Figure 3. Load Transient Response at Load Step from.1 ma to 5 ma, Vout = 1.2 V Figure 31. Load Transient Response at Load Step from.1 ma to 1 ma, Vout = 1.2 V Figure 32. Load Transient Response at Load Step from 1 ma to 5 ma, Vout = 2.5 V Output Voltage Output Current Figure 33. Load Transient Response at Load Step from.1 ma to 5 ma, Vout = 2.5 V Figure 34. Load Transient Response at Load Step from.1 ma to 1 ma, Vout = 2.5 V 16

17 TYPICAL CHARACTERISTICS Figure 35. Load Transient Response at Load Step from 1mA to 5 ma, Vout= 3. V Figure 36. Load Transient Response at Load Step from.1 ma to 5 ma, Vout = 3. V Figure 37. Load Transient Response at Load Step from.1 ma to 1 ma, Vout = 3. V Figure 38. Load Transient Response at Load Step from 1 ma to 5 ma, Vout = 3.6 V Figure 39. Load Transient Response at Load Step from.1 ma to 5 ma, Vout = 3.6 V Figure 4. Load Transient Response at Load Step from.1 ma to 1 ma, Vout = 3.6 V 17

18 TYPICAL CHARACTERISTICS Figure 41. Output Voltage with and without Active Discharge Feature, Vout = 1.2 V Figure 42. Output Voltage with and without Active Discharge Feature, Vout = 2.5 V Figure 43. Output Voltage with and without Active Discharge Feature, Vout = 3. V Figure 44. Output Voltage with and without Active Discharge Feature, Vout = 3.6 V 18

19 TYPICAL CHARACTERISTICS Figure 45. Enable Turn on Response at Vout = 1.2 V Figure 46. Enable Turn on Response at Vout = 1.8 V Figure 47. Enable Turn on Response at Vout = 2.5 V Figure 48. Enable Turn on Response at Vout = 3.6 V 19

20 APPLICATIONS INFORMATION General The is a high performance 15 ma Linear Regulator with Ultra Low IQ. This device delivers low Noise and high Power Supply Rejection Ratio with excellent dynamic performance due to employing the Dynamic Quiescent Current adjustment which assure ultra low I Q consumption at no load state. These parameters make this device very suitable for various battery powered applications. Input Decoupling (C IN ) It is recommended to connect at least a 1 F Ceramic X5R or X7R capacitor between IN and GND pins of the device. This capacitor will provide a low impedance path for any unwanted AC signals or Noise superimposed onto constant Input Voltage. The good input capacitor will limit the influence of input trace inductances and source resistance during sudden load current changes. Higher capacitance and lower ESR Capacitors will improve the overall line transient response. Output Decoupling (C OUT ) The does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The device is designed to be stable with standard ceramics capacitors with values of 1. F or greater up to 1 F. The X5R and X7R types have the lowest capacitance variations over temperature thus they are recommended. There is recommended connect the output capacitor as close as possible to the output pin of the regulator. Enable Operation The uses the EN pin to enable /disable its device and to activate /deactivate the active discharge function at devices with this feature. If the EN pin voltage is pulled below.4 V the device is guaranteed to be disable. The active discharge transistor at the devices with Active Discharge Feature is activated and the output voltage VOUT is pulled to GND through an internal circuitry with effective resistance about 1 ohms. If the EN pin voltage is higher than 1.2 V the device is guaranteed to be enabled. The internal active discharge circuitry is switched off and the desired output voltage is available at output pin. In case the Enable function is not required the EN pin should be connected directly to input pin. Thermal Shutdown When the die temperature exceeds the Thermal Shutdown point (TSD = 175 C typical) the device goes to disabled state and the output voltage is not delivered until the die temperature decreases to 15 C. The Thermal Shutdown feature provides a protection from a catastrophic device failure at accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Power Dissipation and Heat sinking The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. For reliable operation, junction temperature should be limited to +125 C. The maximum power dissipation the device can handle is given by: P D(MAX) TJ(MAX) T A R JA (eq. 1) The power dissipated by the device for given application conditions can be calculated from the following equations: or P D V IN IGND (I OUT ) IOUT VIN V OUT (eq. 2) V IN(MAX) P D(MAX) VOUT I OUT I OUT I GND (eq. 3) Hints VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the, and make traces as short as possible. 2

21 ORDERING INFORMATION Device Nominal Output Voltage Marking AMX12TCG 1.2 AC AMX135TCG 1.35 AP AMX15TCG 1.5 AJ AMX17TCG 1.7 AT AMX18TCG 1.8 AD AMX19TCG 1.9 AL AMX25TCG 2.5 AE AMX28TCG 2.8 AF AMX285TCG 2.85 AK AMX3TCG 3. AA AMX31TCG 3.1 AN AMX32TCG 3.2 AQ AMX33TCG 3.3 AG AMX36TCG 3.6 AM BMX12TCG 1.2 2C BMX135TCG P BMX15TCG 1.5 2J BMX17TCG 1.7 2T BMX18TCG 1.8 2D BMX19TCG 1.9 2L BMX25TCG 2.5 2E BMX28TCG 2.8 2F BMX285TCG K BMX3TCG 3. 2A BMX31TCG 3.1 2N BMX32TCG 3.2 2Q BMX33TCG 3.3 2G BMX36TCG 3.6 2M Active Discharge Package Shipping Yes No XDFN (Pb-Free) 3 / Tape & Reel 21

22 ORDERING INFORMATION Nominal Active Device Output Voltage Marking Discharge Package Shipping AXV12T2G 1.2 AC AXV135T2G 1.35 AL AXV15T2G 1.5 AJ AXV18T2G 1.8 AD AXV19T2G 1.9 AM AXV21T2G 2.1 AK AXV25T2G 2.5 AE AXV28T2G 2.8 AF AXV3T2G 3. AA AXV31T2G 3.1 AN AXV33T2G 3.3 AH BXV12T2G 1.2 2C BXV135T2G L BXV15T2G 1.5 2J BXV18T2G 1.8 2D BXV19T2G 1.9 2M BXV25T2G 2.5 2E BXV28T2G 2.8 2F BXV3T2G 3. 2A BXV31T2G 3.1 2N BXV33T2G 3.3 2H ASN12T2G 1.2 GCG ASN15T2G 1.5 GCH ASN18T2G 1.8 GCF ASN25T2G 2.5 GCE ASN28T2G 2.8 GCA ASN3T2G 3. GCC ASN33T2G 3.3 GCD Yes No Yes SOT 563 (Pb-Free) TSOP 5 (Pb-Free) 4 / Tape & Reel (Available Soon) 3 / Tape & Reel (Available Soon) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. 22

23 PACKAGE DIMENSIONS XDFN4 1.x1.,.65P MX SUFFIX CASE 711AJ ISSUE A PIN ONE REFERENCE 2X.5 C D ÉÉ 2X.5 C TOP VIEW NOTE 4.5 C.5 C SIDE VIEW A B E (A3) A1 A C SEATING PLANE 4X b2 DETAIL A 4X L2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN.15 AND.2 mm FROM THE TERMINAL TIPS. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS DIM MIN MAX A A1..5 A3.1 REF b b D 1. BSC D E 1. BSC e.65 BSC L.2.3 L DETAIL A e 1 2 e/2 4X L RECOMMENDED MOUNTING FOOTPRINT* D2 45 D X b.5 M C A B BOTTOM VIEW NOTE 3.65 PITCH PACKAGE OUTLINE 4X.11 4X.24 2X.52 4X X.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 23

24 PACKAGE DIMENSIONS SOT 563, 6 LEAD XV SUFFIX CASE 463A ISSUE G D X A L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL e E Y b 65 PL.8 (.3) M X Y H E C MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A b C D E e.5 BSC.2 BSC L H E SOLDERING FOOTPRINT* SCALE 2:1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 24

25 PACKAGE DIMENSIONS 2X 2X.2 NOTE 5 T.1 B.5 A T B H G A TOP VIEW SIDE VIEW C D 5X S.2 C SEATING PLANE C A B J K TSOP 5 CASE 483 ISSUE M DETAIL Z END VIEW M DETAIL Z SOLDERING FOOTPRINT* NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN.2 FROM BODY. MILLIMETERS DIM MIN MAX A B C D.25.5 G.95 BSC H.1.1 J.1.26 K.2.6 M 1 S SCALE 1:1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patent Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor E. 32nd Pkwy, Aurora, Colorado 811 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative /D