NCP ma, 10 V, Low Dropout Regulator

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1 ma, V, Low Dropout Regulator The NCP6 is a CMOS Linear voltage regulator with ma output current capability. The device is capable of operating with input voltages up to V, with high output voltage accuracy and low temperature drift coefficient. The NCP6 is easy to use, with output current fold back protection and a thermal shutdown circuit included. A Chip Enable function is included to save power by lowering supply current. MARKING DIAGRAMS Features Operating Input Voltage Range:.6 V to V Output Voltage Range:. to 6. V (available in. V steps) Low Supply Current: A Very Low Dropout: mv (I OUT = ma, V IN =. V) 77 mv (I OUT = ma, V IN =.8 V) High PSRR: 7 db at khz Line Regulation.%/V Typ Current Fold Back Protection Thermal Shutdown Protection Stable with Ceramic Capacitors Available in SC 7, SOT89 and SOT Package These are Pb Free Devices SC 7 CASE 9A SOT 89 CASE 8AB SOT CASE XXX M XXX XMM XXXMM Typical Applications Battery products powered by Two Lithium Ion cells Networking and Communication Equipment Cameras, DVRs, STB and Camcorders Toys, industrial applications VIN C VIN CE NCP6x GND VOUT C VOUT XX, XXX= Specific Device Code M, MM = Date Code A = Assembly Location Y = Year W = Work Week = Pb Free Package (*Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Figure. Typical Application Schematic Semiconductor Components Industries, LLC, February, Rev. Publication Order Number: NCP6/D

2 VIN VOUT VIN VOUT Vref Vref CE Current Limit Thermal Shutdown CE Current Limit Thermal Shutdown GND GND NCP6Hxxxx NCP6Dxxxx Figure. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. SOT89 Pin No. SC 7 Pin No. SOT Pin Name Description VIN Input pin GND Ground CE Chip enable pin (Active H ) VOUT Output pin NC No connection ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note ) V IN. V Output Voltage VOUT. to VIN +. V Chip Enable Input VCE. V Output Current I OUT ma Power Dissipation SOT89 P D 9 mw Power Dissipation SC 7 8 Power Dissipation SOT Junction Temperature T J to C Storage Temperature T STG to C ESD Capability, Human Body Model (Note ) ESD HBM V ESD Capability, Machine Model (Note ) ESD MM V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC Q (EIA/JESD A) ESD Machine Model tested per AEC Q (EIA/JESD A) Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

3 THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOT89 Thermal Resistance, Junction to Air Thermal Characteristics, SOT Thermal Resistance, Junction to Air Thermal Characteristics, SC 7 Thermal Resistance, Junction to Air R JA C/W R JA 8 C/W R JA 6 C/W ELECTRICAL CHARACTERISTICS C T A 8 C; V IN = V OUT(NOM) + V; I OUT = ma, C IN = C OUT =.7 F, unless otherwise noted. Typical values are at T A = + C. Parameter Test Conditions Symbol Min Typ Max Unit Operating Input Voltage V IN.6 V Output Voltage T A = + C V OUT >. V V OUT x.99 x. V V OUT. V mv C T A 8 C V OUT >. V x.97 x. V V OUT. V mv Output Voltage Temp. Coefficient C T A 8 C ±8 ppm/ C Line Regulation V OUT(NOM) +. V or.6 V (whichever is higher) V IN V Line Reg.. %/V Load Regulation IOUT =. ma to ma Line Reg 7 mv Dropout Voltage I OUT = ma. V V OUT <. V V DO..8 V. V V OUT <. V..7. V V OUT <.8 V...8 V V OUT <. V.98.. V V OUT <. V V V OUT <. V.6.8. V V OUT < 6. V..7 Output Current IOUT ma Short Current Limit V OUT = V I SC ma Quiescent Current IQ A Standby Current V IN = V, V CE = V, T A = C ISTB.. A CE Pin Threshold Voltage CE Input Voltage H VCEH.7 V CE Input Voltage L VCEL.8 CE Pull Down Current ICEPD. A Power Supply Rejection Ratio V IN = V OUT + V or. V whichever is higher, ΔV IN =. V pk pk, I OUT = ma, f = khz PSRR 7 db Output Noise Voltage f = Hz to khz V N 8 V rms Low Output N channel Tr. On Resistance V IN = 7 V, V CE = V, V OUT =. V, V IN =.6 V, I OUT = ma R LOW Thermal Shutdown Temperature T TSD 6 C Thermal Shutdown Release T TSR C

4 TYPICAL CHARACTERISTICS V IN =.6 V. V. V.... V IN =. V. V.6 V. V. V Figure. Output Voltage vs. Output Current. V Version (T J = C). 6 Figure. Output Voltage vs. Output Current.8 V Version (T J = C) V IN =. V.6 V 6. V 7. V 8. V V DO (V) T J = C and T J = C C Figure. Output Voltage vs. Output Current. V Version (T J = C). Figure 6. Dropout Voltage vs. Output Current. V Version.7. V DO (V) C T J = C C V DO (V).... C T J = C C. Figure 7. Dropout Voltage vs. Output Current.8 V Version. Figure 8. Dropout Voltage vs. Output Current. V Version

5 TYPICAL CHARACTERISTICS V IN =.6 V. 6 8 T J, JUNCTION TEMPERATURE ( C) Figure 9. Output Voltage vs. Temperature,. V Version V IN =.8 V T J, JUNCTION TEMPERATURE ( C) Figure. Output Voltage vs. Temperature,.8 V Version V IN = 6. V T J, JUNCTION TEMPERATURE ( C) Figure. Output Voltage vs. Temperature,. V Version I GND ( A) V OUT = V.8 V. V 6 V IN, OUTPUT VOLTAGE (V) Figure. Supply Current vs. Input Voltage. I GND ( A).8 V. V V OUT =. V ma ma ma ma I OUT = ma. 6 8 T J, JUNCTION TEMPERATURE ( C) Figure. Supply Current vs. Temperature,. V Version. 6 8 V IN, INPUT VOLTAGE (V) Figure. Output Voltage vs. Input Voltage,. V Version

6 TYPICAL CHARACTERISTICS. 6.. ma ma..... ma ma I OUT = ma.... ma ma ma ma I OUT = ma. 6 8 V IN, INPUT VOLTAGE (V) Figure. Output Voltage vs. Input Voltage,.8 V Version. 6 8 V IN, INPUT VOLTAGE (V) Figure 6. Output Voltage vs. Input Voltage,. V Version PSRR (db) 9 8 I OUT = ma 7 ma 6 ma.. FREQUENCY (khz) Figure 7. PSRR,. V Version, V IN =.6 V PSRR (db) 9 I OUT = ma 8 7 ma 6 ma.. FREQUENCY (khz) Figure 8. PSRR,. V Version, V IN =. V PSRR (db) I OUT = ma ma ma.. FREQUENCY (khz) PSRR (db) 9 I OUT = ma 8 7 ma 6 ma.. FREQUENCY (khz) Figure 9. PSRR,.8 V Version, V IN =.8 V Figure. PSRR,.8 V Version, V IN =.8 V 6

7 TYPICAL CHARACTERISTICS PSRR (db) ma 6 ma I OUT = ma.. FREQUENCY (khz) Figure. PSRR,. V Version, V IN = 6. V PSRR (db) I OUT = ma ma ma.. FREQUENCY (khz) Figure. PSRR,. V Version, V IN = 7. V V N ( V rms / Hz) FREQUENCY (khz) Figure. Output Voltage Noise,. V Version, V IN =.6 V V N ( V rms / Hz) FREQUENCY (khz) Figure. Output Voltage Noise,.8 V Version, V IN =.8 V V N ( V rms / Hz) FREQUENCY (khz) Figure. Output Voltage Noise,. V Version, V IN = 6. V 7

8 TYPICAL CHARACTERISTICS Figure 6. Line Transients,. V Version, t R = t F = s, I OUT = ma V IN (V) Figure 7. Line Transients,.8 V Version, t R = t F = s, I OUT = ma 6 V IN (V) Figure 8. Line Transients,. V Version, t R = t F = s, I OUT = ma V IN (V) 8

9 TYPICAL CHARACTERISTICS Figure 9. Load Transients,. V Version, I OUT = ma, t R = t F =. s, V IN =.6 V Figure. Load Transients,.8 V Version, I OUT = ma, t R = t F =. s, V IN =.8 V Figure. Load Transients,. V Version, I OUT = ma, t R = t F =. s, V IN = 6. V 9

10 TYPICAL CHARACTERISTICS Figure. Load Transients,. V Version, I OUT = ma, t R = t F =. s, V IN =.6 V Figure. Load Transients,.8 V Version, I OUT = ma, t R = t F =. s, V IN =.8 V Figure. Load Transients,. V Version, I OUT = ma, t R = t F =. s, V IN = 6. V

11 TYPICAL CHARACTERISTICS Chip Enable.. I OUT = ma. I OUT = ma. I OUT = ma Figure. Start up,. V Version, V IN =.6 V V CE (V) Chip Enable I OUT = ma I OUT = ma I OUT = ma Figure 6. Start up,.8 V Version, V IN =.8 V V CE (V) 8 6 Chip Enable I OUT = ma I OUT = ma I OUT = ma Figure 7. Start up,. V Version, V IN = 6. V 8 6 V CE (V)

12 TYPICAL CHARACTERISTICS.... I OUT = ma Chip Enable I OUT = ma. I OUT = ma Figure 8. Shutdown,. V Version D, V IN =.6 V V EN (V) Chip Enable I OUT = ma Figure 9. Shutdown,.8 V Version D, V IN =.8 V 8 6 I OUT = ma I OUT = ma I OUT = ma Chip Enable I OUT = ma I OUT = ma Figure. Shutdown,. V Version D, V IN = 6. V 8 6 V EN (V) V EN (V)

13 APPLICATION INFORMATION A typical application circuit for NCP6 series is shown in Figure. VIN C VIN CE NCP6x GND VOUT C Figure. Typical Application Schematic VOUT Input Decoupling Capacitor (C) A F ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP6. Higher values and lower ESR improves line transient response. Output Decoupling Capacitor (C) A F ceramic output decoupling capacitor is enough to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. The capacitors should be connected as close as possible to the output and ground pins. Larger values and lower ESR improves dynamic parameters. Enable Operation The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down current source. If the enable function is not needed connect CE pin to VIN. Output Discharger The D version includes a transistor between V OUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Thermal As a power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. PCB Layout Make the VIN and GND line as large as practical. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C and C as close as possible to the IC, and make wiring as short as possible.

14 ORDERING INFORMATION Device Nominal Output Voltage Description Marking Package Shipping NCP6DSNTG. V Auto discharge FBA SOT / Tape & Reel NCP6DSN8TG.8 V Auto discharge FBH SOT NCP6DSN8TG.8 V Auto discharge FBU SOT NCP6DSNTG. V Auto discharge FBX SOT NCP6DSNTG. V Auto discharge GBA SOT NCP6DSNTG. V Auto discharge GBT SOT NCP6HSNTG. V Standard FAA SOT NCP6HSN8TG.8 V Standard FAH SOT NCP6HSN8TG.8 V Standard FAU SOT NCP6HSNTG. V Standard FAX SOT NCP6HSNTG. V Standard GAA SOT NCP6HSNTG. V Standard GAT SOT / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D.

15 PACKAGE DIMENSIONS SC 88A (SC 7 /SOT ) CASE 9A ISSUE K S A G B D PL. (.8) M B M N NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 98.. CONTROLLING DIMENSION: INCH.. 9A OBSOLETE. NEW STANDARD 9A.. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B.... C...8. D.... G.6 BSC.6 BSC H J.... K.... N.8 REF. REF S C J H K

16 PACKAGE DIMENSIONS SOT 89, LEAD CASE 8AB ISSUE O E D H NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. LEAD THICKNESS INCLUDES LEAD FINISH.. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.. DIMENSIONS L, L, L, L, L, AND H ARE MEAS- URED AT DATUM PLANE C. C A TOP VIEW SIDE VIEW c. C MILLIMETERS DIM MIN MAX A..6 b.. b.7.7 c.. D..6 D..8 E..6 e..6 H.. L.. L.8. L.9. L.6. L..6 e b e b L RECOMMENDED MOUNTING FOOTPRINT* L X.7.7 L L D BOTTOM VIEW L X. X.6 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6

17 PACKAGE DIMENSIONS SOT LEAD CASE ISSUE A A E L e D B E X b. M C B S A S A. S C C A RECOMMENDED SOLDERING FOOTPRINT* A L NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.M, 99.. CONTROLLING DIMENSIONS: MILLIMETERS.. DATUM C IS THE SEATING PLANE. MILLIMETERS DIM MIN MAX A ---. A.. A.. b.. c.. D.7. E.. E..8 e.9 BSC L L X.8 X.6.9 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 6, Denver, Colorado 87 USA Phone: 67 7 or 8 86 Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 79 9 Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative NCP6/D

18 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ON Semiconductor: NCP6DSNTG NCP6DSN8TG NCP6DSN8TG NCP6DSNTG NCP6DSNTG NCP6DSNTG NCP6HSNTG NCP6HSN8TG NCP6HSN8TG NCP6HSNTG NCP6HSNTG NCP6HSNTG

NCP ma, 10 V, Low Dropout Regulator

NCP ma, 10 V, Low Dropout Regulator 15 ma, 1 V, Low Dropout Regulator The is a CMOS Linear voltage regulator with 15 ma output current capability. The device is capable of operating with input voltages up to 1 V, with high output voltage