The Global Leader in High Frequency Thin Film Solutions. Build-to-Print

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1 The Goba Leader in High Frequency Thin Fim Soutions Buid-to-Print Thin Fim Technoogy

2 What makes DLI BTP services unique? The marriage of ceramic expertise, manufacturing know-how, product quaity, customer service, product customization, and cever microwave and RF design engineering sets us apart from a others in the industry. With over three decades of materia science formuation and deveopment, more than one hundred proprietary and/or patented ceramic formuations, and mutipe recent patent fiings, DLI is the pre-eminent ceramic component manufacturer in the industry. You can turn to DLI with confidence for your high frequency Singe-Layer Capacitors, Muti-Layer Capacitors that are difficut to buid and tight toerance; Heat Sinks, Resonators, Fiters, and Buid-To-Print or Custom Thin Fim Components. Thin Fim Buid-to-Print RoHS Compiance Statement DLI is a eading suppier to the eectronic components market and is fuy committed to offering products supporting Restriction of Hazardous Substances (RoHS) directives. A of our Dieectric formuations are RoHS compiant and we offer a broad range of capacitors with RoHS compiant terminations. DLI compies with the requirements of the individua customer and wi maintain product offerings that meet the demands of our industry. Quaity and Environmenta Poicy DLI s reputation for quaity and environmenta responsibiity is based on a commitment not ony to meet our customers requirements, but to exceed their expectations. The entire organization, beginning with top management, strives to achieve exceence in designing, manufacturing and deivering High Q Capacitors and proprietary thin fim components for niche high frequency appications, whie maintaining safe and heathy working conditions. Furthermore, DLI commits to achieve these goas in an environmentay responsibe manner through our commitment to compy with environmenta reguations and poution prevention initiatives. DLI strives to continuay improve the effectiveness of our Quaity and Environmenta Management System through the estabishment and monitoring of objectives and targets. Certified System DLI offers Buid-to-Print services designed to faciitate thin fim product design, manufacturing and testing from prototype to high voume production. TM ISO 9001:2000 & AS9100B Certified System Dieectric Laboratories, Inc. (DLI) has buit its reputation as a manufacturer of High frequency, High Q Capacitors and is your goba partner for appication specific microwave and miimeterwave components serving customers in fiber optic, wireess, medica, transportation, semiconductor, space, avionics and miitary markets. TM ISO DLI s custom ceramics offer significanty better therma performance than the majority of industry standard ceramics and have an added benefit of a sufficienty higher dieectric constant (K) aowing miniaturization opportunities and temperature stabe performance. DLI offers a wide range of test capabiities incuding materia physica and eectrica properties characterization incuding fu S-Parameter testing to 67 GHz. DLI offers circuit integration from simpe conductors and pated vias to integration of passive components and muti-eve circuits on either DLI hi-performance ceramics or industry standard materias such as Aumina and AN. Convert your Buid-to-Print design to a Buid-toPerformance specification where DLI can provide 100% tested products that guarantee performance. Combining a of DLI s unique capabiities, DLI offers one of a kind service to meet your needs. DLI s experienced engineering staff is ready to answer your questions and to hep you exceed expectations. Typica Appications Heat Sinks and Standoff Integrated Passive Components Custom Resistor Capacitor Networks Lange Coupers, Power Combiners EMI Fiters High Frequency Fiters Microwave Integrated Circuits (MIC) Bias Decouping and Fitering Lumped Eement Impedance Matching Network PA Stabiization Impedance Matching and Power Combining Network

3 Thin Fim Buid-to-Print DLI offers Buid-to-Print services designed to faciitate thin fim product design, manufacturing and testing from prototype to high voume production. Our custom ceramics offer significanty better therma performance than the majority of industry standard ceramics and have an added benefit of a sufficienty higher dieectric constant (K) aowing miniaturization opportunities and temperature stabe performance. We provide a wide range of test capabiities incuding materia physica and eectrica properties characterization incuding fu S-parameter testing to 67 GHz. DLI offers circuit integration from simpe conductors and pated vias to integration of passive components and mutieve circuits on either DLI hi-performance ceramics or industry standard materias such as Aumina and AN. Convert your Buid-to-Print design to a Buid-to-Performance specification where DLI can provide 100% tested products that guarantee performance. Combining a of our unique capabiities, DLI offers one of a kind service to meet your needs. DLI s experienced engineering staff are ready to answer your questions and to hep you exceed expectations. RF Testing DLI offers RF testing capabiities of customer designs. DLI wi sampe or 100% test customer designed parts and provide test data as requested. DLI has precision measurement capabiity up to 67 GHz with mutipe vector network anayzers. A fiters can be copanar RF probe tested (nondestructive) with standard or custom fixtures to mimic our customers production environment. DLI s extensive RF design experience aows us to work with the customer to improve their designs and manufacturabiity. Additiona Testing A parts are 100% visuay tested to MIL-STD-883 Wire Pu/Ba Shear (Adhesion) MIL-STD-883 method 2011 Tape Test (Adhesion) ASTM 3339 Bister Testing Dimensiona Resistor (100% or Sampe) Temperature Coefficient of Resistance MIL-STD-202 method 304 Temperature Cycing MIL-STD-883 method 1010 Capacitance, Insuation Resistance and Dissipation Factor avaiabe Customer Requests Soderabiity Resistors DLI utiizes Tantaum Nitride (TaN) as the resistive materia. This materia aows Ohm/square and appications where high reative humidity (80%) may be approached. The resistors are anneaed and provide exceent temperature stabiity. DLI can provide resistor toerances as ow as 0.5%. Notch, fush and top hat designs are avaiabe with aser trimming service. Trimming is avaiabe in mutipe forms athough scrub trimming is most popuar. RF fiter testing

4 Substrate Materia Dieectric Constant (Toerance) Typica Loss Tangent Coefficient of Therma Expansion (ppm/ K) Temperature Coefficient of Capacitance (ppm/ C) Surface Finish (µ-inch) Fused Quartz (SiO2) QZ 1MHz 1MHz 24GHz 0.55 <0.1 Auminum Nitride (AN) AG 96% Aumina (A2O3) PJ 99.6% Aumina (A2O3) PI 8.6 (± 1MHz 8GHz (± 1MHz (± P120 ± 30 As Fired <20 Poished <2 As Fired <4 Poished <1 As Fired 3 Poished <5 PG 12.5 (± 0.5) P22 ± 30 Poished <5 AH 20 (± 0.5) P90 ± 20 Poished <5 NA 23 (± 1) ± 15 Poished <5 CF 25 (± 2) ± 15 Poished <5 CD 38 (± 1) N20 ± 1 Poished <5 CG 67 (± 3) ± 30 Poished <5 Lapped <20 NP 85 (± 10%) N750 ± 200 Poished <5 NR 152 (± 5%) N1500 ± 500 Poished <5 NS 300 (± 10%) N2400 ± 500 Poished <5 NU 600 (± 10%) N3700 ± 1000 Poished <5 Standard substrate thicknesses are in 5 and 10mi thick increments but can be custom to 0.1mi. Poished and apped surfaces are avaiabe to ± toerance where As-Fired materias are accurate to ± Aternative surface finishes may aso be avaiabe, pease consut the factory for more options. Buid-to-Print Reference Guide Meta Coatings God (Au) Nicke (Ni) Patinum (Pt) Titanium (Ti) Copper (Cu) Nicke Vanadium (NiV) God Tin (AuSn) Tantaum Nitride (TaN) (Resistive Layer) Lithography Conductor Thickness God 150 μ God μ Copper μ Nicke μ Laser Driing Features as sma as dia. Dri features in high K dieectrics Line width and Spacing 0.5 ± 0.1 mi 1.0 ± 0.2 mi 3.0 ± 0.4 mi 3.0 ± 0.4 mi Other Options Edge-wrap Metaization Casteated Vias God Fied Vias Reinforced Vias Spira Inductors Interdigitated Capacitors Lange Couper Resistors - Notched, Fush, Top-Hat Poymide Soder Dam RF test capabiities up to Contoured Surfaces - (non-rectanguar shapes Seective Metaization Different top and bottom Different meta schemes Packaging - Photon Ring packaging, Anti-Static Waffe packa

5 Appication Metaization System Appication Suitabe for microwave and miimeter wave frequency appications. Low oss. Therma Conductivity: 1.38 W/m-K. Suitabe for circuits requiring high power dissipation. RF and microwave circuit appications. Therma Conductivity: 170 W/m- K or 200W/ m- K. Genera circ uit appications. Compatibe with Si and GaAs chip technoogy. Therma Conductivity: 26 W/m- K. Genera circuit appications. Compatibe with Si and GaAs chip technoogy. Therma Conductivity: 27 W/m- K. Repacement for Aumina - improved temperature stabiity. Suitabe for circuit miniaturization. RF and microwave circuit appications. Suitabe for circuit miniaturization. RF and microwave circuit appications. Tantaum Nitride (TaN) God (Au) God (Au) Tantaum Nitride (TaN) God (Au) Copper (Cu) Nicke (Ni) God (Au) Tantaum Nitride (TaN) God (Au) Nicke (Ni) God (Au) Standard Thin Fim Meta System for Conductors Resistor Layer Standard Thin Fim Meta System for Conductors High Current & Low Loss with or without TaN Re 9.9 (± Exceent temperature stabiity. Suitabe for circuit miniaturization. RF and microwave circuit appications. Suitabe for circuit miniaturization. RF and microwave circuit appications. Exceent temperature stabiity. Suitabe for circuit miniaturization. RF and microwave circuit appications. Suitabe for circuit miniaturization. RF and microwave circuit appications. Microwave power transistor matching; eg. GaN, SiC Tantaum Nitride (TaN) God (Au) Nicke (Ni) God Tin (AuSn) Nicke (Ni) God Tin (AuSn) Patinum (Pt) God (Au) Nicke (Ni) God (Au) With or without TaN Resistor Layer for seective G and wire bond ocations For God/Tin Soder Systems without TaN Resistor Note: Titanium can be substituted depending on substrate composition. Custom Metaizations and Nicke Vanadium may be substituted for Nicke in some appications; contact appications engineer ) 67 GHz - substrate meta scheme on the same side of substrate repopuation, Tape and Ree ging up to 4 square The meta system utiized is typicay chosen based on the the foowing requirements: current carrying requirement, chip and component mounting strategies, ine width and spacing requirements and if utiizing an integrated resistor. Higher current requirements can empoy thicker god or copper meta but that imits the abiity for fine ine geometries. Wire bonding to the surface of a circuit generay requires 100 μ of god. When tin/ead sodering is required, god thickness is decreased to reduce embrittement and a nicke/ patinum barrier ayer is utiized. DLI aso has the capabiity to seectivey appy god/ tin soder for attachment of descrete die. Note: For ower frequency fiter (<4 GHz) designs, DLI suggests using a minimum god thickness of 150 μ-inches. Higher frequency designs shoud use the standard 100 μ-inch god thickness.

6 Component Attachment Method Typica Thickness Range Comments Maximum Use Temperature C with Au/Ge - Eutectic, Epoxy Au/Ge - Eutectic, Sn/Pb, Epoxy TaN: 12 to 200 Ω/ Not recommended for Tin/Lead Soder Attach - Maintain God 5-20μ for Soder Attach. Compatibe with wire bonding - Maintain God 100μ for Wire bonding sistor Layer Au/Ge - Eutectic, Sn/Pb, Epoxy Au/Ge - Eutectic, Sn/Pb, Epoxy TaN: 12 to 200 Ω/ Au: 5 to 10 μ Cu: 150 to 600 μ Ni: 40 to 100 μ TaN: 12 to 200 Ω/ NiV: 40 to 100 μ Au: 5 to 70 μ Compatibe with Tin/Lead Soder Attach - Maintain exposed surface God 5-20μ for Sn/Pb Soder Attach. When repeated sodering is required for repairs. Compatibe with Wire bonding - Maintain God 100μ for Wire bonding od/tin attach Layer Au/Sn Au/Sn TaN: 12 to 200 Ω/ Au: 5 to 100 μ NiV: 40 to 100 μ AuSn: 100 to 350 μ NiV: 40 to 100 μ AuSn: 100 to 350 μ Eiminates soder preform. Direct die attach to pad. (Au/Sn) Seective Areas avaiabe for Wire bonding Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Au/Ge - Eutectic, Epoxy thicknesses are avaiabe upon request. ing for detais. Pt: 6-10 μ NiV: 40 to 100 μ Compatibe with Tin/Lead Soder Attach - Maintain God 5-20μ for Soder Attach. When repeated sodering is required for repairs. Compatibe with Wire bonding - Maintain God 100μ for Wire bonding. > TF Coupon Resistors can be incorporated directy into the circuit design with the advantage of reducing assemby steps, improving therma dissipation and improving reiabiity through the reduction of interconnections. DLI s resistor technoogy utiizes TaN. This materia has higher maximum exposure temperature and superior resistance to harsh environments (sodering and processing). Under most circumstances DLI can tune a resistor in to toerance of 10% without trimming. When tighter toerance is required aser trimming is avaiabe. DLI offers reinforced vias when higher current is required which gives better mechanica strength and ower resistance to the via hoe. Fied vias provide improved performance and reiabiity over pated vias but have a higher processing cost. Fied vias increase current carrying capacity and have higher therma conductivity to the ground pane. When mounting active die, use of fied vias effectivey conducts heat away from the die. DLI offers god fi (copper or siver can diffuse into other ayers of the metaization eading to reiabiity issues). The precision of conductor ine width and ine spacing can be critica to achieving the performance required. Contro of meta geometries is key to repeatabe performance in microwave structures. Characteristic impedance of transmission ines is governed by ine widths. DLI has extensive experience and can assist in taioring ceramic/metaization systems to your design to achieve maximum performance. DLI is capabe of meeting as sma as ine width and spacing with toerance.

7 DLI is a premier manufacturer of custom designed thin fim fiters. DLI combines its RF design knowedge, testing capabiities, materias characterization expertise with our precision manufacturing capabiities to provide our customers with repeatabe designs. Customers may provide designs on 99.6% aumina or are free to design fiters using DLI s high K, high Q, temperature stabe dieectrics to receive a smaer, ighter and higher performing fiter. We can deiver these fiters tested with known good yied. DLI has the capabiity to manufacture custom designs utiizing Poyimide materias to extend ow frequency whie miniaturizing overa size. Buid-t o-print o ce! i o h C r Buid-to-Performance - You make the DLI aso has the RF expertise to mode high performance fiters to your specific needs incuding muti-ayer technoogy. Pease see DLI s Custom Thin Fim Product Line Cataog.

8 BSC Fiters Limited Dover House, Stering Park, Amy Johnson Way, Cifton Moor, York YO30 4WU UK Phone: Fax: Emai: Dieectric Laboratories, Inc 2777 Route 20 East, Cazenovia, NY USA Phone: Fax: Emai: Dow-Key Microwave 4822 McGrath Street, Ventura, CA USA Phone: Fax: Emai: Copyright DLI Laboratories design - K&L Microwave 2250 Northwood Drive, Saisbury, MD USA Phone: Fax: Emai: saes@kmicrowave.com Novacap Anza Drive, Vaencia, CA USA Phone: Fax: Emai: info@novacap.com Poe/Zero Corporation 5558 Union Centre Drive, West Chester, OH USA Phone: Fax: Emai: support@poezero.com Syfer Technoogy Limited Od Stoke Road, Armingha, Norwich, NR14 8SQ UK Phone: Fax: Emai: saes@syfer.co.uk Votronics Corporation 2250 Northwood Drive, Saisbury, MD USA Phone: Fax: Emai: info@votronicscorp.com Ceramic & Microwave Products (CMP) designs, manufactures and ses specia eectronic components and systems, incuding highperformance fiters, switches, capacitors and EMI and cosite signa interference soutions. Our products are used in miitary, space, teecom infrastructure, medica and industria appications where function and reiabiity are crucia.