MLC & SLC Capacitors Thin Film Components. High-Q MLC Capacitors. Low ESR MLC Capacitors. Single Layer Capacitors

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1 High-Q MLC Capacitors Low ESR MLC Capacitors Single Layer Capacitors Broadband Blocking Capacitors Thin Film Ceramic Filters High-K Ceramic Substrates and Plates Thin Film Resonators Thin Film Gain Equalizers Custom Ceramic Components MLC & SLC Capacitors Thin Film Components

2 Introduction to Dielectric Laboratories Inc. What makes DLI Unique? DLI built its global reputation as a manufacturer of high frequency, High Q capacitors. In recent years, DLI has emerged as a comprehensive manufacturer of specialty ceramic components for application specific microwave and millimeter wave components serving customers in fiber optic, wireless, medical, transportation, semiconductor, space, avionics and military markets. With over four decades of material science formulation and development, more than one hundred proprietary and/or patented ceramic formulations, and multiple recent patent filings, DLI is the pre-eminent ceramic component manufacturer in the industry. The marriage of ceramic expertise, manufacturing know-how, product quality, customer service, product customization, and clever microwave and RF design engineering sets us apart from all others in the industry. DLI offers a broad range of Multi-Layer Capacitor products. We have the most comprehensive array of Broadband Blocking capacitors. We have expertise in customizing, tight tolerances and meeting specific design targets. DLI is the preeminent global supplier of Single-Layer Capacitors. We have the world s broadest range of materials starting with Class 1 dielectrics with ξr from 5.7 to 900 and Class 2 dielectrics with ξr from 445 to 25,000. DLI specializes in high reliability and space applications. Our Build-to-Print services designed to facilitate thin film product design, manufacturing and testing from prototype to high volume production. Our custom ceramics offer significantly better thermal performance than majority of industry standard ceramics and have an added benefit of a sufficiently higher dielectric constant (K) allowing miniaturization opportunities and temperature stable performance. DLI continues to introduce exciting new innovations in custom ceramic resonator and filter technologies. These patent-protected products leverage decades of ceramic and Thin Film experience, creative and clever design expertise, and advanced prototyping and testing capabilities. Please discuss your needs with our Sales and Applications Engineering Team. Heat Sinks and Resonator Components complete our portfolio. RoHS Compliance Statement DLI is a leading supplier to the electronic components market and is fully committed to offering products supporting Restriction of Hazardous Substances (RoHS) directive 2011/65/Eu. All of our Dielectric formulations are RoHS compliant and we offer a broad range of capacitors with RoHS compliant terminations. DLI complies with the requirements of the individual customer and will maintain product offerings that meet the demands of our industry. Quality and Environmental Policy DLI s reputation for quality and environmental responsibility is based on a commitment not only to meet our customers requirements, but to exceed their expectations. The entire organization, beginning with top management, strives to achieve excellence in designing, manufacturing and delivering High Q capacitors and proprietary thin film components for niche high frequency applications, while maintaining safe and healthy working conditions. Furthermore, DLI commits to achieve these goals in an environmentally responsible manner through our commitment to comply with environmental regulations and implement pollution prevention initiatives. DLI strives to continually improve the effectiveness of our Quality and Environmental Management System through the establishment and monitoring of objectives and targets. ISO Environmental

3 Contents Introduction About Us... Inside front cover What s New at DLI...2 Simplified Frequency & Application Chart...3 Single Layer Capacitors General Information Packaging...7 Border Cap 1 or 2-sided recessed metallization T-Cap Transmission Line Capacitor...12 Di-Cap 1MHz to > 80GHz Bar Cap Multiple arrays...16 Gap Cap to eliminate wire bonding Bi-Cap Binary Capacitor...20 Heatsinks, Standoffs & Submounts...21 Multilayer Ceramic Capacitors Material & Case Size Summary Sheets Application Notes General Information Standard Part Number System...28 AH Series: P90 Porcelain Capacitors CF Series: Ultrastable Porcelain Capacitors NA Series: N30 Porcelain Capacitors...35 UL Series: Ultra Low ESR Ceramic Capacitors High Q Capacitors - C04, C06, C11 & C17 Kits...39 Broadband Blocking Capacitors C04/C06/C08 Broadband Blocking Capacitor...40 Opti-Cap Ultra Broadband DC Blocking Milli-Cap Millimeter Wave Broadband Blocking Capacitor...44 Miniature RF Blocking Network Thin Film Devices RF Guru Ceramic Filter Request Form...47 Ceramic Filters product summary Filter Packaging, Shielding and Mounting Filter Temperature Stability...52 Surface Mount Lowpass Filter Series GHz Bandpass Filter Series...54 Wilkinson Power Divider...55 Symmetric Dual Mode Resonator Filter GHz 4 Pole Band Pass with Bandstop Filter GHz 8 Pole SMT Filter GHz Filter Repeatability...56 GPS Filters...57 High-K Ceramic Substrate and Plates...58 Ceramic Cavity Resonators Self Bias Network Gain Equalizers Build to Print Phone:

4 What s New at DLI 0402 S 0402 product line extension of Z type plating (Sn over Ni) in the C04 (0402) case size with its Ultra-Low ESR UL dielectric material. Previously the C04 product line was only available in S type plating (Au flash over Ni). Plating Code Layers Applications S Z Z Au Flash (3-5µ ) Ni barrier Layer Ag Termination Sn plated solder Ni barrier layer Ag Termination Specialty Solder & Epoxy High Volume & Hand Solder Both termination types are fully RoHS compliant Dielectric Laboratories Inc. C04 case size meets the EIA 0402 footprint, which is perfectly suited for High Frequency decoupling type of applications. Milli-Caps Available in 0402, 0502 and 0602 footprints with capacitance values ranging from 0.3pF to 82pF. These capacitors are perfect for testing equipment, photonics, SONET, digital radios and matching filter applications. A usable frequency range up to 40GHz with very low series inductance and ultra-high series resonance makes this the ideal capacitor for your broadband blocking needs. 50V UX material The UX material space qualified to MIL- PRF Class K is now available in a 50V rating. DLI s broad range of standard architectures, including Di-Caps, Border Caps, Bar Caps and Gap Caps can utilize the new 50V rated high K dielectric. UX has the highest dielectric constant of any of DLI s wide variety of materials. The high dielectric constant (K) allows for higher capacitance values in smaller case sizes. This means smaller components on your boards without sacrificing performance! Ultra-High Dielectric Constant K=25,000 X7R Temperature Stability Highest Capacity Density SLC Ideal for Epoxy & Wire Bond Assembly Voltage Rating of 25V & 50V Rugged Ceramic & Thin Film Gold Excellent Dimensional Tolerance Catalog Filters Newly released Catalog Lowpass and Bandpass Filters for high frequency applications. This small, surface mount filters have temperature stable performance from 2 GHz up to 50 GHz. The filters integrate DLI s high dielectric, temperature stable ceramic materials to offer high reliability in environmentally challenging conditions. Continue to check our website for new additions. Cavity Filters Ceramic cavity resonator technology can be employed in conjunction with DLI s stable, high Q ceramics to create highly selective, small, low loss band pass filters. Using a multiport implementation, a very small robust filter can be created. Wide reject band performance without spurious modes is possible. The small, shielded nature of the ceramic filter implementation makes it an ideal choice for integration in low noise receiver front ends with the antenna and pre-amplifier. High-order band pass filters are created by cascading single cavity resonators to generate the required rejection. Build to print DLI offers Build to Print services designed to facilitate thin film product design, manufacturing and testing from prototype to high volume production. Our custom ceramics offer significantly better thermal performance than the majority of the industry standard ceramics and have an added benefit of a sufficiently higher dielectric constant (K) allowing miniaturization opportunities and temperature stable performance. Gain Equalizers Gain Equalizers are designed as a small, low cost solution to your gain slope challenges. DLI s EW series is designed to address the issue from DC to 18 GHz in a package smaller than an 0302 capacitor. Components are designed for surface mount pick and place equipment or epoxy mount. 2 Phone:

5 Simplified Frequency & Product Application Chart SLC and Thin Film Di-Cap Bar-Cap Binary-Cap Bias Filter Networks Self Bias Networks 1 Mhz 10 MHz 100 MHz 1 GHz 10 GHz 100 GHz High Q Capacitors C04 UL C06 CF, UL C07 UL C08 UL C11 AH, CF, UL C17 AH, CF, UL C18 AH, CF C22 AH, CF C40 AH, CF 1 Mhz 10 MHz 100 MHz 1 GHz 10 GHz 100 GHz Broadband and DC Blocks C04BL C06BL C08BL C18BL Opti-Cap Milli-Cap 1 Mhz 10 MHz 100 MHz 1 GHz 10 GHz 100 GHz DC Blocking Low Noise Amplifiers Power Amplifiers, High Power Amplifiers Oscillators Filters Phone:

6 SLC - Dielectric Information Single Layer Capacitors are available with any of our proprietary dielectric materials in the following configurations: Border Cap Di-Cap Bar Cap Bi-Cap Gap Cap T-Cap Please consult the following pages for part number identification. DLI Class I Dielectric Materials Dielectric Code Relative 1 MHz Temperature Coefficient -55 C to 125 C (ppm/ C Max) 1 MHz Dissipation Factor (% Maximum) 25 C Insulation Resistance (MΩ) 125 C Insulation Resistance (MΩ) PI 9.9 P105 ± >106 >105 PG 13 P22 ± >106 >105 AH 20 P90 ± >106 >105 CF 24 0 ± >106 >105 NA 22 N30 ± >106 >105 CD 37 N20 ± >106 >105 NG 43 N220 ± >106 >105 CG 70 0 ± >106 >105 DB 72 N50 ± >106 >105 NP 85 N750 ± >104 >103 NR 160 N1500 ± >106 >105 NS 300 N2400 ± >106 >105 NU 600 N3700 ± >106 >105 NV 900 N4700 ± >106 >105 DLI Class II Dielectric Materials Dielectric Code Relative 1 MHz Temperature Coefficient -55 C to 125 C (ppm/ C Max) No Bias, Pre Voltage Conditioning No Bias, Post Voltage Conditioning 1 MHz Dissipation Factor (% Maximum) 25 C Insulation Resistance (MΩ) 125 C Insulation Resistance (MΩ) BF* 445 ±7.5 ± >104 >102 BD 700 ±10 ± >104 >103 BG* 900 ±10 ± >104 >103 BC 1300 ±10 ± >104 >103 BE 1250 ±10 ± >104 >103 BL 2000 ±15 ± >105 >104 BJ 3300 ±10 ± >105 >104 BN 4500 ±15 ± >105 >104 DLI Class III Dielectric Materials BT* 4200 BU 8500 BV 13, , -56% (-55 C to 105 C) +22, -82% (10 C to 85 C) +22, -82% (10 C to 85 C) +22, -56% (-55 C to 105 C) +22, -82% (10 C to 85 C) +22, -82% (10 C to 85 C) 3.0 >105 > >105 > >105 >104 UX 25,000 ±15% ±25% 2.5 >103 >102 * Recommended for commercial use only. Please contact an inside sales representative for additional information. 4 Phone:

7 SLC - Dielectric Information Dielectric Temperature Characteristics Capacitance Change % LA PI PG AH Capacitance Change % C F N A C G D B C D Temperature C Temperature C 50 5 Capacitance Change % NG NP NR NS NU NV Capacitance Change % BF BD BG BC Temperature C Temperature C Capacitance Change % BE BL BJ UX Capacitance Change % BN BT BU BV Temperature C Temperature C Dielectric Aging Characteristics Capacitance Change % NU,NV BU,BV UX BG BN Capacitance Change % BD BJ BL BF BT Hours Hours Phone:

8 SLC - Specifications Termination Codes Code P T M Description (Layers in order from dielectric material to outermost) S1 (Sputter Plated) Angstroms Titanium-Tungsten 2. 50µ Inches min. Nickel-Vanadium µ Inches min. Gold S Angstroms Titanium-Tungsten 2. 50µ Inches min. Nickel-Vanadium µ Inches min. Gold-Tin S Angstroms Titanium-Tungsten µ Inches min. Gold AU-100 (Wet Plated) 1. 75µ Inches min. Nickel µ Inches min. Gold Capacitor Types Di-Cap,T-Cap, Bar Cap, Binary Cap, and Gap Cap Di-Cap, T-Cap Di-Cap,T-Cap, Bar Cap, Binary Cap, and Gap Cap B S1 AU-100 Single Border Cap E S1 AU-100 Double Border Cap Single beam lead L Standard lead material is silver (Ag).002 thick. Optional Gold (Au) Di-Cap Axial beam lead A Standard lead material is Silver (Ag).002 thick. Optional Gold (Au) Z Standard lead material is Tin-Copper (Sn,Cu).002 thick. Optional Gold (Au) Di-Cap Standard axial beam lead S Standard lead material is silver (Ag).002 thick. Optional Gold (Au) Di-Cap Capacitance Tolerance Table Test Level Codes Code Y X Description Industrial / Commercial Options 1% AQL 2 Side Visual Screening 100% 4 Side Visual Screening 1% AQL for the electrical parameters Capacitance, Dissipation Factor, Insulation Resistance, and Dielectric Withstanding Voltage High Reliability Options MIL-PRF Group A 100% Thermal Shock 100%, /-4 Hours Voltage Conditioning 100% Electrical Screening A 100% 6 Side Visual Screening Bond Strength Die Shear Strength Temperature Coefficient Limits MIL-PRF Group B MIL-PRF-49464, Group A B Immersion Low Voltage Humidity Life Special agreed upon testing to customers formal specification. Customer Drawing Required! (May include, but is not limited to, one or more of the following common requests.) MIL-PRF Class H Element Evaluation. D MIL-PRF Class K Element Evaluation. 10(0) Destructive Bond Pull per MIL-STD-883, Method (0) Die Shear per MIL-STD-883, Method Consult Factory for other alternatives or assistance in specifying custom testing. E 6 Side Visual Screening per MIL-STD-883, Method All Single Layer Capacitors are Lead Free and RoHS compliant. Tolerance Code Tolerance A ±.05pF B ±.10pF C ±.25pF D ±.50pF E ±.5% F ±1% G ±2% H ±3% I ±4% J ±5% K ±10% L ±15% M ±20% X GMV V +100%, -0% Z +80%,-20% S Special Environmental & Physical Testing Procedures MIL-STD-202 Parameter Method Condition Thermal Shock 107 A, (modified), -55 C to +125 C. Immersion 104 B Moisture Resistance Resistance to Solder Heat 210 C, 260 C for 20 seconds. Life 108 A, C. Barometric Pressure 105 B Shock, (Specified Pulse) 213 I, 100g s, 6ms. Vibration, High Frequency 204 G, 30g s peak, 10Hz to 2kHz. Parameter MIL-STD-883 Method Condition Bond Strength 2011 D, 3 grams minimum with.001 dia wire Die Shear Strength 2019 Limit per MIL-STD-883, Figure Temperature Cycling 1010 C Mechanical Shock 2002 B,Y1, Constant Acceleration ,000g s, Y1 direction 6 Phone:

9 SLC - Packaging SLC Waffle Packaging DLI offers a wide variety of standard design waffle packs in various materials depending on the application. Typical material offerings are antistatic and gel pack, which can contain up to 400 pieces depending on component dimension. Custom waffle packs are available; please consult the factory for details. SLC Tape and Reel DLI offers tape and reel packaging solutions for a variety of our single layer capacitor case sizes. Utilizing the latest technology and equipment to provide our customers the highest quality products, our standard SMD tape and reel packaging meets or exceeds EIA standards. Custom tape and reel packaging available; consult the factory for options. SLC Waffle Packaging SLC on Tape Ring DLI offers single layer capacitors re-populated on blue membrane tape and photon ring assembly to maximize efficiency and minimize product cost. Used in high volume applications, the re-populated capacitors provide for more efficient component placement and fewer pick and place machine change outs. The re-populated capacitors meet GMV capacitance value, are 100% visually acceptable and can be re-populated in custom shapes and sizes on a 6 inch photon tape ring. SLC Black Dotted on Tape Ring DLI offers black dotted capacitors on membrane tape and photon ring assembly. For high volume applications utilizing visual recognition, a less expensive alternative is the use of black dotted capacitors provided on saw dice membrane tape. The non- black dotted capacitors meet GMV capacitance value and a minimum of 75% visually acceptable product is guaranteed. SLC Tape and Reel Storage Single layer capacitors with applicable terminations will be solderable for a minimum of 1 year from date of shipment if properly stored in their original packaging. For extended periods, storage in a dry nitrogen environment is recommended. Product supplied on membrane tape and photon ring should be stored in the original container and in an environmentally controlled area where temperature and humidity are maintained. It is recommended not to store the product in direct light as this can negatively impact the adhesion properties of the tape. SLC on Tape Ring Handling Single layer ceramic capacitors should be handled carefully during component transfer or placement, preventing damage to the gold and ceramic surfaces. The capacitors should be handled with precision stainless steel tweezers or a vacuum wand. Contacting the capacitor with bare hands should be avoided as resulting contaminants will affect the performance of the component. SLC Black Dotted on Tape Ring Phone:

10 SLC - Border Cap Description SLC with recessed metallization available with border on one or both sides. Recessed metallization minimizes the potential for shorting during die attach Bordered area provides contrast for vision recognition during automated placement and wire bonding Thin film technology ESD proof Functional Applications DC Blocking RF Bypass Filtering Tuning and Submounts Double Border Cap Designer Kits 160 Capacitors, 10 Each of 16 Values Part Number Capacitor Width D10XXKITA1EX.010 D15XXKITA1EX D20XXKITA1EX D25XXKITA1EX D30XXKITA1EX Capacitors of each value Dielectric pf Tol. pf Tol. pf Tol. pf Tol. Class I, see codes on 0.1 B 0.6 C 1.5 C 2.7 D Page B 1.0 C 2.2 D 3.3 D Class II, see codes on 3.9 D 5.6 M 8.2 M 20 M Page D 6.2 M 10 M 33 M Class I, see codes on 0.1 B 0.7 C 1.5 C 3.3 D Page B 1.0 C 2.2 C 6.4 D Class II, see codes on 6.8 K 10 K 20 M 50 M Page K 15 K 33 M 100 M 0.4 B 1.7 C 4 D 8.2 K Class I, see codes on 0.6 C 1.9 C 5 D 10 K Page C 2.7 C 5.6 D 20 K Class II, see codes on Page 4 33 M 50 M 100 M 180 M DLI reserves the right to substitute values as required. Customer may request particular cap value and material for sample kit to prove out designs. Part Number Identification D 10 BN 100 K 1 E X Product D = Border Cap Case Size Material See material tables on Page 4. Capacitance (pf) R02 = 0.02 pf 0R5 = 0.5 pf 1R0 = 1.0 pf 5R1 = 5.1 pf 100 = 10 pf 101 = 100 pf 152 = 1500 pf Refer to Capacitance range tables for available values. Consult an inside sales rep. for custom solutions. Tolerance A = ± 0.05pF B = ± 0.10pF C = ± 0.25pF D = ± 0.5pF F = ± 1% G = ± 2% J = ± 5% K = ± 10% L = ± 15% M = ± 20% Z = +80% -20% Voltage 2 = 25V* 1 = 100V *For Capacitors with UX material only Termination P = Ni / Au B = Single Border E = Double Border M = Au Test Level Y, X, A, B, D and E. See test level definitions on Page 6. Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page 7. 8 Phone:

11 SLC - Border Cap Border Cap W T Border Cap L P B Double Border Cap B Border Cap Dimensions Style Standard Capacitance Range pf L&W Length & Width Inches (±.001) mm (±.025) Inches (Nom.) P Pad Size mm (Nom.) D D B Border T Thickness Inches mm Inches mm (+.001,-.0005) (+.025,-.013) D D D D (+.002,-.0015) (+.005, -.038) ( +0, ) (+0, ) D D D Phone:

12 SLC - Border Cap Ultra High K, UX Dielectric 25 Volt Single Border Cap Cap. Ranges (pf) 25 Volt Double Border Cap Cap. Ranges (pf) Available Thicknesses Available Thicknesses Case Size Case Size Min 82 Min 75 D10 D10 Max 100 Max 91 Min 120 Min 110 D12 D12 Max 140 Max 130 Min Min 140 D15 D15 Max Max 170 Min Min 270 D20 D20 Max Max 320 Min Min 440 D25 D25 Max Max 540 Min Min 650 D30 D30 Max Max 800 Min Min 900 D35 D35 Max Max 1100 Min Min 1200 D40 D40 Max Max 1500 Min Min 2000 D50 D50 Max Max 2400 UX material restricted to M termination only. Consult a DLI Application Engineer for additional values. 100 Volt Single Border Cap Capacitance Ranges (pf) Case DLI Class I Dielectrics pf Size PI PG AH CF NA CD NG CG DB NP NR NS NU NV D10 Min Max D12 Min Max D15 Min Max D20 Min Max D25 Min Max D30 Min Max D35 Min Max D40 Min Max D50 Min Max *Recommended for commercial use only. Please contact an inside sales representative for additional information. 100 Volt Double Border Cap Capacitance Ranges (pf) Case Size D10 D12 D15 D20 D25 D30 D35 D40 D50 pf DLI Class I Dielectrics PI PG AH CF NA CD NG CG DB NP NR NS NU NV Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max *Recommended for commercial use only. Please contact an inside sales representative for additional information. 10 Phone:

13 SLC - Border Cap Ultra High K, UX Dielectric 50 Volt Single Border Cap Cap. Ranges (pf) 50 Volt Double Border Cap Cap. Ranges (pf) Case Size Available Thicknesses Available Thicknesses Case Size D10 Min Min - D10 Max Max - D12 Min Min - D12 Max Max - D15 Min 100 Min 91 D15 Max 140 Max 110 D20 Min 200 Min 170 D20 Max 240 Max 210 D25 Min 300 Min 280 D25 Max 370 Max 340 D30 Min 450 Min 410 D30 Max 540 Max 500 D35 Min 600 Min 560 D35 Max 750 Max 700 D40 Min 800 Min 750 D40 Max 1000 Max 900 D50 Min 1200 Min 1200 D50 Max 1500 Max 1500 UX material restricted to M termination only. Consult a DLI Application Engineer for additional values. DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Case Size D10 D12 D15 D20 D25 D30 D35 D40 D50 DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Case Size D10 D12 D15 D20 D25 D30 D35 D40 D50 Phone:

14 SLC - T-Cap T-Cap Transmission Line capacitors are designed as a reliable solution in DC Blocking and RF Bypassing applications. The T-Cap products utilize the same Single- Layer processing technology of the Di-Cap product line, with one difference, this device offers a more constant physical size and resonance behavior where dimensional consistency is more desirable than a specified capacitance value. Description Transmission Line Single Layer Capacitors Consistant electrical resonance performance at microwave frequencies Repeatable performance from lot to lot Thin Film technology Functional Applications Filtering DC Blocking RF Bypassing Tuning Insulation Submounts Stand-Offs Microstrip L W T Part Number Identification T 30 BV 30 X 45 P X Product T = T-Cap Width Two digit number representing the Width in.001 For Widths >.099, Consult an inside sales rep. Material See material tables on Page 4. Length Two digit number representing the Length in.001 For Lengths >.099, Consult an inside sales rep. Tolerance X= Length and Width: ±.001, Thickness:.0005 S= Special Thickness Represents thickness in.0001 K0 =.010 M0 =.020 Examples: 55 =.0055 K2 =.012 M5 =.025 Termination P = Ni / Au T = Ni / AuSn M = Au Test Level Y or X See test level definitions on Page 6. Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page Phone:

15 SLC - Di-Cap High Performance Single Layer Capacitors for RF, Microwave and Millimeter-Wave Applications. Gold metallization for wire bonding Rugged construction Custom sizes at commercial prices Thin film technology ESD proof Functional Applications DC Blocking RF Bypass Filtering Tuning Di-Cap Microstrip L W T Dimensions Maximum thickness does not apply for capacitance values below 0.5pF. For thickness of 25 Volt product refer to table on page 14. W Width L Length (Max) T Thickness (50 Volts) T Thickness (100 Volts) Std. Capacitor Range Style Inches mm Inches mm Inches mm Inches mm pf D ± ± D ± ± D ± ± ± ± D ± ± ± ± D ± ± ± ± D ± ± ± ± D ± ± ± ± ± ± D ± ± ± ± D ± ± ± ± D ± ± ± ± ,000 Leaded Di-Cap L Axial Beam Lead A L Single Beam Lead L or Z W W Standing Axial Beam Lead S Notes: See Di-Cap Termination Code Table for available lead configurations. Lead material is pure silver, (Ag), ±.0005 thick. Leads are attached with AuSn, 80%/20% eutectic alloy. Re-flow temperature is 280 C minimum. Pure Gold, (Au) leads are available. Consult factory for details. Chip dimensions per Di-Cap dimensions table. Custom lead dimensions are available. Consult factory for details. L W Dimensions W Lead Width (Min) W Lead Width (Max) L Lead Length (Min) Style Inches mm Inches mm Inches mm D D D D D D D D D D Part Number Identification D 10 CF 0R1 B 5 P X Product D = Di-Cap Case Size Material See material tables on Page 4. Capacitance (pf) R02 = 0.02pF 0R5 = 0.5pF 1R0 = 1.0pF 5R1 = 5.1pF 100 = 10pF 101 = 100pF 432 = 4300pF Refer to Capacitance range tables for available values. Consult an inside sales rep. for custom solutions. Tolerance A = ± 0.05pF B = ± 0.10pF C = ± 0.25pF D = ± 0.5pF F = ± 1% G = ± 2% J = ± 5% K = ± 10% L = ± 15% M = ± 20% Z = +80% -20% Voltage 2 = 25V 5 = 50V 1 = 100V Termination P = Ni / Au T = Ni / AuSn M = Au L = Single Beam Lead A = Axial Beam Lead S = Standing Axial Beam Lead D = Special Z = Tin Copper Ribbon Test Level Y, X, A, B, D and E. See test level definitions on Page 6. Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page 7. Phone:

16 SLC - Di-Cap Ultra High K, UX* Dielectric Di-Cap 25 Volt Capacitance Ranges (pf) Case Size D10 D12 D15 D20 D25 D30 D35 D50 D70 D90 Available Thicknesses Min 51 Max 75 Min 75 Max 180 Min 110 Max 250 Min Max Min Max Min Max Min Max Min Max Min Max Min Max *UX material restricted to M termination only. 50 Volt Capacitance Ranges (pf) Case Size D10 D12 D15 D20 D25 D30 D35 D50 D70 D90 Available Thicknesses Min Max Min Max Min 82 Max 150 Min 100 Max 200 Min 170 Max 390 Min 240 Max 470 Min 360 Max 850 Min 940 Max 2000 Min 2100 Max 3500 Min 3700 Max Volt Di-Cap Capacitance Ranges (pf) Case Size D10 D12 D15 D20 D25 D30 D Volt Di-Cap Capacitance Ranges (pf) Case Size D15 D20 D25 D30 D35 D50 D70 D90 pf DLI Class I Dielectrics PI PG AH CF NA CD NG CG DB NP NR NS NU NV Min Max Min Max Min Max Min Max Min Max Min Max Min Max *Recommended for commercial use only. Please contact an inside sales representative for additional information. pf DLI Class I Dielectrics PI PG AH CF NA CD NG CG DB NP NR NS NU NV Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max *Recommended for commercial use only. Please contact an inside sales representative for additional information. 14 Phone:

17 SLC - Di-Cap Di-Cap Designer Kits 160 Capacitors, 10 Each of 16 Values Part Number Capacitor Width D10XXKITA5PX.010 D15XXKITA5PX D20XXKITA5PX D25XXKITA5PX D30XXKITA5PX Capacitors of each value Dielectric pf Tol. pf Tol. pf Tol. pf Tol. Class I, see codes on Page 4 Class II, see codes on Page 4 Class I, see codes on Page 4 Class II, see codes on Page 4 Class I, see codes on Page 4 Class II, see codes on Page 4 DLI reserves the right to substitute values as required. Customer may request particular cap value and material for sample kits. 0.1 B 0.6 C 1.5 C 2.7 D 0.4 B 1 C 2.2 D 3.3 D 3.9 D 5.6 M 8.2 M 20 M 4.7 D 6.2 M 10 M 33 M 0.1 B 0.6 C 1.5 C 3.3 D 0.4 B 1.0 C 2.2 C 5.6 D 6.8 K 10 K 20 M 50 M 8.2 K 15 K 33 M 100 M 0.4 B 1.5 C 3.3 D 8.2 K 0.6 C 2.2 C 4.76 D 10 K 1.0 C 2.7 C 5.6 D 20 K 33 M 50 M 100 M 180 M DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Min Max Case Size D10 D12 D15 D20 D25 D30 D35 DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Case Size D15 D20 D25 D30 D35 D50 D70 D90 Phone:

18 SLC - Bar Cap Bar Caps are specifically designed for MMIC circuits requiring multiple capacitor applications, such as Multiple Decoupling or RF Bypassing Networks. Multiple capacitor array devices have become an integral circuit component due to their High Q and low inductance. Description Multiple Decoupling/Blocking Capacitors in a Single Array Can be integrated into IC package to reduce bond wire lengths and improve performance Single insertion reduces complexity and costs Simplified assembly Functional Applications RF Bypass DC Blocking for GaAs IC s Decoupling Bar Cap Dimensions Case size E20 E25 E30 E40 No. Caps W Width L Length Nom Pad Size Inches (± 0.003) mm (± 0.076) Inches (±0.005) mm Inches mm (±0.127) T L W Ultra High K, UX Dielectric 25 Volt Bar Cap Capacaitance Ranges (pf) Class lll, BU Dielectric 100 Volt Bar Cap Capacaitance Ranges (pf) Case Size E20 E25 E30 E40 No. Caps Each Cap (pf) T Thickness Case Size E20 E25 E30 E40 No. Caps Each Cap (pf) T Thickness (0.178mm) Part Number Identification E 40 BU 151 Z 1 P X 4 Product E = Bar Capacitors Case Size Material See material tables on Page 4. Capacitance (pf) 800 = 80 pf 101 = 100 pf 121 = 120 pf 151 = 150 pf Consult an inside sales rep. for custom solutions. Tolerance Z = +80% -20% Voltage 2 = 25V 5 = 50V Termination P = Ni / Au M = Au Test Level Y or X See test level definitions on Page 6. *Custom Solutions are available; however additional tooling costs may apply. Please contact the sales office for more information. Capacitor Quantity In mils Etc. Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page Phone:

19 SLC - Gap Cap Series Configured Capacitors for Microwave Applications. Gap Caps are designed for DC Blocking and RF Bypassing. The low insertion loss and high resonant frequencies make it an ideal device for this type of application. This product s unique configuration eliminates the need for wirebonding, therefore reducing performance variations. Description Consistent performance Coplannar waveguide Gap Cap configuration eliminates wirebonding Functional Applications DC Blocking RF Bypass Elimination of wirebond C EFF Microstrip L C1 C2 C1 C2 T W C EFF = SERIES EQUIVALENT C1 = C2 C EFF = C1 2 All Gap Cap values are listed as C EFF common Gap C EFF Gap Cap Designer Kits 160 Capacitors, 10 Each of 16 Values Part Number Capacitor Width G10XXKITAPX G15XXKITAPX08 G20XXKITAPX G25XXKITAPX Capacitors of each value Dielectric pf Tol. pf Tol. pf Tol. pf Tol. Class I, see codes on 0.05 A 0.2 A 0.4 A 0.6 C Page A 0.3 A 0.5 B 0.8 C Class II, see codes on 1 C 2.2 D 5.6 M 10 M Page C 4.7 M 8.2 M 15 M Class I, see codes on 0.08 A 0.4 A 0.6 B 1.5 D Page A 0.5 B 1 C 2.2 D Class II, see codes on 3.3 D 5.6 M 8.2 M 15 M Page M 6.8 M 10 M 20 M Class I, see codes on 0.4 A 0.77 B 1.5 C 3.3 D Page B 1 C 2.2 D 4.7 D Class II, see codes on 5.6 M 8.2 M 15 M 33 M Page M 10 M 20 M 51 M DLI reserves the right to substitute values as required. Customer may request particular cap value and material for sample kits. Part Number Identification G 10 BU 100 K 5 P X 10 Product G = GAP Cap Case Size Material See material tables on Page 4. Capacitance (pf) R01 = 0.01 pf 0R5 = 0.5 pf 1R0 = 1.0 pf 5R1 = 5.1 pf 100 = 10 pf 511 = 510 pf Refer to Capacitance range tables for available values. Consult an inside sales rep. for custom solutions. Tolerance A = ± 0.05pF B = ± 0.10pF C = ± 0.25pF D = ± 0.5pF F = ± 1% G = ± 2% J = ± 5% K = ± 10% L = ± 15% M = ± 20% Z = +80% -20% Voltage 2 = 25V 5 = 50V Termination P = Ni / Au M = Au Test Level Y, X, A, B, D and E. See test level definitions on page 6. Gap Width In mils Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page 7. Phone:

20 SLC - Gap Cap Ultra High K, UX Dielectric 25 Volt Single Gap Cap Cap. Ranges (pf) Case Size G10 G15 G20 G25 G30 G35 G50 Available Thicknesses Min 40 Max 60 Min Max Min Max Min Max Min Max Min Max Min Max Microstrip T C EFF L Gap W 25 Volt Gap Cap Capacitance Ranges (pf) Case Std. DLI Class I Dielectrics pf Size Gap PI PG AH CF NA CD NG CG DB NP NR NS NU NV Min G Max Min G Max Min G Max Min G Max Min G Max Min G Max Volt Gap Cap Capacitance Ranges (pf) Case Std. DLI Class I Dielectrics pf Size Gap LA PI PG AH CF NA CD NG CG DB NP NR NS NU NV Min G Max Min G Max Min G Max Min G Max Min G Max Min D Max Min G Max *Recommended for commercial use only. Please contact an inside sales representative for additional information. 18 Phone:

21 SLC - Gap Cap 25 Volt Gap Cap Dimensions Style G Gap (Nom.) W Width L Length (Max) Inches mm Inches mm Inches mm T Thickness Range* Inches (±0.001) mm (± 0.025) G G G G G G ± ± G ± ± *UX thickness only available in.006 and Volt Gap Cap Dimensions Style G Gap (Nom.) W Width L Length (Max) Inches mm Inches mm Inches mm T Thickness Range Inches (±0.001) mm (± 0.025) G G G G G G ± ± G ± ± DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Std. Gap Case Size.005 G G G G G G35 DLI Class II Dielectrics DLI Class III Dielectrics BF* BD BG* BC BE BL BJ BN BT* BU BV pf Min Max Min Max Min Max Min Max Min Max Min Max Min Max Std. Gap Case Size.005 G G G G G G G50 Phone:

22 SLC - Bi-Cap Description Binary Tunable Caps for SLC Hybrids. Small size is compatible with microwave geometries Ideal for prototype circuits Functional Applications Matching Networks Tank Cicuits Dielectric resonator tuning/coupling C 1 C 2 C 3 C 1 = 1 C 2 = 2 x C 1 C 3 = 4 x C 1 (4 pad - C 4 = 8 x C 1 ) Pads may be used singularly or in combination to tune circuit. C 3 C 2 C 1 L T W Bi-Cap Dimensions and Part Numbers Part Number No. Caps Each Cap (pf) L & W Length & Width Inches mm (±.001) (±.025) T Thickness Inches mm (±.001) (±.025) B Border Inches mm (±.002) (±.051) Voltage Rating (Volts) F15CGR08M5PX ,.15, F15NR0R1M1PX3 3.1,.2, F20CG0R1M1PX3 3.1,.2, F20NR0R2M1PX3 3.2,.4, F25CFR08M5PX ,.15, F25CG0R2M1PX3 3.2,.4, F25NR0R4M1PX3 3.4,.8, F35CF0R1M1PX3 3.1,.2, F35CG0R4M1PX3 3.1,.2, F40NR0R5M1PX4 4.5, 1, 2, *Custom Solutions are available; however additional tooling costs may apply. Please contact an inside sales representative for more information. Part Number Identification F 15 NR 0R1 M 1 P X 3 Product F = Binary Capacitors Case Size Material See material tables on Page 4. Capacitance (pf) Lowest Value in Series is Part Number R08 =.080 pf 0R1 =.1 pf 0R2 =.2 pf 0R4 =.4 pf 0R5 =.5 pf Consult an inside sales rep. for custom solutions. Tolerance M = ±20% Voltage 2 = 25V 5 = 50V 1 = 100V Termination P = Ni / Au M = Au Test Level Y or X See test level definitions on Page 6. Pad Quantity 3 4 Packaging D = Black Dotted E = Repopulated T = Tape and Reel Leave blank for generic waffle pack. See packaging definitions on Page Phone:

23 SLC - Heatsinks, Standoffs & Submounts Heatsinks Heatsinks are fully metallized on all sides and are used to dissipate and absorb heat Heatsinks allow for high thermal conductivity and are electrically conductive (DC short) Typically used with LED s or laser diodes LED or Laser Diode Aluminum Nitride Heat Sink Metalized 6 Sides (i.e. DC Short) Pkg Floor Standoffs A Standoff is much like a Heatsink however it is typically metallized on only the top and bottom surfaces Each device is custom tailored to the customer s specifications and is typically used with LED s or Photo Diodes (works as a photo detector, light is allowed in through fibers) Standoff Photo-Diode (Metalization Top & Bottom Only i.e. DC Isolated) Wire Bonds For Signal Pkg Floor { & Bias Submounts Submounts are ceramic LED package bases which minimize thermal resistance between LED junctions and adjacent components By reducing junction temperatures, an LED will produce increased efficiency, brightness, color and reliability Each device is custom tailored to the customer s specifications Material Specifications Material Code Relative 5 GHz TCC Loss ppm/ C Coefficient of Tangent* % Max Thermal Thermal Expansion ppm/ K Conductivity W/m- K AG 8.85 ± 0.35 (@ 1MHz) Aluminum Nitride PI 9.9 ± 0.15 (@ 1MHz) Alumina 99.6% *Unless otherwise specified K dielectric measurement at approximately 5 GHz. For the temperature range -55 to 125 C. **Material only provided metalized. Surface Finish Code Roughness R a Material Process X >50 µ in. As-Fired Y 20 µ in. Machined Z <5 µ in. Polished S Special Drawing required Metallization Code Description M 300 Angstroms TiW, 100 µ in. min. Au P 75 µ in. min. Nickel, 100 µ in. min. Au E Metallized and etched per Customer drawing T 300 Angstroms min. TiW, 50 µ in. min. NiV, 300 µ in. min. Au-Sn D SPECIAL, DLI Design per Customer Requirements Phone:

24 MLC - Dielectric Material & Case Sizes AH DLI Series Case Size Footprint in. (mm) Cap Value Range (pf) Cap (pf) Typical ESR 150 MHz 500 MHz 1 GHz Series Resonance (MHz) Working Voltage (Max) C11AH.055 x.055 (1.40 x 1.40) 0.1 to C17AH.110 x.110 (2.79 x 2.79) 0.1 to TCC (ppm/ C) (-55 to +125 C) Porcelain (P90) +90 ±20 C18AH C22AH.110 x.110 (2.79 x 2.79).220 x.250 (5.84 x 6.35) 0.1 to to MHz 30MHz 100MHz C40AH.380 x.380 (9.65 x 9.65) 1 to CF DLI Series Case Size Footprint in. (mm) Cap Value Range (pf) Cap (pf) Typical ESR 150 MHz 500 MHz 1 GHz Series Resonance (MHz) Working Voltage max C06CF.063 x.030 (1.60 x 0.80) 0.1 to C11CF.055 x.055 (1.40 x 1.40) 0.1 to TCC (ppm/ C) (-55 to +125 C) Porcelain (NP0) 0 ±15 C17CF C18CF.110 x.110 (2.79 x 2.79).110 x.110 (2.79 x 2.79) 0.1 to to C22CF.220 x.250 (5.84 x 6.35) 1 to MHz 30MHz 100MHz C40CF.380 x.380 (9.65 x 9.65) 1 to NA DLI Series Case Size Footprint in. (mm) Cap Value Range (pf) Cap (pf) Typical ESR 150 MHz 500 MHz 1 GHz Series Resonance (MHz) Working Voltage max TCC (ppm/ C) (-55 to +125 C) Ceramic (NP0) N30 ±15 C11NA C17NA.055 x.055 (1.40 x 1.40).110 x.110 (2.79 x 2.79) 0.1 to to Phone:

25 MLC - Dielectric Material & Case Sizes UL TCC (ppm/ C) (-55 to +125 C) Ceramic (NP0) 0 ±30 DLI Series C04UL C06UL C07UL C08UL C11UL C17UL Case Size Footprint in. (mm).040 x.020 (1.0 x 0.5).060 x.030 (1.60 x 0.80).110 x.070 (2.79 x 1.72).080 x.050 (2.0 x 1.27).055 x.055 (1.40 x 1.40).110 x.110 (2.79 x 2.79) Cap Value Range (pf) 0.1 to to to to to to 1000 Cap (pf) Typical ESR 150 MHz 500 MHz 1 GHz Series Resonance (MHz) Working Voltage max DLI MLC Dielectric Materials Dielectric Code Temperature Coefficient -55 C to +125 C Dissipation 1 MHz (% Maximum) AH P90 ± 20 ppm/ C 0.05 CF 0 ± 15 ppm/ C 0.05 UL 0 ± 30 ppm/ C 0.05 Insulation Resistance +25 C See Notes +125 C See Notes below BL* ± 15% 2.50 >10 4 >10 3 NA N30 ± 15 ppm/ C 0.05 >10 6 >10 5 *Broadband Blocks only. Notes: Insulation Resistance (Per MIL-PRF & MIL-PRF-55681/4) High Frequency Capacitors (C11, C17 & C18) All other Case sizes (C04, C06, C07, C08, C22, +25 C: 10 6 MΩ (0.1pF to 470pF) / 10 5 MΩ (510pF to +25 C: C: 10 5 MΩ (0.1pF to 470pF) / 10 4 MΩ (510pF to +125 C: 10 4 MΩ ESR and Resonance data is of typical performance and can vary from lot to lot. Consult factory for additional case size data. Temperature Coefficient of Capacitance 1.25 CF UL AH NA 1 Capacitance Change % Temperature (ºC) Phone:

26 MLC Application Notes Chip Selection Multilayer capacitors (MLC) are categorized by dielectric performance with temperature, or temperature coefficient, as these devices vary in behavior over temperature. The choice of component is thus largely determined by the temperature stability required of the device, i.e. type of dielectric, and the size necessary for a given capacitance and voltage rating. The following items are pertinent to chip selection: Dielectric Type CF: Ultra stable Class I dielectric exceeds EIA COG requirements with negligible dependence of electrical properties on temperature, voltage, frequency and time, used in circuitry requiring very stable performance. AH: EIA Class I dielectric with a dielectric constant that increases with temperature (90ppm/ C). Useful for temperature compensation where other board components may be losing capacitance with temperature. NA: EIA Class I dielectric with a negative TCC. Useful in situations where other board components are gaining capacitance with temperature. UL: EIA Stable Class I dielectric, with extremely low ESR. Useful in any application where heat generation or signal loss are concerns. BL: EIA Stable Class II dielectric (X7R), with predictable change in properties with temperature, voltage, frequency and time. Used as blocking, de-coupling, bypassing and frequency discriminating elements. This dielectric is ferroelectric, and provides higher capacitance than Class I. Capacitor Size Size selection is based primarily on capacitance value, voltage rating, and resonance frequency. Smaller units are generally less expensive; 0603 is the most economical size. Because mass affects the thermal shock behavior of chips, size selection must consider the soldering method used to attach the chip to the board. C18 and smaller can be wave, vapor phase or reflow soldered. Larger units require reflow soldering. Termination Material Nickel barrier termination, with exceptional solder leach resistance is recommended for all applications involving solder. DLI offers two versions of the nickel barrier termination. The Z termination is a nickel barrier with 100% matte tin for a lead free capacitor. The U termination is a nickel barrier with 90/10 tin/lead for military applications. Non-magnetic versions of these termination finishes are also available. Solder Leaching DLI s termination finishes are designed to withstand RoHS attachment methods. During soldering, time above 230 C should be minimized to reduce thinning of the barrier layer and subsequent bond failure. DLI offers enhanced magnetic and nonmagnetic termination finishes for applications requiring extended soldering time or repeated reflow cycles. Please consult your Sales Representative when ordering. Packaging Units are available in bulk, reeled or in waffle pack. Attachment Methods Bonding of capacitors to substrates can be categorized into two methods, those involving solder, which are prevalent, and those using other materials, such as epoxies and thermo-compression or ultrasonic bonding with wire. Please see DLI application note Recommended Solder Attachment Techniques for MLC Chip and Pre-Thinned Capacitors located on our website: Soldering Soldering methods commonly used in the industry and recommended are Reflow Soldering, Wave Soldering, and to a lesser extent, Vapor Phase Soldering. All these methods involve thermal cycling of the components and therefore the rate of heating and cooling must be controlled to preclude thermal shocking of the devices. In general, rates which do not exceed 120 C per minute and a temperature spike of 100 C maximum for any soldering process on sizes C18 and smaller is advisable. Other precautions include post soldering handling, primarily avoidance of rapid cooling with contact with heat sinks, such as conveyors or cleaning solutions. Large chips are more prone to thermal shock as their greater bulk will result in sharper thermal gradients within the device during thermal cycling. Units larger than C18 experience excessive stress if processed through the fast cycles typical of solder wave or vapor phase operations. Solder reflow is most applicable to the larger chips as the rates of heating and cooling can be slowed within safe limits. In general, rates that do not exceed 60 C per minute and a temperature spike of 50 C maximum for any soldering process on sizes larger than C18 is advisable. Attachment using a soldering iron requires extra care, particularly with large components, as thermal gradients are not easily controlled and may cause cracking of the chip. Precautions include preheating of the assembly to within 100 C of the solder flow temperature, the use of a fine tip iron which does not exceed 30 watts, and limitation of contact of the iron to the circuit pad areas only. Bonding Hybrid assembly using conductive epoxy or wire bonding requires the use of silver palladium or gold terminations. Nickel barrier termination is not practical in these applications, as intermetallics will form between the dissimilar metals. The ESR will increase over time and may eventually break contact when exposed to temperature cycling. Cleaning Chip capacitors can withstand common agents such as water, alcohol and degreaser solvents used for cleaning boards. Ascertain that no flux residues are left on the chip surfaces as these diminish electrical performance. DLI Shelf Life / Storage Capacitors are solderable for a maximum of one year from the date of shipment if properly stored in the original packaging. Dry nitrogen storage is preferable for longer periods. 24 Phone:

27 MLC Application Notes Board Design Considerations The amount of solder applied to the chip capacitor will influence the reliability of the device. Excessive solder can create thermal and tensile stresses on the component which could lead to fracturing of the chip or the solder joint itself. Insufficient or uneven solder application can result in weak bonds, rotation of the device off line or lifting of one terminal off the pad (tombstoning). The volume of solder is process and board pad size dependent. WAVE SOLDERING exposes the devices to a large solder volume, hence the pad size area must be restricted to accept an amount of solder which is not detrimental to the chip size utilized. Typically the pad width is 66% of the component width, and the length is.030" (.760 mm) longer than the termination band on the chip. An 0805 chip which is.050" wide and has a.020" termination band therefore requires a pad.033" wide by.050" in length. Opposing pads should be identical in size to preclude uneven solder fillets and mismatched surface tension forces which can misalign the device. It is preferred that the pad layout results in alignment of the long axis of the chips at right angles to the solder wave, to promote even wetting of all terminals. Orientation of components in line with the board travel direction may require dual waves with solder turbulence to preclude cold solder joints on the trailing terminals of the devices, as these are blocked from full exposure to the solder by the body of the capacitor. Restrictions in chip alignment do not apply to SOLDER REFLOW or VAPOR PHASE processes, where the solder volume is controlled by the solder paste deposition on the circuit pads There are practical limitations on capacitor sizes that prohibit reliable direct mounting of chip capacitors larger than 2225 to a substrate. Without mechanical restriction, thermally induced stresses are released once the capacitor attains a steady state condition, at any given temperature. Capacitors bonded to substrates, however, will retain some stress, due primarily to the mismatch of expansion of the component to the substrate; the residual stress on the chip is also influenced by the ductility and hence the ability of the bonding medium to relieve the stress. Unfortunately, the thermal expansions of chip capacitors differ significantly from those of substrate materials. Recommended Printed Wire Board Land Patterns Printed Wire Board land pattern design for chip components is critical to ensure a reliable solder fillet, and to reduce nuisance type manufacturing problems such as component swimming and tombstoning. The land pattern suggested can be used for reflow and wave solder operations as noted. Land patterns constructed with these dimensions will yield optimized solder fillet formation and thus reduce the possibility of early failure. 1 A = (Max Length) (.762mm)* B = (Max Width) (.254mm)** C = (Min Length) 2 (Nominal Band)*** Temperature Precautions The rate of heating and cooling must be controlled to preclude thermal cracking of ceramic capacitors. Soldering temperatures should not exceed 200 C per minute, temperature variation must not exceed 100 C maximum for any solder operation. Avoid forced cooling or contact with heat sinks, such as conveyor belts, metal tables or cleaning solutions, before the chips reach ambient temperatures. MLC Orientation - Horizontal and Vertical Mounting The orientation of the MLC relative to the ground plane affects the devices impedance. When the internal electrodes are parallel to the ground plane (Horizontal mounting) the impedance of the MLC resembles a folded transmission line driven from one end. The below graph shows the modeled insertion loss and parallel resonances of C17AH101K-7UN-X0T with horizontal mounting. When the internal electrodes are perpendicular to the ground plane (Vertical mounting, bottom graph) the MLC impedance resembles a folded transmission line driven from the center reducing resonance effects. C11,17 are available with vertical or horizontal orientation in tape and reel packaging. Modeling can be done in CapCad. HP/EEs of series 4 contains models for C11 and C17 in the element libraries under Dielectric Laboratories MLC. S21 (db) S21 (db) Horizontal Orientation C17AH101K-7UN-X0T 100.0pF Temp = 25 C Frequency (GHz) Vertical Orientation C17AH101K-7UN-X0T 100.0pF Temp = 25 C -5 * Add for Wave Solder operations. ** Replace Max Width with Max Thickness for vertical mounting. *** C to be no less than 0.02, change A to (Max Length) For CO4 C to be no less than Frances Classon, James Root, Martin Marietta Orlando Aerospace, Electronics Packaging and Interconnection Handbook Frequency (GHz) Phone:

28 MLC General Information Case Size Definitions Case Size Case Code Termination Width Length Inches mm Inches mm Thickness (1) (Max) Gap Min (Between Bands) Band Min (2) (Plated) Band Max (2) (Plated) Min. Max. Min. Max. Min. Max. Min. Max. Inches mm Inches mm Inches mm Inches mm 04BL 0402 U,S UL 0402 S,Z BL 0603 U,S,Z CF 0603 U,S,Z,E,P,W,H,V,R UL 0603 U,S,Z UL 0711 S,Z BL 0805 U,S,Z UL 0805 U,S,Z U,S,Z,E,P,Q,Y,M,W,H,V,R T NA NA NA NA U,S,Z,E,P,Q,Y,M,W,H,V,R T NA NA NA NA 18BL 1111 U,S,Z U,Z,E,W,H,V U,S,Z,E,P,Q,Y,M,W,H,V,R NA NA NA NA U,S,Z,E,P,Q,Y,M,W,H,V,R NA NA NA NA (1) Dimensions listed include the termination, not just ceramic. (2) Band widths are from corner to corner of part. *C22-Bands must not have more than an.017 difference from the measured band on one end to the band on the other. Recommended Pad Spacing Dimensions (inches) Case Size C04 C06 C07 C08 C11 C17 C18 C22 C40 Internal Reflow Soldering Wave Soldering Electrode A B C A B C Horizontal Vertical Not Recommended Not Recommended Horizontal Vertical Not Recommended Not Recommended Horizontal Vertical Not Recommended Not Recommended Horizontal Vertical Horizontal Vertical Horizontal Vertical Horizontal Vertical Horizontal Vertical Not Recommended Not Recommended Horizontal Vertical Not Recommended Not Recommended 26 Phone:

29 MLC - General Information Termination Systems Code Termination System Application T U S RoHS Z RoHS E RoHS P RoHS Q RoHS Ag Termination Ni Barrier Layer Heavy SnPb Plated Solder Ag Termination Ni Barrier Layer SnPb Plated Solder Ag Termination Ni Barrier Layer Gold Flash Ag Termination Ni Barrier Layer Sn Plated Solder Ag Termination Enhanced Ni Barrier Sn Plated Solder AgPd Termination Polymer Termination Ni Barrier Layer Sn Plated Solder High Reliability Applications Hand Soldering High Reliability Applications High Volume & Hand Solder Assembly Specialty Solder, Epoxy Applications Standard for 0402 High Volume & Hand Solder Assembly High Volume & Hand Solder Assembly Ultra Leach Resistant Non-Magnetic Applications Resistant to Cracking High Volume & Hand Solder Assembly Code Termination System Application Y M RoHS W RoHS H RoHS V R Polymer Termination Ni Barrier Layer Sn/Pb Plated Solder Polymer Termination Cu Barrier Layer Sn Plated Solder Ag Termination Cu Barrier Layer Sn Plated Solder Ag Termination Enhanced Cu Barrier Sn Plated Solder Ag Termination Cu Barrier Layer SnPb Plated Solder Ag Termination Cu Barrier Layer Heavy SnPb Plated Solder Resistant to Cracking High Reliability Applications High Volume & Hand Solder Assembly Resistant to Cracking Non-Magnetic Application High Volume & Hand Solder Assembly Non-Magnetic Application High Volume Non-Magnetic Applications High Vol. & Hand Solder Assembly Ultra Leach Resistant Non-Magnetic Applications High Reliability Applications High Volume & Hand Solder Assembly Non-Magnetic Applications High Reliability Applications Hand Soldering Lead Termination Codes Leads are attached with high melting point solder (HMP) at 296 C. Axial Ribbon Code A Radial Ribbon Code B Center Ribbon Code C Axial Wire Lead Code E Radial Wire Lead Code F Packaging Configurations Case Style C04 C06 C07 C08 C11 C17 C18 C22 C40 Size L x W 0.040" x 0.020" 0.060" x 0.030" x " x 0.050" 0.055" x 0.055" 0.110" x 0.110" 0.110" x 0.110" 0.220" x 0.245" 0.380" x 0.380" 7" Reel, 8mm Tape Horizontal Orientation 5000 Vertical Orientation 7" Reel, 16mm Tape 13" Reel, 16mm Tape Horizontal Orientation 2" x 2" Waffle Pack Test Level Codes Test code Y X A C D Inspection Description - see individual part pages for additional detail 100% IR, 1% AQL visual, 1% AQL Electrical (DWV, Cap., DF) 100% IR, 1 % visual, 1% AQL Electrical (DWV, Cap., DF) Group A testing per MIL PRF Group C testing per MIL PRF Customer Defined Typically a minimum 500 piece order for tape and reel packaging. Standard Packaging: Bulk in plastic bags. Consult factory for custom packaging solutions. Phone:

30 MLC - Standard P/N System C 17 CF 620 J- 7 U N- X 0 T MLC Capacitor Case Size Material System Capacitance Code Tolerance Level Voltage Code Termination Code Leading Code Test Level Marking Code Packaging Case Size 17 Case Dimensions " x 0.020" " x 0.030" " x 0.070" " x 0.050" " x 0.055" " x 0.110" " x 0.110" " x 0.250" " x 0.380" Voltage 7 Code Value 5 50V 1 100V 8 150V 6 200V 9 250V 3 300V 4 500V V A 1500V G 2000V B 2500V D 3600V F 5000V H 7200V S SPECIAL Material Material AH CF UL BL NA Termination CF Characteristics P90 High-Q NPO High-Q Ultra Low ESR-NPO DC Blocking Ultra N30 High-Q Capacitance 620 First two Significant figures in digits capacitance Additional number Third digit of zeros Represents a R decimal point 620 = 62pF Examples: 152 = 1500pF U Code Termination System T Ag Termination, Ni Barrier Layer, Heavy SnPb Plated Solder U Ag Termination, Ni Barrier Layer, SnPb Plated Solder S Ag Termination, Ni Barrier Layer, Gold Flash RoHS Z Ag Termination, Ni Barrier Layer, Sn Plated Solder RoHS E Ag Termination, Enhanced Ni Barrier, Sn Plated Solder RoHS P** AgPd Termination RoHS Q Polymer Termination, Ni Barrier Layer, Sn Plated Solder RoHS Y Polymer Termination, Ni Barrier Layer, SnPb Plated Solder M** Polymer Termination, Cu Barrier Layer, Sn Plated Solder RoHS W** Ag Termination, Cu Barrier Layer, Sn Plated Solder RoHS H** Ag Termination, Enhanced Cu Barrier, Sn Plated Solder RoHS V** Ag Termination, Cu Barrier Layer, SnPb Plated Solder R** Ag Termination, Cu Barrier Layer, Heavy SnPb Plated Solder NOTE: All fields are required. Any specials, please consult factory. ** Nonmagnetic Tolerance Code Value A ± 0.05pF B ± 0.1pF C ± 0.25pF D ± 0.5pF F ± 1% G ± 2% J ± 5% K ± 10% M ± 20% X GMV S SPECIAL <10pF A, B, C, D >10pF F, G, J, K, M Leading J N Code Lead Type A Axial Ribbon B Radial Ribbon C Center Ribbon Specialty D Customer Defined E Axial Wire F Radial Wire N NONE NOTE: Consult Sales Representative for RoHS compliant leaded devices Test Level Code Testing X Commercial or Industrial Y Reduced Visual A MIL-PRF Group A C MIL-PRF Group C D Customer Specified X Laser Mark 0 Code Laser Marking 0 No marking 1* Single-side marked 2* Double-side marked 3* Large single-side marked 4* Large double-side marked 5* Vertical edge marked 9 Customer Specified *Reduces DWV Rating. Packaging Code Packaging T Tape & Reel Horizontal V Tape & Reel Vertical W Waffle Pack B Bulk P Plastic Box R Tube (Rail) S Customer Specified T 28 Phone:

31 MLC - AH Series: P90 Porcelain Capacitors Description High Q Porcelain Capacitors SMD Compatibility Positive TC P90 Low ESR, High Q Capacitance range pf Operating Range -55 to +125 C High Voltage High Self-resonance Low Noise Established Reliability Functional Applications Impedance Matching Power Handling DC Blocking Bypass Coupling Tuning and Feedback Amplifier Matching Networks VCO Frequency Stabilization Filtering, Diplexers and Antenna Matching High RF Power Circuits Oscillators Timing Circuits Filters RF Power Amplifiers and Delay Lines Dielectric characteristics Dielectric Material (Code) P90 (AH) Temperature Coefficient (ppm/ C ) +90 ± 20 Dissipation Factor 1MHz Maximum) 0.05 Dielectric Withstanding Voltage Insulation Resistance (MΩ Minimum) Ageing Piezoelectric Effects Dielectric Absorption Voltage Rating (Volts) DWV C Note: Refer to table on page 28 for ordering information. Refer to table 250% of rated 10 6 MΩ min 10 5 MΩ min None None None Capacitance and Voltage Table Case Size Cap Code Cap (PF) C C C R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Reel QTY Horizontal 200V Code 6 250V Code 9 100V Code 1 50V Code 5 C C Special capacitance values available upon request. 200V Code 6 500V Code 4 1kV Code 7 100V Code 1 50V Code 5 200V Code 6 1kV Code 7 2kV Code G 500V Code 4 300V Code 3 1kV Code 7 1.5kV Code A 2.5kV Code B 500V Code 4 1kV Code 7 2.5kV Code B 3.6kV Code D 7.2kV Code H Phone:

32 MLC - AH Series: P90 Porcelain Capacitors This information represents typical device performance. 30 Phone:

33 MLC - AH Series: P90 Porcelain Capacitors This information represents typical device performance. Part Number See Page 28 for complete part number system. C 17 AH 620 J- 7 U A- X 0 T MLC Capacitor Case Size Material System Capacitance Code Tolerance Level Voltage Code Termination Code Leading Code Test Level Marking Code Packaging Terminations C11 T, U, S, Z, E, P, Q, Y, M, W, H, V, R C17 T, U, S, Z, E, P, Q, Y, M, W, H, V, R C18 U, Z, E, Y, W, H C22 U, S, Z, E, P, Q, Y, M, W, H, V, R C40 T, U, S, Z, E, P, Q, Y, M, W, H, V, R Lead Types* Test Level - All Case Sizes C11 A, B, D X Standard C17 A, B, C, D, E, F Y Reduced Visual C18 A, B, C, D, E, F A MIL-PRF Group A C22 A, B, C, D, E, F C MIL-PRF Group C C40 A, B, C, D, E, F D Customer Specified *Special leading requirements available. Laser Marking C11 0, 1, 2, 5 C17 0, 1, 2, 3, 4, 5 C18 0, 1, 2, 5 C22 0, 1 C40 0, 1 Packaging C11 T, V, W, B, P, S C17 T, V, W, B, P, S C18 T, V, W, B, P, S C22 T, B, P, S C40 T, B, P, S, R Phone:

34 MLC - CF Series - Ultrastable Porcelain Capacitors Description High Q Porcelain Capacitors SMD Compatibility Ultra Temperature Stable Low ESR, High Q Capacitance range pf Operating Range -55 to +125 C High Voltage High Self-resonance Low Noise Established Reliability Functional Applications Impedance Matching Power Handling DC Blocking Bypass Coupling Tuning and Feedback Amplifier Matching Networks VCO Frequency Stabilization Filtering, Diplexers and Antenna Matching High RF Power Circuits Oscillators Timing Circuits Filters RF Power Amplifiers and Delay Lines Dielectric characteristics Dielectric Material (Code) Temperature Coefficient (ppm/ C ) 0 ± 15 Dissipation Factor 1MHz Maximum) 0.05 Dielectric Withstanding Voltage Insulation Resistance (MΩ Minimum) Ageing Piezoelectric Effects Dielectric Absorption Voltage Rating (Volts) DWV C Note: Refer to table on page 28 for ordering information. C0G/NP0 (CF) Refer to table 250% of rated 10 6 MΩ min 10 5 MΩ min None None None Capacitance and Voltage Table Case Size Cap Code Cap (PF) C C C C C C R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Reel QTY V Code 9 Special capacitance values available upon request. 200V Code 6 250V Code 9 100V Code 1 50V Code 5 200V Code 6 500V Code 4 1KV Code 7 100V Code 1 50V Code 5 200V Code 6 1KV Code 7 2KV Code G 500V Code 4 300V Code 3 1KV Code 7 1.5KV Code A 2.5KV Code B 500V Code 4 1KV Code 7 2.5KV Code B 3.6KV Code D 7.2KV Code H 32 Phone:

35 MLC - CF Series - Ultrastable Porcelain Capacitors The information above represents typical device performance. Phone:

36 MLC - CF Series: Ultrastable Porcelain Capacitors This information represents typical device performance. Part Number See Page 28 for complete part number system. C 17 CF 620 J- 7 U N- X 0 T MLC Capacitor Case Size Material System Capacitance Code Tolerance Level Voltage Code Termination Code Leading Code Test Level Marking Code Packaging Terminations C06 U, S, Z, E, P, Q, Y, W, H, V, R C11/17 T, U, S, Z, E, P, Q, Y, W, H, V, R C18 U, Q, Y, V, W, H, Z C22 U, S, Z, E, P, Q, Y, W, H, V, R C40 T, U, S, P, Q, Y, W, H, V, R Lead Types Test Level - All Case Sizes C11 A, B, D X Standard C17 A, B, C, D, E, F Y Reduced Visual C18 A, B, C, D, E, F A MIL-PRF Group A C22 A, B, C, D, E, F C MIL-PRF Group C C40 A, B, C, D, E, F D Customer Specified *Special leading requirements available. Laser Marking C06 0, 1, 2, 5 C11 0 C17 0, 1, 2, 5 C18 0, 1 C22/40 0, 1 Packaging C06 T, W, B, S C11/17 T, V, W, B, P, S C18 T, V, W, B, P, S C22 T, B, P, S C40 T, B, P, S, R 34 Phone:

37 MLC - NA Series: N30 Porcelain Capacitors Description Porcelain Capacitors SMD Compatibility N30 ±15 ppm/ C Low ESR, High Q Capacitance Range pf Operating Range -55 to +125 C High Voltage High Self-resonance Low Noise Established Reliability Functional Applications Impedance Matching DC Blocking Bypass Coupling Tuning & Feedback Amplifier Matching Networks VCO Frequency Stabilization Filtering, Diplexers & Antenna Matching High RF Power Circuits Oscillators Timing Circuits Filters RF Power Amplifiers & Delay Lines Power Handling Dielectric Characteristics Dielectric Material Code NA Temperature Coefficient (ppm/ C) -30 ±15 Dissipation Factor 1MHz Maximum) 0.05 Voltage Rating (Volts) See Page 28 Dielectric 250% of WVDC Withstanding Voltage DWV (Volts) for 5 sec unless specified in table +25 C 10 6 Resistance (MΩ +125 C 10 5 Aging None Piezoelectric Effects Dielectric Absorption Terminations C04 C06/07/08/11/17 Lead Types C04/06/07/08 C11 C17 S U, S, Z N A, B, D A, B, C, D, E, F None None Part Number See Page 52 for complete part number system. Packaging C04/06 T, W, B, P, S C07 W, B, P, S C08/11/17 T, V, W, B, P, S Laser Marking C04 0 C06 0, 1, 2 C07 0, 1, C08/11/17 0, 1, 2 Test Level - All Case Sizes X Standard Y Reduced Visual A MIL-PRF Group A C MIL-PRF Group C D Customer Specified Capacitance and Voltage Table Cap Code Cap (PF) 0R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Reel QTY Horizontal C Special capacitance values available upon request. 150V Code 8 Case Size C V Code 5 100V C1 200V Code 6 500V Code 4 1KV Code 7 Phone:

38 MLC - UL Series: Ultra Low ESR Ceramic Capacitors Description Ceramic Capacitors SMD Compatibility Stable TC NP0 Low ESR, High Q Capacitance range pf Operating Range -55 to +125 C High Voltage Low Noise EIA 0603 & 0805 Case Size Functional Applications DC Blocking Bypass Coupling Tuning & Feedback Amplifier Matching Networks VCO Frequency Stabilization Filtering, Diplexers & Antenna Matching High RF Power Circuits Oscillators Timing Circuits Filters Broadcast Power Amps RF Power Amplifiers & Delay Lines Dielectric Characteristics Dielectric Material Code Temperature Coefficient (ppm/ C ) 0 ± 30 Dissipation Factor 1MHz Maximum) 0.05 Dielectric Voltage Rating (Volts) Refer to table Withstanding Voltage DWV (Volts) 250% of rated +25 C ** Resistance (MΩ +125 C ** Aging None Piezoelectric Effects Dielectric Absorption ** Refer to table and statement provided on Page 28. UL None None Capacitance and Voltage Table Cap Code Cap (PF) 0R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Reel QTY Horizontal C V Code 6 C Case Size C C C C Special capacitance values available upon request. 250V Code 9 250V Code 9 500V Code 4 150V Code 8 250V Code 9 200V Code 6 1KV Code 7 50V Code 5 100V Code 1 200V Code 6 500V Code 4 1KV Code 7 36 Phone:

39 MLC - UL Series: Ultra Low ESR Ceramic Capacitors The information above represents typical device performance. Phone:

40 MLC - UL Series: Ultra Low ESR Ceramic Capacitors The information above represents typical device performance. Part Number See Page 28 for complete part number system. C 17 UL 620 J- 7 U N- X 0 T MLC Capacitor Case Size Material System Capacitance Code Tolerance Level Voltage Code Termination Code Leading Code Test Level Marking Code Packaging Terminations C04 S C06 U, S, Z, C07 S, Z, C08/11/17 U, S, Z, Lead Types C04/6/7/8 C11 N A, B, D C17 A, B, C, D, E, F *Special leading requirements available. Test Level - All Case Sizes X Standard Y Reduced Visual A MIL-PRF Group A C MIL-PRF Group C D Customer Specified Laser Marking C04 0 C06 0, 1, 2 C07 0, 1 C08/11/17 0, 1, 2 Packaging C04/6 T, W, B, P, S C07 W, B, P, S C08/11/17 T, V, W, B, P, S 38 Phone:

41 High Q Capacitors - C04, C06, C11 and C17 Kits C04 Engineering Kit 10 Pieces Each of 15 Values Code Cap 0R3 0.3pF 0R5 0.5pF 1R0 1.0pF 1R2 1.2pF 1R5 1.5pF 1R8 1.8pF 2R0 2.0pF 2R2 2.2pF 2R7 2.7pF 3R3 3.3pF 3R9 3.9pF 4R7 4.7pF 5R6 5.6pF 6R8 6.8pF pF C04 Broadband Block 120pF C04 Designer Kit 10 Pieces Each of 8 Values Kit C Kit D Kit E 0R1 0R9 3R9 0R2 1R0 4R7 0R3 1R2 5R1 0R4 1R5 5R6 0R5 1R8 6R8 0R6 2R2 8R2 0R7 2R7 9R1 0R8 3R3 100 C06 Engineering Kit 10 Pieces Each of 21 Values Code Cap 0R3 0.3pF 0R5 0.5pF 1R0 1.0pF 1R2 1.2pF 1R5 1.5pF 1R8 1.8pF 2R0 2.0pF 2R2 2.2pF 2R7 2.7pF 3R3 3.3pF 3R9 3.9pF 4R7 4.7pF 5R6 5.6pF 6R8 6.8pF pF pF pF pF pF pF pF C06 Broadband Block 850pF C06 Designer Kit 10 Pieces Each of 10 Values Kit C Kit D Kit E 0R1 1R2 6R8 0R2 1R5 8R2 0R3 1R8 9R1 0R4 2R R5 2R R6 3R R7 3R R8 4R R9 5R R0 5R6 470 DLI reserves the right to substitute values as required. Customers may request particular cap value and material for sample kit to prove out designs. Custom kits available upon request. C11 Engineering Kit 10 Pieces Each of 28 Values Code Cap 0R3 0.3pF 0R5 0.5pF 0R7 0.7pF 1R0 1.0pF 1R2 1.2pF 1R5 1.5pF 1R8 1.8pF 2R0 2.0pF 2R2 2.2pF 2R7 2.7pF 3R3 3.3pF 3R9 3.9pF 4R7 4.7pF 5R6 5.6pF 6R8 6.8pF 8R2 8.2pF pF pF pF pF pF pF pF pF pF pF pF pF C08 Broadband Block 2400pF C11 Designer Kit 10 Pieces Each of 10 Values Kit C Kit D Kit E Kit F 0R1 1R0 5R R2 1R2 6R R3 1R5 8R R4 1R R5 2R R6 2R R7 3R R8 3R R9 4R R0 5R C17 Engineering Kit 10 Pieces Each of 35 Values Code Cap 0R3 0.3pF 0R5 0.5pF 0R7 0.7pF 1R0 1.0pF 1R2 1.2pF 1R5 1.5pF 1R8 1.8pF 2R0 2.0pF 2R2 2.2pF 2R7 2.7pF 3R3 3.3pF 3R9 3.9pF 4R7 4.7pF 5R6 5.6pF 6R8 6.8pF 8R2 8.2pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF C08 Broadband Block 2400pF C17 Designer Kit 10 Pieces Each of 10 Values Kit C Kit D Kit E Kit F 0R1 1R0 5R R2 1R2 6R R3 1R5 8R R4 1R R5 2R R6 2R R7 3R R8 3R R9 4R R0 5R Phone:

42 Broadband Blocks - C04/C06/C08 Description Resonance free DC Blocking / Decoupling Less than 0.25 db 4 GHz (typical) Surface mountable Functional Applications Fiber Optic Links High Isolation Decoupling LAN s, VCO Frequency Stabilization Diplexers RF/Microwave Modules Instruments Test Equipments Mechanical Specification Product Code C04BL C06 BL C08 BL C18BL Length (L) 0.040" ± 0.008" 0.060" ± 0.012" 0.081" ± 0.020" ± Body Dimensions Width (W) 0.020" ± 0.006" 0.031" ± 0.009" 0.051" ± 0.013" ± Thickness (T) Band Dimensions (B) Min Max 0.028" Max 0.003" 0.019" 0.036" Max 0.006" 0.03" 0.061" Max 0.012" " Max T W B L Part Characteristics Part Number C04BL121X-5UN-X0T C06BL851X-1UN-X0T C08BL242X-5UN-X0T C08BL102X-1UN-X0T C18BL103X-4GN-XOT Performance Capacitance Guaranteed Minimum Value 1KHz,.2Vrms 1KHz,.2Vrms 1KHz,.2Vrms 1KHz,.2Vrms 1KHz,.2Vrms Voltage Rating 50 Vdc Temperature Coefficient -55 C to 125 C Maximum Dissipation Factor Insulation Resistance (MΩ Minimum) Aging Rate Frequency Range 10MHz 40GHz Termination U & S 100 Vdc 50 Vdc 2MHz 30GHz U, S & Z 50 Vdc 3.0%@ <=1.5%/ ± 15% 1KHz, 10 4 decade 1MHz 20GHz U, S & Z.2Vrms hours 100 Vdc 1MHz 20GHz U, S & Z 500 Vdc 1MHz 6GHz U, S & Z C06BL851X-1UN-X0T Insertion Loss (S21) S21 (db) Frequency (GHz) The information above represents typical device performance. 40 Phone:

43 Broadband Blocks - Opti-Cap Description Resonance Free DC Blocking to >40GHz Surface Mountable by Solder or Epoxy Bonding Available in Tape & Reel or Waffle Pack Format Low Frequency Stability over Temperature Very Low Series Inductance 0201, 0402 or 0603 footprints Functional Applications Improved Low Frequency Stability over Temperature Very Low Series Inductance X7R Temperature and Voltage Stability Case Sizes Case Size Milli-Cap Length (L) Width (W) Thickness (T) Length (L) Width (W) Thickness (T) MLC P21 (0201) ± ± ± ± ± ± P42 (0402) ± ± ± ± ± ± P62 (0603) ± ± ± ± ± ± T Part Numbers L W Part Number Capacitance MLC Milli-Cap Voltage Rating TCC +20 C 1KHz Aging Rate %/Decade Hr Freq. Range 3dB (TYP) P21BN300MA nF 30pF 10V X5R >10 2 MΩ 3.5% 1.0% P21BN300MA nF 30pF 10V X5R >10 2 MΩ 3.5% 1.0% P21BN300MA nF 30pF 10V X5R >10 2 MΩ 3.5% 1.0% P21BN300MA nF 30pF 10V X5R >10 2 MΩ 3.5% 1.0% P21BN300MA nF 30pF 10V X5R >10 2 MΩ 3.5% 1.0% 16KHz- >40GHz P42BN820MA nF 82pF 10V X5R >10 2 MΩ 3.5% 1.0% P42BN820MA nF 82pF 50V X7R >10 2 MΩ 3.5% 1.0% P62BN820MA nf 82pF 10V X7R >10 2 MΩ 3.5% 1.0% Notes: X5R: -55 C to +85 C C ±15% X7R: -55 C to +125 C C ±15% Termination Metallization 7.5µ Au over 50µ Ni Recommended attachment is solder or conductive epoxy Maximum assembly process temperature 250 C For best high frequency performance attach Milli-Cap side to transmission line Recommended microstrip gap length is Phone:

44 Broadband Blocks - Opti-Cap Attachment Methods EPOXY DIAMETER THICKNESS SOLDER DIAMETER THICKNESS DISTANCE FROM TRACE EDGE DISTANCE FROM TRACE EDGE GAP IDEAL MICRO STRIP WIDTH GAP IDEAL MICRO STRIP WIDTH Recommended Attachment to Soft or Hard Substrate Using Conductive Epoxy: 1. Place a single drop of conductive epoxy onto each micro strip as illustrated; the edge of the epoxy shall be at least back from the edge of the trace to prevent filling the gap with epoxy. 2. Centering the termination gap of the capacitor within the gap in the micro strip, press with careful, even pressure onto the micro strip ensuring the terminations make good contact with the epoxy drops. 3. Cure according to the epoxy manufacturer s preferred schedule, typically 125 C to 150 C max. 4. After curing, inspect joint for epoxy shorts across the termination and micro strip gaps that would cause a short across the cap. Isopropanol, and Methanol are both safe to use to pre clean Opti-Caps. Isopropanol, and Methanol are not to be used after mounting with conductive epoxy as they act as a solvent! Recommended Attachment to Soft or Hard Substrate Using Solder: 1. Place a single drop of solder paste onto each micro strip as illustrated; the edge of the solder shall be at least back from the edge of the trace to prevent filling the gap with solder. 2. Centering the termination gap of the capacitor within the gap in the micro strip, press with careful, even pressure onto the micro strip ensuring the terminations make good contact with the drops of solder paste. 3. Reflow according to the solder manufacturer s preferred profile, ensuring the reflow temperature does not exceed 250 C. 4. After the reflow step is completed, inspect joint for voids or excess flux and non-reflowed solder balls that can degrade performance or cause shorts across the gaps. Proper cleaning after the reflow process is crucial to avoiding performance degradation and discovering poor solder joints. Isopropanol, and Methanol are both safe to use with soldered Opti-Caps. 42 Phone:

45 Broadband Blocks - Opti-Cap Phone:

46 Broadband Blocks - Milli-Cap SMD Millimeter Wave Capacitor Description 0402, 0502 & 0602 Footprints Low Loss High Q part Very Low Series Inductance Ultra High Series Resonance Matches typical 50Ω Line Widths Preserves Board Space Behaves Like An Ideal Capacitor More Usable Bandwidth.020 ±.002 (.508 ±.05 mm).020 ±.002 (.508 ±.05 mm) Functional Applications Ideal for Test Equipment, Photonics, SONET, Digital radios, and Matching Filter applications Mechanical Specification Terminations: Gold Assembly temperatures not to exceed 260 C. Electrical Characteristics Part Number P_2BN820Z5ST Cap. 82 pf Voltage Rating Temperature Coefficient -55 C to 125 C Maximum Dissipation C P_2NR3R0K5ST 3.0 pf N1500 ±500PPM / C Insulation Resistance (MΩ Minimum) Aging Rate Frequency Range ± 10% C at rated voltage <=1.5%/decade hrs 20MHz 40GHz 4 20GHz P_2CG1R5C5ST 1.5 pf 8 32GHz 50 Vdc 0 ± 30PPM P_2CG1R0C5ST 1.0 pf C 18 40GHz N / A* P_2CD0R7B5ST 0.7 pf N20 ±15PPM / C at rated voltage 20 46GHz P_2CF0R5B5ST 0.5 pf 28 40GHz 0 ±15PPM / C P_2CF0R3B5ST 0.3 pf 35 50GHz Dimensions Key: P42 = 0402; P02 = 0502; P62 = 0602 Electrical Performance The information below represents typical device performance. 44 Phone:

47 Broadband Blocks - Miniature RF Blocking Network Description For RF Noise Suppression in high speed mixed signal semiconductor devices Eliminates Noise at I/O Pins Replaces Large Decoupling Capacitor with Superior Performance Clean DC Lines Beyond 18 GHz Functional Applications High Speed Digital Mixed Signal IC s Suppression of Noise on DC Supply Lines MCM and Hybrid Modules X7R Temperature and Voltage Stability Layout and Dimensions Segment Equivalent Schematic Representation Part Number Identification J 30 XX BA01 2 L X 4 Product J = Blocking Network Width (Mils) Material BL or BJ Internal Drawing Reference Voltage 2 = 25 Vdc Metallization 100µ Gold Finish Test Level Commercial Number of RC Segments Material and Electrical Characteristics Material Code Capacitance (typical) Resistance (pad to pad) DF TCC Rated Voltage BL 30 pf 10Ω Nom. 3.0% Max. X7R 25 Vdc BJ 45 pf 10Ω Nom. 3.0% Max. X7R 25 Vdc Phone:

48 Thin Film - Miniature RF Blocking Network Metallization: Top: 50 /Square TaN, 300Å TiW, 100 Inch minimum Au. Bottom: 300Å TiW, 100 Inch minimum Au. Screening Options Test Code Test/Inspection Sample Size Description Bond Strength 2 Pcs/Plate 2 bonding pads on each sample X IR 1% AQL 21/2 times rated voltage of 25 volts Visual Inspection 100% 4 Side visual screening Pad to pad resistance check 1% AQL Ensure isolation between segments and boarder Performance Segment Bonding for Measurement For additional data of multi-segment devices please contact an inside sales representative. Typical Application 46 Phone:

49 Thin Film - RF Guru Ceramic Filter Request Form This is an example of the form you ll find on the DLI website ( It was developed as a template to make it easy for our customers to enter the information DLI needs for an initial assessment of filter performance, size and cost. Fill out the RF Guru filter request form and your requirement will be automatically sent to DLI engineering. After submitting this form DLI Applications Engineering will contact you. From these discussions DLI will provide you with further information about possible topologies and predicted filter performance. Then you can decide if a filter on a high-k dielectric is the right option for you. Please note: This is not an order form. There is no obligation until you are confident in our capabilities and actually decide to place an order. If you re looking for a catalog off the shelf solution you might find our EAR99 classified catalog filters on the following pages helpful. Phone:

50 Thin Film - Ceramic Filters Typical Filter Types: Bandpass Filters from 500MHz - 67GHz Lowpass Filters from 500MHzz - 67GHz Highpass Filters from 500MHz - 67GHz Notch Filters from 500MHz - 67GHz Duplexers and Diplexers from 1GHz - 30GHz Cavity Filters from 6GHz - 25GHz Typical Weight: <0.3 grams Typical Area: <0.1 in 2 Typical Volume: <0.01in 3 Typical Characteristics: RF power handling up to 20 watts (function of topology, BW and other variables) Steep selectivity (number of poles) n - 2 to 20 poles Fractional bandwidths up to 80% Low insertion loss Flat amplitude ripple and group delay Solder-surface mount designs Chip and wire designs Interdigital Typical Filter Topologies: Interdigital End Coupled Edge Coupled Hair Pin Edge - End Coupled Combline and Pseudocombline Dual Mode Quasi-lumped Advantages of DLI High K Ceramics and Thin Film Processing: Size reduction over Alumina and PWB materials Extremely temperature stable from -60 C to +125 C Thin Film Precision - Tight geometry tolerance High repeatability and no tuning required Improved field confinement Lower CTE mismatch in SMT appicaltions: Smaller size and low CTE ----> Less stress, and higher reliability Note: 67GHz is an artificially imposed limit currently set by the test equipment at DLI. Dual Mode Mounting Information PCB ground pattern length and width can be inches larger than filter footprint. Dimensions of filter launch and PCB launch pattern should be closely matched. It is suggested that PCB ground metal be pulled back from RF I/O trace to account for component alignment tolerance. Ground via depth and spacing should be set so as not to create any resonances at the frequency of operation. Reference SMT Filter Mounting application note for additional mounting information. Individual footprint diagrams of all Filters are available upon request from the DLI Sales Office. Combline Hairpin 48 Phone:

51 Thin Film - Ceramic Filters DLI has expanded its filter capability beyond microstrip bandpass designs. Notch filters, lowpass and highpass filters, ceramic cavity filters, and various other filter types are now available. All filters employ DLI s high-k ceramics which allow for great size reduction and unbelievable temperature stability compared to alumina and PWB materials. Solder surface mount and chip and wire filters are all possible. 4GHz Notch Filter >20dB attenuation at 4GHz >Low loss in passband regions: 1.5dB >Small size:.25 x.196 x.02 inches >Solder surface mount device >Picture below Typical Lowpass Filter >Low loss in passband: 1.0dB >40dB attenuation in stopband >Typical size:.4 x.25 x.015 inches >Chip and wire filter [mounted on PCB with epoxy] >Devices scalable from L to Ka band NOTE: See our website for more details. Typical Cavity Filter >Ceramic cavity filter design on CF ceramic >Low loss in passband: 3.5dB typical >Typical size:.75 x.18 x.03 inches >Devices scalable from X to Ku band >Bandwidth 1 to 3% Phone:

52 Thin Film - Ceramic Filter Packaging and Shielding Exceptional performance demands rigorous engineering, both of the component and of its interaction with the system. The design of the filter s shielding is a crucial element for achieving laboratory-grade performance outside of the laboratory and assuring smooth integration with the system. Shielding protects the filter from interference and creates a precisely controlled micro-environment for optimal performance. There are three packaging options available for RF shielding: Insertion Loss db Filter with printed wire board cover Printed wire board (PWB) covers are one solution offered by DLI. This style of cover offers excellent RF shielding for solder surface mount applications. Additionally, PWB covered components are extremely resistant to high shock and vibration environments. No Cover Cover Filter with sheet metal cover These covers are attached using epoxy; the cured assemblies offer a small and sturdy surface mount package that can integrate multiple filters in one pc. The overall height of the package is typically 0.1 inch. A second option for shielding is the attachment of an integral metal cover to the filter. Sheet metal covers are compatible with both solder surface mount and chip and wire filter applications. Typically, this style of cover has tabs that fit into the ground vias along the perimeter of the part and a high-temperature solder is used for the assembly. Covers can be recessed to expose the I/O contact pad for chip and wire filters to allow wire-bonding. The I/O contact pad is not plated with a solderable metal scheme to facilitate reliable wire bonding. The overall assembly height can vary from 0.07 to 0.1 inches. The third option leaves packaging up to the customer. Either the next level of assembly provides the RF shielding for the filter or the customer can have their own cover integrated. DLI s engineering team can provide recommendations for housing dimensions, leveraging years of expertise to ensure successful design integration. If the customer provides their own shielding for the filter, it is very important that DLI engineering knows the channel width and cover height that will enclose the device. These dimensions will be taken into account during design and test to ensure that the part will work in its next level of assembly Frequency MHz High K substrate provides Higher Field Confinement 9 GHz Filter (30 mil CF with and without cover). Housing dimensions critically affect performance Solder Stop Prevents solder from wicking through vias onto critical features during SMT processing 50 Phone:

53 Thin Film - Ceramic Filter Mounting DLI offers metallization schemes compatible for both chip and wire filters, and solder-surface mount filters. The correct metal scheme will be employed to ensure reliable connectivity depending on the desired mounting method. Custom metallization schemes are also available. Please consult the factory for more details. Ribbon or Wirebound RF (I/)O) Top Metallization Options RF (I/)O) PC Board Filter Bottom Metalization Options Housing Floor The above illustration demonstrates the mounting of a typical chip and wire filter. The circuit is relieved to accommodate the filter. The bottom surface of the part is attached directly to the system ground plane using conductive epoxy. Wire or ribbon bonds are launched from the circuit to the filter I/O pad. In a typical application a channelized housing would sit over the filter to provide adequate RF shielding. Surface mounting techniques typically rely on a solder bond between the bottom conductor of the component and the ground conductor of the circuit board. The I/O connection is realized through edge castellations on the filter which mate with contact pads when the component is mounted on the board. Note the use of multiple ground vias between the component and the system ground plane to ensure optimal performance. Solder surface mount designs are custom matched to the specific board material on which they will be placed. In a typical application, a channelized RF (I/O) housing would be placed Board Trace over the filter to provide RF shielding. RF (I/O) Ground Plane PC Board Top Metallization Options SMT Filter RF (I/O) Solder PC Board Ground Via Housing Floor Phone:

54 Thin Film - Ceramic Filter Temperature Stability The primary ceramics used in DLI filter designs are CF [K=23] and CG [K=67]. Both of these materials exhibit extreme temperature stability across a wide range of frequencies. So regardless of the filter operating frequency, no guard band needs to be designed into the device to meet a demanding temperature requirement. CF and CG also do not out gas, do not exhibit signs of aging, and have been exposed to a mega-rad of total radiation dosage with no degradation in performance. The filters will perform the same from outer space to the desert. The graphs below demonstrate the extreme stability of DLI custom ceramic devices. 0 Thermal Data (-55C to +125C) - 3.5GHz Filter; CG Ceramic 0 Temperature Data [-20C to +85C] GHz Filter; CF Ceramic Magnitude (db) Magnitude (db) Frequency (MHz) Frequency (MHz) Stability Over Temperature (-60 to +125 C) db Filter ( c) Filter on Alumina Alumina -60.s2p_S11_Mag(dB) 0.s2p_S11_Mag(dB) 20.s2p_S11_Mag(dB) 40.s2p_S11_Mag(dB) 60.s2p_S11_Mag(dB) 80.s2p_S11_Mag(dB) 100.s2p_S11_Mag(dB) 125.s2p_S11_Mag(dB) -20.s2p_S11_Mag(dB) -40.s2p_S11_Mag(dB) -60.s2p_S21_Mag(dB) 0.s2p_S21_Mag(dB) 20.s2p_S21_Mag(dB) 40.s2p_S21_Mag(dB) 60.s2p_S21_Mag(dB) 80.s2p_S21_Mag(dB) 100.s2p_S21_Mag(dB) 125.s2p_S21_Mag(dB) -20.s2p_S21_Mag(dB) -40.s2p_S21_Mag(dB) CF Material Frequency (MHz) db (freq. vs. temp.) CG Material Frequency (MHz) 125.s2p_S11_Mag(dB) 100.s2p_S11_Mag(dB) 80.s2p_S11_Mag(dB) 60.s2p_S11_Mag(dB) 40.s2p_S11_Mag(dB) 20.s2p_S11_Mag(dB) 0.s2p_S11_Mag(dB) -20.s2p_S11_Mag(dB) -40.s2p_S11_Mag(dB) -60.s2p_S21_Mag(dB) 125.s2p_S21_Mag(dB) 100.s2p_S21_Mag(dB) 80.s2p_S21_Mag(dB) 60.s2p_S21_Mag(dB) 40.s2p_S21_Mag(dB) 20.s2p_S21_Mag(dB) 0.s2p_S21_Mag(dB) -20.s2p_S21_Mag(dB) -40.s2p_S21_Mag(dB) -60.s2p_S11_Mag(dB) 52 Phone:

55 Thin Film - Surface Mount Lowpass Filter Series Description DLI introduces its new high frequency surface mountable catalog lowpass filters. These LPF s incorporate DLI s high dielectric ceramic materials which provide small size and minimal performance variation over temperature. The catalog LPF s are offered in a variety of frequency bands, which offers a drop in solution for high frequency attenuation. Features Small Size SMD device Fully Shielded Component Frequency Stable over Temp. Excellent Repeatability Operating Temp: -55 C to +125 C Characteristic Impedance: 50Ω 100% Tested and Inspected Part Number Specification L065XG9S L095XG9S L117XH4S L128XH4S L157XG3S L204XF4S L254XF3S 3 db Cutoff 6.5 GHz 9.5 GHz 11.7 GHz 12.8 GHz 15.7 GHz 20.4 GHz 25.4 GHz Passband DC - 6 GHz DC - 9 GHz DC - 11 GHz DC - 12 GHz DC - 15 GHz DC - 20 GHz DC - 25 GHz Max Insertion Loss in Passband 1.3 db 1.3 db 1 db 1.2 db 2.2 db 1.8 db 1.4 db Min VSWR in Passband 1.22:1 1.12:1 1.43:1 1.38:1 1.3:1 1.43:1 1.3:1 Min Rejection GHz (35 db) GHz (30 db) GHz (40 db) GHz (40 db) -55 to +125ºC GHz (40 db) GHz (30 db) GHz (30 db) Usable temp. Range Length - Inches (mm) (5.58) (5.58) (5.58) (5.58) (5.58) (5.58) (5.58) Width - Inches (mm) (4.57) (3.56) (3.56) (3.56) (3.56) (3.56) (3.56) Height - Inches (mm) (2.62) (2.62) (2.62) (2.62) (2.62) (1.98) (1.98) Typical Measured Performance L065XG9S GHz L095XG9S GHz L117XH4S GHz L128XH4S GHz L157XG3S GHz L204XF4S GHz L254XF3S GHz Phone:

56 Thin Film - 2 to 18 GHz Bandpass Filter Series Description Utilizing DLI s high permittivity, NP0 ceramics allow for small size, temperature stable performance over frequency and high reliability in environmentally challenging conditions. This series of bandpass filters was designed to span the popular 2-18 GHz frequency range. The compact size and surface mount attachment allow for low cost of manufacturing without sacrificing performance and repeatability. Designed for use on PCB 8-12 mils thick with a permittivity of Features Small Size Fully Shielded Component Frequency Stable over Temperature Applications C, X and Ku Band Satellite communications Satellite TV Weather and Radar Radar and Military communications Part number Specification B028RF2S B033ND5S B056RC4S B096QC2S B148QF0S Center Frequency 3 GHz 3.5 GHz 6 GHz 10 GHz 15 GHz Passband 2 to 4 GHz 3.1 to 3.5 GHz 4 to 8 GHz 8 to 12 GHz 12 to 18 GHz 25ºC 2.5 db 2.0 db 3.0 db 2.5 db 3.1 db Loss (@Fc) -40 to +85ºC 3.0 db 3.2 db 3.5 db 3.0 db 3.6 db VSWR - 50W System 1.63:1 2 to 4 GHz 2.00:1 3.1 to 3.5 GHz 1.5:1 4 to 8 GHz 2.0:1 8 to 12 GHz 1.63:1 12 to 18 GHz Rejection dc to 1.25 GHz (40 db) dc to 2.6 GHz (30 db) dc to 3 GHz (40 db) dc to 6 GHz (40 db) dc to 7.6 GHz (40 db) 4.85 to 6 GHz (40 db) 4 to 6 GHz (40 db) 9.5 to 12 GHz (40 db) 14 to 18 GHz (40 db) 22.5 to 25 GHz (30 db) Usable Temperature Range -55 to +125ºC Length - Inches (mm) (11.43) (9.98) (11.43) (10.86) (13.97) Width - Inches (mm) (10.16) (8.97) (5.84) (4.57) (3.81) Height - Inches (mm) (2.87) (3.25) (2.54) (2.54) (2.49) Typical Performance B028RF2S - 2 to 4 GHz B033ND5S to 3.5 GHz B056RC4S - 4 to 8 GHz B096QC2S - 8 to 12 GHz B148QF0S - 12 to 18 GHz 54 Phone:

57 Thin Film - Wilkinson Power Divider Description - Part number PDW05758 DLI introduces its new high frequency surface mountable Wilkinson Power Divider. The power divider utilizes DLI s high dielectric ceramic material which provides small size and minimal performance variation over temperature. The compact size, broad band performance and ease of integration make this power divider ideal anywhere board space is of a premium and quality signal splitting or combining is required. Features Broad Band 6 to 18 GHz Performance 0.7dB Typical Insertion Loss 20dB Typical Isolation and Return Loss Excellent Phase and Amplitude Balance Compact Solder Surface Mount Package Electrical Specification Physical Dimensions Frequency Range (GHz) 6 to 18 Nominal Power Splitting (db) Nominal Phase Shift (degrees) 3.0 (typical) 0.0 (typical) Output (4.06) Output (0.51) unit = in (mm) (0.38) Amplitude Balance (db) Phase Balance (degrees) ±0.025 max. ±3.0 (max.) (4.70) Y (3.69) Excess Insertion Loss (db) Return Loss (db) Isolation (db) Input Power as a Splitter (W) (typical) 20 (typical) 20 (typical) 5 (max.) (2.03) X Common port Shaded areas are solderable metal (0.53) 1) Electrical Specifications at 25ºC; Over Temperature Performance TBD. 2) Load VSWR not to Exceed 1.20 : 1.00; Base Temperature not to Exceed 85ºC. Typical Measured Return Loss Recommended PCB Layout Dimensions R0.026 (R0.67) R0.010 (R0.24) Output Output (0.38) Typical Measured Isolation and Insertion Loss Common port (0.48) Phone:

58 Thin Film - Symmetric Dual Mode Resonator Filter Description High seectivity, (>-60 db rejection in 1% bandwidth distance from center High Q (low loss) Low loss Temperature stable 16 pole design with integrated trap to surpress harmonics 6.5 GHz Symmetric Dual Mode Bandpass Filter S21(dB) Top Line S11(dB) Bottom Line Frequency (GHz) -30 Thin Film - 10GHz 4 Pole Band Pass with Bandstop Filter Size: 0.9 x 0.2 x.02 Inches Magnitude in db Frequency in MHz Thin Film - 20 GHz 8 Pole SMT Filter Size: 420 x 90 x 15 mils Thin Film - 36 GHz Filter Repeatability 70 Samples from Multiple Substrates and Material Lots 10 mil CF (K23) Material Highly repeatable performance Excellent temperature stability Magnitude in db Frequency in MHz 56 Phone:

59 Thin Film - GPS Filters DLI introduced a family of GPS components that includes two bandpass filters, two diplexers, and a notch filter. The bandpass filters and diplexer pass both L1 and L2 frequency bands. The notch filter attenuates the L1 frequency band. Two different versions of the diplexer have been designed and manufactured. The first version has higher insertion loss but better rejection due to a narrow bandwidth. The bandwidth was widened on the second version to reduce the insertion loss at the cost of eroding the rejection skirts. Data for the second version is presented below. The notch filter incorporates an integral metal cover for RF shielding. All components are solder surface mount compatible and would make a nice temperature stable drop-in for any GPS application. The data here represents typical performance for all of the devices. The bandpass filters and diplexer incorporate DLI s new printed wire board cover technology. The PWB cover provides RF shielding and reduces the possibility of energy coupling from the filters to other components in the circuit. Thin Film GHz End Coupled Filter 7-Pole End Coupled Filter 4% Bandwidth (400 MHz) Insertion Loss <2.7 db Size (1.1 x 0.1 x 0.03 ) but Typical cover height is 6X material thickness between 75 and 100 mils S11 (db) (Lower Line) S12 (db) (Upper Line) Features Frequency (GHz) Phone: GHz Bandpass Filter

60 Thin Film - High-K Ceramic Substrates and Plates High K substrates are used for circuit miniaturization. DLI offers complete fabrication services! Case Sizes and Tolerances For custom sizes please contact the sales office. Case Size (Inches) Length (Inches) Material Specifications Material Code Width (Inches) Relative 5 GHz Plates (H) ± (Inches) Tolerance Substrates (S) ± (Inches) Substrates Only TCC Loss ppm/ C Coefficient of Tangent* % Max Thermal Thermal Expansion ppm/ K Conductivity W/m- K QZ 3.82 (@ 1MHz) Fused Quartz (@ 1MHz) (@ 24 GHz) AG 8.85 ± 0.35 (@ 1MHz) Aluminum Nitride PI 9.9 ± 0.15 (@ 1MHz) Alumina 99.6% PG 12.5 ± 0.5 P22 ± AH 20 ± 0.5 P90 ± NA 23 ± 1 N30 ± CF 25 ± 2 0 ± CD 38 ± 1 N20 ± CG 67 ± 3 0 ± NR 152 ± 5 N1500 ± *Unless otherwise specified K dielectric measurement at approximately 5 GHz. For the temperature range -55 to 125 C. Surface Finish Code Roughness R a Material Process X >50 µ in. As-Fired Y 20 µ in. Machined Z <5 µ in. Polished S Special - Drawing req d Screening Options Metallization Code Description X No Metallization M 300 Angstroms TiW, 100 µ in. min. Au N 300 Angstroms TiW, 50 µ in. min. NiV, 100 µ in. min. Au P 75 µ in. min. Nickel, 100 µ in. min. Au Top 50 Ohms/sq. TaN, 300 Angstroms TiW, 100 µ in. min Au. L Bottom Side 300 Angstroms TiW, 100 µ in. min. Au E Metallized and etched per Customer drawing T 300 Angstroms min. TiW, 50 µ in. min. NiV, 300 µ in. min. Au-Sn D SPECIAL, Customer Drawing Required! Test Code Test/Inspection Sample Size Description X Visual Mechanical 100% Verify that the required area is available and continuous (Broken corners allowable). K Visual Mechanical 100% Verify that the required area is available and continuous (Broken corners allowable). Kent Test 10% of lot K and Loss. D Customer Defined Customer Drawing Required! Part Number Identification S 20 CG 250 D Z N X Product S = Substrate H = Plate Case Size Material See material table above. Thickness 100 = = =.025 Thickness Tolerance D = ±.0005 E = ±.001 Surface Finish X Y Z S Thickness Code. A three digit code representing the thickness in mils. Examples: Code 100 =.010, Code 155 =.0155, Code 250 =.025 Please consult with an applications engineer for thicknesses <.010 Metallization See table above. Test Level X K D Thickness Tolerance Codes D = ±.0005 Machined or Polished E = ±.001 Standard 58 Phone:

61 Thin Film - Ceramic Resonators DLI has a family of patent pending high-q ceramic cavity resonators. They provide an ideal solution for high performance, low-cost microwave, or millimeter wave oscillators. The devices are fully shielded and designed on our temperature stable, high dielectric constant ceramics. Frequencies of resonator designs range from <1.0 to >67GHz. Designs can be customized for either soldersurface mount or chip and wire applications. High reliability thin film gold metallization is employed and frequency tolerances as low as 0.1% are attainable. DLI has developed an equivalent circuit modeling tool for cavity resonators. The tool enables optimization of resonator based oscillator designs and constrains circuit element values to realizable combinations. Three models are shown below, at 8GHz, using CF ceramic, one using FS, and one using CG. Please consult DLI Applications Engineering for a copy of the modeling tool. CF (design1) S11 CG S Freq(GHz) DLI resonators are direct in frequency. So in addition to all of the other benefits no multiplication is required as there would be in other technologies. As a solid block of ceramic they are also non microphonic...imagine the possibilities! Types of Applications Systems INSTRUMENTATION AUTOMOTIVE RADAR Ground-based Avionics/Missile Shipboard COMMUNICATIONS Base Stations WLAN, WLL SONET/SDH MILITARY RFID ECM/ECCM/EW Tx/Rx Man Pack Radio Aerospace Intelligent Munitions 6.8GHz oscillator Circuits Microwave and Millimeter-Wave Oscillators Fundamental Fixed Frequency Oscillators - Ultra-low Phase Noise (former solution: expensive DRO s and multiplied-up crystal or SAW based device with decreased performance) Narrow-Band Tunable VCO or Phase Locked Oscillators (typically ± 3% tuning) (former solution: varactor tuned expensive DRO) Integration of high performance Oscillators directly on the system motherboard without the expense and complexity of subassemblies, housing and labor intensive operations typical of former solutions. Narrow bandwidth low loss filters (former solution: low loss SAW devices with frequency limitation and poor performance) Two port resonators can also be realized for varactor-tuned oscillator and feedback oscillator applications. The devices can also be implemented as one-pole bandpass filters. These are fully shielded and designed on temperature stable ceramics like the one port resonators. Below is required information for a two port resonator design and measured test data of a two port resonator at 24GHz Electrical Specification General Information Freq(GHz) CF (design2) 0.0 Resonant Frequency Fc = GHz Tolerance: % Resonator Application Varactor - Tuned OSC Feedback OSC Filter Doubly Loaded Q QL = Size Restriction Max width: Max length: Max thickness: S Maximum Insertion Loss At Fc IL = db Assembly Type Solder Surface Mount Epoxy Attach -8.0 FS Freq(GHz) S Freq(GHz) Phone:

62 Thin Film - Single Frequency Cavity Resonator The table summarizes the characteristics of selected standard resonators to illustrate the primary resonator design variables. The primary variables are frequency of resonance, cavity material dielectric constant and lengthby-width dimensions. The interaction of these variables is illustrated in the resonator size charts on Page 62. The loaded Q of the resonators is effected by the coupling coefficient (denoted in the tables in terms of return loss), the material choice (dielectric constant), and by material thickness. Generally, resonators made from thick, low dielectric constant materials are capable of the highest loaded Q s. For reference, when a resonator has a coupling coefficient of 1.0, it will exhibit an excellent return loss at the resonant frequency and the unloaded Q will be 2 times the loaded Q value. The desired level of resonator coupling varies with individual circuit requirements such as varactor frequency tuning or transistor negative resistance value. The unloaded Q s of the cases shown range up to 2,000, clearly a new standard for a component compatible with automated assembly. In contrast to other high Q microwave resonators, DLI s cavity resonator is completely self contained. Large, expensive housings are not needed. Its loaded Q and resonant frequency can be directly measured using RF coplanar probe technology. Thus, ambiguities of special test fixtures and components which are not appropriate to the product realization are eliminated from part evaluation. Representative Sampling of Resonator Characteristics Resonant Frequency (GHz) *1 Material Temperature Coefficient of Frequency *2 (Typical 9PPM/ C) Return Resonance Typical (db) Loaded Q Typical (50 OHMS) mm Dimensions L x W x T Inches 3.2 CG x 8.1 x x 0.32 x CF x 8.1 x x 0.36 x CG x 5.1 x x 0.20 x FS x 21.8 x x 0.86 x FS x 15.7 x x 0.62 x CF x 5.3 x x 0.21 x CF x 4.3 x x 0.17 x CF x 3.6 x x 0.14 x FS x 5.6 x x 0.22 x CF x 21.8 x x 0.86 x FS x 4.6 x x 0.18 x FS x 4.2 x x 0.16 x FS x 2.7 x x 0.10 x FS x 2.2 x x 0.08 x FS x 1.6 x x 0.06 x 0.04 *1 Frequency Tolerance 0.1~ 1% *2 Over the range -60 C to C The equivalent circuit of the Single Frequency Cavity Resonator (SFCR) near its lowest resonant frequency is shown below. The lowest resonant mode is typically employed in oscillator and filter designs. The element values are shown for a 9.95 GHz SFCR. The resonant frequency is set by the parallel combination of Cp and Lp, and the finite unloaded Q by R. The series capacitance Cs connects the resonator L-C to the input pad, thus setting the coupling between the external circuit and the frequency controlling L-C resonator. The capacitance Csh is a stray capacitance between the input pad and ground. All of these network elements have excellent repeatability providing tight control over resonant frequency, coupling and input impedance. The structure also provides an integrated DC blocking function, thus eliminating a tolerance sensitive element from the bill of materials. For wide bandwidth circuit modeling, S-Parameters are recommended. S-Parameters are available for downloading from our website ( The resonators are readily customized for frequency, coupling, Q, tunability and assembly requirements. The Graph below depicts typical Single Frequency Cavity Resonator frequency stability versus temperature for DLI standard dielectric materials. Equivalent Circuit of a 9.95 GHz SFCR Input Cs pF Cp 0.194pF R 0.13ohm Lp 1.264nH Csh 0.132pF 60 Phone:

63 Thin Film - Single Frequency Cavity Resonator Standard Frequencies for SFCR DLI has established a series of standard specific frequency resonators (EAR 99) which have the ability to be laser trimmed down in frequency by approximately 2% of the actual resonant frequency. The resonators incorporate lithography defined snake eyes that the laser can recognize as a starting point to trim through the gold. Frequencies above and below this range of standard frequencies are obtainable. Please contact DLI Applications Engineering for more details. Resonant Frequency (MHz) Tunable Range (MHz) Resonant Frequency (MHz) Tunable Range (MHz) Resonant Frequency (MHz) Tunable Range (MHz) *1 Frequency Tolerance 0.1~ 1% *2 Over the range -60 C to C The graph to the left shows a 9.9GHz resonator tuned down in frequency by laser trimming slots through the gold metallization. In this particular example the part was lasered approximately 96MHz lower than its true resonant frequency. Tuning resonators up in frequency is possible by using photolithography to define slots on the top side of the resonator circuit. Wirebonding across the slots will tune the device up in frequency. Estimating Resonator Size The size of the cavity resonator is determined by the desired resonant frequency and the ceramic material selected. At the same resonant frequency, a higher dielectric constant material will offer reduced size compared to a lower dielectric constant material. Resonators are typically designed on thick ceramics due to Q increasing with material thickness. These graphs can be used as a guide for estimating resonator sizes on typical DLI materials. Designs are slightly rectangular in shape. Length to width aspect ratios are usually less than 1.2:1. For additional information consult the factory. db GHz Resonator - Before & After Laser Lasered Not Lasered Frequency (MHz) Phone:

64 Thin Film - Single Frequency Cavity Resonator Mounting Alternatives The illustrations demonstrate a surface mounting technique. The first resonator is positioned with the I/O pad in view to demonstrate the alignment with the printed wire board geometry [1]. The second illustration shows the resonator mounted in position [2]. The third illustration shows the printed wire board geometry [3a-c]. A solder mask is used to control the flow of solder during assembly and insulate the input line from shorting to the resonator ground metallization. A solderable metal scheme with a nickel barrier will be employed on the resonators. A thin outer layer of gold will prevent oxidation of the nickel. 1) Resonator mounting surface shown facing up (contact pad is visable) 2) SMT resonator shown in normal mounted orientation 3) Typical circuit board layout forsmt resonator mounting: a) Solder mask, insulates input line from shorting to ground b) Input line c) Ground vias in board Microstrip Mount This picture illustrates a microstrip mounting technique. Shown is an implementation where the active device and power supply bypass capacitors are assembled onto the resonator. The wirebond signal leads are kept as short as possible. In a typical application conductive epoxy would be used to attach the resonator to the circuit. 62 Phone:

65 Thin Film - Self Bias Network Description Wireless communication modules MIC broadband high gain RF/Microwave module Bias line voltage divider and integrated decoupling capacitor Simplifies assembly with 1 component Improves gain flatness and stability in GaAs FET Miniature size:.020 x.034 (.5mm x.86mm) Physical Characteristics Equivalent Schematic Representation User wire bond to Ground to select resistance WB R1 R2 To FET source R4 R3 Resistor Values: R1-200W R2-100W R3-50W R4-20W Nominal Capacitance: 50pF Typical application requires 2 networks Recommended Mounting: The self Bias Network should be mounted with fully metalized side down directly on the RF ground plane for best performance. Part Number Identification B 28 BL SBN01 Product B = Bias Network Width 28 Material BL ±25% TC Network Type Physical Characteristics Typical Application Custom Networks can be designed per customer specification. Please consult factory for additional information or special requirements. Phone:

66 Thin Film - Bias Filter Network Description Wireless communication modules Ideal varactor decoupling element High gain RF/Microwave modules Ideal GaAs FET gate biasing device MMIC multichip modules Functional Applications Filters noise and RF from Supplies Reduces RF feedback through bias supplies Simplifies assembly - one component replaces many Designed with large 4 mil wirebond pads for assembly ease Equivalent Schematic Representation Total Series Resistance: DC Rating: Volts Max: 50V Total Shunt Capacitance: I(ma) Max: 10Ma Recommended Mounting: The Bias Filter Network should be mounted with fully metallized side down directly on RF ground plane for maximum isolation performance. Physical Characteristics Typical Application Part Number Identification B 28 BT BFN01 Product B = Bias Network Width 28 Material BT +22, -56% BJ +/- 15% TC Network Type Isolation vs. Frequency Frequency (GHz) Frequency (GHz) Custom Networks can be designed per customer specification. Please consult factory for additional information or special requirements. 64 Phone:

67 Thin Film - Gain Equalizer Description Equalizer compensates for module Gain Slope Broadband communications, radar, phased arrays SONET modules to 40+ GHz RADAR applications to >67 GHz Superior microwave performance Excellent repeatability Ease of assembly, reduced size and cost Designed with large 4 mil wirebond pads for assembly ease Physical Characteristics Performance Insertion Loss, S21 (db) AEQ3042 AEQ3055 AEQ2199 AEQ2050 AEQ Mounting attachment material: Epoxy or Solder Metallization - Epoxy mount: Top: 100 µ inch Au min over 300 Angstroms TiW min. Bottom: 100 µ inch Au min over 300 Angstroms TiW min over TaN resistor Metallization - Solder mount: Top side: 100 µ inch min. over 50 µ inch NiV min. over 300 Angstroms TiW min. Bottom side: 25 µ inch min. over 50 µ inch NiV min. over 300 Angstroms TiW min. over TaN resistor Die attachment recommendations: The gap in the microstrip line should nominally be equal to dimension S (see equalizer outline on Page 64) Frequency in GHz Excellent, repeatable microwave performance is achieved by application of precision thin film fabrication and DLI Hi-K Ceramic materials. DLI s unique design solution provides near Ideal R-C frequency response, far superior to Stacked R-C chip Assemblies. Equivalent Schematic Representation Part # Resistor (R) Low Frequency Insertion Loss, 50 ohm system (db) Equivalent Capacitance (pf) F 0 (GHz) Mounting Attachment Material: S=solder E=epoxy AEQ Ω E L W T ±.002 (.762 ±.051mm) ±.002 (.457 ±.051mm) ±.001 (.127 ±.025mm) AEQ Ω E ±.002 (.711 ±.051mm) ±.002 (.406 ±.051mm) ±.001 (.178 ±.025mm) AEQ Ω E ±.002 (.813 ±.051mm) ±.002 (.406 ±.051mm) ±.001 (.127 ±.025mm) AEQ Ω S ±.002 (1.02 ±.051mm) ±.002 (.508 ±.051mm) ±.001 (.152 ±.025mm) AEQ Ω S ±.002 (1.02 ±.051mm) ±.002 (.508 ±.051mm) ±.001 (.152 ±.025mm) Phone:

68 Thin Film - DC to 18 GHz EW Series Gain Equalizers Description DLI s Gain Equalizers are designed as a small, low cost solution to your gain slope challenges. DLI s EW Series is designed to address this issue from DC to 18 GHz in a package smaller than an 0302 capacitor. Components are designed for surface mount pick and place equipment or epoxy mount. Available in tape and reel packaging for high volume applications. Applications Broadband Microwave Modules; EW, ECM, ECCM Equalizer is utilized as a compensation circuit to correct for loss slope created by other circuit elements such as amplifiers Benefits Footprint interchangeable part series, gain slopes from 1 to 3.5 db Superior, repeatable microwave performance Ease of assembly; terminations are compatible with solder SMT and conductive epoxy assembly Package optimized for typical 50 W transmission line width No ground connection required Equivalent Schematic Representation Part Numbers - DC to 18 GHz EW Series Gain Equalizers Part Number L W T Lp Wp G Attach method Nominal Slope AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 1.0 db AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 1.5 db AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 2.0 db AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 2.5 db AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 3.0 db AEQ ± 1 16 ± 1 7 ± 1 7 min. 14 ± 1 10 Solder/Epoxy 3.5 db All dimensions in mils Typical Performance Die Attach Recommendations Magnitude in db AEQ05467 AEQ05468 AEQ05469 AEQ05470 AEQ05471 AEQ Frequency in MHz 1) Equalizer width should be approximately as wide as 50 W line trace on PCB. 2) The gap in the microstrip line should be nominally equal to dimension G. 3) Vacuum pick-up tool recommended for component handling. If pressure is to be applied during component placement, it should be done uniformly across the part. 4) Thin, unmounted circuit boards are prone to warpage during reflow. This can cause solder attach defects and cracking of components during handling or subsequent housing installation. 66 Phone:

69 Thin Film - Gain Equalizer DLI s miniature Thin Film Gain Equalizers have a microwave frequency response which is so close to ideal that it can be modeled by the simple parallel R-C circuit shown below. This is a convenient model for Spice (time domain) simulations. Other common equalizer implementations using stacked R-C chips are not accurately modeled by this circuit. For highest accuracy frequency domain simulations, S-parameters are recommended. The stacked R-C chip implementation, illustrated in the figure below has many issues in both design and manufacturing which lead to lower performance and higher product cost. The equivalent circuit model below more accurately predicts the frequency response of the stacked chips. At microwave frequencies, the additional parasitic circuit elements are required. The effect of ESL, the equivalent inductance of the chip capacitor is particularly important as it causes a more peaked response as seen in the graph (right). DLI s gain equalizer frequency response is compared with that of an ideal R-C, and stacked R-C chips in the figure below. The stacked R-C chip model utilizes the same Rchip and Cchip values as in the ideal R-C model. The key point is that the chip component R and C values used in a stacked chip equalizer are generally not the ideal values for specifying the DLI single chip gain equalizer. The next section discusses specifying the part by frequency response parameters, or in terms of the ideal R-C values. Parasitics.DB[S21], IdealRC.DB[S21], AEQ2199.DB[S21] Stacked R-C chips ESL causes high frequency roll-off Parasitics.DB[S21] IdealRC.DB[S21] AEQ2199.DB[S21] Frequency in MHz Measured Response of AEQ2199 Ideal RC Custom Equalizer Design Inputs: Low frequency loss or resistance value F o - minimum loss frequency or capacitance determined using equivalent circuit model on Page 64 Case size restrictions - 50 ohm microstrip line width is a typical maximum case width objective Case Size (inches) Preferred: Maximum Length: Maximum Width Minimum Loss Frequency (GHz) Low Frequency Loss (db), 50 ohm system F o GHz Design Resistance (ohms): Loss(dB): Operating Temperature Range (C ) Minimum Temperature: Maximum Temperature: Power Dissipation (mw) Assembly Method (SMT or Epoxy) Conductive Epoxy attach: Solder attach: Solder type: Board Material Material: Dielectric constant: Thickness: Phone:

70 Introduction What makes DLI to Dielectric BTP Laboratories Inc. services What makes DLI unique? Unique? DLI built its global reputation as a manufacturer of high frequency, Dielectric Laboratories, (DLI) its reputation High Q capacitors. In recentinc. years, DLIhas hasbuilt emerged as a comprehensive manufacturer specialty ceramic for as a manufacturer of Highoffrequency, High components Q Capacitors application specific microwave and millimeter wave components and is your serving customers in fiber optic, wireless, medical, transportation, global partnerspace, avionics and military markets. semiconductor, DLI continues to introduce exciting new innovations in custom ceramic resonator and filter technologies. Build-to-Print Reference Guide These patent-protected products leverage decades of ceramic and Thin Film experience, creative and clever design expertise, and advanced prototyping Metal Coatings and testing capabilities. discuss your(tiw) needs with our(pt) Sales l Gold l Platinum (Au) l Nickel (Ni) lplease Titanium Tungsten l Titanium (Ti) l Copper (Cu) l Team. Nickel Vanadium (NiV) and Applications Engineering With over four decades of material science formulation and specific development, more than one hundred proprietary and/or patented microwave and and multiple recent patent filings, DLI is the ceramic formulations, pre-eminent ceramic component manufacturer in the industry. The millimeterwave marriage of ceramic expertise, manufacturing know-how, product components quality, customer service, product customization, and clever serving customers microwave and RF design engineering sets us apart from all others in the fiber optic, in industry. Heat Sinks and Resonator Components complete our portfolio. Lithography for application wireless, medical, DLI offers a broad range of Multi-Layer Capacitor products. transportation, space, avionics Blocking and We have the mostsemiconductor, comprehensive array of Broadband military markets. capacitors. We have expertise in customizing, tight tolerances and meeting specific design targets. The marriage of ceramic expertise, manufacturing knowdli is the preeminent global supplier of Single-Layer Capacitors. how, product quality, customer We have the world s broadest range of materials starting with service, product customization, and Class 1 dielectrics with ξr from 5.7 to 900 and Class 2 dielectrics clever microwave andreliability RF design with ξr from 445 to 25,000. DLI specializes in high and space applications. engineering sets us apart from all in to the industry. Our Build-to-Print servicesothers designed facilitate thin film product design, manufacturing and testing from prototype to high volume With over three decades of production. Our custom ceramics offer significantly better thermal science formulation performance than majoritymaterial of industry standard ceramics and and development, more than have an added benefit of a sufficiently higher dielectric constant (K) miniaturization and temperature oneallowing hundred proprietaryopportunities and/or patented ceramic stable performance. formulations, and multiple recent patent filings, DLI is the pre-eminent ceramic component manufacturer in the industry. You can turn to DLI with confidence for your high frequency SingleLayer Capacitors, MultiLayer Capacitors that are difficult to build and tight tolerance; Heat Sinks, Resonators, Filters, and Build-To-Print or Custom Thin Film Components. Typical Applications l Heat Sinks and Standoff l Integrated Passive Components l Custom Resistor Capacitor Networks l Lange Couplers, Power Combiners l EMI Filters l High Frequency Filters l Microwave Integrated Circuits (MIC) l Bias Decoupling and Filtering l Lumped Element Impedance Matching Network l PA Stabilization l Impedance Matching and Power Combining Network 68 Phone: l Gold Tin (AuSn) l Tantalum Nitride (TaN) (Resistive Layer) l Conductor Thickness Line width and Spacing RoHS Statement Gold Compliance 150 μ 0.5 ± 0.1 mil - 300supplier μ 0.2 mil DLI Gold is a 150 leading to1.0 the± electronic components market μ 3.0 ± 0.4 mil andcopper is fully50 committed to offering products supporting Restriction Nickel μ 3.0 ± 0.4 mil of Hazardous Substances (RoHS) directive 2011/65/Eu. All of Laser Drilling our Dielectric formulations are RoHS compliant and we offer a l Features as small broad range of capacitors with RoHS compliant terminations. DLI as dia. complies with the requirements of the individual customer and will l Drill features in maintain product high K dielectrics offerings that meet the demands of our industry. Quality and Environmental Policy DLI s reputation for quality and environmental responsibility isother basedoptions on a commitment not only to meet our customers requirements, but to exceed their expectations. TheVias entire l Edge-wrap Metallization l Castelated Vias l Gold Filled l Reinforced Vias l Spiral with l Interdigitated strives organization, beginning top management, to achieve Inductors Capacitors l Lange Coupler l Resistors l Polyimide - Notched, Flush, Top-Hat excellence in designing, manufacturing and delivering High Q l Solder Dam l RF test capabilities up to 67 GHz capacitors and proprietary thin film components for niche high l Contoured Surfaces - (non-rectangular shapes) frequency applications, while maintaining andsubstrate healthymetal working l Selective Metallization - Different top andsafe bottom conditions. Furthermore, DLI commits to achieve these goals in scheme. Different metal schemes on the same side of substrate l Packaging - Photon Ring packaging, repopulation, and Reel an environmentally responsible manner through Tape our commitment Anti-Static Waffle packaging up to 4 square to comply with environmental regulations and implement pollution prevention initiatives. DLI strives to continually improve the effectiveness of our Quality and Environmental Management TF Coupon System through the establishment and monitoring of objectives and targets. Resistors can be incorporated directly into the circuit design with the advantage of reducing assembly steps, improving thermal dissipation and improving reliability through the reduction of interconnections. DLI s resistor technology utilizes TaN. This material has higher maximum exposure temperature and superior resistance to harsh environments (soldering and processing). Under most circumstances DLI can tune a resistor in to tolerance of 10% without trimming. When tighter tolerance is ISO required laser trimming is available. Environmental DLI offers reinforced vias when higher current is required which gives better mechanical strength and lower resistance to the via hole. Filled vias provide improved performance and reliability over plated vias but have a higher processing cost. Filled vias increase current carrying capacity and have higher thermal conductivity to the ground plane. When mounting active die, use of filled vias effectively conducts heat away from the die. DLI offers gold fill (copper or silver can diffuse into other layers of the metallization leading to reliability issues). The precision of conductor line width and line spacing can be critical to achieving the performance required. Control of metal geometries is key to repeatable performance in microwave structures. Characteristic impedance of transmission lines is governed by line widths. DLI has extensive experience and can assist in tailoring ceramic/ metallization systems to your design to achieve maximum performance. DLI is capable of meeting as small as line width and spacing with tolerance. Substrate Substrate Material Material Coefficient Coefficient of oftemperature Temperature Dielectric Dielectric TypicalTypical Loss Loss Thermal Thermal Coefficient Coefficient of ofsurfacesurface Finish Finish Constant Constant Tangent Tangent Expansion Expansion Capacitance Capacitance (µ-inch) (µ-inch) (Tolerance) (Tolerance) (ppm/ C) premier manufacturer of custom designed(ppm/ K) thin (ppm/ K) (ppm/ C) DLI is a film filters. DLI combines its RF design MHz Fused Quartz Fused (SiO2) QuartzQZ (SiO2) QZ 1MHz 1MHz GHz@ expertise 24GHz testing capabilities, materials characterization our precision manufacturing capabilities to provide Aluminum Aluminum Nitride with (AlN) Nitride AG (AlN) AG 8.6 (±0.35) (±0.35) 1MHz GHz our customers with repeatable designs. Customers 96% Alumina 96% Alumina (Al2O3)(Al2O3) PJ9.5 (±1) 1MHz 1MHz maypjprovide designs on 99.6% alumina or are free6.4to design using DLI s high@1mhz K, high Q, temperature 99.6% Alumina 99.6% Alumina (Al2O3) (Al2O3) PIfiltersPI 9.9 (±0.15) (±0.15) stable dielectrics to receive a smaller, lighter and higher PG PG 13.3 (±0.5) 13.3can (±0.5) performing filter. We deliver these filters tested7.6with 7.6 known good yield. A <0.1 <0.1 S T As Fired As <20Fired <20 Polished Polished <2 <2 S T As Fired As <4 Fired <4 Polished Polished <1 <1 G T P120 ± 30 P120 ± 30 As Fired As 3 Fired 3 Polished Polished <5 <5 G T P22 ± 30P22 ± 30 Polished Polished <5 <5 R AH AH 20 (±0.5)20 (±0.5) P90 ± 20P90 ± 20 Polished Polished <5 <5 S NA NA 23 (±0.5)23 (±0.5) N30 ± 15N30 ± 15 Polished Polished <5 <5 S CF CF 25 (±0.5)25 (±0.5) ± 15 0 ± 15 Polished Polished <5 <5 E CD CD 38 (±1) 38 (±1) N20 ± 15N20 ± 15 Polished Polished <5 <5 S CG CG 67 (±1) 67 (±1) ± 30 0 ± 30 Polished Polished <5 <5 Lapped <20 Lapped <20 E NP NP 85 (±5%) 85 (±5%) N750 ± 200 N750 ± 200 Polished Polished <5 <5 NR NR 152 (±5%) 152 (±5%) N1500 ±N ± 500 Polished Polished <5 <5 NS NS 300 (±10%) 300 (±10%) N2400 ±N ± 500 Polished Polished <5 <5 NU NU 600 (±10%) 600 (±10%) N3700 ±N ± 1000 Polished Polished <5 <5 Metalization Metalization SystemSystem Application Application Component Component Attachment Attachment MethodMethod TypicalTypical Thickness Thickness Range Range TantalumTantalum Nitride (TaN) Nitride (TaN) TitaniumTitanium TungstenTungsten (TiW) (TiW) Gold (Au)Gold (Au) StandardStandard Thin FilmThin Metal Film System Metalfor System for Conductors Conductors with Resistor with Layer Resistor Layer Au/Sn, Au/Si, Au/Sn, Au/Si, Au/Ge - Eutectic, Au/Ge - Eutectic, Epoxy Epoxy TaN: 12 to TaN: 20012Ωto / 200 Ω / TiW: 300TiW: to Å to 500 Å Au: 5 to Au: 300 5μ to 300 μ TitaniumTitanium TungstenTungsten (TiW) (TiW) Gold (Au)Gold (Au) StandardStandard Thin FilmThin Metal Film System Metalfor System for Conductors Conductors Au/Sn, Au/Si, Au/Sn, Au/Si, Au/Ge - Eutectic, Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Epoxy TiW: 300TiW: to Å to 500 Å Au: 5 to Au: 300 5μ to 300 μ TantalumTantalum Nitride (TaN) Nitride (TaN) TitaniumTitanium TungstenTungsten (TiW) (TiW) Gold (Au)Gold (Au) Copper (Cu) Copper (Cu) Nickel (Ni) Nickel (Ni) Gold (Au)Gold (Au) TaN: 12 to TaN: 20012Ωto / 200 Ω / TiW: 300TiW: to Å to 500 Å Au: 5 to Au: 10 μ 5 to 10 μ High Current High &Current Low Loss & Low withloss or without with or withoutau/sn, Au/Si, Au/Sn, Au/Si, TaN Resistor TaN Layer Resistor Layer Au/Ge - Eutectic, Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Cu:150 to Cu: μ to 600 μ DLI hasepoxy the capability to manufacture custom designs NiV: 40 to NiV: 10040μ to 100 μ utilizing Polyimide materials to extend low frequency Au:5 to 300 Au:5μ to 300 μ TantalumTantalum Nitride (TaN) Nitride (TaN) TitaniumTitanium TungstenTungsten (TiW) (TiW) Gold (Au)Gold (Au) Nickel (Ni) Nickel (Ni) Gold (Au)Gold (Au) TantalumTantalum Nitride (TaN) Nitride (TaN) TitaniumTitanium TungstenTungsten (TiW) (TiW) Gold (Au)Gold (Au) Nickel (Ni) Nickel (Ni) Gold Tin Gold (AuSn) Tin (AuSn) B uild-t TitaniumTitanium TungstenTungsten (TiW) (TiW) Nickel (Ni) Nickel (Ni) Gold Tin Gold (AuSn) Tin (AuSn) TitaniumTitanium TungstenTungsten (TiW) (TiW) PlatinumPlatinum (Pt) (Pt) Gold (Au)Gold (Au) TitaniumTitanium TungstenTungsten (TiW) (TiW) Nickel (Ni) Nickel (Ni) Gold (Au)Gold (Au) while miniaturizing overall size. TaN: 12 to TaN: 20012Ωto / 200 Ω / DLI also has the RF TiW: expertise model high 300TiW: toto Å to 500 Å High Current High &Current Low Loss & Low withloss or without with or withoutau/sn, Au/Si, Au/Sn, Au/Si, Au:your 5 to specific Au: 300 5μ to 300 μ including performance filters to needs TaN Resistor TaN Layer Resistor Layer Au/Ge - Eutectic, Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Epoxy NiV: 40 to NiV: 10040μ to 100 μ multi-layer technology. Please see DLI s Custom Au: 5 to Au: 70 μ 5 to 70 μ Thin Film Product Line Catalog. With or without With or TaN without Resistor TaN Layer Resistor forlayer for selective selective Gold/Tin Gold/Tin attach and attach wireand bond wire bond Au/Sn locationslocations o-print TaN: 12 to TaN: 20012Ωto / 200 Ω / TiW: 300TiW: to Å to 500 Å Au: 5 to Au: 10 μ 5 to 10 μ NiV: 40 to NiV: 10040μ to 100 μ Au:5 to 300 Au:5μ to 300 μ Au/Sn or B uil d-ttan For Gold/Tin For Gold/Tin Solder Systems Solder Systems without owithout -PeTaNrAu/Sn Au/Sn Resistor Layer Resistor Layer fo r m ance TiW: 300TiW: to Å to 500 Å NiV: 40 to NiV: 10040μ to 100 μ AuSn: 100 AuSn: to μ to 350 μ - You ma TiW: 300TiW: to 500 to 500 Å kept: t6-10 hept: C300hÅμ o μ 6-10 ice! Au: 5 to Au: 300 5μ to 300 μ Heat sinkheat applications sink applications Au/Sn, Au/Si, Au/Sn, Au/Si, Au/Ge - Eutectic, Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Epoxy StandardStandard Thin FilmThin metal Film system metalfor system for conductors conductors Sn/Pb, Au/Sn, Sn/Pb,Au/Si, Au/Sn, Au/Si, Au/Ge - Eutectic, Au/Ge - Eutectic, Epoxy Epoxy TiW: 300TiW: to Å to 500 Å NiV: 40 to NiV: 10040μ to 100 μ Au: 5 to Au: 300 5μ to 300 μ S M C N M C M C re C - E D S C M re C - Note: Titanium Note: Titanium can be substituted can be substituted depending depending on substrate on substrate composition. composition. Custom Metalizations Custom Metalizations and thicknesses and thicknesses are available are available upon request. upon request. Nickel Vanadium Nickel Vanadium may be substituted may be substitute for Nic

71 Substrate Material Fused Quartz (SiO2) QZ Dielectric Constant (Tolerance) 1MHz Typical Loss Tangent 1MHz 24GHz Coefficient of Thermal Expansion (ppm/ K) Aluminum Nitride (AlN) AG 8.6 1MHz 8GHz % Alumina (Al2O3) PJ 9.5 1MHz Temperature Coefficient of Capacitance (ppm/ C) 0.55 < % Alumina (Al2O3) PI P120 ± 30 Surface Finish (µ-inch) As Fired <20 Polished <2 As Fired <4 Polished <1 As Fired 3 Polished <5 Application Suitable for microwave and millimeter wave frequency applications. Low loss. Thermal Conductivity: 1.38 W/m-K. Suitable for circuits requiring high power dissipation. RF and microwave circuit applications. Thermal Conductivity: 170 W/m-K or 200 W/m-K General circ uit applications. Compatible with Si and GaAs chip technology. Thermal Conductivity: 26 W/m-K. General circuit applications. Compatible with Si and GaAs chip technology. Thermal Conductivity: 27 W/m-K. Standard substrate thicknesses are in 5 and 10mil thick increments but can be custom to 0.1mil. Polished and lapped surfaces are available to ± tolerance where As-Fired materials are accurate to ± Alternative surface finishes may also be available, please consult the factory for more options. PG 13.3 (±0.5) P22 ± 30 Polished <5 Replacement for Alumina - improved temperature stability. AH 20 (±0.5) P90 ± 20 Polished <5 Suitable for circuit miniaturization. RF and microwave circuit applications. NA 23 (±0.5) N30 ± 15 Polished <5 Suitable for circuit miniaturization. RF and microwave circuit applications. CF 25 (±0.5) ± 15 Polished <5 Excellent temperature stability. Suitable for circuit miniaturization. RF and microwave circuit applications. CD 38 (±1) N20 ± 15 Polished <5 Suitable for circuit miniaturization. RF and microwave circuit applications. CG 67 (±1) ± 30 Polished <5 Lapped <20 Excellent temperature stability. Suitable for circuit miniaturization. RF and microwave circuit applications. NP 85 (±5%) N750 ± 200 Polished <5 NR 152 (±5%) N1500 ± 500 Polished <5 NS 300 (±10%) N2400 ± 500 Polished <5 Suitable for circuit miniaturization. RF and microwave circuit applications. Microwave power transistor matching; eg. GaN, SiC NU 600 (±10%) N3700 ± 1000 Polished <5 Metalization System Application Component Attachment Method Typical Thickness Range Comments Tantalum Nitride (TaN) Titanium Tungsten (TiW) Gold (Au) Titanium Tungsten (TiW) Gold (Au) Tantalum Nitride (TaN) Titanium Tungsten (TiW) Gold (Au) Copper (Cu) Nickel (Ni) Gold (Au) Tantalum Nitride (TaN) Titanium Tungsten (TiW) Gold (Au) Nickel (Ni) Gold (Au) Tantalum Nitride (TaN) Titanium Tungsten (TiW) Gold (Au) Nickel (Ni) Gold Tin (AuSn) Titanium Tungsten (TiW) Nickel (Ni) Gold Tin (AuSn) Titanium Tungsten (TiW) Platinum (Pt) Gold (Au) Titanium Tungsten (TiW) Nickel (Ni) Gold (Au) Standard Thin Film Metal System for Conductors with Resistor Layer Standard Thin Film Metal System for Conductors High Current & Low Loss with or without TaN Resistor Layer High Current & Low Loss with or without TaN Resistor Layer With or without TaN Resistor Layer for selective Gold/Tin attach and wire bond locations For Gold/Tin Solder Systems without TaN Resistor Layer Heat sink applications Standard Thin Film metal system for conductors Au/Sn, Au/Si, Au/Ge - Eutectic, Epoxy Au/Sn, Au/Si, Au/Ge - Eutectic, Sn/Pb, Epoxy Au/Sn, Au/Si, Au/Ge - Eutectic, Sn/Pb, Epoxy Au/Sn, Au/Si, Au/Ge - Eutectic, Sn/Pb, Epoxy Au/Sn Au/Sn Au/Sn, Au/Si, Au/Ge - Eutectic, Sn/Pb, Epoxy Sn/Pb, Au/Sn, Au/Si, Au/Ge - Eutectic, Epoxy TaN: 12 to 200 Ω / TiW: 300 to 500 Å Au: 5 to 300 μ TiW: 300 to 500 Å Au: 5 to 300 μ TaN: 12 to 200 Ω / TiW: 300 to 500 Å Au: 5 to 10 μ Cu:150 to 600 μ NiV: 40 to 100 μ Au:5 to 300 μ TaN: 12 to 200 Ω / TiW: 300 to 500 Å Au: 5 to 300 μ NiV: 40 to 100 μ Au: 5 to 70 μ TaN: 12 to 200 Ω / TiW: 300 to 500 Å Au: 5 to 10 μ NiV: 40 to 100 μ Au:5 to 300 μ TiW: 300 to 500 Å NiV: 40 to 100 μ AuSn: 100 to 350 μ TiW: 300 to 500 Å Pt: 6-10 μ Au: 5 to 300 μ TiW: 300 to 500 Å NiV: 40 to 100 μ Au: 5 to 300 μ Not recommended for Tin/Lead Solder Attach - Maintain Gold 5-20 μ for Solder Attach. Compatible with Wire bonding - Maintain Gold 100 μ for Wire bonding. Compatible with Tin/Lead Solder Attach - Maintain exposed surface Gold 5-20 μ for Sn/Pb Solder Attach when repeated soldering is required for repairs. Compatible with Wire bonding - Maintain Gold 100 μ for Wire bonding. Eliminates solder preform. Direct die attach to pad (Au/Sn). Selective Areas available for Wire bonding. Compatible with Tin/Lead Solder Attach - Maintain Gold 5-20 μ for Solder Attach when repeated soldering is required for repairs. Compatible with Wire bonding - Maintain Gold 100 μ for Wire bonding. Note: Titanium can be substituted depending on substrate composition. Custom Metalizations and thicknesses are available upon request. Nickel Vanadium may be substituted for Nickel in some applications; contact applications engineering for details. Maximum Use Temperature C > The metal system utilized is typically chosen based on the the following requirements: current carrying requirement, chip and component mounting strategies, line width and spacing requirements and if utilizing an integrated resistor. Higher current requirements can employ thicker gold or copper metal but that limits the ability for fine line geometries. Wire bonding to the surface of a circuit generally requires 100 μ of gold. When tin/lead soldering is required, gold thickness is decreased to reduce embrittlement and a nickel/ platinum barrier layer is utilized. DLI also has the capability to selectively apply gold/tin solder for attachment of descrete die. Note: For lower frequency filter (<4 GHz) designs, DLI suggests using a minimum gold thickness of 150µ. Higher frequency designs should use the standard 100µ gold thickness. 69