FEATURES TYPICAL APPLICATIO. LTC Low Power 8th Order Pin Selectable Butterworth or Bessel Lowpass Filter DESCRIPTIO APPLICATIO S

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1 FEATRES Pin Selectable Butterworth or Bessel Response ma Supply Current with ±V Supplies f CTOFF up to khz µv RMS Wideband Noise THD <.% (:, V S = ±.V, = V RMS ) Operates with a Single V Supply (V RMS Input Range) µv RMS Clock Feedthrough (Single V Supply) Operates up to ±V Supplies TTL/CMOS-Compatible Clock Input No External Components Available in -Pin DIP and -Pin SO Wide Packages APPLICATIO S Anti-Aliasing Filters Battery-Operated Instruments Telecommunications Filters Smoothing Filters, LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. LTC- Low Power th Order Pin Selectable Butterworth or Bessel Lowpass Filter DESCRIPTIO The LTC - is a monolithic th order filter; it approximates either a Butterworth or a Bessel lowpass response. The LTC- features clock-tunable cutoff frequency and low power consumption (.ma with ±V supplies and.ma with single V supply). Low power operation is achieved without compromising noise or distortion performance. With ±V supplies and khz cutoff frequency, the operating signal-to-noise ratio is db and the THD throughout the passband is.%. nder the same conditions, a db signal-tonoise ratio and distortion is obtained with a single V supply while the clock feedthrough is kept below the noise level. The maximum signal-to-noise ratio is db. The LTC- approximates an th order Butterworth response with a clock-to-cutoff frequency ratio of : (Pin to V ) or : double-sampled (Pin to V + and Pin shorted to Pin ). Double-sampling allows the input signal frequency to reach the clock frequency before any aliasing occurrence. An th order Bessel response can also be approximated with a clock-to-cutoff frequency ratio of : (Pin to ground). With ±.V supply, ±V supply and single V supply, the maximum clock frequency of the LTC- is.mhz, MHz and MHz respectively. The LTC- is pin-compatible with the LTC- and LTC--. TYPICAL APPLICATIO Frequency Response Butterworth khz Anti-Aliasing Filter V NC LTC- V CLK = MHz TO V + V OT - TA WIDEBAND NOISE = µv RMS THD IN PASSBAND <.% AT = V RMS NOTE: THE CONNECTION FROM PIN TO PIN SHOLD BE MADE NDER THE PACKAGE. FOR : OPERATION CONNECT PIN TO PIN AS SHOWN. FOR : OR : OPERATION PINS AND SHOLD FLOAT. THE POWER SPPLIES SHOLD BE BYPASSED BY A.µF CAPACITOR AS CLOSE TO THE PACKAGE AS POSSIBLE. - TA fc

2 LTC- ABSOLTE AXI RATI GS W W W Total Supply Voltage (V + to V )... V Input Voltage (Note )... (V + +.V) to (V.V) Output Short-Circuit Duration... Indefinite Power Dissipation... mw Burn-In Voltage... V (Note ) Operating Temperature Range LTC-C... C to C LTC-M (OBSOLETE)... C to C Storage Temperature Range... C to C Lead Temperature (Soldering, sec)... C PACKAGE/ORDER I FOR W ATIO : MODE GND V + GND LP CONNECT TOP VIEW N PACKAGE -LEAD PDIP T JMAX = C, θ JA = C/W J PACKAGE -LEAD CERDIP T JMAX = C, θ JA = C/W CONNECT : MODE V CLK BTT/BESS V OT NC OBSOLETE PACKAGE Consider the N Package as an Alternate Source ORDER PART NMBER LTC-CN LTC-CJ LTC-MJ : MODE GND V + GND NC LP CONNECT TOP VIEW SW PACKAGE -LEAD PLASTIC SO WIDE T JMAX = C, θ JA = C/W CONNECT : MODE V NC CLK BTT/BESS NC V OT ORDER PART NMBER LTC-CSW Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: Consult LTC Marketing for parts specified with wider operating temperature ranges. ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T A = Operating Temperature Range. V S = ±.V, R L = k, f CLK = khz, unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX NITS Passband Gain.Hz at.f CTOFF (Note ) f IN = khz, (f CLK /f C ) = :... db f IN = khz, (f CLK /f C ) = :... db Gain at.f CTOFF (Note ) f IN = khz, (f CLK /f C ) = :... db f IN = khz, (f CLK /f C ) = :... db Gain at.f CTOFF (Note ) f IN =.khz, (f CLK /f C ) = :... db Gain at.f CTOFF (Note ) f IN =.khz, (f CLK /f C ) = :. db Gain at f CTOFF (Note ) f IN = khz, (f CLK /f C ) = :... db f IN = khz, (f CLK /f C ) = :... db Gain at.f CTOFF (Note ) f IN =.khz, (f CLK /f C ) = :... db Gain at.f CTOFF (Note ) f IN = khz, (f CLK /f C ) = :... db Gain with f CLK = khz (Note ) f IN = Hz, (f CLK /f C ) = :... db Gain with V S =.V (Note ) f IN = khz, f IN = khz, (f CLK /f C ) = :... db f IN = khz, f IN = khz, (f CLK /f C ) = :... db Input Frequency Range (f CLK /f C ) = : <f CLK / khz (f CLK /f C ) = : <f CLK khz fc

3 LTC- ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T A = Operating Temperature Range. V S = ±.V, R L = k, f CLK = khz, unless otherwise specified. LTC-C PARAMETER CONDITIONS MIN TYP MAX NITS Maximum f CLK V S ±.V. MHz V S = ±.V. MHz V S = Single V (GND = V). MHz Clock Feedthrough Input at GND, f = f CLK, Square Wave ±V, (f CLK /f C ) = : µv RMS ±V, (f CLK /f C ) = : µv RMS Wideband Noise Input at GND, Hz f < f CLK ±V, (f CLK /f C ) = : ±% µv RMS ±V, (f CLK /f C ) = : ±% µv RMS Input Impedance kω Output DC Voltage Swing V S = ±.V ±. ±. V V S = ±.V ±. ±. V V S = ±.V ±. ±. V Output DC Offset V S = ±V, (f CLK /f C ) = : ± ± mv Output DC Offset TempCo V S = ±V, (f CLK /f C ) = : ± µv/ C Power Supply Current V S = ±.V, T A C.. ma. ma V S = ±.V, T A C.. ma. ma V S = ±.V, T A C.. ma. ma Power Supply Range ±. ± V Note : Absolute Maximum Ratings are those values beyond which life of the device may be impaired. Note : Connecting any pin to voltages greater than V + or less than V may cause latch-up. It is recommended that no sources operating from external supplies be applied prior to power-up of the LTC-. Note : All gains are measured relative to passband gain. The filter cutoff frequency is abbreviated as f CTOFF or f C. TYPICAL PERFOR A CE CHARACTERISTICS Gain vs Frequency W Passband Gain and Phase vs Frequency V S = ±V T A = C A B C A. f CLK = khz f CTOFF = khz (:, PIN TO V ) B. f CLK = khz f CTOFF =.khz (:, PIN GND) C. f CLK = khz f CTOFF = khz (:, PIN TO V +, PINS - SHORTED) V S = ±V f CLK = khz f CTOFF = khz (:, PIN TO V +, PINS - SHORTED) T A = C GAIN PHASE PHASE (DEG) G - G fc

4 LTC- TYPICAL PERFOR A CE CHARACTERISTICS W Passband Gain and Phase vs Frequency Passband Gain and Phase vs Frequency PHASE (DEG) GAIN PHASE PHASE (DEG) V S = ±V f CLK = khz f CTOFF = khz (:, PIN TO V ) T A = C..... V S = ±V f CLK = khz f CTOFF =.khz (:, PIN TO GND) T A = C G - G GROP DELAY (µs). Group Delay vs Frequency V S = ±.V T A = C A B G A. f CLK = khz (BTTERWORTH :) f CTOFF = khz B. f CLK = khz (BESSEL :) f CTOFF =.khz Passband vs Frequency and f CLK. V S = ±.V. : T A = C.. A B C D E F - G A. f CLK = khz f CTOFF = khz B. f CLK = khz f CTOFF = khz C. f CLK = khz f CTOFF = khz D. f CLK = khz f CTOFF = khz E. f CLK = MHz f CTOFF = khz F. f CLK =.MHz f CTOFF = khz Maximum Passband over Temperature for V S = ±.V, : V S = ±.V f CLK =.MHz (:) f CTOFF = khz T A = C T A = C - G Passband vs Frequency and f CLK. V S = ±.V. : T A = C.. A B C D E - G A. f CLK = khz f CTOFF = khz B. f CLK = khz f CTOFF = khz C. f CLK = khz f CTOFF =.khz D. f CLK = MHz f CTOFF = khz E. f CLK =.MHz f CTOFF = khz fc

5 LTC- TYPICAL PERFOR A CE CHARACTERISTICS W Passband vs Frequency and f CLK Passband vs Frequency and f CLK V S = ±.V, : (BESSEL RESPONSE) T A = C A B C D E - G A. f CLK = khz f CTOFF =.khz B. f CLK = khz f CTOFF =.khz C. f CLK = khz f CTOFF =.khz D. f CLK = MHz f CTOFF =.khz E. f CLK =.MHz f CTOFF =.khz V S = ±V. : T A = C. A B C D - G A. f CLK = khz f CTOFF = khz B. f CLK = khz f CTOFF = khz C. f CLK = khz f CTOFF = khz D. f CLK = MHz f CTOFF = khz Maximum Passband over Temperature for V S = ±V, :. V S = ±V. f CLK = MHz f CTOFF = khz. T A = C T A = C - G Maximum Passband over Temperature for V S = ±V, : Passband vs Frequency and f CLK. V S = ±V. : T A = C.. A B C D E - G Passband vs Frequency and f CLK A. f CLK = khz f CTOFF = khz B. f CLK = khz f CTOFF = khz C. f CLK = khz f CTOFF = khz D. f CLK = khz f CTOFF =.khz E. f CLK = MHz f CTOFF = khz..... T A = C T A = C..... A B C D A. f CLK = khz f CTOFF = khz B. f CLK = khz f CTOFF = khz C. f CLK = khz f CTOFF = khz D. f CLK = MHz f CTOFF = khz V S = ±V f CLK = MHz (:) f CTOFF = khz. V S = SINGLE V. : T A = C. - G - G fc

6 LTC- TYPICAL PERFOR A CE CHARACTERISTICS T A = C T A = C. V S = SINGLE V. f CLK = MHz (:) f CTOFF = khz. W Maximum Passband over Temperature for Single V, :* THD + Noise vs RMS Input, : THD + Noise vs RMS Input, : - G. f IN = khz f CLK = khz SINGLE V ±V ±.V - G. f IN = khz f CLK = khz SINGLE V ±V ±.V - G THD + Noise vs Frequency = V RMS ±.V, : f CLK = MHz ( REPRESENTATIVE NITS) THD + Noise vs Frequency = V RMS ±.V, : f CLK = khz ( REPRESENTATIVE NITS) THD + Noise vs Frequency = V RMS ±V, : f CLK = khz ( REPRESENTATIVE NITS) - G - G - G THD + Noise vs Frequency THD + Noise vs Frequency THD + Noise vs Frequency = V RMS ±V, : f CLK = khz ( REPRESENTATIVE NITS) =.V RMS SINGLE V SPPLY :, f CLK = khz f C = khz ( REPRESENTATIVE NITS) = V RMS V S = ±.V, : f CLK = khz f C =.khz ( REPRESENTATIVE NITS) - G - G. - G * See also Passband vs Frequency and f CLK for Single V, :; THD + Noise vs RMS Input for Single V, :; and Maximum Passband for Single V, :, for Two Ground Bias Levels. fc

LTC- TYPICAL PERFOR A CE CHARACTERISTICS W THD + WIDEBAND NOISE (db). THD + Noise vs Input Voltage f IN = khz, : f CLK = khz V S = ±.V V S = ±V V S = ±.V INPT VOLTAGE (V RMS ) - G PHASE (DEG).

:, for Two Ground Bias Levels T A = C f CLK = MHz GND =.V

7 LTC- TYPICAL PERFOR A CE CHARACTERISTICS W THD + WIDEBAND NOISE (db). THD + Noise vs Input Voltage f IN = khz, : f CLK = khz V S = ±.V V S = ±V V S = ±.V INPT VOLTAGE (V RMS ) - G PHASE (DEG) Maximum Passband for Single V, :, for Two Ground Bias Levels T A = C f CLK = MHz GND =.V GND = V - G THD + Noise vs RMS Input for Single V, :. f CLK = MHz T A = C GND = V GND =.V.... INPT (V RMS ) - G TOTAL PHASE DIFFERENCE (DEG) Phase Matching vs Frequency MAXIMM PHASE DIFFERENCE BETWEEN ANY TWO NITS (SAMPLE OF NITS) V S ±V T A C f CLK KHz FREQENCY (FREQENCY/f CTOFF ) A B - G A. BTTERWORTH (f CLK /f CTOFF = : OR :) B. BESSEL (f CLK /f CTOFF = :) PSRR (db) Power Supply Rejection Ratio vs Frequency f CTOFF = khz V + V k k k FREQENCY (Hz) - G CRRENT (ma) Power Supply Current vs Power Supply Voltage C C C POWER SPPLY (V + OR V ) - G V/DIV Transient Response = ±V, Hz Square Wave µs/div BTTERWORTH RATIO = : f CLK = khz f C = khz V S = ±.V V/DIV Transient Response = ±V, Hz Square Wave - G - G BESSEL RATIO = : f CLK = khz f C = khz V S = ±.V µs/div fc

8 LTC- PI F CTIO S V + Power Supply (Pins, ) The V + (Pin ) and the V (Pin ) should be bypassed with a.µf capacitor to an adequate analog ground. The filter s power supplies should be isolated from other digital or high voltage analog supplies. A low noise linear supply is recommended. sing a switching power supply will lower the signal-to-noise ratio of the filter. The supply during power-up should have a slew rate less than V/µs. When V + is applied before V, and V can be more positive than ground, a signal diode must be used to clamp V. Figures and show typical connections for dual and single supply operation..µf * OPTIONAL (SEE TEXT) LTC- *.µf k V V OT CLOCK SORCE GND + DIGITAL SPPLY - F Figure. Dual Supply Operation for f CLK /f CTOFF = : Clock Input (Pin ) Any TTL or CMOS clock source with a square-wave output and % duty cycle (±%) is an adequate clock source for the device. The power supply for the clock source should not be the filter s power supply. The analog ground for the filter should be connected to clock s ground at a single point only. Table shows the clock s low and high level threshold value for a dual or single supply operation. A pulse generator can be used as a clock source provided the high level ON time is greater than.µs. Sine waves are not recommended for clock input frequencies less than khz, since excessively slow clock rise or fall times generate internal clock jitter (maximum clock rise or fall time µs). The clock signal should be routed from the right side of the IC package to avoid coupling into any input or output analog signal path. A k resistor between clock source and Pin will slow down the rise and fall times of the clock to further reduce charge coupling, Figures and. Table. Clock Source High and Low Threshold Levels POWER SPPLY HIGH LEVEL LOW LEVEL Dual Supply > ±.V V + /.V Dual Supply ±.V V + / V +.V Single Supply V + >.V, V = V V +..V + /V + Single Supply V + <.V, V = V V + /.V V V + V k k.µf + µf LTC- k CLOCK SORCE GND + DIGITAL SPPLY V OT Figure. Single Supply Operation for f CLK /f CTOFF = : - F Analog Ground (Pins, ) The filter performance depends on the quality of the analog signal ground. For either dual or single supply operation, an analog ground plane surrounding the package is recommended. The analog ground plane should be connected to any digital ground at a single point. For dual supply operation, Pins and should be connected to the analog ground plane. For single supply operation Pins and should be biased at / supply and they should be bypassed to the analog ground plane with at least a µf capacitor (Figure ). For single V operation at the highest f CLK of MHz, Pins and should be biased at V. This minimizes passband gain and phase variations (see Typical Performance Characteristics curves: Maximum Passband for Single V, :; and THD + Noise vs RMS Input for Single V, :). fc

9 LTC- PI F CTIO S Butterworth/Bessel (Pin ) The DC level at Pin determines the ratio of the clock frequency to the cutoff frequency of the filter. Pin at V + gives a : ratio and a Butterworth response (pins to are shorted for : only). Pin at V gives a : Butterworth response. Pin at ground gives a Bessel response and a ratio of :. For single supply operation the ratio is : when Pin is at V + (Pins to shorted), : when Pin is at ground, and : when at / supply. When Pin is not tied to ground, it should be bypassed to analog ground with a.µf capacitor. If the DC level at Pin is switched mechanically or electrically at slew rates greater than V/µs while the device is operating, a k resistor should be connected between Pin and the DC source. Filter Input (Pin ) The input pin is connected internally through a k resistor tied to the inverting input of an op amp. Filter Output (Pins, ) Pin is the specified output of the filter; it can typically source or sink ma. Driving coaxial cables or resistive loads less than k will degrade the total harmonic distortion of the filter. When evaluating the device s distortion an output buffer is required. A noninverting buffer, Figure, can be used provided that its input common mode range is well within the filter s output swing. Pin is an intermediate filter output providing an unspecified th order lowpass filter. Pin should not be loaded. k + LT - F Figure. Buffer for Filter Output External Connection (Pins, and, ) Pins and should be connected together. In a printed circuit board the connection should be done under the IC package through a short trace surrounded by the analog ground plane. When the clock to cutoff frequency ratio is set at :, Pin should be shorted to Pin ; if not, the passband will exhibit db of gain peaking and it will deviate from a Butterworth response. Pin is the inverting input of an internal op amp and it should preferably be. inches away from any other circuit trace. NC (Pin ) Pin is not connected to any internal circuit point on the device and should be preferably tied to analog ground. APPLICATIO S I FOR Clock Feedthrough ATIO W Clock feedthrough is defined as, the RMS value of the clock frequency and its harmonics that are present at the filter s output pin (Pin ). The clock feedthrough is tested with the input pin (Pin ) grounded and, it depends on PC board layout and on the value of the power supplies. With proper layout techniques the values of the clock feedthrough are shown in Table. Table. Output Clock Feedthrough V S : : ±.V µv RMS µv RMS ±V µv RMS µv RMS ±.V µv RMS µv RMS Note: The clock feedthrough at ±.V supplies is imbedded in the wideband noise of the filter. The clock waveform is a square wave. fc

10 LTC- APPLICATIO S I FOR ATIO W Any parasitic switching transients during the rise and fall edges of the incoming clock are not part of the clock feedthrough specifications. Switching transients have frequency contents much higher than the applied clock; their amplitude strongly depends on scope probing techniques as well as grounding and power supply bypassing. The clock feedthrough, if bothersome, can be greatly reduced by adding a simple R/C lowpass network at the output of the filter pin (Pin ). This R/C will completely eliminate any switching transient. Wideband Noise The wideband noise of the filter is the total RMS value of the device s noise spectral density and it is used to determine the operating signal-to-noise ratio. Most of its frequency contents lie within the filter passband and it cannot be reduced with post filtering. For instance, the LTC- wideband noise at ±.V supply is µv RMS, µv RMS of which have frequency contents from DC up to the filter s cutoff frequency. The total wideband noise (µrms) is nearly independent of the value of the clock. The clock feedthrough specifications are not part of the wideband noise. Speed Limitations The LTC- optimizes AC performance versus power consumption. To avoid op amp slew rate limiting at maximum clock frequencies, the signal amplitude should be kept below a specified level as shown in Table. Table. Maximum vs V S and f CLK POWER SPPLY MAXIMM f CLK MAXIMM V S = ±.V.MHz V RMS (f IN > khz).v RMS (f IN > khz) V S = ±.V.MHz V RMS (f IN > khz).v RMS (f IN > khz) V S = ±.V.MHz.V RMS (f IN > khz).v RMS (f IN > khz) Single V.MHz.V RMS (f IN > khz).v RMS (f IN > khz) Aliasing Aliasing is an inherent phenomenon of sampled data systems and it occurs when input frequencies close to the sampling frequency are applied. For the LTC- case at :, an input signal whose frequency is in the range of f CLK ±.% will be aliased back into the filter s passband. If, for instance, an LTC- operating with a khz clock and khz cutoff frequency receives a khz mv input signal, a khz µv alias signal will appear at its output. When the LTC- operates with a clock-tocutoff frequency of :, aliasing occurs at twice the clock frequency. Table shows details. Table. Aliasing Data (f CLK = khz, V S = ±V) INPT FREQENCY OTPT LEVEL OTPT FREQENCY ( = V RMS ) (Relative to Input) (Aliased Frequency) (f CLK /f C ) = :, f CTOFF = khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz (f CLK /f C ) = :, f CTOFF = khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz.khz.db.khz Table. Transient Response of LTC Lowpass Filters DELAY RISE SETTLING OVER- TIME* TIME** TIME*** SHOOT LOWPASS FILTER (SEC) (SEC) (SEC) (%) LTC- Bessel./f C./f C./f C. LTC- Bessel./f C./f C./f C LTC- Bessel./f C./f C./f C LTC- Linear Phase./f C./f C./f C LTC- Linear Phase./f C./f C./f C LTC- Linear Phase./f C./f C./f C LTC- Butterworth./f C./f C./f C LTC- Elliptic./f C./f C./f C LTC- Elliptic./f C./f C./f C LTC- Elliptic./f C./f C./f C * To % ±%, ** % to % ±%, *** To % ±.% fc

11 LTC- TYPICAL APPLICATIO S Single V, I S =.ma, th Order Clock-Tunable Lowpass Filter, f CLK /f CTOFF = :, db Attenuation at. f CTOFF LTC- LTC- V µf.µf + k k IC V V.µF IC V V OT f CLK k - F Gain vs Frequency THD + Noise vs Frequency V S = SINGLE V =.V RMS f CLK = khz f C = khz V S = SINGLE V f CLK = khz f CTOFF = khz - TA - TA fc

12 LTC- TYPICAL APPLICATIO S th Order Butterworth Lowpass Filter f CLK /f C = : V +.µf + LTC- f CLK V + V OT V.µF - TA th Order Butterworth Lowpass Filter f CLK /f C = : V +.µf + LTC- f CLK V OT V.µF - TA fc

13 LTC- PACKAGE DESCRIPTIO J Package -Lead CERDIP (Narrow., Hermetic) (LTC DWG # --). (.) MIN. (.) MAX. (.) RAD TYP.. (..). BSC (. BSC). (.) MAX.. (..).. (..).. (..) NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.. (..) OBSOLETE PACKAGE. (.) BSC. (.) MIN J fc

14 LTC- PACKAGE DESCRIPTIO N Package -Lead PDIP (Narrow.) (LTC DWG # --).* (.) MAX. ±.* (. ±.).. (..). ±. (. ±.).. (..).. (..) ( ). (.) MIN. (.) MIN. (.) MIN NOTE: INCHES. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLDE MOLD FLASH OR PROTRSIONS. MOLD FLASH OR PROTRSIONS SHALL NOT EXCEED. INCH (.mm). (.) BSC. (.) TYP. ±. (. ±.) N fc

15 LTC- PACKAGE DESCRIPTIO SW Package -Lead Plastic Small Outline (Wide.) (LTC DWG # --). ±. TYP N. BSC. ±... (..) NOTE N. MIN. ±. NOTE.. (..) N/ N/ RECOMMENDED SOLDER PAD LAYOT. (.) RAD MIN.. (..) NOTE.. (..) TYP.. (..).. (..)... (.) (..) NOTE BSC.... (..) (..) TYP NOTE: INCHES. DIMENSIONS IN (MILLIMETERS). DRAWING NOT TO SCALE. PIN IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANFACTRING OPTIONS. THE PART MAY BE SPPLIED WITH OR WITHOT ANY OF THE OPTIONS. THESE DIMENSIONS DO NOT INCLDE MOLD FLASH OR PROTRSIONS. MOLD FLASH OR PROTRSIONS SHALL NOT EXCEED." (.mm).. (..) S (WIDE) Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. fc

16 LTC- TYPICAL APPLICATION th Order Linear Phase Lowpass Filter f CLK /f C = : V +.µf LTC- f CLK V.µF V OT - TA RELATED PARTS PART NMBER DESCRIPTION COMMENTS LTC- Low Power, th Order Elliptic Lowpass Filter Operates from a Single.V to ±V Supply LTC- Very Low Power, th Order Elliptic Lowpass Filter Optimized for V/V Single Supply Operation, Consumes ma at V Linear Technology Corporation McCarthy Blvd., Milpitas, CA - () - FAX: () - fc LT/LT REV C PRINTED IN SA LINEAR TECHNOLOGY CORPORATION

17 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Analog Devices Inc.: LTC-CSW#TRPBF LTC-CN#PBF LTC-CSW LTC-CN LTC-CSW#TR LTC- CSW#PBF

DESCRIPTIO. LTC Low Power, 8th Order Progressive Elliptic, Lowpass Filter

DESCRIPTIO. LTC Low Power, 8th Order Progressive Elliptic, Lowpass Filter LTC9- Low Power, th Order Progressive Elliptic, Lowpass Filter FEATRES th Order Elliptic Filter in SO- Package Operates from Single.V to ±V Power Supplies db at.f CTOFF db at.f CTOFF db at f CTOFF Wide