MCR22-6, MCR22-8 Preferred Device. Sensitive Gate Silicon Controlled Rectifiers. Reverse Blocking Thyristors. SCRs 1.5 AMPERES RMS 400 thru 600 VOLTS
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1 MCR22-6, MCR22-8 referred evice Sensitive ate Silicon Controlled Rectifiers Reverse Blocking Thyristors esigned and tested for repetitive peak operation required for C ignition, fuel ignitors, flash circuits, motor controls and lowpower switching applications. Features 50 for 2 s Safe rea High dv/dt ery Low Forward On oltage at High Current LowCost TO226 (TO92) bfree ackages are vailable* MXIMUM RTINS (T J = 25 C unless otherwise noted) Rating Symbol alue Unit eak Repetitive OffState oltage (Note ) (R K = IK, T J = 40 to +0 C, Sine Wave, RM, RRM 50 to 60 Hz, R K = k ) MCR226 MCR OnState Current RMS (80 Conduction ngles, T C = 80 C) eak Nonrepetitive Surge = 25 C, (/2 Cycle, Sine Wave, 60 Hz) I T(RMS).5 I TSM 5 Circuit Fusing Considerations (t = 8.3 ms) I 2 t s Forward eak ate ower (ulse Width.0 sec, T = 25 C) Forward verage ate ower (t = 8.3 msec, T = 25 C) Forward eak ate Current (ulse Width.0 s, T = 25 C) Reverse eak ate oltage (ulse Width.0 s, T = 25 C) M 0.5 W () 0. W I FM 0.2 RM 5.0 Operating Junction Temperature Range T J 40 to +0 Rated RRM and RM Storage Temperature Range T stg 40 to +50 C THERML CHRCTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoCase R JC 50 C/W Thermal Resistance, Junctiontombient R J 60 C/W Lead Solder Temperature (Lead Length /6 from case, 0 S Max) T L +260 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. RM and RRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. *For additional information on our bfree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLERRM/. 2 3 SCRs.5 MERES RMS 400 thru 600 OLTS STRIHT LE BULK CK TO92 (TO226) CSE 029 STYLE 0 MCR 22x YWW IN SSINMENT Cathode ate node ORERIN INFORMTION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. referred devices are recommended choices for future use and best overall value. K MRKIN IRMS BENT LE TE & REEL MMO CK MCR22x = evice Code x = 6 or 8 = ssembly Location Y = Year WW = Work Week = bfree ackage (Note: Microdot may be in either location) Semiconductor Components Industries, LLC, 2008
2 ELECTRICL CHRCTERISTICS (T C = 25 C unless otherwise noted.) OFF CHRCTERISTICS Characteristic Symbol Min Typ Max Unit eak Repetitive Forward or Reverse Blocking Current ( K = Rated RM or RRM ; R K = k ) T C = 25 C T C = 0 C ON CHRCTERISTICS eak Forward OnState oltage (Note 2) (I TM = eak) I RM, I RRM TM.2.7 ate Trigger Current (Continuous dc) (Note 3) T C = 25 C ( K = 6 dc, R L = 00 ) T C = 40 C I T ate Trigger oltage (Continuous dc) (Note 3) T C = 25 C ( K = 7 dc, R L = 00 ) T C = 40 C T ate NonTrigger oltage ( K = 2 dc, R L = 00 ) T C = 0 C Holding Current ( K = 2 dc, R K = k ) T C = 25 C Initiating Current = 20 m T C = 40 C YNMIC CHRCTERISTICS Critical Rate of Rise of OffState oltage (R K = k ) (T C = 0 C) 2. ulse Width =.0 ms, uty Cycle %. 3. R K Current not included in measurement m dv/dt 25 / s oltage Current Characteristic of SCR + Current node + Symbol RM I RM RRM I RRM TM arameter eak Repetitive Off State Forward oltage eak Forward Blocking Current eak Repetitive Off State Reverse oltage eak Reverse Blocking Current eak on State oltage Holding Current I RRM at RRM on state Reverse Blocking Region (off state) Reverse valanche Region TM + oltage I RM at RM Forward Blocking Region (off state) node 2
3 TO92 EI RIL TE IN FN FOL BOX OR ON REEL H2 H2 H2B H2B H W2 H4 H5 L L H W W T T F F2 T2 2 2 Figure 9. evice ositioning on Tape Item Symbol Inches Specification Millimeter Min Max Min Max Tape Feedhole iameter Component Lead Thickness imension Component Lead itch F, F Bottom of Component to Seating lane H Feedhole Location H eflection Left or Right H eflection Front or Rear H2B Feedhole to Bottom of Component H Feedhole to Seating lane H efective Unit Clipped imension L Lead Wire Enclosure L Feedhole itch Feedhole Center to Center Lead First Lead Spacing imension dhesive Tape Thickness T Overall Taped ackage Thickness T Carrier Strip Thickness T Carrier Strip Width W dhesive Tape Width W dhesive Tape osition W Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. efective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum noncumulative variation between tape feed holes shall not exceed mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than consecutive missing component is permitted. 7. tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. 5
4 ORERIN & SHIIN INFORMTION: MCR22 Series ackaging Options, evice Suffix U.S. MCR226 MCR226 MCR228 MCR228 MCR226RLR MCR226RLR MCR226RLR MCR226RLR Europe Equivalent Shipping escription of TO92 Tape Orientation MCR228RL MCR228RL 2000 / Tape & Reel Flat side of TO92 and adhesive tape visible 5000 Units / Box N/, Bulk 2000 / Tape & Reel Round side of TO92 and adhesive tape visible 2000 / Tape & mmo ack Flat side of TO92 and adhesive tape visible For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel ackaging Specifications Brochure, BR80/. 6
5 CKE IMENSIONS R N B TO92 (TO226) CSE 29 ISSUE M STRIHT LE BULK CK. IMENSIONIN N TOLERNCIN ER NSI Y4.5M, CONTROLLIN IMENSION: INCH. 3. CONTOUR OF CKE BEYON IMENSION R IS UNCONTROLLE. 4. LE IMENSION IS UNCONTROLLE IN N BEYON IMENSION K MINIMUM. L SETIN INCHES MILLIMETERS LNE K IM MIN MX MIN MX B C X X H J H J K C L N SECTION XX R N R B BENT LE TE & REEL MMO CK. IMENSIONIN N TOLERNCIN ER SME Y4.5M, CONTROLLIN IMENSION: MILLIMETERS. 3. CONTOUR OF CKE BEYON IMENSION R IS UNCONTROLLE. 4. LE IMENSION IS UNCONTROLLE IN N BEYON IMENSION K MINIMUM. T MILLIMETERS SETIN LNE K IM MIN MX B C X X J K J N C R SECTION XX N STYLE 0: IN. CTHOE 2. TE 3. NOE 7
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Sx02xS Series RoHS Description New mp sensitive gate SCR series offers high static dv/dt with low turn off time (tq) through small die planar construction design. ll SCR s junctions are glasspassivated
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