MAC08BT1, MAC08MT1. Thyristors. Surface Mount 200V - 600V > MAC08BT1, MAC08MT1. Description

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1 MAC08BT1, MAC08 Pb Description Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control. Features Sensitive Gate Trigger Current in Four Trigger Modes Blocking Voltage to 600 Volts Glass Passivated Surface for Reliability and Uniformity Surface Mount Package Pb Free Packages are Available Pin Out Functional Diagram 4 MT2 G Additional Information Datasheet Resources Samples

2 Maximum Ratings (T J = 25 C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive Off-State Voltage (Note 1) (Gate Open, Sine Wave 50 to 60 Hz, T J = -40 to 110 C) MAC08BT1 MAC08 V DRM, V RRM V On-State RMS Current (Full Cycle Sine Wave, 60 Hz, T C = 80 C) I T (RMS) 0.8 A Peak Non-Repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, T C = 25 C) I TSM 8.0 A Circuit Fusing Consideration (t = 8.3 msec) I 2 t 0.4 A²sec Peak Gate Power (Pulse Width 10 µsec, T C = 80 C) P GM 5.0 W Average Gate Power (t = 8.3 msec, T C = 80 C) P G(AV) 0.1 W Operating Junction Temperature Range T J -40 to +110 C Storage Temperature Range T stg -40 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. V DRM and V RRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. Thermal Characteristics Rating Symbol Value Unit Thermal Resistance, Junction to Ambient PCB Mounted per Figure 1 R 8JA 156 C/W 2. These ratings are applicable when surface mounted on the minimum pad sizes recommended. 3. 1/8" from case for 10 seconds.

3 Electrical Characteristics - OFF (T J = 25 C unless otherwise noted ; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit Peak Repetitive Blocking Current T J = 25 C (V D = V DRM = V RRM ; Gate Open) T J = 110 C I DRM, I RRM ma Electrical Characteristics - ON (T J = 25 C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit Peak On State Voltage (Note 2) (I TM = ±1.1 A) V TM 1.9 V Gate Trigger Current (Continuous dc) (V D = 12 V, R L = 100 Ω) I GT 10 ma Holding Current (V D = 12 V, Gate Open, Initiating Current = ±20 ma)) I H 5.0 ma Gate Trigger Voltage (Continuous dc) (V D = 12 V, R L = 100 Ω) V GT V 2. Pulse Test: Pulse Width ms, Duty Cycle 2%. Dynamic Characteristics Characteristic Symbol Min Typ Max Unit Critical Rate of Rise of Commutation Voltage (f = 250 Hz, I TM = A, Commutating di/dt = A/mS On State Current Duration = ms, V DRM = 200 V, Gate Unenergized, T C = 110 C, Gate Source Resistance = 150 Ω, See Figure 10) (di/dt)c A/ms Critical Rate of Rise of Off-State Voltage (V D = 0.67 x V DRM, Exponential Waveform, Gate Open, T J = 110 C) dv/dt 10 V/µs

4 Voltage Current Characteristic of SCR Symbol Parameter +C urrent V DRM I DRM V RRM Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage I RRM at V RRM on state I H V TM Quadrant 1 MainTerminal 2 + I RRM Peak Reverse Blocking Current I H off state I DRM at V DRM +V oltage V TM I H Maximum On State Voltage Holding Current Quadrant 3 MainTerminal 2 V TM Quadrant Definitions for a Triac Figure 1. PCB for Thermal Impedance and Power Testing (+) MT2 MT2 POSITIVE (Positive Half Cycle) + (+) MT Quadrant II I GT ( ) I GT GATE REF ( ) MT2 (+) I GT GATE REF ( ) MT2 Quadrant I +I GT inches mm Quadrant III ( ) I GT GATE (+) I GT GATE Quadrant IV REF REF MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to. With in phase signals (using standard AC lines) quadrants I and III are used BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR. BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. MATERIAL: G10 FIBERGLASS BASE EPOXY

5 Figure 2. On-State Characteristics Figure 3. Junction to Ambient Thermal Resistance vs. Copper Tab Area I T, INSTANTANEOUS ON-STATE CURRENT (AMPS) TYPICAL AT T J = 110 C MAX AT T J = 110 C MAX AT T J = 25 C v T, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) 5.0 Figure 4. Current Derating, Minimum Pad Size Reference: Ambient Temperature Figure 5. Current Derating, cm Square Pad Reference: Ambient Temperature T A, MAXIMUM ALLOWABLEAMBIENT TEMPERATURE ( C) dc α = MINIMUM FOOTPRINT 50 OR 60 Hz 30 α α 60 α = CONDUCTION 90 ANGLE I T(RMS), RMS ON-STATE CURRENT (AMPS) 0.5 Figure 6. Current Derating, cm Square Pad Reference: Ambient Temperature Figure 7. Current Derating Reference: MT2 Tab

6 Figure 8. Power Dissipation Figure 9. Thermal Response, Device Mounted on Figure 1 Printed Circuit Board Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt) Figure 11. Typical Commutating dv/dt versus Current Crossing Rate and Junction Temperature Figure 12. Typical Commutating dv/dt versus Junction Temperature at 0.8 Amps RMS COMMUTATING dv/dt dv/dt c, (V/ µ S) 10 I TM t w 1 f = 2 t w TM V DRM (di dt) c di/dt c, RATE OF CHANGE OF COMMUTATING CURRENT (A/mS) COMMUTATING dv/dt dv/dt c, (V/ µ S) Hz 180 Hz 400 Hz 300 Hz V DRM = 200 V T J, JUNCTION TEMPERATURE ( C)

7 I Figure 13. Exponential Static dv/dt versus Gate Main Terminal 1 Resistance Figure 14. Typical Gate Trigger Current Variation STATIC dv/dt (V/ µ s) MAIN TERMINAL #1 POSITIVE MAIN TERMINAL #2 POSITIVE 600 V pk T J = 110 C GT, GATE TRIGGER CURRENT (ma) 10 I GT3 I GT2 I GT1 I GT , R G T J, JUNCTION TEMPERATURE ( C) Figure 15. Typical Holding Current Variation Figure 16. Gate Trigger Voltage Variation HOLDING CURRENT (ma) I H, MAIN TERMINAL #2 POSITIVE MAIN TERMINAL #1 POSITIVE V GT, GATE TRIGGER VOLTAGE (VOLTS) V GT2 V GT1 V GT3 V GT T J, JUNCTION TEMPERATURE ( C) T J, JUNCTION TEMPERATURE ( C)

8 Dimensions Soldering Footprint D b H E E e1 e b (0003) A1 A L1 C SCALE 6:1 mm inches Dim Inches Millimeters Min Nom Max Min Nom Max A A b b c D E e e L HE DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. STYLE 6: PIN MT2 3. GATE 4. MT2

9 Dimensions Part Marking System H E D b E CASE 318E STYLE 11 4 AYW AC08x (0003) e1 A1 e b A L1 C A= Assembly Location Y= Year W= Work Week AC08X =D evice Code x= B or M (Note: Microdot may be in either location) Dim Inches Millimeters Min Nom Max Min Nom Max A A b b Soldering Footprint c D E e e L HE SCALE 6:1 mm inches 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. Ordering Information Pin Assignment 1 Main Terminal 1 2 Main Terminal 2 3 Gate Device Package Type Shipping MAC08BT1 SOT / Tape & Reel MAC08BT1G SOT 223 (Pb Free) 1000 / Tape & Reel MAC08 SOT / Tape & Reel 4 Main Terminal 2 MAC08G SOT 223 (Pb Free) 1000 / Tape & Reel Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at:

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