MBRA140T3G NRVBA140T3G. Surface Mount Schottky Power Rectifier. SMA Power Surface Mount Package SCHOTTKY BARRIER RECTIFIER 1.

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1 MBR14T3G, NRVB14T3G Surface Mount Schottky Power Rectifier SM Power Surface Mount Package This device employs the Schottky Barrier principle in a large area metal to silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system. Features Small Compact Surface Mountable Package with J Bent Leads Rectangular Package for utomated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop Guardring for Stress Protection NRVB Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; EC Q11 Qualified and PPP Capable These Devices are Pb Free and are RoHS Compliant* Mechanical Characteristics Case: Epoxy, Molded Weight: 7 mg (approximately) Finish: ll External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 26 C Max. for 1 Seconds Shipped in 12 mm tape, 5 units per 13 inch reel Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or Polarity Band SCHOTTKY BRRIER RECTIFIER MPERES 4 VOLTS Y WW SM CSE 43D MRKING DIGRM B14 YWW = ssembly Location = Year = Work Week = Pb Free Package Device Package Shipping MBR14T3G NRVB14T3G ORDERING INFORMTION SM (Pb Free) SM (Pb Free) 5, / Tape & Reel 5, / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 213 September, 213 Rev. 1 1 Publication Order Number: MBR14T3/D

2 MBR14T3G, NRVB14T3G MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating Symbol Value Unit V RRM V RWM V R 4 V verage Rectified Forward Current (t Rated V R, T C = 95 C) Peak Repetitive Forward Current (t Rated V R, Square Wave, 2 khz, T C = 1 C) Non Repetitive Peak Surge Current (Surge pplied at Rated Load Conditions Halfwave, Single Phase, 6 Hz) I O I FRM 2. I FSM 3 Storage Temperature T stg 55 to +15 C Operating Junction Temperature T J 55 to +125 C Voltage Rate of Change (Rated V R, ) dv/dt 1, V/ s ESD Ratings: Machine Model = C Human Body Model = 3B > 4 > 8 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. V THERML CHRCTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction to Lead (Note 1) Thermal Resistance, Junction to mbient (Note 1) 1. Mounted on 2 Square PC Board with 1 Square Total Pad Size, PC Board FR4. R JL 35 R J 86 C/W ELECTRICL CHRCTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 2) (I F = ) see Figure 2 for other Values (I F = 2. ) Maximum Instantaneous Reverse Current (V R = 4 V) see Figure 4 for other Values (V R = 2 V) 2. Pulse Test: Pulse Width 25 s, Duty Cycle 2.%. V F T J = 1 C V I R T J = 1 C m

3 I I I MBR14T3G, NRVB14T3G i F, INSTNTNEOUS FORWRD CURRENT (MPS) 1 1 T J = 125 C T J = -4 C T J = 125 C , INSTNTNEOUS FORWRD CURRENT (MPS) F v F, INSTNTNEOUS FORWRD VOLTGE (VOLTS) V F, MXIMUM INSTNTNEOUS FORWRD VOLTGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1E-3 1E-3, REVERSE CURRENT (MPS) R 1E-3 E-3 1E-6 1E-6 T J = 125 C, MXIMUM REVERSE CURRENT (MPS) 1E-3 E-3 1E-6 1E-6 E V R, REVERSE VOLTGE (VOLTS) Figure 3. Typical Reverse Current R E V R, REVERSE VOLTGE (VOLTS) Figure 4. Maximum Reverse Current 3

4 I MBR14T3G, NRVB14T3G O, VERGE FORWRD CURRENT (MPS) dc FREQ = 2 khz SQURE WVE Ipk/Io = Ipk/Io = 5 Ipk/Io = 1 Ipk/Io = 2, VERGE POWER DISSIPTION (WTTS) FO P.9 SQURE WVE dc.8 Ipk/Io =.7 Ipk/Io = 5.6 Ipk/Io = Ipk/Io = T L, LED TEMPERTURE ( C) I O, VERGE FORWRD CURRENT (MPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation R (T), TRNSIENT THERML RESISTNCE (NORMLIZED) E+ 1E-3 1E-3 E-3 1E-6 1E-6 1E-6 E-3 T, TIME (s) 1E-3 1E-3 E+ 1E+ 1E+ E+3 T, TIME (s) Figure 7. Thermal Response 1 C, CPCITNCE (pf) V R, REVERSE VOLTGE (VOLTS) Figure 8. Capacitance 4 4

5 MBR14T3G, NRVB14T3G PCKGE DIMENSIONS SM CSE 43D 2 ISSUE G H E E NOTES: 1. DIMENSIONING ND TOLERNCING PER NSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHLL BE MESURED WITHIN DIMENSION L. b D POLRITY INDICTOR OPTIONL S NEEDED (SEE STYLES) MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E H E L STYLE 1: PIN 1. CTHODE (POLRITY BND) 2. NODE L c 1 SOLDERING FOOTPRINT* SCLE 8:1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MBR14T3/D

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