FinFET SPICE Modeling
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1 FinFET SPICE Modeling Synopsys Solutions to Simulation Challenges of Advanced Technology Nodes Joddy Wang December 9, 2015
2 Outline SPICE Model for IC Design FinFET Modeling Challenges Solutions Summary 2015 Synopsys, Inc. 2
3 SPICE Models for IC Design EDA Manufacturing Device Modeling SPICE Models Interconnect Models Design Rules Fabrication GDSII IC Design Memory, SOC, Analogy/RF, HV, Display, Sensor, IPs The bridge between fabrication and IC design Key component of PDK 2015 Synopsys, Inc. 3
4 BSIM-CMG: Industry Standard Compact Model Various device structures Technology Bulk and SOI Channel materials: Si, SiGe, Ge, and InGaAs Production adoption for 16/14/10/7nm Extension and customization are required 2015 Synopsys, Inc. 4
5 Self Heating and MOS Reliability in FinFET FinFET has more pronounced self heating effect (SHE) Increased temperature exacerbates reliability degradation Device aging effect: BTI (Bias Temperature Instability) and HCI (Hot Carrier Injection) Concurrent SHE and reliability analysis Vt ~ exp ( n E a / k B T) BTI & HCI degradation increased ΔT = 20 C EM Imax rule reduced to 0.26x BTI ΔVt increased to 1.30x HCI ΔVt increased to 1.36x Aging simulation 2015 Synopsys, Inc. 5
6 Conventional Aging and Self-Heating Modeling is Insufficient Auxiliary thermal network Performance and convergence One additional node (T) added for each MOSFET, and solved by SPICE Device temperature is updated for every time point in simulation - expensive and prone to convergence issues Lack of good aging models simulation solutions Lack of accurate and efficient aging models Incompatible aging simulation solutions 2015 Synopsys, Inc. 6
7 Self-Heating and EM Analysis Integration EM Imax (Maximum allowed I) reduced I max ~ exp ( E a / k B T) The accuracy of EM rule depends heavily on wire temperatures (5-degree difference may result in ~30% difference) Having an uniform temperature for all wire is convenient but leads to over design Device self heating requires the capability of evaluating the wire temperatures locally T METAL = T joule + T coupling = T joule + a b T od 2015 Synopsys, Inc. 7
8 Parasitic RC in FinFET Many Rs and Cs Complicated to model and challenge to manage accuracy gap between prevs. post- layout R ext R instrinstic R total =R instrinstic +R ext +MEOL_R Increasing parasitic RC impact on circuit characteristics IEDM Synopsys, Inc. 8
9 Different Extraction Methods for Runtime and Accuracy Trade-off Schematic Full RCC Extraction Signals RCC Power CC extraction Parasitics inside model Parasitics Extracted No Parasitics Double Counting Parasitics 2015 Synopsys, Inc. 9
10 Variability and PVT Corners Every thing increasing with geometry scaling down FEOL issues, BEOL issues, # of operation Voltages, temperatures, 2015 Synopsys, Inc. 10
11 Customization and Extension to BSIM-CMG Complex layout dependence (STI, WPE, OSE, PLE ) DFM rules Statistical and parametric variability Self heating effects Device aging effects Additional geometrical scaling half node LOD WPE PSE OSE Foundry and Process specific. Difficult to be standardized into compact models 2015 Synopsys, Inc. 11
12 Synopsys Modeling Solutions for FinFET TSMC Modeling Interface (TMI) CustomCMI API (CMI) MOS Reliability Aging API (MOSRA) Efficient Subckt Macro Modeling TMI CustomCMI MOSFET, BJT, Diode, Resistor, Capacitor Core CMI Standard BSIM-CMG Model LDE TMI: TSMC Modeling Interface OMI: CMC Modeling Interface 2015 Synopsys, Inc. 12
13 BSIM-CMG Performance Optimization 2.5 BSIMCMG Model Speedup 8 7 BSIMCMG MT Scalability Org. C code optimized C code Number of CPUs 2015 Synopsys, Inc. 13
14 New Challenge on Compiled Model Validation Software engineering PURIFY sign off is a must for any compiled model release TMI, OMI, CMI, Conventional PURIFY check flow can not be applied Ideal PURIFY check flow netlist Model card HSPICE (Compiled with PURIFY options)! Source Code IP Violation Purify log file report purify error for HSPICE and TMI.so TMI.so, CMI.so (Compiled with Debug / purify options) A two-step TMI PURIFY check mechanism developed and deployed in TSMC for TMI production releases 2015 Synopsys, Inc. 14
15 Collaboration With Foundries on FinFET SPICE Library Sign Off Model Libs Corners Variations LDE RDR Model cards Foundry Synopsys Modeled Device Char Simulator & Analysis Model equation OP/DC/TRAN Current (I) AC/Noise Charge (Q) Monte Carlo Conductance (G) HF/RF Capacitance (C) MT Accurate Scalable Robust SWE Accurate Robust Efficient Scalable SWE SPICE model validation and regression system established with eco-system partners 2015 Synopsys, Inc. 15
16 Summary SPICE model is the critical link between foundry and IC design FinFET requires more features into SPICE library LDE, self heating, aging, variations Standard compact model is not enough and customization is required Synopsys provides comprehensive FinFET modeling solutions for performance, accuracy, and customization 2015 Synopsys, Inc. 16
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