UHF POWER TRANSISTOR
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1 NPN SiGe RF TRANSISTOR The is a low cost, NPN medium power SiGe HBT(Hetero-Junction Bipolar Transistor) encapsulated in a plastic SOT-3 SMD package. The can be used as a driver device or an output device, depending on the specific application. FEATURES o.8 Volt operation o P1dB 8 o Power gain 8.5 APPLICATIONS o Hand-held radio equipment in common emitter class-ab operation in 9 MHz communication band. PIN CONFIGURATION PIN NO SYMBOL DESCRIPTION 1 E emitter B base 3 E emitter C collector MAXIMUM RATINGS SYMBOL PARAMETER CONDITION VALUE Unit VCBO Collector-Base Voltage Open Emitter VCEO Collector-Emitter Voltage Open Base VEBO Emitter-Base Voltage Open Collector Ic Collector Current (DC) PT Total Power Dissipation Ts = 6 ; note 1 TSTG TJ Storage Temperature Operating Junction Temperature ~ V V V ma W - 1/7 - Sep-3- nd Edition
2 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITION VALUE Unit Rth j-s thermal resistance from junction to soldering point PT=1W; Ts=6 ;note1 55 K/W * Note 1. Ts is temperature at the soldering point of the collector pin. QUICK REFERENCE DATA RF performance at Ts 6 in common emitter test circuit (see Fig 8.) Mode of Operation f [MHz] VCE [V] PL [mw] CW, class-ab GP [db] 7 C [%] - /7 - Sep-3- nd Edition
3 DC CHARACTERISTICS Tj=5 unless otherwise specified SYMBOL PARAMETER CONDITION MIN. MAX. UNIT BVCBO collector-base breakdown voltage open emitte V BVCEO collector-emitter breakdown voltage open base 8 V BVEBO emitter-base breakdown voltage open collector 3 V IS collector leakage current.1 ma hfe DC current gain 6 CCB collector capacitance.5 pf 16 6 Hfe Ic(A) Fig 1. DC Current gain v.s Collector current Fig. Collector-base capacitance v.s Collectorbase voltage(dc) - 3/7 - Sep-3- nd Edition
4 APPLICATION INFORMATION (I) RF performance at Ts 6 in common emitter test circuit (see Fig 7) Mode of Operation f [MHz] VCE [V] PL [mw] GP [db] C [%] CW, class-ab η C [%] Fig 3. Power gain and collector efficiency v.s load power (typical value) Fig. Load power v.s input power (typical value) Typical Large Signal Impedance VCE =.8V, ICQ = 5mA, Pout = 8dBm source load Mag Ang Mag Ang /7 - Sep-3- nd Edition
5 APPLICATION INFORMATION (II) RF performance at Ts 6 in common emitter configuration. (ICQ = 5mA) Mode of Operation f [MHz] VCE [V] PL [mw] CW, class-ab GP [db] C [%] 1 Input/Load Impedance as a frequency Transister Impedance Freq. [MHz] Zin rin xin RL Zin 35 Zin 15 [Ω] rin xin [Ω] XL RL Freq [MHz] Freq [MHz] Fig 5. Input Impedance (series components) as Fig 6. Load Impedance (series components) as a freq, typical values. a freq, typical values /7 - Sep-3- nd Edition
6 Part List C1, C11 1nF C, C1 1nF C3, C, C8, C9 1pF C5 C7 R1 6pF pf. R, R3 1 L1, L 5nH Fig 7. Test Circuit Board f = 9MHz Test board : FR glass epoxy board, dielectric constant =.5, thickness =.8 mm Test condition : CW test, VCC =.8 V, ICQ = 5 ma, frequency = 9 MHz. 9, MHz 9, MHz Fig 8. Test Circuit Schematic = 9MHz - 6/7 - Sep-3- nd Edition
7 PACKAGE DIMENSION Fig 9. SOT-3 Package dimension - 7/7 - Sep-3- nd Edition
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Device Features NF = 0.95 db @ 900MHz at RF connectors of Demo board Gain = 20.5 db @ 900 MHz OIP3 = 30.0 dbm @ 1900MHz Output P1 db = 17.5 dbm @ 900MHz 5V/27mA, MTTF > 100 Years, MSL 1, Class 0 Lead-free/RoHS-compliant
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