NPN Silicon RF Twin Transistor (with 2 Different Elements) in a 6-pin Lead-less Minimold. Part Number Order Number Quantity Package Supplying Form
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1 <R> <R> <R> Preliminary NPN Silicon RF Twin Transistor (with Different Elements) in a -pin Lead-less Minimold FEATURES Low voltage operation different built-in transistors (SC, SC) : Built-in high gain transistor ft =. GHz TYP., Se =. db IC = ma, f = GHz : Built-in low phase distortion transistor suited for OSC operation ft =. GHz TYP., Se =. db VCE = V, IC = ma, f = GHz -pin lead-less minimold package BUILT-IN TRANSISTORS -pin thin-type ultra super minimold part No. SC SC ORDERING IORMATION Part Number Order Number Quantity Package Supplying Form -A pcs (Non reel) -pin lead -less minimold mm wide embossed taping Data Sheet -T -T-A kpcs/reel () (Pb-Free) Pin ( Collector), Pin ( Base) face the perforation side of the tape Remark To order evaluation samples, please contact your nearby sales office. Unit sample quantity is pcs. CAUTION Observe precautions when handling because these devices are sensitive to electrostatic discharge. The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. Page of
2 ABSOLUTE MAXIMUM RATINGS (TA = + C) Parameter Symbol Ratings Unit Collector to Base Voltage VCBO 9 9 V Collector to Emitter Voltage VCEO. V Emitter to Base Voltage VEBO. V Collector Current IC ma Total Power Dissipation 9 Ptot Note in elements Junction Temperature Tj C Storage Temperature Tstg to + C Note Mounted on. cm. mm (t) glass epoxy PCB mw R 9DS E J R ev.. P age of
3 ELECTRICAL CHARACTERISTICS (TA = + C) () Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Collector Cut-off Current ICBO VCB = V, IE = na Emitter Cut-off Current IEBO VBE = V, IC = na DC Current in hfe Note, IC = ma 7 in Bandwidth Product ft, IC = ma, f = GHz.. GHz Insertion Power in Se, IC = ma, f = GHz 7.. db Noise Figure, IC = ma, f = GHz, ZS = Zopt.. db Reverse Transfer Capacitance Cre Note VCB = V, IE =, f = MHz..7 pf () Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Collector Cut-off Current ICBO VCB = V, IE = na Emitter Cut-off Current IEBO VBE = V, IC = na DC Current in hfe Note VCE = V, IC = ma in Bandwidth Product () ft VCE = V, IC = ma, f = GHz.. GHz in Bandwidth Product () ft VCE = V, IC = ma, f = GHz.. GHz Insertion Power in () Se VCE = V, IC = ma, f = GHz.. db Insertion Power in () Se VCE = V, IC = ma, f = GHz.. db Noise Figure VCE = V, IC = ma, f = GHz, ZS = Zopt.9. db Reverse Transfer Capacitance Cre Note VCB =. V, IE =, f = MHz.. pf Notes. Pulse measurement: PW μs, Duty Cycle %. Collector to base capacitance when the emitter grounded hfe CLASSIFICATION Rank Marking FB/YFB vy hfe Value of 7 to hfe Value of to Page of
4 TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = + C) Total Power Dissipation Ptot (mw) 9 Reverse Transfer Capacitance Cre (pf) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE Mounted on Glass Epoxy PCB (. cm. mm (t) ) Elements in total 7 Ambient Temperature TA ( C) REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE. f = MHz... Collector to Base Voltage VCB (V) Reverse Transfer Capacitance Cre (pf)..... REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE f = MHz Collector to Base Voltage VCB (V) Page of
5 COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE VCE = V Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE VCE = V Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Base to Emitter Voltage VBE (V) Page of
6 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE μa 7 μa μa μa μa μa μa 9 μa μa IB = μa 7 Collector to Emitter Voltage VCE (V) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE μa μa μa μa μa IB = μa 7 Collector to Emitter Voltage VCE (V) μa μa μa μa Page of
7 DC Current in hfe DC Current in hfe DC Current in hfe DC CURRENT GAIN vs. COLLECTOR CURRENT DC CURRENT GAIN vs. COLLECTOR CURRENT VCE = V DC CURRENT GAIN vs. COLLECTOR CURRENT DC Current in hfe DC Current in hfe DC CURRENT GAIN vs. COLLECTOR CURRENT DC CURRENT GAIN vs. COLLECTOR CURRENT VCE = V Page 7 of
8 in Bandwidth Product ft (GHz) in Bandwidth Product ft (GHz) in Bandwidth Product ft (GHz) GAIN BANDWIDTH PRODUCT VCE = V f = GHz GAIN BANDWIDTH PRODUCT f = GHz GAIN BANDWIDTH PRODUCT f = GHz in Bandwidth Product ft (GHz) in Bandwidth Product ft (GHz) GAIN BANDWIDTH PRODUCT VCE = V f = GHz GAIN BANDWIDTH PRODUCT f = GHz Page of
9 Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) VCE = V IC = ma INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) IC = ma INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) IC = ma Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) VCE = V IC = ma INSERTION POWER GAIN,, vs. FREQUENCY Frequency f (GHz) INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) VCE = V IC = ma IC = ma Se Page 9 of
10 Remark The graph indicates nominal characteristics. Insertion Power in Se (db) INSERTION POWER GAIN,, vs. FREQUENCY Frequency f (GHz) IC = ma Se Page of
11 Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN,, VCE = V f = GHz INSERTION POWER GAIN, VCE = V f = GHz Se Se Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN, VCE = V f = GHz Se INSERTION POWER GAIN,, VCE = V f = GHz Se Page of
12 Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, f = GHz Se INSERTION POWER GAIN,, f = GHz INSERTION POWER GAIN, f = GHz Se Se Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN, f = GHz INSERTION POWER GAIN,, f = GHz Se Se INSERTION POWER GAIN,, f = GHz Se Page of
13 Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) f = GHz INSERTION POWER GAIN,, Se INSERTION POWER GAIN,, f = GHz INSERTION POWER GAIN, f = GHz Se Se Page of
14 Noise Figure (db) Noise Figure (db) Noise Figure (db) VCE = V f = GHz VCE = V f =. GHz VCE = V f = GHz Associated in (db) Associated in (db) Associated in (db) Noise Figure (db) Noise Figure (db) Noise Figure (db) VCE = V f = GHz VCE = V f =. GHz VCE = V f = GHz Associated in (db) Associated in (db) Associated in (db) Page of
15 Noise Figure (db) Noise Figure (db) Noise Figure (db) f = GHz f =. GHz f = GHz Associated in (db) Associated in (db) Associated in (db) Noise Figure (db) Noise Figure (db) Noise Figure (db) f = GHz f =. GHz f = GHz Associated in (db) Associated in (db) Associated in (db) Page of
16 Noise Figure (db) Noise Figure (db) Noise Figure (db) f = GHz f =. GHz f = GHz Associated in (db) Associated in (db) Associated in (db) Page of
17 S-PARAMETERS S-parameters and noise parameters are provided on our Web site in a format (SP) that enables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. Click here to download S-parameters. [RF and Microwave] [Device Parameters] URL Page 7 of
18 <R> PACKAGE DIMENSIONS -PIN LEAD-LESS MINIMOLD () (UNIT: mm) ±...± vy (Bottom View). ±.. + C E C (Top View) PIN CONNECTIONS. Collector (). Emitter (). Collector (). Base (). Emitter (). Base () B E B Page of
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