4 Ω RON, 4-/8-Channel ±15 V/+12 V/±5 V icmos Multiplexers ADG1408/ADG1409

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1 4 Ω RON, 4-/-Channel ±5 V/+ V/±5 V icmos Multiplexers AG4/AG49 FEATURES 4.7 Ω maximum on 5 C.5 Ω on resistance flatness Up to 9 ma continuous current Fully specified at ±5 V/+ V/±5 V 3 V logic-compatible inputs Rail-to-rail operation Break-before-make switching action -lead TSSOP and 4 mm 4 mm LFCSP packages APPLICATIONS Relay replacement Audio and video routing Automatic test equipment ata acquisition systems Temperature measurement systems Avionics Battery-powered systems Communication systems Medical equipment GENERAL ESCRIPTION The AG4/AG49 are monolithic icmos analog multiplexers comprising eight single channels and four differential channels, respectively. The AG4 switches one of eight inputs to a common output, as determined by the 3-bit binary address lines, A, A, and A. The AG49 switches one of four differential inputs to a common differential output, as determined by the -bit binary address lines, A and A. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off. The icmos (industrial CMOS) modular manufacturing process combines high voltage CMOS (complementary metal-oxide semiconductor) and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage parts has been able to achieve. Unlike analog ICs using conventional CMOS processes, icmos components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size. S S FUNCTIONAL BLOCK IAGRAM AG4 -OF- ECOER A A A EN SA S4A SB S4B Figure. AG49 -OF-4 ECOER A A EN The ultralow on resistance and on resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications where low distortion is critical. icmos construction ensures ultralow power dissipation, making the parts ideally suited for portable and batterypowered instruments. PROUCT HIGHLIGHTS. 4 Ω on resistance...5 Ω on resistance flatness V logic compatible digital input, VIH =. V, VIL =. V. 4. -lead TSSOP and 4 mm 4 mm LFCSP packages. Table. Related evices Part No. escription AG/AG9 Low capacitance, low charge injection, and low leakage 4-/-channel ±5 V multiplexers A B 4- Rev. B Information furnished by Analog evices is believed to be accurate and reliable. However, no responsibility is assumed by Analog evices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog evices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9, Norwood, MA -9, U.S.A. Tel: Fax: Analog evices, Inc. All rights reserved.

2 AG4/AG49 TABLE OF CONTENTS Features... Applications... Functional Block iagram... General escription... Product Highlights... Revision History... Specifications V ual Supply... 3 ingle Supply V ual Supply... 7 Continuous Current per channel, S or... Absolute Maximum Ratings...9 Thermal Resistance...9 ES Caution...9 Pin Configurations and Function escriptions... Typical Performance Characteristics... Terminology... Test Circuits... 7 Outline imensions... 9 Ordering Guide... REVISION HISTORY 3/9 Rev. A to Rev. B Change to I Parameter (Table )... 4 Change to I Parameter (Table 3)... / Rev. to Rev. A Changes to Features... Added Table 5; Renumbered Sequentially... Changes to Table... 9 Added Exposed Pad Notation to Figure 3... Added Exposed Pad Notation to Figure 5... Added Exposed Pad Notation to Outline imensions... 9 / Revision : Initial Version Rev. B Page of

3 AG4/AG49 SPECIFICATIONS 5 V UAL SUPPLY V = +5 V ± %, VSS = 5 V ± %, GN = V, unless otherwise noted. Table. Parameter +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range VSS to V V On Resistance (RON) 4 Ω typ VS = ± V, IS = ma; see Figure Ω max V = +3.5 V, VSS = 3.5 V On Resistance Match Between. Ω typ VS = ± V, IS = ma Channels (ΔRON).7.5. Ω max On Resistance Flatness (RFLAT(ON)).5 Ω typ VS = ± V, IS = ma Ω max LEAKAGE CURRENTS V = +.5 V, VSS =.5 V Source Off Leakage, IS (Off) ±.4 na typ VS = ± V, V = V; see Figure 7 ±. ±. ±5 na max rain Off Leakage, I (Off) ±.4 na typ VS = ± V, V = V; see Figure 7 ±.45 ± ±3 na max Channel On Leakage, I, IS (On) ±. na typ VS = V = ± V; see Figure ±.5 ±3 ±3 na max IGITAL INPUTS Input High Voltage, VINH. V min Input Low Voltage, VINL. V max Input Current ±.5 μa typ VIN = VGN or V ±. μa max igital Input Capacitance, CIN 4 pf typ YNAMIC CHARACTERISTICS Transition Time, ttransition 4 ns typ RL = Ω, CL = 35 pf 7 4 ns max VS = V, see Figure 9 Break-Before-Make Time elay, tbbm 5 ns typ RL = Ω, CL = 35 pf 3 ns min VS = VS = V; see Figure 3 ton (EN) ns typ RL = Ω, CL = 35 pf 5 5 ns max VS = V; see Figure 3 toff (EN) ns typ RL = Ω, CL = 35 pf 5 7 ns max VS = V; see Figure 3 Charge Injection 5 pc typ VS = V, RS = Ω, CL = nf; see Figure 3 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 33 Channel-to-Channel Crosstalk 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 34 Total Harmonic istortion, TH + N.5 % typ RL = Ω, 5 V p-p, f = Hz to khz; see Figure 3 3 db Bandwidth RL = 5 Ω, CL = 5 pf; see Figure 35 AG4 MHz typ AG49 5 MHz typ Insertion Loss.4 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 35 CS (Off) 4 pf typ f = MHz C (Off) AG4 pf typ f = MHz AG49 4 pf typ f = MHz C, CS (On) AG4 35 pf typ f = MHz AG49 9 pf typ f = MHz Rev. B Page 3 of

4 AG4/AG49 Parameter POWER REQUIREMENTS +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments V = +.5 V, VSS =.5 V I. μa typ igital inputs = V or V μa max μa typ igital inputs = 5 V 3 μa max ISS. μa typ igital inputs = V, 5 V or V μa max V/VSS ±4.5/±.5 V min/max Temperature range: Y version: 4 C to +5 C. Guaranteed by design, not subject to production test. Rev. B Page 4 of

5 AG4/AG49 INGLE SUPPLY V = V ± %, VSS = V, GN = V, unless otherwise noted. Table 3. Parameter +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range to V V On Resistance (RON) Ω typ VS = V to V, IS = ma; see Figure 9.5. Ω max V =. V, VSS = V On Resistance Match. Ω typ VS = V to V, IS = ma Between Channels (ΔRON)..5. Ω max On Resistance Flatness (RFLAT(ON)).5 Ω typ VS = V to V, IS = ma.5.5. Ω max LEAKAGE CURRENTS V = 3. V Source Off Leakage, IS (Off) ±.4 na typ VS = V/ V, V = V/ V; see Figure 7 ±. ±. ±5 na max rain Off Leakage, I (Off) ±.4 na typ VS = V/ V, V = V/ V; see Figure 7 ±.45 ± ±37 na max Channel On Leakage, I, IS (On) ±. na typ VS = V = V or V; see Figure ±.44 ±.3 ±3 na max IGITAL INPUTS Input High Voltage, VINH. V min Input Low Voltage, VINL. V max Input Current ±.5 μa typ VIN = VGN or V ±. μa max igital Input Capacitance, CIN 5 pf typ YNAMIC CHARACTERISTICS Transition Time, ttransition ns typ RL = Ω, CL = 35 pf 33 3 ns max VS = V; see Figure 9 Break-Before-Make Time elay, tbbm 9 ns typ RL = Ω, CL = 35 pf 4 ns min VS = VS = V; see Figure 3 ton (EN) ns typ RL = Ω, CL = 35 pf 5 5 ns max VS = V; see Figure 3 toff (EN) 5 ns typ RL = Ω, CL = 35 pf 45 ns max VS = V; see Figure 3 Charge Injection pc typ VS = V, RS = Ω, CL = nf; see Figure 3 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 33 Channel-to-Channel Crosstalk 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 34 3 db Bandwidth RL = 5 Ω, CL = 5 pf; see Figure 35 AG4 3 MHz typ AG49 7 MHz typ Insertion Loss.5 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 35 CS (Off) 5 pf typ f = MHz C (Off) AG4 5 pf typ f = MHz AG49 pf typ f = MHz C, CS (On) AG4 pf typ f = MHz AG49 pf typ f = MHz Rev. B Page 5 of

6 AG4/AG49 Parameter POWER REQUIREMENTS +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments V = 3. V I. μa typ igital inputs = V or V μa max μa typ igital inputs = 5 V 3 μa max V 5/.5 V min/max VSS = V, GN = V Temperature range for Y version: 4 C to +5 C. Guaranteed by design, not subject to production test. Rev. B Page of

7 AG4/AG49 5 V UAL SUPPLY V = +5 V ± %, VSS = 5 V ± %, GN = V, unless otherwise noted. Table 4. Parameter +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range VSS to V V On Resistance (RON) 7 Ω typ VS = ±4.5 V, IS = ma; see Figure 9.5 Ω max V = +4.5 V, VSS = 4.5 V On Resistance Match Between.3 Ω typ VS = ±4.5 V, IS = ma Channels (ΔRON).7.9. Ω max On Resistance Flatness (RFLAT(ON)).5 Ω typ VS = ±4.5 V; IS = ma Ω max LEAKAGE CURRENTS V = +5.5 V, VSS = 5.5 V Source Off Leakage, IS (Off) ±. na typ VS = ±4.5 V, V = 4.5 V; see Figure 7 ±. ±. ±5 na max rain Off Leakage, I (Off) ±. na typ VS = ±4.5 V, V = 4.5 V; see Figure 7 ±.45 ±. ± na max Channel On Leakage, I, IS (On) ±.4 na typ VS = V = ±4.5 V; see Figure ±.3 ±. ± na max IGITAL INPUTS Input High Voltage, VINH. V min Input Low Voltage, VINL. V max Input Current ±.5 μa typ VIN = VGN or V ±. μa max igital Input Capacitance, CIN 5 pf typ YNAMIC CHARACTERISTICS Transition Time, ttransition 33 ns typ RL = Ω, CL = 35 pf ns max VS = 5 V; see Figure 9 Break-Before-Make Time elay, tbbm ns typ RL = Ω, CL = 35 pf 5 ns min VS = VS = 5 V; see Figure 3 ton (EN) 45 ns typ RL = Ω, CL = 35 pf ns max VS = 5 V; see Figure 3 toff (EN) 5 ns typ RL = Ω, CL = 35 pf ns max VS = 5 V; see Figure 3 Charge Injection pc typ VS = V, RS = Ω, CL = nf; see Figure 3 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 33 Channel-to-Channel Crosstalk 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 34 Total Harmonic istortion, TH + N. % typ RL = Ω, 5 V p-p, f = Hz to khz; see Figure 3 3 db Bandwidth RL = 5 Ω, CL = 5 pf; see Figure 35 AG4 4 MHz typ AG49 MHz typ Insertion Loss.5 db typ RL = 5 Ω, CL = 5 pf, f = MHz; see Figure 35 CS (Off) pf typ f = MHz C (Off) AG4 3 pf typ f = MHz AG49 5 pf typ f = MHz C, CS (On) AG4 pf typ f = MHz AG49 pf typ f = MHz Rev. B Page 7 of

8 AG4/AG49 Parameter POWER REQUIREMENTS +5 C 4 C to +5 C 4 C to +5 C Unit Test Conditions/Comments V = +5.5 V, VSS = 5.5 V I. μa typ igital inputs = V or V μa max ISS. μa typ igital inputs = V, 5 V or V μa max V/VSS ±4.5/±.5 V min/max Temperature range for Y version: 4 C to +5 C. Guaranteed by design, not subject to production test. CONTINUOUS CURRENT PER CHANNEL, S OR Table 5. Parameter 5 C 5 C 5 C Unit Test Conditions/Comments CONTINUOUS CURRENT, S or 5 V ual Supply V = +3.5 V, VSS = 3.5 V AG ma max AG ma max ingle Supply V =. V, VSS = V AG ma max AG ma max 5 V ual Supply V = +4.5 V, VSS = 4.5 V AG ma max AG ma max Guaranteed by design, not subject to production test. Rev. B Page of

9 AG4/AG49 ABSOLUTE MAXIMUM RATINGS TA = 5 C, unless otherwise noted. Table. Parameter V to VSS V to GN VSS to GN Analog Inputs, igital Inputs Rating 35 V.3 V to +5 V +.3 V to 5 V VSS.3 V to V +.3 V or 3 ma, whichever occurs first Continuous Current, S or Table 5 data + % Peak Current, S or (Pulsed at ms, 35 ma % uty Cycle Maximum) Operating Temperature Range Industrial (Y Version) 4 C to +5 C Storage Temperature Range 5 C to +5 C Junction Temperature 5 C Reflow Soldering Peak Temperature (+/ 5) C (Pb-Free) Overvoltages at A, EN, S, or are clamped by internal diodes. Current should be limited to the maximum ratings given. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE θja is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 7. Thermal Resistance Package Type θja θjc Unit -Lead TSSOP C/W -Lead LFCSP 3.4 C/W ES CAUTION Rev. B Page 9 of

10 S4 S S7 5 7 EN 5 A 4 A 3 A AG4/AG49 PIN CONFIGURATIONS AN FUNCTION ESCRIPTIONS A EN 3 S 4 S 5 S3 S4 7 AG4 TOP VIEW (Not to Scale) A 5 A 4 GN 3 V S5 S S7 9 S Figure. AG4 Pin Configuration (TSSOP) 4- S S 3 S3 4 PIN INICATOR AG4 TOP VIEW (Not to Scale) GN V S5 9 S NOTES. THE EXPOSE PA IS CONNECTE INTERNALLY. FOR INCREASE RELIABILITY OF THE SOLER JOINTS AN MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENE THAT THE PA BE SOLERE TO THE SUBSTRATE,. Figure 3. AG4 Pin Configuration (LFCSP) 4-3 Table. AG4 Pin Function escriptions Pin No. TSSOP LFCSP Mnemonic escription 5 A Logic Control Input. EN Active High igital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 VSS Most Negative Power Supply Potential. In single supply applications, it can be connected to ground. 4 S Source Terminal. Can be an input or an output. 5 3 S Source Terminal. Can be an input or an output. 4 S3 Source Terminal 3. Can be an input or an output. 7 5 S4 Source Terminal 4. Can be an input or an output. rain Terminal. Can be an input or an output. 9 7 S Source Terminal. Can be an input or an output. S7 Source Terminal 7. Can be an input or an output. 9 S Source Terminal. Can be an input or an output. S5 Source Terminal 5. Can be an input or an output. 3 V Most Positive Power Supply Potential. 4 GN Ground ( V) Reference. 5 3 A Logic Control Input. 4 A Logic Control Input. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS. Table 9. AG4 Truth Table A A A EN On Switch X X X None Rev. B Page of

11 S4A A B S4B 5 7 EN 5 A 4 A 3 GN AG4/AG49 A EN 3 SA 4 SA 5 S3A S4A 7 A AG49 TOP VIEW (Not to Scale) A 5 GN 4 V 3 SB SB S3B S4B 9 B Figure 4. AG49 Pin Configuration (TSSOP) 4-4 SA SA 3 S3A 4 PIN INICATOR AG49 TOP VIEW (Not to Scale) V SB SB 9 S3B NOTES. THE EXPOSE PA IS CONNECTE INTERNALLY. FOR INCREASE RELIABILITY OF THE SOLER JOINTS AN MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENE THAT THE PA BE SOLERE TO THE SUBSTRATE,. Figure 5. AG49 Pin Configuration (LFCSP) 4-5 Table. AG49 Pin Function escriptions Pin No. TSSOP LFCSP Mnemonic escription 5 A Logic Control Input. EN Active High igital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 VSS Most Negative Power Supply Potential. In single supply applications, it can be connected to ground. 4 SA Source Terminal A. Can be an input or an output. 5 3 SA Source Terminal A. Can be an input or an output. 4 S3A Source Terminal 3A. Can be an input or an output. 7 5 S4A Source Terminal 4A. Can be an input or an output. A rain Terminal A. Can be an input or an output. 9 7 B rain Terminal B. Can be an input or an output. S4B Source Terminal 4B. Can be an input or an output. 9 S3B Source Terminal 3B. Can be an input or an output. SB Source Terminal B. Can be an input or an output. 3 SB Source Terminal B. Can be an input or an output. 4 V Most Positive Power Supply Potential. 5 3 GN Ground ( V) Reference. 4 A Logic Control Input. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS. Table. AG49 Truth Table A A EN On Switch Pair X X None 3 4 Rev. B Page of

12 AG4/AG49 TYPICAL PERFORMANCE CHARACTERISTICS T A = 5 C 5 7 V = +5V = 5V ON RESISTANCE (Ω) 4 3 V = +5V, = 5V V = +3.5V, = 3.5V V = +V, = V V = +V, = V V = +.5V, =.5V SOURCE OR RAIN VOLTAGE (V) Figure. On Resistance vs. V, VS; ual Supply 4- ON RESISTANCE (Ω) T A = +5 C T A = +5 C T A = 4 C T A = +5 C 5 5 SOURCE OR RAIN VOLTAGE (V) Figure 9. On Resistance vs. V, VS for ifferent Temperatures; 5 V ual Supply T A = 5 C V = +5V = 5V ON RESISTANCE (Ω) ON RESISTANCE (Ω) 4 V = +7V, = 7V V = +5.5V, = 5.5V V = +5V, = 5V V = +4.5V, = 4.5V SOURCE OR RAIN VOLTAGE (V) Figure 7. On Resistance vs. V, VS; ual Supply T A = +5 C T A = +5 C T A = 4 C T A = +5 C SOURCE OR RAIN VOLTAGE (V) Figure. On Resistance vs. V, VS for ifferent Temperatures; 5 V ual Supply ON RESISTANCE (Ω) T A = 5 C = V ON RESISTANCE (Ω) V = V = V 3 V = V V = 3.V V =.V V = V V = 5V SOURCE OR RAIN VOLTAGE (V) Figure. On Resistance vs. V, VS; Single Supply 4-7 T A = +5 C T A = +5 C T A = 4 C T A = +5 C 4 SOURCE OR RAIN VOLTAGE (V) Figure. On Resistance vs. V, VS for ifferent Temperatures; ingle Supply 4- Rev. B Page of

13 AG4/AG49 LEAKAGE CURRENT (na) I S (OFF) + I (OFF) + I S (OFF) + I (OFF) + I, I S (ON) ++ I, I S (ON) V = +5V = 5V V BIAS = +V/ V LEAKAGE CURRENT (na) 4 4 I S (OFF) + I (OFF) + I S (OFF) + I (OFF) + I, I S (ON) ++ I, I S (ON) V = V = V V BIAS = V/V TEMPERATURE ( C) Figure. Leakage Current vs. Temperature; 5 V ual Supply 4-4 TEMPERATURE ( C) Figure 5. Leakage Current vs. Temperature; ingle Supply 4-3 LEAKAGE CURRENT (na) 4 4 I S (OFF) + I (OFF) + I S (OFF) + I (OFF) + I, I S (ON) ++ I, I S (ON) V = +5V = 5V V BIAS = +V/ V I (µa) V = +V = V I PER CHANNEL T A = 5 C V = +5V = 5V V = +5V = 5V 4 4 TEMPERATURE ( C) Figure 3. Leakage Current vs. Temperature; 5 V ual Supply LOGIC, AX (V) Figure. Positive Supply Current vs. Logic Level 4-34 LEAKAGE CURRENT (na) I S (OFF) + I (OFF) + I S (OFF) + I (OFF) + I, I S (ON) ++ I, I S (ON) V = +5V = 5V V BIAS = +4.5V/ 4.5V CHARGE INJECTION (pc) T A = 5 C V = +5V = 5V V = +5V = 5V V = +V = V 4 TEMPERATURE ( C) Figure 4. Leakage Current vs. Temperature; 5 V ual Supply (V) Figure 7. Charge Injection vs. Source Voltage 4-4 Rev. B Page 3 of

14 AG4/AG49 TIME (ns) V = +5V = 5V V = V = V V = +5V = 5V CROSSTALK (db) V = +5V = 5V T A = 5 C AJACENT CHANNEL NONAJACENT CHANNEL TEMPERATURE ( C) Figure. Transition Time vs. Temperature 4-33 k k k M M M FREQUENCY (Hz) Figure. AG49 Crosstalk vs. Frequency G 4- OFF ISOLATION (db) k V = +5V = 5V T A = 5 C k k M M M FREQUENCY (Hz) Figure 9. Off Isolation vs. Frequency G 4- BANWITH (db) V = +5V = 5V T A = 5 C 4. k k k M M M FREQUENCY (Hz) Figure. AG4 On Response vs. Frequency V = +5V = 5V T A = 5 C.5. CROSSTALK (db) BANWITH (db) k k k M M M FREQUENCY (Hz) Figure. AG4 Crosstalk vs. Frequency G V = +5V = 5V T A = 5 C 4. k k k M M M G FREQUENCY (Hz) Figure 3. AG49 On Response vs. Frequency 4-3 Rev. B Page 4 of

15 AG4/AG LOA = Ω T A = 5 C V = +5V = 5V T A = 5 C V p-p =.3V TH + N (%) V = +5V, = 5V, = +5V p-p V = +5V, = 5V, = +5V p-p ACPSRR (db) NO ECOUPLING CAPACITORS ECOUPLING CAPACITORS ON SUPPLIES. k k k FREQUENCY (Hz) Figure 4. Total Harmonic istortion Plus Noise vs. Frequency 4-3 k k k M M FREQUENCY (Hz) Figure 5. AC Power Supply Rejection Ratio vs. Frequency 4-35 Rev. B Page 5 of

16 AG4/AG49 TERMINOLOGY RON Ohmic resistance between and S. ΔRON ifference between the RON of any two channels. RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured. IS (Off) Source leakage current when the switch is off. I (Off) rain leakage current when the switch is off. I, IS (On) Channel leakage current when the switch is on. V (VS) Analog voltage on Terminal and Terminal S. CS (Off) Channel input capacitance for off condition. C (Off) Channel output capacitance for off condition. C, CS (On) On switch capacitance. CIN igital input capacitance. ton (EN) elay time between the 5% and 9% points of the digital input and switch on condition. toff (EN) elay time between the 5% and 9% points of the digital input and switch off condition. ttransition elay time between the 5% and 9% points of the digital inputs and the switch on condition when switching from one address state to another. tbbm Off time measured between the % point of both switches when switching from one address state to another. VINL Maximum input voltage for Logic. VINH Minimum input voltage for Logic. IINL, IINH Input current of the digital input. I Positive supply current. ISS Negative supply current. Off Isolation A measure of unwanted signal coupling through an off channel. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching. Bandwidth Frequency at which the output is attenuated by 3 db. On Response Frequency response of the on switch. Total Harmonic istortion Plus Noise (TH + N) Ratio of the harmonic amplitude plus noise of the signal to the fundamental. AC Power Supply Rejection Ratio (ACPSRR) A measure of the ability of a part to avoid coupling noise and spurious signals that appear on the supply voltage pin to the output of the switch. The dc voltage on the device is modulated by a sine wave of. V p-p. The ratio of the amplitude of signal on the output to the amplitude of the modulation is the ACPSRR. Rev. B Page of

17 AG4/AG49 TEST CIRCUITS V S I S (OFF) A S I (OFF) A NC S I (ON) A I S 4- V 4- NC = NO CONNECT V 4- Figure. On Resistance Figure 7. Off Leakage Figure. On Leakage V 3V ARESS RIVE (V IN ) V 5% 5% t r < ns t f < ns V IN 5Ω V A A A S S TO S7 t TRANSITION OUTPUT t TRANSITION 9% S AG4.4V EN OUTPUT 9% GN Ω 35pF SIMILAR CONNECTION FOR AG Figure 9. Address to Output Switching Times, ttransition V 3V ARESS RIVE (V IN ) V V IN 5Ω V A A A S S TO S7 OUTPUT % % S AG4.4V EN OUTPUT GN Ω 35pF t BBM SIMILAR CONNECTION FOR AG Figure 3. Break-Before-Make elay, tbbm V 3V V ENABLE RIVE (V IN ) V 5% 5% A A A S S TO S OUTPUT t ON (EN).9V O.9V O t OFF (EN) V IN 5Ω EN AG4 GN OUTPUT Ω 35pF Figure 3. Enable elay, ton (EN), toff (EN) SIMILAR CONNECTION FOR AG Rev. B Page 7 of

18 AG4/AG49 V 3V V A V IN A A AG4 V OUT Q INJ = C L ΔV OUT ΔV OUT R S V IN S EN GN C L nf V OUT Figure 3. Charge Injection SIMILAR CONNECTION FOR AG µFV.µF.µFV.µF V NETWORK ANALYZER V NETWORK ANALYZER S GN 5Ω 5Ω R L 5Ω V OUT S GN 5Ω V OUT R L 5Ω Figure 33. Off Isolation OFF ISOLATION = log V OUT 4-7 V OUT WITH SWITCH INSERTION LOSS = log V OUT WITHOUT SWITCH Figure 35. Insertion Loss 4-9.µFV.µF NETWORK ANALYZER V.µFV.µF V OUT R L 5Ω S S GN R 5Ω IN V S AUIO PRECISION R S V p-p CHANNEL-TO-CHANNEL CROSSTALK = log V OUT 4- V IN GN R L kω V OUT 4-3 Figure 34. Channel-to-Channel Crosstalk Figure 3. TH + Noise Rev. B Page of

19 AG4/AG49 OUTLINE IMENSIONS BSC.5.5 PIN.5 BSC.3.9 COPLANARITY.. MAX SEATING PLANE..45 COMPLIANT TO JEEC STANARS MO-53-AB Figure 37. -Lead Thin Shrink Small Outline Package [TSSOP] (RU-) imensions shown in millimeters 4. BSC SQ.5.4. MAX.3 PIN INICATOR PIN INICATOR..5. SEATING PLANE 3.75 BSC SQ.5 9 BSC TOP VIEW.95 BCS MAX. MAX.5 TYP MAX. NOM COPLANARITY. REF. COMPLIANT TO JEEC STANARS MO--VGGC. EXPOSE PA 4 5 BOTTOM VIEW.5.5 SQ.35.5 MIN Figure 3. -Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm 4 mm, Very Thin Quad (CP--3) imensions shown in millimeters FOR PROPER CONNECTION OF THE EXPOSE PA, REFER TO THE PIN CONFIGURATION AN FUNCTION ESCRIPTIONS SECTION OF THIS ATA SHEET. 3-A Rev. B Page 9 of

20 AG4/AG49 ORERING GUIE Model Temperature Range Package escription Package Option AG4YRUZ 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG4YRUZ-REEL 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG4YRUZ-REEL7 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG4YCPZ-REEL7 4 C to +5 C -Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP--3 AG49YRUZ 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG49YRUZ-REEL 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG49YRUZ-REEL7 4 C to +5 C -Lead Thin Shrink Small Outline Package [TSSOP] RU- AG49YCPZ-REEL7 4 C to +5 C -Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP--3 Z = RoHS Compliant Part. 9 Analog evices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. 4--3/9(B) Rev. B Page of

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