Fault Protection and Detection, 10 Ω RON, Quad SPST Switches ADG5412F-EP

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1 Enhanced Product FEATURES Overvoltage protection up to 55 V and +55 V Power-off protection up to 55 V and +55 V Overvoltage detection on source pins Low on resistance: Ω On-resistance flatness:.5 Ω 5.5 kv human body model (HBM) ESD rating Latch-up immune under any circumstance Known state without digital inputs present ENHANCED PRODUCT FEATURES Supports defense and aerospace applications (AQEC standard) Military temperature range: 55 C to Controlled manufacturing baseline One assembly/test site One fabrication site Enhanced product change notification Qualification data available on request APPLICATIONS Avionics Analog input/output modules Process control/distributed control systems Data acquisition Instrumentation Automatic test equipment Communication systems Relay replacement GENERAL DESCRIPTION The contains four independently controlled single-pole/single-throw (SPST) switches. The has four switches that turn on with Logic inputs. Each switch conducts equally well in both directions when on, and each switch has an input signal range that extends to the supplies. The digital inputs are compatible with 3 V logic inputs over the full operating supply range. When no power supplies are present, the switch remains in the off condition, and the switch inputs are high impedance. Under normal operating conditions, if the analog input signal levels on any Sx pin exceed VDD or VSS by a threshold voltage, VT, the switch turns off. Input signal levels up to +55 V or 55 V relative to ground are blocked, in both the powered and unpowered condition. The low on resistance of these switches, combined with on-resistance flatness over a significant portion of the signal range make them an ideal solution for data acquisition and gain Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Fault Protection and Detection, Ω RON, Quad SPST Switches FUNCTIONAL BLOCK DIAGRAM S S2 S3 S4 FAULT DETECTION + SWITCH DRIVER IN IN2 IN3 IN4 NOTES. SWITCHES SHOWN FOR A LOGIC INPUT. Figure. switching applications where excellent linearity and low distortion are critical. PRODUCT HIGHLIGHTS. Source pins are protected against voltages greater than the supply rails, up to 55 V and +55 V. 2. Source pins are protected against voltages between 55 V and +55 V in an unpowered state. 3. Overvoltage detection with digital output indicates operating state of switches. 4. Trench isolation guards against latch-up. 5. Optimized for low on resistance and on-resistance flatness. 6. The can be operated from a dual supply of ±5 V up to ±22 V or a single power supply of +8 V up to +44 V. Additional application and technical information can be found in the ADG542F data sheet. One Technology Way, P.O. Box 96, Norwood, MA , U.S.A. Tel: Analog Devices, Inc. All rights reserved. Technical Support D D2 D3 D4 FF 275-

2 TABLE OF CONTENTS Features... Enhanced Product Features... Applications... Functional Block Diagram... General Description... Product Highlights... Revision History... 2 Specifications... 3 ±5 V Dual Supply... 3 ±2 V Dual Supply... 5 Enhanced Product 2 ingle Supply ingle Supply...9 Continuous Current per Channel, Sx or Dx... Absolute Maximum Ratings... 2 ESD Caution... 2 Pin Configuration and Function Descriptions... 3 Typical Performance Characteristics... 4 Test Circuits... 9 Outline Dimensions Ordering Guide REVISION HISTORY /27 Rev. A to Rev. B Changes to Drain Leakage Current, ID, With Overvoltage Parameter, Table... 3 Changes to Drain Leakage Current, ID, With Overvoltage Parameter, Table Changes to Drain Leakage Current, ID, With Overvoltage Parameter, Table /25 Rev. to Rev. A Changes to Features Section... Added Enhanced Product Features Section... 7/25 Revision : Initial Version Rev. B Page 2 of 22

3 Enhanced Product SPECIFICATIONS ±5 V DUAL SUPPLY VDD = 5 V ± %, VSS = 5 V ± %, = V, CDECOUPLING =. µf, unless otherwise noted. Table. Parameter 4 C to 55 C to Unit Test Conditions/Comments ANALOG SWITCH VDD = 3.5 V, VSS = 3.5 V, see Figure 3 Analog Signal Range VDD to VSS V On Resistance, RON Ω typ VS = ± V, IS = ma Ω max 9.5 Ω typ VS = ±9 V, IS = ma Ω max On-Resistance Match Between Channels, RON.5 Ω typ VS = ± V, IS = ma Ω max.5 Ω typ VS = ±9 V, IS = ma Ω max On-Resistance Flatness, RFLAT(ON).6 Ω typ VS = ± V, IS = ma.9.. Ω max. Ω typ VS = ±9 V, IS = ma Ω max Threshold Voltage, VT.7 V typ See Figure 26 LEAKAGE CURRENTS VDD = 6.5 V, VSS = 6.5 V Source Off Leakage, IS (Off ) ±. na typ VS = ± V, VD = V, see Figure 3 ±.5 ±5. ±2. na max Drain Off Leakage, ID (Off ) ±. na typ VS = ± V, VD = V, see Figure 3 ±.5 ±5. ±8. na max Channel On Leakage, ID (On), IS (On) ±.3 na typ VS = VD = ± V, see Figure 32 ±.5 ±2. ±4.5 na max FAULT Source Leakage Current, IS With Overvoltage ±78 µa typ VDD = 6.5 V, VSS = 6.5 V, = V, VS = ±55 V, see Figure 35 Power Supplies Grounded or Floating ±4 µa typ VDD = V or floating, VSS = V or floating, = V, INx = V or floating, VS = ±55 V, see Figure 36 Drain Leakage Current, ID With Overvoltage ±2. na typ VDD = 6.5 V, VSS = 6.5 V, = V, VS = ±55 V, see Figure 35 ±2 ±3 ±65 na max Power Supplies Grounded ± na typ VDD = V, VSS = V, = V, VS = ±55 V, INx = V, see Figure 36 ±3 ±5 ± na max Power Supplies Floating ± ± ± µa typ VDD = floating, VSS = floating, = V, VS = ±55 V, INx = V, see Figure 36 DIGITAL INPUTS/OUTPUTS Input Voltage High, VINH 2. V min Input Voltage Low, VINL.8 V max Input Current, IINL or IINH ±.7 µa typ VIN = V or VDD ±.2 µa max Digital Input Capacitance, CIN 5. pf typ Output Voltage High, VOH 2. V min Output Voltage Low, VOL.8 V max Rev. B Page 3 of 22

4 Enhanced Product Parameter DYNAMIC CHARACTERISTICS 4 C to 55 C to Unit Test Conditions/Comments ton 4 ns typ RL = 3 Ω, CL = 35 pf ns max VS = V, see Figure 44 toff 4 ns typ RL = 3 Ω, CL = 35 pf ns max VS = V, see Figure ns min VS = VS2 = V, see Figure 44 Overvoltage Response Time, tresponse 46 ns typ RL = kω, CL = 2 pf, see Figure ns max Overvoltage Recovery Time, trecovery 72 ns typ RL = kω, CL = 2 pf, see Figure ns max Interrupt Flag Response Time, tdigresp 85 5 ns typ CL = pf, see Figure 4 Interrupt Flag Recovery Time, tdigrec 6 85 µs typ CL = pf, see Figure 42 6 ns typ CL = pf, RPULLUP = kω, see Figure 43 Charge Injection, QINJ 68 pc typ VS = V, RS = Ω, CL = nf, see Figure 45 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 33 Channel-to-Channel Crosstalk 9 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 34 Total Harmonic Distortion Plus Noise, THD + N.5 % typ RL = kω, VS = 5 V p-p, f = 2 Hz to 2 khz, see Figure 38 3 db Bandwidth 27 MHz typ RL = 5 Ω, CL = 5 pf, see Figure 37 Insertion Loss.72 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 37 CS (Off ) 3 pf typ VS = V, f = MHz CD (Off ) 2 pf typ VS = V, f = MHz CD (On), CS (On) 24 pf typ VS = V, f = MHz POWER REQUIREMENTS VDD = 6.5 V, VSS = 6.5 V, = V, digital inputs = V, 5 V, or VDD Normal Mode IDD.9 ma typ.2.3 ma max I.4 ma typ.55.6 ma max ISS.5 ma typ.65.7 ma max Fault Mode VS = ±55 V IDD.2 ma typ.6.8 ma max I.8 ma typ.. ma max ISS.5 ma typ..8 ma max VDD/VSS ±5 V min = V ±22 V max = V Guaranteed by design; not subject to production test. Rev. B Page 4 of 22

5 Enhanced Product ±2 V DUAL SUPPLY VDD = 2 V ± %, VSS = 2 V ± %, = V, CDECOUPLING =. µf, unless otherwise noted. Table 2. Parameter 4 C to 55 C to Unit Test Conditions/Comments ANALOG SWITCH VDD = 8 V, VSS = 8 V, see Figure 3 Analog Signal Range VDD to VSS V On Resistance, RON Ω typ VS = ±5 V, IS = ma Ω max 9.5 Ω typ VS = ±3.5 V, IS = ma Ω max On-Resistance Match Between Channels, RON.5 Ω typ VS = ±5 V, IS = ma Ω max.5 Ω typ VS = ±3.5 V, IS = ma Ω max On-Resistance Flatness, RFLAT(ON). Ω typ VS = ±5 V, IS = ma Ω max. Ω typ VS = ±3.5 V, IS = ma Ω max Threshold Voltage, VT.7 V typ See Figure 26 LEAKAGE CURRENTS VDD = 22 V, VSS = 22 V Source Off Leakage, IS (Off ) ±. na typ VS = ±5 V, VD = 5 V, see Figure 3 ±.5 ±5. ±2. na max Drain Off Leakage, ID (Off ) ±. na typ VS = ±5 V, VD = 5 V, see Figure 3 ±.5 ±5. ±8. na max Channel On Leakage, ID (On), IS (On) ±.3 na typ VS = VD = ±5 V, see Figure 32 ±.5 ±2. ±4.5 na max FAULT Source Leakage Current, IS With Overvoltage ±78 µa typ VDD = 22 V, VSS = 22 V, = V, VS = ±55 V, see Figure 35 Power Supplies Grounded or Floating ±4 µa typ VDD = V or floating, VSS = V or floating, = V, INx = V or floating, VS = ±55 V, see Figure 36 Drain Leakage Current, ID With Overvoltage ±5. na typ VDD = +22 V, VSS = 22 V, = V, VS = ±55 V, see Figure 35 ±. ±. ±. µa max Power Supplies Grounded ± na typ VDD = V, VSS = V, = V, VS = ±55 V, INx = V, see Figure 36 ±3 ±5 ± na max Power Supplies Floating ± ± ± µa typ VDD = floating, VSS = floating, = V, VS = ±55 V, INx = V, see Figure 36 DIGITAL INPUTS Input Voltage High, VINH 2. V min Input Voltage Low, VINL.8 V max Input Current, IINL or IINH.7 µa typ VIN = V or VDD.2 µa max Digital Input Capacitance, CIN 5. pf typ Output Voltage High, VOH 2. V min Output Voltage Low, VOL.8 V max Rev. B Page 5 of 22

6 Enhanced Product Parameter DYNAMIC CHARACTERISTICS 4 C to 55 C to Unit Test Conditions/Comments ton 4 ns typ RL = 3 Ω, CL = 35 pf ns max VS = V, see Figure 44 toff 45 ns typ RL = 3 Ω, CL = 35 pf ns max VS = V, see Figure 44 2 ns min VS = VS2 = V, see Figure 44 Overvoltage Response Time, tresponse 37 ns typ RL = kω, CL = 2 pf, see Figure ns max Overvoltage Recovery Time, trecovery 84 ns typ RL = kω, CL = 2 pf, see Figure ns max Interrupt Flag Response Time, tdigresp 85 5 ns typ CL = pf, see Figure 4 Interrupt Flag Recovery Time, tdigrec 6 85 µs typ CL = pf, see Figure 42 6 ns typ CL = pf, RPULLUP = kω, see Figure 43 Charge Injection, QINJ 64 pc typ VS = V, RS = Ω, CL = nf, see Figure 45 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 33 Channel-to-Channel Crosstalk 9 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 34 Total Harmonic Distortion Plus Noise, THD + N. % typ RL = kω, VS = 2 V p-p, f = 2 Hz to 2 khz, see Figure 38 3 db Bandwidth 27 MHz typ RL = 5 Ω, CL = 5 pf, see Figure 37 Insertion Loss.73 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 37 CS (Off ) 2 pf typ VS = V, f = MHz CD (Off ) pf typ VS = V, f = MHz CD (On), CS (On) 23 pf typ VS = V, f = MHz POWER REQUIREMENTS VDD = 22 V, VSS = 22 V, digital inputs = V, 5 V, or VDD Normal Mode IDD.9 ma typ.2.3 ma max I.4 ma typ.55.6 ma max ISS.5 ma typ.65.7 ma max Fault Mode VS = ±55 V IDD.2 ma typ.6.8 ma max I.8 ma typ.. ma max ISS.5 ma typ..8 ma max VDD/VSS ±5 V min = V ±22 V max = V Guaranteed by design; not subject to production test. Rev. B Page 6 of 22

7 Enhanced Product 2 INGLE SUPPLY VDD = 2 V ± %, VSS = V, = V, CDECOUPLING =. µf, unless otherwise noted. Table 3. Parameter 4 C to Rev. B Page 7 of C to Unit Test Conditions/Comments ANALOG SWITCH VDD =.8 V, VSS = V, see Figure 3 Analog Signal Range V to VDD V On Resistance, RON 22 Ω typ VS = V to V, IS = ma Ω max Ω typ VS = 3.5 V to 8.5 V, IS = ma Ω max On-Resistance Match Between Channels, RON.5 Ω typ VS = V to V, IS = ma Ω max.5 Ω typ VS = 3.5 V to 8.5 V, IS = ma Ω max On-Resistance Flatness, RFLAT(ON) 2.5 Ω typ VS = V to V, IS = ma Ω max.6 Ω typ VS = 3.5 V to 8.5 V, IS = ma.9..3 Ω max Threshold Voltage, VT.7 V typ See Figure 26 LEAKAGE CURRENTS VDD = 3.2 V, VSS = V Source Off Leakage, IS (Off ) ±. na typ VS = V/ V, VD = V/ V, see Figure 3 ±.5 ±5. ±2. na max Drain Off Leakage, ID (Off ) ±. na typ VS = V/ V, VD = V/ V, see Figure 3 ±.5 ±5. ±8. na max Channel On Leakage, ID (On), IS (On) ±.3 na typ VS = VD = V/ V, see Figure 32 ±.5 ±2. ±4.5 na max FAULT Source Leakage Current, IS With Overvoltage ±78 µa typ VDD = 3.2 V, VSS = V, = V, VS = ±55 V, see Figure 35 Power Supplies Grounded or Floating ±4 µa typ VDD = V or floating, VSS = V or floating, = V, INx = V or floating, VS = ±55 V, see Figure 36 Drain Leakage Current, ID With Overvoltage ±2. na typ VDD = 3.2 V, VSS = V or floating, = V, VS = ±55 V, see Figure 35 ±2 ±3 ±65 na max Power Supplies Grounded ± na typ VDD = V, VSS = V, = V, VS = ±55 V, INx = V, see Figure 36 ±3 ±5 ± na max Power Supplies Floating ± ± ± µa typ VDD = floating, VSS = floating, = V, VS = ±55 V, INx = V, see Figure 36 DIGITAL INPUTS Input Voltage High, VINH 2. V min Input Voltage Low, VINL.8 V max Input Current, IINL or IINH.7 µa typ VIN = V or VDD.2 µa max Digital Input Capacitance, CIN 5. pf typ Output Voltage High, VOH 2. V min Output Voltage Low, VOL.8 V max

8 Enhanced Product Parameter DYNAMIC CHARACTERISTICS 4 C to 55 C to Unit Test Conditions/Comments ton 4 ns typ RL = 3 Ω, CL = 35 pf ns max VS = 8 V, see Figure 44 toff 375 ns typ RL = 3 Ω, CL = 35 pf ns max VS = 8 V, see Figure 44 7 ns min VS = VS2 = 8 V, see Figure 44 Overvoltage Response Time, tresponse 56 ns typ RL = kω, CL = 2 pf, see Figure ns max Overvoltage Recovery Time, trecovery 64 ns typ RL = kω, CL = 2 pf, see Figure ns max Interrupt Flag Response Time, tdigresp 85 5 ns typ CL = pf, see Figure 4 Interrupt Flag Recovery Time, tdigrec 6 85 µs typ CL = pf, see Figure 42 6 ns typ CL = pf, RPULLUP = kω, see Figure 43 Charge Injection, QINJ 34 pc typ VS = 6 V, RS = Ω, CL = nf, see Figure 45 Off Isolation 65 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 33 Channel-to-Channel Crosstalk 9 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 34 Total Harmonic Distortion Plus Noise, THD + N.7 % typ RL = kω, VS = 6 V p-p, f = 2 Hz to 2 khz, see Figure 38 3 db Bandwidth 27 MHz typ RL = 5 Ω, CL = 5 pf, see Figure 37 Insertion Loss.74 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 37 CS (Off ) 6 pf typ VS = 6 V, f = MHz CD (Off ) 5 pf typ VS = 6 V, f = MHz CD (On), CS (On) 25 pf typ VS = 6 V, f = MHz POWER REQUIREMENTS VDD = 3.2 V, VSS = V, digital inputs = V, 5 V, or VDD Normal Mode IDD.9 ma typ.2.3 ma max I.4 ma typ.55.6 ma max ISS.5 ma typ.65.7 ma max Fault Mode VS = ±55 V IDD.2 ma typ.6.8 ma max I.8 ma typ.. ma max ISS.5 ma typ Digital inputs = 5 V..8 ma max VS = ±55 V, VD = V VDD 8 V min = V 44 V max = V Guaranteed by design; not subject to production test. Rev. B Page 8 of 22

9 Enhanced Product 36 INGLE SUPPLY VDD = 36 V ± %, VSS = V, = V, CDECOUPLING =. µf, unless otherwise noted. Table 4. Parameter 4 C to 55 C to Unit Test Conditions/Comments ANALOG SWITCH VDD = 32.4 V, VSS = V, see Figure 3 Analog Signal Range V to VDD V On Resistance, RON 22 Ω typ VS = V to 3 V, IS = ma Ω max Ω typ VS = 4.5 V to 28 V, IS = ma Ω max On-Resistance Match Between Channels, RON.5 Ω typ VS = V to 3 V, IS = ma Ω max.5 Ω typ VS = 4.5 V to 28 V, IS = ma Ω max On-Resistance Flatness, RFLAT(ON) 2.5 Ω typ VS = V to 3 V, IS = ma Ω max. Ω typ VS = 4.5 V to 28 V, IS = ma Ω max Threshold Voltage, VT.7 V typ See Figure 26 LEAKAGE CURRENTS VDD =39.6 V, VSS = V Source Off Leakage, IS (Off ) ±. na typ VS = V/3 V, VD = 3 V/ V, see Figure 3 ±.5 ±5. ±2. na max Drain Off Leakage, ID (Off ) ±. na typ VS = V/3 V, VD = 3 V/ V, see Figure 3 ±.5 ±5. ±8. na max Channel On Leakage, ID (On), IS (On) ±.3 na typ VS = VD = V/3 V, see Figure 32 ±.5 ±2. ±4.5 na max FAULT Source Leakage Current, IS With Overvoltage ±78 µa typ VDD = 39.6 V, VSS = V, = V, VS = +55 V, 4 V, see Figure 35 Power Supplies Grounded or Floating ±4 µa typ VDD = V or floating, VSS = V or floating, = V, INx = V or floating, VS = +55 V, 4 V, see Figure 36 Drain Leakage Current, ID With Overvoltage ±2. na typ VDD = 39.6 V, VSS = V or floating, = V, VS = +55 V, 4 V, see Figure 35 ±2 ±3 ±65 na max Power Supplies Grounded ± na typ VDD = V, VSS = V, = V, VS = +55 V, 4 V, INx = V, see Figure 36 ±3 ±5 ± na max Power Supplies Floating ± ± ± µa typ VDD = floating, VSS = floating, = V, VS = +55 V, 4 V, INx = V, see Figure 36 DIGITAL INPUTS Input Voltage High, VINH 2. V min Input Voltage Low, VINL.8 V max Input Current, IINL or IINH.7 µa typ VIN = V or VDD.2 µa max Digital Input Capacitance, CIN 5. pf typ Output Voltage High, VOH 2. V min Output Voltage Low, VOL.8 V max Rev. B Page 9 of 22

10 Enhanced Product Parameter DYNAMIC CHARACTERISTICS 4 C to 55 C to Unit Test Conditions/Comments ton 4 ns typ RL = 3 Ω, CL = 35 pf ns max VS = 8 V, see Figure 44 toff 375 ns typ RL = 3 Ω, CL = 35 pf ns max VS = 8 V, see Figure ns min VS = VS2 = 8 V, see Figure 44 Overvoltage Response Time, tresponse 25 ns typ RL = kω, CL = 2 pf, see Figure ns max Overvoltage Recovery Time, trecovery 5 ns typ RL = kω, CL = 2 pf, see Figure ns max Interrupt Flag Response Time, tdigresp 85 5 ns typ CL = pf, see Figure 4 Interrupt Flag Recovery Time, tdigrec 6 85 µs typ CL = pf, see Figure 42 6 ns typ CL = pf, RPULLUP = kω, see Figure 43 Charge Injection, QINJ 6 pc typ VS = 8 V, RS = Ω, CL = nf, see Figure 45 Off Isolation 7 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 33 Channel-to-Channel Crosstalk 9 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 34 Total Harmonic Distortion Plus Noise, THD + N. % typ RL = kω, VS = 8 V p-p, f = 2 Hz to 2 khz, see Figure 38 3 db Bandwidth 27 MHz typ RL = 5 Ω, CL = 5 pf, see Figure 37 Insertion Loss.75 db typ RL = 5 Ω, CL = 5 pf, f = MHz, see Figure 37 CS (Off ) 2 pf typ VS = 8 V, f = MHz CD (Off ) pf typ VS = 8 V, f = MHz CD (On), CS (On) 23 pf typ VS = 8 V, f = MHz POWER REQUIREMENTS VDD = 39.6 V, VSS = V, digital inputs = V, 5 V, or VDD Normal Mode IDD.9 ma typ.2.3 ma max I.4 ma typ.55.6 ma max ISS.5 ma typ.65.7 ma max Fault Mode VS = +55 V, 4 V IDD.2 ma typ.6.8 ma max I.8 ma typ.. ma max ISS.5 ma typ..8 ma max VDD 8 V min = V 44 V max = V Guaranteed by design; not subject to production test. Rev. B Page of 22

11 Enhanced Product CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx Table 5. Parameter 25 C 85 C 25 C Unit Test Conditions/Comments 6-LEAD TSSOP θja = 2.6 C/W ma max VS = VSS V to VDD 4.5 V ma max VS = VSS to VDD Rev. B Page of 22

12 ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted. Table 6. Parameter Rating VDD to VSS 48 V VDD to.3 V to +48 V VSS to 48 V to +.3 V Sx Pins to 55 V to +55 V Sx to VDD or VSS 8 V VS to VD 8 V Dx Pins VSS.7 V to VDD +.7 V or 3 ma, whichever occurs first Digital Inputs.3 V to +48 V Peak Current, Sx or Dx Pins 288 ma (pulsed at ms, % duty cycle maximum) Continuous Current, Sx or Dx Pins Data 2 + 5% Digital Output.3 V to 6 V or 3 ma, whichever occurs first Operating Temperature Range 55 C to Storage Temperature Range 65 C to +5 C Junction Temperature 5 C Thermal Impedance, θja 6-Lead TSSOP, θja Thermal 2.6 C/W Impedance (4-Layer Board) Reflow Soldering Peak As per JEDEC J-STD-2 Temperature, Pb Free ESD (HBM: ANSI/ESD STM5.-27) Input/Output Port to Supplies 5.5 kv Input/Output Port to 5.5 kv Input/Output Port All Other Pins 5.5 kv Overvoltages at the Dx pins are clamped by internal diodes. Limit current to the maximum ratings given. 2 See Table 5. Enhanced Product Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. ESD CAUTION Rev. B Page 2 of 22

13 Enhanced Product PIN CONFIGURATION AND FUNCTION DESCRIPTIONS IN 6 IN2 D 2 5 D2 S S TOP VIEW (Not to Scale) S2 FF S3 D4 7 D3 IN4 8 9 IN Figure 2. Pin Configuration Table 7. Pin Function Descriptions Pin No. Mnemonic Description IN Logic Control Input. 2 D Drain Terminal. This pin can be an input or an output. 3 S Overvoltage Protected Source Terminal. This pin can be an input or an output. 4 VSS Most Negative Power Supply Potential. 5 Ground ( V) Reference. 6 S4 Overvoltage Protected Source Terminal. This pin can be an input or an output. 7 D4 Drain Terminal. This pin can be an input or an output. 8 IN4 Logic Control Input. 9 IN3 Logic Control Input. D3 Drain Terminal. This pin can be an input or an output. S3 Overvoltage Protected Source Terminal. This pin can be an input or an output. 2 FF Fault Flag Digital Output. This pin has a high output when the device is in normal operation or a low output when a fault condition occurs on any of the Sx inputs. 3 VDD Most Positive Power Supply Potential. 4 S2 Overvoltage Protected Source Terminal. This pin can be an input or an output. 5 D2 Drain Terminal. This pin can be an input or an output. 6 IN2 Logic Control Input. Table 8. Truth Table INx Switch Condition (S to S4) On Off Rev. B Page 3 of 22

14 Enhanced Product TYPICAL PERFORMANCE CHARACTERISTICS ON RESISTANCE (Ω) = +22V = 22V = +2V = 2V = +8V = 8V = +3.5V = 3.5V T A = 25 C = +6.5V = 6.5V ON RESISTANCE (Ω) = +5V = 5V 5 = +5V = 5V 5 4 C 55 C , V D (V) Figure 3. RON as a Function of VS, VD (Dual Supply) , V D (V) Figure 6. RON as a Function of VS, VD for Different Temperatures, ±5 V Dual Supply ON RESISTANCE (Ω) =.8V = V = 2V = V T A = 25 C = 3.2V = V ON RESISTANCE (Ω) C 55 C = +2V = 2V , V D (V) , V D (V) Figure 4. RON as a Function of VS, VD (2 ingle Supply) Figure 7. RON as a Function of VS, VD for Different Temperatures, ±2 V Dual Supply 25 T A = 25 C 4 35 = 2V = V ON RESISTANCE (Ω) 2 5 = 32.4V = V = 36V = V ON RESISTANCE (Ω) = 39.6V = V 5 4 C 55 C , V D (V) Figure 5. RON as a Function of VS, VD (36 ingle Supply) , V D (V) Figure 8. RON as a Function of VS, VD for Different Temperatures, 2 ingle Supply Rev. B Page 4 of 22

15 Enhanced Product ON RESISTANCE (Ω) C 55 C = 36V = V , V D (V) Figure 9. RON as a Function of VS, VD for Different Temperatures, 36 ingle Supply 275- LEAKAGE CURRENT (na) 2 3 = 2V = V V BIAS = V/V 4 I S (OFF) + I D (OFF) + I S (OFF) + I D (OFF) + I S, I D (ON) + + I S, I D (ON) TEMPERATURE ( C) Figure 2. Leakage Current vs. Temperature, 2 ingle Supply LEAKAGE CURRENT (na) = +5V = 5V V BIAS = +V/ V 6 I S (OFF) + I D (OFF) + 7 I S (OFF) + I D (OFF) + I S, I D (ON) + + I S, I D (ON) TEMPERATURE ( C) Figure. Leakage Current vs. Temperature, ±5 V Dual Supply 275- LEAKAGE CURRENT (na) = 36V = V V BIAS = V/3V 8 I S (OFF) + I D (OFF) + I S (OFF) + I D (OFF) + I S, I D (ON) + + I S, I D (ON) TEMPERATURE ( C) Figure 3. Leakage Current vs. Temperature, 36 ingle Supply LEAKAGE CURRENT (na) = +2V = 2V V BIAS = +5V/ 5V 8 I S (OFF) + I D (OFF) + I S (OFF) + I D (OFF) + I S, I D (ON) + + I S, I D (ON) TEMPERATURE ( C) Figure. Leakage Current vs. Temperature, ±2 V Dual Supply LEAKAGE CURRENT (na) 5 5 = +5V = 5V 5 = 3V = 55V = +3V = +55V TEMPERATURE ( C) Figure 4. Overvoltage Leakage Current vs. Temperature, ±5 V Dual Supply Rev. B Page 5 of 22

16 Enhanced Product 5 = +2V = 2V 2 = +5V = 5V T A = 25 C LEAKAGE CURRENT (na) 5 5 = 3V 2 = 55V = +3V = +55V TEMPERATURE ( C) Figure 5. Overvoltage Leakage Current vs. Temperature, ±2 V Dual Supply OFF ISOLATION (db) k k k M M M G FREQUENCY (Hz) Figure 8. Off Isolation vs. Frequency, ±5 V Dual Supply = 2V = V 2 = +5V = 5V T A = 25 C LEAKAGE CURRENT (na) = 3V 4 = 55V = +3V = +55V TEMPERATURE ( C) Figure 6. Overvoltage Leakage Current vs. Temperature, 2 ingle Supply CROSSTALK (db) k k M M FREQUENCY (Hz) M Figure 9. Crosstalk vs. Frequency, ±5 V Dual Supply G = 36V = V 8 7 T A = 25 C LEAKAGE CURRENT (na) = 38V V 2 S = 4V = +38V = +55V TEMPERATURE ( C) Figure 7. Overvoltage Leakage Current vs. Temperature, 36 ingle Supply CHARGE INJECTION (pc) = 2V = V = 36V = V (V) Figure 2. Charge Injection vs. Source Voltage (VS), Single Supply Rev. B Page 6 of 22

17 Enhanced Product CHARGE INJECTION (pc) T A = 25 C = +5V = 5V = +2V = 2V BANDWIDTH (db) = +5V = 5V T A = 25 C (V) Figure 2. Charge Injection vs. Source Voltage (VS), Dual Supply k k M M M G FREQUENCY (Hz) Figure 24. Bandwidth vs. Frequency, ±5 V Dual Supply = +5V = 5V T A = 25 C WITH DECOUPLING CAPACITORS ACPSRR (db) k k M M M FREQUENCY (Hz) Figure 22. ACPSRR vs. Frequency, ±5 V Dual Supply G TIME (ns) t ON (2V) t ON (36V) t ON (±5V) 36 t ON (±2V) t OFF (2V) 34 t OFF (36V) t OFF (±5V) t OFF (±2V) TEMPERATURE ( C) Figure 25. ton, toff Times vs. Temperature LOAD = kω T A = 25 C.9 THD + N (%).5..5 = 2V, = V, = 6V p-p = 5V, = 5V, = 5V p-p = 2V, = 2V, = 2V p-p THRESHOLD VOLTAGE, V T (V) = 36V, = V, = 8V p-p FREQUENCY (Hz) Figure 23. THD + N vs. Frequency TEMPERATURE ( C) Figure 26. Threshold Voltage (VT) vs. Temperature Rev. B Page 7 of 22

18 Enhanced Product T SOURCE 24 2 T A = 25 C = +V = V 2 DRAIN SIGNAL VOLTAGE (V p-p) DISTORTIONLESS OPERATING REGION CH 5.V CH3 5.V CH2 5.V M4ns A CH2.V T.ns Figure 27. Drain Output Response to Positive Overvoltage FREQUENCY (MHz) Figure 29. Large Signal Voltage Tracking vs. Frequency DRAIN SOURCE CH 5.V CH2 5.V M4ns A CH2 4.7V CH3 5.V T.ns Figure 28. Drain Output Response to Negative Overvoltage Rev. B Page 8 of 22

19 Enhanced Product TEST CIRCUITS V Sx Dx I S A Sx Dx I D A R ON = V/I DS I DS > OR R L kω Figure 3. On Resistance Figure 35. Switch Overvoltage Leakage = = = V I S (OFF) A Sx Dx I D (OFF) A I S A Sx Dx I D A V D R L kω Figure 3. Off Leakage Figure 36. Switch Unpowered Leakage NC Sx Dx I D (ON) A DD.µFV.µF NC = NO CONNECT V D NETWORK ANALYZER Figure 32. On Leakage INx Sx 5Ω DD.µFV.µF V IN Dx R L 5Ω V OUT INx V IN Sx Dx 5Ω NETWORK ANALYZER 5Ω R L 5Ω V OUT DD.µFV.µF V OUT WITH SWITCH INSERTION LOSS = 2 log V OUT WITHOUT SWITCH Figure 37. Bandwidth Figure 33. Off Isolation OFF ISOLATION = 2 log V OUT INx Sx AUDIO PRECISION R S V p-p R L 5Ω DD.µFV.µF Dx S S2 NETWORK ANALYZER R L 5Ω V OUT V IN Dx R L kω Figure 38. THD + N V OUT CHANNEL-TO-CHANNEL CROSSTALK = 2 log V OUT Figure 34. Channel-to-Channel Crosstalk Rev. B Page 9 of 22

20 Enhanced Product.µF.µF +.5V SOURCE VOLTAGE ( ) V S D C L * 2pF V D R L kω t RESPONSE.9V OUTPUT (V D ) S2 TO S4 V *INCLUDES TRACK CAPACITANCE Figure 39. Overvoltage Response Time, tresponse µF.µF +.5V SOURCE VOLTAGE ( ) V S D C L * 2pF V D R L kω t RECOVERY OUTPUT (V D ) V V S2 TO S4 *INCLUDES TRACK CAPACITANCE Figure 4. Overvoltage Recovery Time, trecovery µF.µF +.5V SOURCE VOLTAGE ( ) V S D S2 TO S4 t DIGRESP OUTPUT (V FF ) FF C L * 2pF V.V OUT *INCLUDES TRACK CAPACITANCE Figure 4. Interrupt Flag Response Time, tdigresp Rev. B Page 2 of 22

21 Enhanced Product.µF.µF +.5V SOURCE VOLTAGE ( ) V S D S2 TO S4 t DIGREC.9V OUT FF C L * 2pF OUTPUT (V FF ) V *INCLUDES TRACK CAPACITANCE Figure 42. Interrupt Flag Recovery Time, tdigrec.µf.µf +.5V SOURCE VOLTAGE ( ) V 5V OUTPUT (V FF ) t DIGREC 3V S D S2 TO S4 FF 5V C L * 2pF R PULLUP kω OUTPUT V *INCLUDES TRACK CAPACITANCE Figure 43. Interrupt Flag Recovery Time, tdigrec, with a kω Pull-Up Resistor DD.µFV.µF V IN 5% 5% Sx Dx V OUT INx R L 3Ω C L 35pF V OUT t ON 9% t OFF % Figure 44. Switching Times, ton and toff.µf.µf R S Sx Dx V OUT V IN OFF ON INx C L nf V OUT Q INJ = C L ΔV OUT ΔV OUT Figure 45. Charge Injection, QINJ Rev. B Page 2 of 22

22 Enhanced Product OUTLINE DIMENSIONS BSC PIN.65 BSC.3.9 COPLANARITY..2 MAX SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-53-AB Figure Lead Thin Shrink Small Outline Package [TSSOP] (RU-6) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option ADG542FTRUZ-EP 55 C to 6-Lead Thin Shrink Small Outline Package [TSSOP] RU-6 ADG542FTRUZ-EP-R7 55 C to 6-Lead Thin Shrink Small Outline Package [TSSOP] RU-6 Z = RoHS Compliant Part Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D275--/7(B) Rev. B Page 22 of 22

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