: PNPN DB3 : MCRB25D MCRB25M MCRB25N MCRB25H. Pin Polarity Circuit Diagram TO-220F, TO-220AB, TO-263 (D 2 PAK)
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- Evelyn Copeland
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1 Designed primarily for half wave ac control applications, such asmotor controls, heating controls, and power supplies; or whereverhalf wave, silicon gate controlled devices are needed. Blocking Voltage to VV On-State Current Rating of Amperes RMS igh Surge Current Capability3A Rugged, Economical TO AB Package Glass Passivated Junctions for Reliability and Uniformity Minimum and Maximum Values of I GT, V GT, and I Specified forease of Design igh Immunity to dv/dtv/sec : PNPN DB3 : / BT-RBT-RMCRMMCRNMCR6MMCR6N TYN6TYN8TYNTYN66TYN86TYN6TYN6 TYN6TYNTYNTYN6TYN8TYNTYN S6SSCPC6A Product Model Reference & Naming A V 6V V V V I GT TO-F F MCRFD MCRFM MCRFN MCRF MCRFG TO-AB MCRD MCRM MCRN MCR MCRG 3mA TO-63 B MCRBD MCRBM MCRBN MCRB MCRBG Remarks () PINNING: Insulated Package Pin in Symbol and Description TO-F, TO-AB, TO-63 (D PAK) 3 K A G Cathode Anode Gate - Pin Polarity Circuit Diagram TO-F TO-AB 3 G (3) D PAK TO-63 Tab A () K () MCR N AOAI ELECTRONICS CO.,LTD. SCR Microelectronics SCR F: TO-F P: TO-AB P: No letters in TO-AB B: TO-63 B: (D PAK) 8=8A =A =A 6=6A =A =A D=V M=6V N=V =V G=V 7 kkg@kkg.com.cn AOAI ELECTRONICS CO., LTD. MCR_Series SCRs
2 ABSOLUTE RATINGs (Limiting Values) SYMBOL Paramenter & Test Conditions Value Unit I T(RMS) On-State RMS Current ( Conduction Angles, T C =) I TSM Peak Non-Repetitive Surge Current (½ Cycle, Sine Wave) (6z, T j =) 3 A I GM Forward Peak Gate Current (Pulse WidthμS, T C =). I t Circuit Fusing Consideration (t=8.3ms) 373 Ases P GM P G(AV) Forward Peak Gate Power (Pulse WidthμS, T C =) Forward Average Gate Power (t=8.3ms, T C =). W V DRM V RRM Peak Repetitive OffState Voltage (T j =, Sine Wave, ~6z; Gate Open)See Reference Feature Description ~ V T j Operating Range -~+ T stg Storage Temperature Range -~+ T L Maximum Lead Temperature for Soldering Purposes /8,from Case for Seconds 6 V DRM and V RRM for all types can be applied on a continuous basis. Ratingsapply for zero or negative gate voltage; positive gate voltage shall not beapplied concurrent with negative potential on the anode. Blocking voltagesshall not be tested with a constant current source such that the voltageratings of the devices are exceeded. ELECTRICAL CARACTERISTICs (Tj= Unless Otherwise Noted) SYMBOL Paramenter & Test Conditions Min Typ Max Unit I GT V D =V, R L = ( T j =) 3 I olding Current (I T =ma, V D =V DC ) Gate Open 3 I L Latching Current (V D =V, I G =3mA) T C = 3 ma I DRM I RRM Peak Repetitive Forward or Reverse Blocking Current (V AK =Rated V DRM or V RRM, Gate Open) T j = T j =.. V GT V TM Gate Trigger Voltage (V D =V, R L =, T j =) Peak Forward On-State Voltage (I TM =A T j =) V DYNAMIC CARACTERISTICS SYMBOL Paramenter & Test Conditions Min Typ Max Unit Critical Rate of Rise of Off State Voltage dv/dt (V D =67% of Rated V DRM, Exponential Waveform, Gate Open, T J =) V/μs di/dt Critical Rate of Rise of On State Current (I PK =A, P W =3sec, dig/dt=a/sec, I GT =ma) A/μs R th(j-c) Thermal ResistanceJunctiontoCase R th(j-a) Thermal ResistanceJunctiontoAmbient. 6. /W Indicates Pulse Test: Pulse Width. ms, Duty Cycle %. R GK = included in measurement. Does not include R GK in measurement. AOAI ELECTRONICS CO., LTD. 7 kkg@kkg.com.cn MCR_Series SCRs
3 Voltage Current Characteristic of SCR Voltage Current Characteristic of SCR + Current Anode + Symbol VDRM IDRM VRRM IRRM VTM I Parameter Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak On State Voltage olding Current IRRM at VRRM on state Reverse Blocking Region (off state) Reverse Avalanche Region VTM I + Voltage IDRM at VDRM Forward Blocking Region (off state) Anode., GATE TRIGGER CURRENT (ma) I GT Figure. Typical Gate Trigger Current versus, GATE TRIGGER VOLTAGE (V) V GT Figure. Typical Gate Trigger Voltage versus AOAI ELECTRONICS CO., LTD. 37 kkg@kkg.com.cn MCR_Series SCRs
4 IT, INSTANTANEOUS ON STATE CURRENT (A) C C C Z R R(t) JC(t) JC VT, INSTANTANEOUS ON STATE VOLTAGE (VOLTS) t, TIME (ms) Figure 3. Typical On State Characteristics Figure. Transient Thermal Response R(t) TRANSIENT TERMAL R (NORMALIZED), OLDING CURRENT (ma), LATCING CURRENT (ma) I I L Figure. Typical olding Current versus Figure 6. Typical Latching Current versus, CASE TEMPERATURE ( C) T C 3 9 = = Conduction Angle 6 IT(RMS), RMS ON STATE CURRENT (AMPS) 8 dc, AVERAGE POWER DISSIPATION (WATTS) P (AV) = Conduction Angle = IT(AV), AVERAGE ON STATE CURRENT (AMPS) 6 8 dc Figure 7. Typical RMS Current Derating Figure 8. On State Power Dissipation 7 kkg@kkg.com.cn AOAI ELECTRONICS CO., LTD. MCR_Series SCRs
5 PACKAGE MECANICAL DATA mm & inch TO-AB PACKAGE DIMENSIONS Marking Dimensions REF Millimeters Inches Min. Max. Min. Max. A B C C C D E F G L 3..6 L L XXXXX X KKG aabb : AOAI XXXXXXXXXX: Part Number KKG: Registered trademark aa: Year bb: Week (~3) LOGO in The upper left corner mark : XXXXXXXXXX: KKG: aa: bb: (~3) LOGO TO-F PACKAGE DIMENSIONS Marking Dimensions REF Millimeters Inches Min. Max. Min. Max. A B C C C D E F G L 3.63 TYP.3 L L3 3.3 TYP.3 V XXXXXX KKG aabb : AOAI XXXXXXXXXX: Part Number KKG: Registered trademark aa: Year bb: Week (~3) LOGO in The upper left corner mark : XXXXXXXXXX: KKG: aa: bb: (~3) LOGO Packaging Specifications() TO-AB TO-F REF. Tube. BOX Carton Tube. BOX Carton QTY Pcs, Pcs, Pcs Pcs, Pcs, Pcs 7 kkg@kkg.com.cn AOAI ELECTRONICS CO., LTD. MCR_Series SCRs
6 PACKAGE DIMENSIONS TO-63D PAKPACKAGE INFORMATIONTO-63: mm.3 max. max. max max... (x).8 max (x) XXXXXX KKG aabb Packaging Specifications TO-63 D PAK (Pcs/Tub, Kpcs/BOX, Kpcs/Carton) (Pcs/Reel, 8Kpcs/Carton) 67 kkg@kkg.com.cn AOAI ELECTRONICS CO., LTD. MCR_Series SCRs
7 Manufacturers version information 6-7- KKG Product Data-. -- KKG Product Data KKG Product Data-. KKG WARN, Letters, patterns, are officially registered my trademark counterfeiting, theft are all violations, violators will be held liable! SENZEN AOAI ELECTRONICS CO., LTD. TEL: TEL: FAX: : AOAI ELECTRONICS CO., LTD. MCR_Series SCRs
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