FPP POINT PROBE SOP

Transcription

1 FPP-5000 Versin 1.0 2/20/2015 Page 1 f 9 FPP POINT PROBE SOP The VEECO FPP pint prbe simplifies the measurement f resistive prperties f semicnductr wafers and resistive films. The micrprcessr based electrnics permits direct cmputatin f V/I, sheet r slice resistivity, and metallizatin thickness and P-N type testing. Unlike mst fur pint prbes and prbing statins, which mve the prbe head int the wafer, the FPP-5000 is designed s that the wafer is mved int the prbe head. This insures cnstant prbe frce independent f peratr frce and wafer thickness. Requirements befre use 1. T sign up fr training g n the NRF website. 2. Check-ut platen (Figure 5), wafer hlder (Figure 5), and hand held prbe (Figure 7) at the receptin desk.

2 FPP-5000 Versin 1.0 2/20/2015 Page 2 f 9 Keybard Descriptin: V/I - Displays measured V/I multiplied by prgrammed GEOM Cnstant. SHEET - Displays sheet resistance based n measured V/I. SLICE - Calculates the bulk resistivity f a slice f layer whse thickness is entered in the PRGM mde. THICK - Calculates the thickness f a layer f slices whse bulk resistivity is entered in the PRGM mde. TYPE - When selected, a type test is perfrmed. PEN - When selected, a penetrate vltage is applied t the sample. PRGM - Put the keybard int the PRGM mde fr entering bulk resistivity r film thickness. Press STORE afterwards t stre the input int system memry. SELF-TEST - Perfrms a system self-test. RETEST - Perfrms a retest when the previus test failed. CONST - Displays the selected input stred in the memry. NUMERICAL KEYS - T enter the input required fr calculatin. Figure 1

3 FPP-5000 Versin 1.0 2/20/2015 Page 3 f 9 Set up and Sample Lading: 1. Enable tl thrugh TUMI lgin. Pwer switch shuld be in the ON psitin. 2. All display lights shuld be n except FAIL. Figure 2 3. Press CLEAR (will lk like Figure 3 after pressing CLEAR). Figure 3 4. Open lid (Figure 8). 5. Place wafer hlder (2 r 4 ) inside f machine.

4 FPP-5000 Versin 1.0 2/20/2015 Page 4 f 9 Figure 4 6. Place the wafer (shiny side dwn) yu wish t prbe in the apprpriately sized wafer hlder (2 r 4 ). Figure 5 7. Place platen (spiral side dwn) n tp f wafer.

5 FPP-5000 Versin 1.0 2/20/2015 Page 5 f 9 Figure 6 8. Adjust the rear stp by lsening the thumb screw (Figure 8) and mving the psitin f the stp. 9. Select desired measurement mde (see page 8 fr details). 10. Clse the lid and gently press dwn until the measurement is cmplete. Results will be shwn n the display. 11. When finished pen the lid, remve yur wafer and clse lid. 12. Lg ut f TUMI and recrd any malfuctins r cmments. Return checked-ut items back t the receptin desk.

6 FPP-5000 Versin 1.0 2/20/2015 Page 6 f 9 2 platen 2 wafer hlder 4 platen 4 wafer hlder Figure 7 Thumb Screw Put Place Hlder Here Figure 8: Open lid f Main Cnsle

7 FPP-5000 Versin 1.0 2/20/2015 Page 7 f 9 Operating Hand Held Prbe: 1. Cnnect t the prt belw the ON/OFF switch n the left rear f the main cnsle (Figure 10). 2. Sample size must be a minimum f 1 by 1 (See belw fr an exact reference). 3. Gently press dwn n wafer with hand held prbe until measurement is cmplete. Results will be shwn n the display. 4. When finished discnnect frm main cnsle and turn ff machine. Return hand held prbe back t receptinist. *CAN ONLY OPERATE MAIN CONSOLE OR HAND HELD PROBE ONE AT A TIME.* MIN. SIZE REQUIREMENTS TO USE HAND HELD PROBE Cnnect Hand Held Prbe Here Figure 9: Hand Held Prbe Figure 10: Back f Main Cnsle

8 FPP-5000 Versin 1.0 2/20/2015 Page 8 f 9 Operatin Prcedure: A. Measure Resistance V/I (Ohms) Measurement range: 0.25e-3 t 99.9e3 1. Press V/I buttn, light shuld illuminate. 2. Press PRGM buttn. 3. Fr samples with a diameter greater than 2.5 inches enter Depress the PRGM buttn. B. Measure Sheet Resistivity R=ρ/T (Ω/sq) Measurement range: 1.1e-3 t 4.50e5 1. Press SHEET buttn, light shuld illuminate. 2. Press PRGM buttn. 3. Fr samples with a diameter greater than 2.5 inches enter Depress the PRGM buttn. Other Optins fr Testing C. Measure Slice Resistivity ρ=rt (Ω-cm) Measurement range: 4.19e-5 t 17.1e3 Must perfrm Operatin Prcedure A 1 ST 1. Press SLICE buttn, light shuld illuminate. 2. Press PRGM buttn. 3. Enter thickness in angstrm (Å), micrn (µm) r MIL. 4. Press STORE buttn 5. Press PRGM buttn and that is yur answer. D. Measure Thickness Measurement range: metallized thickness up t 2.43e-5 1. Can d this measurement assuming knw resistivity (Must perfrm C 1 st.) 2. Press THICK buttn, light shuld illuminate. 3. Press PRGM. 4. Enter the slice resistance in Ω-cm. 5. Press STORE buttn 6. Press PRGM buttn and that is yur answer. Micrmeters t Mils Cnversin Frmula

9 FPP-5000 Versin 1.0 2/20/2015 Page 9 f 9 Other Optins: 1. P/N; the measurement will als indicate whether the semicnductr is n-type r p-type. 2. PEN; a high vltage (penetratin vltage) is applied t the wafer t break thrugh a thin insulating layer prir t measurement. 3. RETEST; perfrm the same test again withut pening the lid. 4. SELF-TEST; perfrms a self-test. If successful, all lights except FAIL shuld be lit, and indicatr shuld display 888x108. The clear buttn must be pressed t cntinue. 5. CONST; display the prgrammed cnstant. Errr Messages: Pressing Clear can clear mst errr cdes. Errr Cdes E 01 E 02 E 03 E 04 E 05 E 06 E 07 E 21 thru E 40 E 51 thru E 57 Descriptin Retest attempted with prbe interlck pen Prbe interlck is pened while a measurement is in prgress Display expnent ver flw r under flw Stre attempted withut cmpleting entry f the new cnstant in PRGM mde Penetrate switch depressed while penetrate mde internally disabled Nrmal and reverse V/I disagree by mre than 10% Arithmetic errr prduced as a result f a gemetric crrectin measurement Electrnic failure while attempting t make a measurement Self-test errr