RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

Transcription

1 Technical Data RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs Designed primarily for CW large--signal output and driver applications with frequencies up to 450 MHz. Devices are unmatched and are suitable for use in industrial, medical and scientific applications. Typical CW performance at 220 MHz: V DD =50Vdc,I DQ =30mA, P out =10W Power gain 23.9 db Drain efficiency 62% Capable of handling 10:1 50 Vdc, 220 MHz, 10 W CW output power Features Characterized with series equivalent large--signal impedance parameters Qualified up to a maximum of 50 V DD operation Integrated ESD protection 225 C capable plastic package Document Number: MRF6V2010N Rev. 6, 9/2016 MRF6V2010N MRF6V2010NB MRF6V2010GN MHz, 10 W, 50 V LATERAL N -CHANNEL BROADBAND RF POWER MOSFETs TO PLASTIC MRF6V2010N TO PLASTIC MRF6V2010NB TO -270G -2 PLASTIC MRF6V2010GN Gate 2 1 Drain (Top View) Note: Exposed backside of the package is the source terminal for the transistor. Figure 1. Pin Connections , 2010, 2016 NXP B.V. 1

2 Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage V DSS --0.5, +110 Vdc Gate--Source Voltage V GS --0.5, +10 Vdc Storage Temperature Range T stg to +150 C Case Operating Temperature T C 150 C Operating Junction Temperature (1,2) T J 225 C Table 2. Thermal Characteristics Characteristic Symbol Value (2,3) Unit Thermal Resistance, Junction to Case Case Temperature 81 C, 10 W CW R JC 3.0 C/W Table 3. ESD Protection Characteristics Test Methodology Human Body Model (per JESD22--A114) 2 Machine Model (per EIA/JESD22--A115) Charge Device Model (per JESD22--C101) Table 4. Moisture Sensitivity Level Class Test Methodology Rating Package Peak Temperature Unit Per JESD 22--A113, IPC/JEDEC J--STD C Table 5. Electrical Characteristics (T A =25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit A IV Off Characteristics Gate--Source Leakage Current (V GS =5Vdc,V DS =0Vdc) Drain--Source Breakdown Voltage (I D =5mA,V GS =0Vdc) Zero Gate Voltage Drain Leakage Current (V DS =50Vdc,V GS =0Vdc) Zero Gate Voltage Drain Leakage Current (V DS = 100 Vdc, V GS =0Vdc) On Characteristics Gate Threshold Voltage (V DS =10Vdc,I D =28 Adc) Gate Quiescent Voltage (V DD =50Vdc,I D = 30 madc, Measured in Functional Test) Drain--Source On--Voltage (V GS =10Vdc,I D =70mAdc) Dynamic Characteristics Reverse Transfer Capacitance (V DS =50Vdc 30 1 MHz, V GS =0Vdc) Output Capacitance (V DS =50Vdc 30 1 MHz, V GS =0Vdc) Input Capacitance (V DS =50Vdc,V GS =0Vdc 30 1 MHz) I GSS 10 Adc V (BR)DSS 110 Vdc I DSS 50 Adc I DSS 2.5 ma V GS(th) Vdc V GS(Q) Vdc V DS(on) 0.26 Vdc C rss 0.13 pf C oss 7.3 pf C iss 16.3 pf 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to and search for AN1955. (continued) 2

3 Table 5. Electrical Characteristics (T A =25 C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Functional Tests (In NXP Test Fixture, 50 ohm system) V DD =50Vdc,I DQ =30mA,P out =10W,f=220MHz,CW Power Gain G ps db Drain Efficiency D % Input Return Loss IRL db Table 6. Ordering Information Device Tape and Reel Information Package MRF6V2010NR1 R1 Suffix = 500 Units, 24 mm Tape Width, 13--inch Reel TO MRF6V2010NBR1 R1 Suffix = 500 Units, 44 mm Tape Width, 13--inch Reel TO MRF6V2010GNR1 R1 Suffix = 500 Units, 24 mm Tape Width, 13--inch Reel TO--270G--2 ATTENTION: The MRF6V2010N, MRF6V2010NB and MRF6V2010GN are high power devices and special considerations must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which exceed the maximum allowable operating junction temperature. Refer to NXP Application Note AN3263 (for bolt down mounting) or AN1907 (for solder reflow mounting) PRIOR TO STARTING SYSTEM DESIGN to ensure proper mounting of these devices. 3

4 L2 B2 B1 + V SUPPLY V BIAS + + C11 C12 C13 C14 C15 C16 C2 C3 C4 C5 RF INPUT C6 Z1 C7 C1 C8 R1 L1 Z2 Z3 Z4 DUT Z5 Z6 C9 Z7 C10 Z8 L3 Z9 Z10 C17 C18 Z11 RF OUTPUT Z1 Z2 Z3 Z4 Z5 Z x Microstrip x Microstrip x Microstrip x Microstrip x Microstrip x Microstrip Z x Microstrip Z x Microstrip Z x Microstrip Z x Microstrip Z x Microstrip PCB Arlon CuClad 250GX , 0.030, r =2.55 Figure 2. MRF6V2010N(NB) Test Circuit Schematic Table 7. MRF6V2010N(NB) Test Circuit Component Designations and Values Part Description Part Number Manufacturer B1, B2 95, 100 MHz Long Ferrite Beads Fair--Rite C1, C8, C11, C pf Chip Capacitors ATC100B102JT50XT ATC C2 10 F, 35 V Tantalum Capacitor T491D106K035AT Kemet C3 22 F, 35 V Tantalum Capacitor T491X226K035AT Kemet C4, C13 39 K pf Chip Capacitors ATC200B393KT50XT ATC C5, C14 22 K pf Chip Capacitors ATC200B223KT50XT ATC C6, C F Chip Capacitors CDR33BX104AKYS Kemet C7, C F, 50 V Chip Capacitors C1825C225J5RAC Kemet C pf Variable Capacitor, Gigatrim 27271SL Johanson C10 12 pf Chip Capacitor ATC100B120JT500XT ATC C F, 63 V Electrolytic Capacitor ESMG630ELL471MK205 United Chemi--Con C17 27 pf Chip Capacitor ATC100B270JT500XT ATC L nh Inductor B06T CoilCraft L2, L3 82 nh Inductors 1812SMS--82NJ CoilCraft R1 120, 1/4 W Chip Resistor CRCW RFKEA Vishay 4

5 C5 C14 C4 C6 C13 C15 B2 B1 L2 C16 C2 C3 R1 L1 C7 C8 C12 C11 L3 C17 C18 C1 CUT OUT AREA C9 C10 MRF6V2010N/NB Rev. 3 Figure 3. MRF6V2010N(NB) Test Circuit Component Layout 5

6 TYPICAL CHARACTERISTICS C, CAPACITANCE (pf) 10 1 C iss C oss Measured with 30 1 MHz V GS =0Vdc I D, DRAIN CURRENT (AMPS) 10 1 C rss T C =25 C V DS, DRAIN--SOURCE VOLTAGE (VOLTS) V DS, DRAIN--SOURCE VOLTAGE (VOLTS) Figure 4. Capacitance versus Drain -Source Voltage Figure 5. DC Safe Operating Area 200 I D, DRAIN CURRENT (AMPS) V GS =3V V V V V DRAIN VOLTAGE (VOLTS) Figure 6. DC Drain Current versus Drain Voltage G ps, POWER GAIN (db) ma 30 ma 23 ma 15 ma I DQ =45mA V DD =50Vdc f1 = 220 MHz P out, OUTPUT POWER (WATTS) CW Figure 7. CW Power Gain versus Output Power ma 47 IMD, THIRD ORDER INTERMODULATION DISTORTION (dbc) ma 30 ma 38 ma I DQ =60mA 45 ma V DD =50Vdc f1 = 220 MHz, f2 = MHz Two--Tone Measurements 100 khz Tone Spacing P out, OUTPUT POWER (WATTS) PEP Figure 8. Third Order Intermodulation Distortion versus Output Power P out, OUTPUT POWER (dbm) P3dB = dbm (12.2 W) P1dB = dbm (11.04 W) P in, INPUT POWER (dbm) Ideal Actual V DD =50Vdc,I DQ =30mA f = 220 MHz Figure 9. CW Output Power versus Input Power 23 6

7 TYPICAL CHARACTERISTICS G ps, POWER GAIN (db) V 50 V V 40 V V V I DQ =30mA V DD =20V f = 220 MHz P out, OUTPUT POWER (WATTS) CW Figure 10. Power Gain versus Output Power P out, OUTPUT POWER (dbm) _C T C =--30_C 85_C P in, INPUT POWER (dbm) V DD =50Vdc I DQ =30mA f = 220 MHz Figure 11. Power Output versus Power Input _C 25_C G ps, POWER GAIN (db) 24 G ps T C =--30_C _C 25_C D 54 85_C V DD =50Vdc 19 I DQ =30mA 9 18 f = 220 MHz P out, OUTPUT POWER (WATTS) CW Figure 12. Power Gain and Drain Efficiency versus CW Output Power D, DRAIN EFFICIENCY (%) G ps, POWER GAIN (db) G 130 MHz G 26 G 220 MHz 130 MHz G 450 MHz MHz MHz 220 MHz V DD =50Vdc I DQ =30mA P out, OUTPUT POWER (WATTS) CW Figure 13. Power Gain and Drain Efficiency versus CW Output Power 10 D, DRAIN EFFICIENCY (%) MTTF (HOURS) T J, JUNCTION TEMPERATURE ( C) This above graph displays calculated MTTF in hours when the device is operated at V DD =50Vdc,P out = 10 W CW, and D = 62%. MTTF calculator available at Figure 14. MTTF versus Junction Temperature 7

8 Z o =50 Z source f = 220 MHz f = 220 MHz Z load f MHz V DD =50Vdc,I DQ =30mA,P out =10WCW Z source Z load j j44 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. Input Matching Network Device Under Test Output Matching Network Z source Z load Figure 15. Series Equivalent Source and Load Impedance 8

9 C10 C9 C8 C6 C14 C16 C7 C15 B2 B1 C5 L5 C4 L1 C13 L2 C18 L3 L4 C17 C19 C1 R1 C2 C3 CUT OUT AREA C11 C MHz Rev. 1 Figure 16. MRF6V2010N(NB) Test Circuit Component Layout 130 MHz Table 8. MRF6V2010N(NB) Test Circuit Component Designations and Values 130 MHz Part Description Part Number Manufacturer B1, B2 95, 100 MHz Long Ferrite Beads, Surface Mount Fair--Rite C1, C5, C18, C pf Chip Capacitors ATC100B102JT50XT ATC C2, C pf Variable Capacitors, Gigatrim 27271SL Johanson C3 27 pf Chip Capacitor ATC100B270JT500XT ATC C4, C F, 50 V Chip Capacitors C1825C225J5RAC Kemet C6, C F, 50 V Chip Capacitors CDR33BX104AKYM Kemet C7, C15 22K pf Chip Capacitors ATC200B223KT50XT ATC C8, C16 39K pf Chip Capacitors ATC200B393KT50XT ATC C9 22 F, 35 V Tantalum Capacitor T491X226K035AT Kemet C10 10 F, 35 V Tantalum Capacitor T491D106K035AT Kemet C11 16 pf Chip Capacitor ATC100B160JT500XT ATC C F, 63 V Electrolytic Capacitor MCRH63V337M13X21--RH Multicomp L nh Inductor B06T CoilCraft L2, L5 82 nh Inductors 1812SMS--82NJ CoilCraft L nh Inductor B09T CoilCraft L4 43 nh Inductor B10T CoilCraft R1 100, 1/4 W Chip Resistor CRCW RFKEA Vishay PCB PCB Material CuClad 250GX , 0.030, r =2.55 Arlon 9

10 C10 C9 C8 C6 C16 C18 C7 C17 B2 B1 L4 C20 C3 C4 L1 C5 C11 L2 L3 C12 C19 C13 C15 C1 C2 R1 CUT OUT AREA C MHz Rev. 1 Figure 17. MRF6V2010N(NB) Test Circuit Component Layout 450 MHz Table 9. MRF6V2010N(NB) Test Circuit Component Designations and Values 450 MHz Part Description Part Number Manufacturer B1, B2 95, 100 MHz Long Ferrite Beads, Surface Mount Fair--Rite C1, C5, C12, C pf Chip Capacitors ATC100B241JT200XT ATC C2, C3 10 pf Chip Capacitors ATC100B100JT500XT ATC C4, C F, 50 V Chip Capacitors C1825C225J5RAC Kemet C6, C uf 50V Chip Capacitors CDR33BX104AKYM Kemet C7, C17 22K pf Chip Capacitors ATC200B223KT50XT ATC C8, C18 39K pf Chip Capacitors ATC200B393KT50XT ATC C9 22 F, 35 V Tantalum Capacitor T491X226K035AT Kemet C10 10 F, 35 V Tantalum Capacitor T491D106K035AT Kemet C13, C pf Chip Capacitors ATC100B6R2BT500XT ATC C F, 63 V Electrolytic Capacitor MCGPR63V477M13X26--RH Multicomp C20 47 F, 50 V Electrolytic Capacitor 476KXM050M Illinois Cap L nh Inductor B06T CoilCraft L2, L4 82 nh Inductors 1812SMS--82NJ CoilCraft L3 5.0 nh Inductor A02T CoilCraft R1 120, 1/4 W Chip Resistor CRCW RFKEA Vishay PCB PCB Material CuClad 250GX , 0.030, r =2.55 Arlon 10

11 C11 C10 C9 C7 C18 C20 C8 C19 B2 B1 L6 L1 C4 L2 C6 C5 C16 L3 C17 L4 L5 C21 C15 C1 R1 C2 C3 CUT OUT AREA C12 C13 C14 64 MHz Rev. 1 Figure 18. MRF6V2010N(NB) Test Circuit Component Layout 64 MHz Table 10. MRF6V2010N(NB) Test Circuit Component Designations and Values 64 MHz Part Description Part Number Manufacturer B1, B MHz Long Ferrite Beads, Surface Mount Fair--Rite C1, C5, C15, C pf Chip Capacitors ATC100B102JT50XT ATC C2 91 pf Chip Capacitor ATC100B910JT500XT ATC C3, C14 22 pf Chip Capacitors ATC100B220JT500XT ATC C4, C F, 50 V Chip Capacitors C1825C225J5RAC Kemet C6 220 nf, 50 V Chip Capacitor C1812C224J5RAC Kemet C7, C F, 50 V Chip Capacitors CDR33BX104AKYM Kemet C8, C19 100K pf Chip Capacitors ATC200B104KT50XT ATC C9, C20 22K pf Chip Capacitors ATC200B223KT50XT ATC C10 22 F, 35 V Tantalum Capacitor T491X226K035AT Kemet C11 10 F, 35 V Tantalum Capacitor T491D106K035AT Kemet C12 68 pf Chip Capacitor ATC100B680JT500XT ATC C13 27 pf Chip Capacitor ATC100B270JT500XT ATC C F, 63 V Electrolytic Capacitor MCRH63V337M13X21--RH Multicomp L nh Inductor B06T CoilCraft L2 43 nh Inductor B10T CoilCraft L3, L4, L5, L6 82 nh Inductors 1812SMS--82NJ CoilCraft R1 180, 1/4 W Chip Resistor CRCW RFKEA Vishay PCB PCB Material CuClad 250GX , 0.030, r =2.55 Arlon 11

12 Z o =50 f = 450 MHz Z source f = 220 MHz Z source f = 450 MHz Z load f = 130 MHz Z source f = 220 MHz Z load f=64mhzz source f = 130 MHz Zload f=64mhzz load f MHz V DD =50Vdc,I DQ =30mA,P out =10WCW Z source Z load j j j j j j j j49.0 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. Input Matching Network Device Under Test Output Matching Network Z source Z load Figure 19. Series Equivalent Source and Load Impedance 12

13 50 OHM TYPICAL CHARACTERISTICS Table 11. Common Source S -Parameters (V DD =50V,I DQ =30mA,T A =25 C, 50 Ohm System) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S (continued) 13

14 50 OHM TYPICAL CHARACTERISTICS Table 10. Common Source S -Parameters (V DD =50V,I DQ =30mA,T A =25 C, 50 Ohm System) (continued) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S

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24 PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following resources to aid your design process. Application Notes AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages Engineering Bulletins EB212: Using Data Sheet Impedances for RF LDMOS Devices Software Electromigration MTTF Calculator RF High Power Model To Download Resources Specific to a Given Part Number: 1. Go to 2. Search by part number 3. Click part number link 4. Choose the desired resource from the drop down menu The following table summarizes revisions to this document. REVISION HISTORY Revision Date Description 0 Feb Initial release of data sheet 1 May 2007 Corrected Test Circuit Component part numbers in Table 6, Component Designations and Values for C1, C8, C11, C18, C4, C13, C5, and C14, p. 3 Corrected Series Impedance Z source and Z load values, Fig. 13, Series Equivalent Source and Load Impedance, p. 7 2 Aug Replaced Case Outline with , Issue K, p. 1, Corrected cross hatch pattern in bottom view and changed its dimensions (D2 and E3) to minimum value on source contact (D2 changed from Min--Max to.290 Min; E3 changed from Min--Max to.150 Min). Added JEDEC Standard Package Number. Replaced Case Outline with , p. 1, Issue D: Removed Drain--ID label from View Y--Y on Sheet 2. Renamed E2 to E3. Added cross--hatch region dimensions D2 and E2. Corrected Test Circuit Component part number in Table 6, Component Designations and Values for R1, p. 3 Added Figure 12, Power Gain and Drain Efficiency versus CW Output Power, p. 6 Corrected plot points to show 50 Ohms in Figure 14, Series Equivalent Source and Load Impedance, p. 7 Added Figures , Test Circuit Component Layout and Tables 7--9, Test Circuit Component Designations and Values to show 130, 450 and 64 MHz, respectively, p Added Figure 18, Series Equivalent Source and Load Impedance to show 64, 130, 220 and 450 MHz plot points, p Feb Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150 C, p. 1 Corrected C iss test condition to indicate AC stimulus on the V GS connection versus the V DS connection, Dynamic Characteristics table, p. 2 Replaced Case Outline , Issue D, with , Issue E, p Corrected document number 98ASA99191D on Sheet 3. 4 Mar Corrected Z source ( j15.1) and Z load ( j16.7) 64 MHz values and replotted both, p. 11 Added S--Parameter table, p. 12, 13 (continued) 24

25 REVISION HISTORY (continued) Revision Date Description 5 Apr Operating Junction Temperature increased from 200 C to 225 C in Maximum Ratings table, related Continuous use at maximum temperature will affect MTTF footnote added and changed 200 C to 225 C in Capable Plastic Package bullet, p. 1 Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software, p Sept Added part number MRF6V2010GN, pp. 1, 3 Added TO--270G--2 package isometric, p. 1, and Mechanical Outline, pp Table 3, ESD Protection Characteristics, removed the word Minimum after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 2 Fig. 14, MTTF versus Junction Temperature: MTTF end temperature on graph changed to match maximum operating junction temperature, p. 7 Replaced Case Outline TO , Issue K (Case ), with TO , Issue R, pp Issue P: changed dimension A to AA and D to DD on Sheets 1 and 3. Added tolerance bbb and feature control frame to dimensions E and E5. Issue R: incorporated NXP logo. 25

26 How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: nxp.com/salestermsandconditions. NXP, the NXP logo, Freescale, and the Freescale logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E , 2010, 2016 NXP B.V. Document Number: MRF6V2010N 26 Rev. 6, 9/2016