PLED Unidirectional Series (PLEDxUx)

Transcription

1 (PLEDxUx) PLED Open LED Protectors Agency Approvals Agency Agency File Number E Description The (PLEDxUx Series) open LED protectors provide an electronic switching shunt path around a single LED that fails as an open circuit. This ensures the remaining string of LEDs will continue to function even though a single LED in the string has failed open. It also provides reverse battery or reverse power polarity protection. The components were designed to enable higher reliability in outdoor LED lighting applications such as street lighting, outdoor signage, aircraft runway lighting, roadside warning lights and other applications. Compatible with one, two and three watt LEDs that have a nominal 3V forward characteristic, PLED Unidirectional Series components are available in two different surface mount packages, the DO-214AA and the Quad Flat Pak Nolead (QFN). The QFN s low profile, chip scale package (CSP) is ideal for dense board applications. Schematic Symbol Control Circuit MT2 MT1 Cathode (bar marking side) Features & Benefits Fast switching Reverse Battery/Power Protection Automatically resets after power cycle Available in low profile, small footprint QFN and Standard DO214AA packages Compatible with industrial lighting environments Compatible with PWM frequencies up to 10 khz RoHS compliant and halogen-free Electrical Characteristics (All parameters are measured at T=25 C unless otherwise noted) Part Number Marking V BR breakdown V DRM breakdown I H I T V I F = 1 A I F V I F = 1 A Critical rate of rise dv/dt Volts Volts mamps mamps Amps Volts Amps Volts Volts Min Max Min Max Max Max Max Max Max Max PLED6UQ12 PL6U PLED6US PL6U PLED9UQ12 PL9U PLED9US PL9U PLED13UQ12 PL13U PLED13US PL13U PLED18UQ12 PL18U PLED18US PL18U PLED35US* PL35U Note: 1. IO- Operation current alumium boards, ambient temp 85C 2. Part with * is not a UL Recognized component. 250V/µs

2 Thermal Considerations Package Symbol Parameter Value Unit T J Operating Junction Temperature Range -40 to +150 C QFN 3x3 DO-214AA T S Storage Temperature Range -65 to +150 C R θja Thermal Resistance: Junction to Ambient DO-214AA: 90 1 DO-214AA: 40 2 QFN: QFN: 60 3 C/W Notes: 1) Standard FR-4 PCB with Copper Pads (Recommended Size) 2) Aluminum PCB Thickness: 1.6mm Grade: 1-2 W/mK Thermal Conductivity Trace thickness: 2 oz Insulation layer thickness: 215 µm Solder Pad Dimensions: 2.0mm x 2.8mm (Recommended Size) 3) Aluminum PCB Thickness: 1.6mm Grade: 1-2 W/mK Thermal Conductivity Trace thickness: 2 oz Insulation layer thickness: 60 µm Solder Pad Dimensions: 1.27mm x 2.54mm (Recommended Size) V-I Characteristics V BR vs. Junction Temperature +I 14 -V I S I H V F V T -I V DRM V BR +V C hange % cent of V BR P er C Junction Temperature (T J ) C Normalized DC Holding Current vs. Case Temperature LED Interference Test Circuit i H i H ( T C = 2 5 C ) of R atio C V bat 12 Vdc 2.0 Ω, 1/4 W 110 kω, 1/4 W PWM Q2 2N2222 Q1 LED Driver ON/OFF Switch MT2 Control Circuit MT1 Unidiretional PLED Case Temperature (T C ) C

3 6 LEDs in Series 50% Duty Cycle 10kHz 5 LEDs and 1 PLED in Series 50% Duty Cycle 10kHz Note: These two graphs show the current magnitude through the LED string with and without the PLED included. There is no noticeable effect on the LED current magnitude when the PLED is included in the circuit as compared to the LED current magnitude when the PLED is not in the circuit. (The conversion factor for the test measurement in the graphs above is 10mA/mV for the Pearson coil measurement, therefore, the current magnitude in the first figure is 10mA*8.9 = 89mA, while the second figure is 91mA.) PLED in the Off-State 10kHz PLED device zeners and then turns fully on 10kHz Channel 1: current through LEDs (318 ma) Channel 2: voltage across PLED device (4.5 V) Channel 1: current through LEDs (346 ma) and PLED device once it is fully turned on 2.5 μsec later Channel 2: voltage across PLED device (21.3 V before PLED crowbars with 2 V drop)

4 Soldering Parameters Reflow Condition Pb Free assembly Pre Heat - Temperature Min (T s(min) ) 150 C - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus Temp (T L ) to peak T S(max) to T L - Ramp-up Rate Reflow - Temperature (T L ) (Liquidus) 217 C 3 C/second max 3 C/second max - Temperature (t L ) seconds Peak Temperature (T P ) /-5 C Time within 5 C of actual peak Temperature (t p ) Ramp-down Rate Time 25 C to peak Temperature (T P ) 30 seconds Do not exceed 260 C Physical Specifications Terminal Material Terminal Finish Body Material Copper Alloy 100% Matte Tin Plated 6 C/second max 8 minutes max UL Recognized compound meeting flammability rating V-0. Environmental Specifications High Temperature Voltage Blocking Temperature Cycling Biased Temperature & Humidity High Temperature Storage Low Temperature Storage Thermal Shock Resistance to Solder Heat MIL-STD-750: Method 1040, Condition A 80% min V DRM (VAC-peak), 150 C, 504 hours MIL-STD-750: Method C to 150 C, 15-minute dwell, 100 cycles EIA/JEDEC: JESD22-A101 52VDC, 85 C, 85%RH, 1008 hours MIL-STD-750: Method C, 1008 hours -65 C, 1008 hours MIL-STD-750: Method C to 100 C, 5-minute dwell, 10-second transfer, 10 cycles MIL-STD-750: Method C, 10 seconds Part Numbering System DO-214AA Part Marking System TYPE PLED: LED Protector PLED x VDRM 6 Volts 9 Volts 13 Volts 18 Volts 35 Volts U x x Blank:1A 002: 2A PACKAGE TYPE Q12: 3.0x3.0mm QFN S: DO-214AA Unidirectional DO-214AA QFN QFN XXXXX XXXXX Cathode Bar Cathode Bar XXXXX XXXXX Cathode Bar Cathode Bar

5 Packaging Package Description Packaging Quantity Industry Standard Q12 QFN 3x EIA S DO-214AA 2500 EIA Dimensions - QFN (3x3) Package TOP VIEW A E BOTTOM VIEW C J Dimensions Inches Millimeters Min Typ Max Min Typ Max B F A B C END VIEW SIDE VIEW E H F K1 K2 N2 N1 M2 M1 M1 M2 H J mm mm K K M M mm Recommended solder pad layout (Reference Only) N N Dimensions - DO-214 AA Package B D CASE TEMPERATURE MEASURING POINT Dimensions Inches Millimeters Min Max Min Max C A A B C D K H F E E G F G " (2.0mm) H K " (2.8mm) 0.079" (2.0mm) Recommended solder pad layout (Reference Only)

6 Tape and Reel Specification - QFN (3x3) A D B C W1 N Symbols Description Inches Millimeters Minimum Maximum Minimum Maximum A Reel Diameter N/A N/A B Drive Spoke Width N/A 1.50 N/A Reel Dimension C Arbor Hole Diameter K0 T W0 COVER TAPE D0 P1 P0 P2 Tape Dimension Items E1 CARRIER TAPE D1 A1 B0 F E2 W D Drive Spoke Diameter N/A N/A N Hub Diameter N/A N/A W1 Reel Inner Width at Hub A0 Pocket Width at bottom B0 Pocket Length at bottom D0 Feed Hole Diameter END CATHODE BAR ON THIS SIDE CARRIER TAPE COVER TAPE START D1 Pocket Hole Diameter N/A 1.50 N/A E1 Feed hole Position E2 Feed hole Position TRAILER 160mm MIN LEADER 400mm MIN F Feed hole center-pocket hole K0 Pocket Depth Leader and Trailer Dimension of the Ttape P0 Feed hole Pitch P1 Component Spacing P2 Feed hole center-pocket hole T Carrier Tape Thickness W Embossed Carrier Tape Width W0 Cover Tape Width DO-214AA Embossed Carrier Reel Pack (RP) Meets all EIA Standards (4.0) Cathode bar on this side (12.0) 0.36 (9.2) (8.0) DIA (1.5) Cover tape (13.0) Arbor Hole Dia (330.0) Dimensions are in inches (and millimeters) (12.4) Direction of Feed