Lightning Surge Protection - SP4031 SP1050 Series 7 (N/C) 6 (N/C)

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1 SP431 RoHS Pb GREEN Description The SP431 hybrid protector offers both overcurrent and differential only overvoltage protection for applications such as 1/1/1 BaseT ports. Compliant with the newest standards of overvoltage per industry standard ITU-T K.21. Tested to basic tests levels 2.5kV overvoltage. Flowthrough package layout allows PCB trace routing directly through the SP431 without changing pitch dimensions, thus having less impact on normal signal high frequency components. Functional Block Diagram 1 (PIN-IN 8 (PIN-OUT 2 (N/C 7 (N/C 3 (N/C 6 (N/C 4 (PIN-IN 5 (PIN-OUT During a prolonged overvoltage event such as a power fault, this component will present a high impedance. The high impedance state will reset once the power fault event has ended. During a fast transient event, the component will clamp, thus protecting any downstream chipsets. These components can safely absorb up to 35A per IEC nd edition (t p =8/2μs without performance degradation and a minimum ±3kV ESD per IEC International Standard. The low loading capacitance and high surge capability makes the SP431 ideal for protecting telecommunication ports such as Ethernet and other high speed data interfaces. Features Applications ESD, IEC , ±3kV contact, ±3kV air EFT, IEC , 4A (5/5ns Lightning, 35A (8/2 as defined in IEC nd edition Low capacitance of 2.5pF (@V R =V Moisture Sensitivity Level (MSL -1 Lead free and RoHS compliant This SP431 hybrid component provides a tested and proved protection solution for high-speed interfaces such as 1/1/1 BaseT applications Low parasitic capacitance Low operating voltage (<3.3 V Low breakdown voltage (>3.5V 1/1/1 BaseT Ethernet ITU K.21 Basic level compliance ADSL/VDSL/G.fast modem Industrial Ethernet Application Example RJ-45 Connector PHY SP431*4 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Absolute Maximum Ratings Symbol Parameter Value Units T OP Operating Temperature -4 to 85 C Peak Current (tp=8/2μs 35 A T STOR Storage Temperature -55 to 85 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics, Pin1 to Pin5 (T OP = C Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM I R = 1μA 3.3 V Breakdown Voltage V BR I R = 1mA V Reverse Leakage Current I LEAK V R =3.3V.5 ua Clamp Voltage 1 V C =1A, t p =8/2μs, Pin5 to Pin V =35A, t p =8/2μs, Pin5 to Pin V Dynamic Resistance 2 R DYN TLP, t p =1ns, Pin5 to Pin8.45 Ω ESD Withstand Voltage 1 V ESD IEC (Contact Discharge ±3 kv IEC (Air Discharge ±3 kv Diode Capacitance 1 C I/O-I/O Reverse Bias=V, f=1mhz pf Notes: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP with 1ns width, 2ns rise time, and average window t1=7ns to t2= 9ns 8/2 Pulse Waveform Capacitance vs. Reverse Bias 11% 1% 9% Percent of 8% 7% 6% 5% 4% 3% 2% Capacitance (pf % % Time (μs Bias Voltage (V

3 Temperature TVS Diode Arrays (SPA Diodes Positive Transmission Line Pulsing (TLP Plot Negative Transmission Line Pulsing (TLP Plot TLP Current (A 2 15 TLP Current (A TLP Voltage (V TLP Voltage (V Clamping voltage vs. for 8/2μS waveshape 3 Clamp Voltage (V C Peak Pulse Current- (A Soldering Parameters Reflow Condition Pre Heat - Temperature Min (T s(min 15 C - Temperature Max (T s(max 2 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak 3 C/second max T L T S(max Preheat t L Ramp-down T S(max to T L - Ramp-up Rate Reflow - Temperature (T L (Liquidus 217 C 3 C/second max - Temperature (t L 6 15 seconds Peak Temperature (T P 26 +/-5 C T S(min t S time to peak temperature Time Time within 5 C of actual peak Temperature (t p 2 4 seconds Ramp-down Rate 6 C/second max Time C to peak Temperature (T P 8 minutes Max. Do not exceed 26 C

4 Product Characteristics Lead Plating Lead Material Lead Coplanarity Substrate Material Body Material Flammability Tin Copper Alloy.4 inches(.12mm Silicon Molded Compound UL Recognized compound meeting flammability rating V- Ordering Information Part Number Package Min. Order Qty. SP431-2BTG SOIC Tape & Reel Part Marking System SP431 LTNUMBER HWWYY o SP431=Part code LTNUMBER = Lot Number H = Assembly Code WW=Week code YY=Year code Part Numbering System TVS Diode Arrays (SPA Diodes Series Number of Channels SP B T G G= Green T= Tape & Reel Package B = SOIC PIN Package Dimensions of SOIC-8 FL o Recommended Soldering Pad Outline (Reference Only Package SOIC Pins 8 JEDEC MS-12 Millimeters Inches Min Max Min Max A A A B c D E E e 1.27 BSC.5 BSC L

5 Embossed Carrier Tape & Reel Specification SOIC Package User Feeding Direction Pin 1 Location Millimeters Inches Min Max Min Max E F P D D1 1.5 Min.59 Min P P 4. +/ /-.8 W P A B K t.3 +/ /-.2 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at

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