SP4040 Series 3.3V 75A Rail Clamp Array

Transcription

1 3.3V 7A Rail Clamp Array RoHS Pb GREEN Description The SP4040 provides overvoltage protection for applications such as 0/00/000 Base-T Ethernet and T3/ E3 interfaces. This device has a low capacitance of only pf making it suitable for PHY side Ethernet protection and the capability to protect against both longitudinal and differential transients. Furthermore, the SP4040 is rated up to 00A (tp=2/0µs) making it suitable for line side protection as well against lightning transients as defined by GR-089 (intra-building), ITU, YD/T, etc. The application schematic provides the connection information for a PHY side protection scheme of a single differential pair. Pinout Features Lightning protection, IEC , 7A (8/20µs) Low clamping voltage Clamping speed of nanoseconds MS-02 surface mount package (JEDEC SO-8) 3 4 SO-8 (Top View) 6 Low insertion loss, loglinear capacitance Combined longitudinal and metallic protection UL 94V-0 epoxy molding RoHS compliant Note: Pinout diagrams above shown as device footprint on circuit board. Functional Block Diagram Applications T/E Line cards T3/E3 and DS3 Interfaces Line in Pin and 8 Line out 0/00/000 BaseT Ethernet STS- Interfaces Application Example Pin 2, 3, 6, and 7 TeleLink (046.2) to chipset (Ethernet PHY, T3/E3 PHY, etc.) Line in Pin 4 and Line out 4 SP BTG Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. The schematic shows protection for a single differential pair as part of a larger high-speed data interface such as Ethernet. The SP4040 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events as specified by regulatory standards such as Telcordia s GR-089 CORE and ITU K.20 and 2. The SP4040 protects against both positive and negative induced surge events while the TeleLink fuse provides overcurrent protection for the long term 0/60 Hz power fault events. 88 Revision: September 3, Littelfuse, Inc.

2 Absolute Maximum Ratings Thermal Information Parameter Rating Units Peak Pulse Current (8/20µs) 7 A Peak Pulse Power (8/20µs) 200 W IEC , Direct Discharge, (Level 4) 30 kv IEC , Air Discharge, (Level 4) 30 kv Telcordia GR 089 (Intra-Building) (2/0µs) 00 A ITU K.20 (/30µs) 20 A CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Parameter Rating Units SOIC Package 70 C/W Operating Temperature Range - to 2 C Storage Temperature Range -6 to 0 C Maximum Junction Temperature 0 C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 C SP4040 Electrical Characteristics (T OP = 2 C) Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage V RWM µa V Reverse Breakdown Voltage V BR = 2µA V Snap Back Voltage V SB = 0mA V Reverse Leakage Current I R V RWM = 3.3V - - µa Clamping Voltage, Line-Ground V C = 40A, t p =8/20 µs V Clamping Voltage, Line-Ground V C = 7A, t p =8/20 µs V Clamping Voltage, Line-Ground V C = 00A, t p =2/0 µs 20 V Dynamic Resistance, Line-Ground R DYN ( V C2 -V C )/(2 - ) Ω Clamping Voltage, Line-Line V C = 40A, t p =8/20 µs V Clamping Voltage, Line-Line V C = 7A, t p =8/20 µs V Clamping Voltage, Line-Line V C = 00A, t p =2/0 µs 30 V Dynamic Resistance, Line-Line R DYN ( V C2 -V C )/(2 - ) Ω Junction Capacitance C j V R =0V, f= MHz Line to Ground - 8 pf Line to Line, V R =0V, f= MHz - 2. pf Parameter is guaranteed by design and/or device characterization. 20 Littelfuse, Inc. 89 Revision: September 3, 20

3 Pulse Waveform Clamping Voltage vs. Percent of 0% 00% 90% 80% 70% 60% 0% 40% Clamp Voltage-VC (V) Line-Line Line-Gound 30% 20% 0% 0% Time (μs) Peak Pulse Current- (A) Capacitance vs. Reverse Bias at MHz Current Derating Curve Capacitance (pf) Line-Gound Line-Line Bias Voltage (V) Percentage of Rated Current (% I P ) Ambient Temperature (ºC) Non-Repetitive Peak Pulse Power vs. Pulse Time 0 Peak Pulse Power (kw) Peak Pulse Dura on -t P (µs) 90 Revision: September 3, Littelfuse, Inc.

4 Temperature Soldering Parameters Reflow Condition - Temperature Min (T s(min) ) 0 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak T S(max) to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max) T S(min) t S Preheat t L Ramp-down SP4040 Reflow - Temperature (T L ) (Liquidus) 27 C - Temperature (t L ) 60 0 seconds 2 time to peak temperature Time Peak Temperature (T P ) /- C Time within C of actual peak Temperature (t p ) seconds Ramp-down Rate 6 C/second max Time 2 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260 C Part Marking System Product Characteristics Lead Plating Matte Tin plating FL SP CYYWW Part number Date code Pin Lead Coplanarity inches (0.02mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes :. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI -3. Lead Material Copper Alloy 20 Littelfuse, Inc. 9 Revision: September 3, 20

5 Package Dimensions Mechanical Drawings and Recommended Solder Pad Outline o FL Recommended Soldering Pad Outline (Reference Only) Package MS-02 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres Inches Min Max Min Max A A A B c D E E e.27 BSC 0.00 BSC L Embossed Carrier Tape & Reel Specification SOIC Package User Feeding Direction Pin Location Millimetres Inches Min Max Min Max E F P D D.0 Min 0.09 Min P P / / W P A B K t / / Part Numbering System Silicon Protection Array Series Number of Channels SP xx x T G G= Green T= Tape & Reel Package B = SOIC-8 Ordering Information Part Number Package Marking Min. Order Qty. SP BTG SOIC-8 SP Revision: September 3, Littelfuse, Inc.