SP3050 Lead-Free/Green Series

Transcription

1 RoHS Pb GREEN Description The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC (t P =8/20μs) without performance degradation and a minimum ±20kV ESD per IEC Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Pinout Features I/O 1 I/O 4 (5/50ns) (TYP) per I/O packaging I/O 2 I/O 3 Functional Block Diagram Applications

2 Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Current (t p T OP Operating Temperature -40 to 85 C T STOR Storage Temperature -50 to 150 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 C 150 C 260 C Electrical Characteristics (T OP =25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I R 6.0 V I V R =5V Clamp Voltage 1 V C I PP p V I PP p V I PP p V IEC (Contact) ±20 kv ESD Withstand Voltage 1 V ESD ±30 kv Diode Capacitance 1 C 2.0 Diode Capacitance 1 C I/O-I/O Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. 2

3 Capacitance vs. Reverse Bias Pulse Waveform % 100% % Capacitance (pf) =3.3V =Float =5V 80% 70% 60% 50% 40% 30% % 10% DC Bias (V) 0% Clamping Voltage vs. I PP Clamp Voltage (V C ) Peak Pulse Current-I PP (A) 3

4 Application Example Dual Port Protection USB Controller C T C T SP HTG D+ D- USB Port D+ D- USB Port C T CT 10/100 Ethernet Differential Protection RJ45 10/100 Ethernet PHY TX + TX - RX SP HTG TX + TX - RX + RX - To Twisted-Pair Network RX - VCC VCC 4

5 Soldering Parameters Reflow Condition - Temperature Min (T s(min) ) 150 C Pre Heat - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak T S(max) to T L - Ramp-up Rate Reflow - Temperature (T L ) (Liquidus) 217 C - Temperature (t L ) seconds Peak Temperature (T P ) /-5 C Time within 5 C of actual peak Temperature (t p ) seconds Ramp-down Rate Time 25 C to peak Temperature (T P ) Do not exceed 260 C Package Dimensions - SOT23-6 Package SOT23-6 Pins 6 Recommended Solder Pad Layout JEDEC MO-203 Issue A Millimeters Inches Notes Min Max Min Max A A A b C D E E e 0.95 Ref ref - e1 1.9 Ref Ref - L N a 0º 10º 0º 10º - M O TYP - P TYP - R P O R M 5

6 Part Numbering System Product Characteristics SP H T G Lead Plating Silicon Protection Array Series Number of Channels G= Green T= Tape & Reel Package H: SOT23-6 Lead Material Lead Coplanarity Subsitute Material Body Material inches (0.102mm) Silicon Part Marking System L * 4 L*4 Product Series Number of Channels L = SP3050 Assembly Site (Varies) Flammability 2. Dimensions include solder plating. Ordering Information Part Number Package Marking Min. Order Qty. SOT

7 Embossed Carrier Tape & Reel Specification -- SOT23-6 ACCESS HOLE 14.4mm 1.5mm DIA. HOLE 4.0mm 2.0mm 1.75mm 13mm 8mm C L 4.0mm 180mm 60mm SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED PIN 1 GENERAL INFORMATION PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. COVEAPE 7