DATA SHEET ELECTROSTATIC DISCHARGE PROTECTION DEVICES INDUSTRIAL / CONSUMER UBT23AXXL02 series

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1 Product specification December 19, 218 V. DATA SHEET ELECTROSTATIC DISCHARGE PROTECTION DEVICES INDUSTRIAL / CONSUMER UBT2AXXL2 series RoHS compliant & Halogen free

2 2 Electrostatic Discharged Protection Devices (ESD) Data Sheet Description This is ultra low capacitance TVS arrays designed to protect high speed data interfaces. It has been specifically designed to protect sensitive components which is connected to high-speed data and transmission lines from overvoltage caused by electrostatic (ESD), cable discharge events (CDE) and electrical fast transients (EFT). Features IEC1-4-2 ESD 15KV Air, 8KV contact compliance Protects two high speed data lines Working voltage: 5V Ultra low capacitance and clamping voltages Low leakage current Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 2~27 Flammability rating UL 94V- Meets MSL level 1, per J-ST2 Applications HDMI interface protection Mobile display digital interface RF/Antenna circuits USB 2. & Firewire ports 1 2 UBT2A5L2 GaAs photodetector protection HBT power Amp protection Infiniband transceiver protection Maximum Ratings Rating Symbol Value Unit Peak pulse current (tp=8/2μs waveform) I PP A ESD voltage (Contact discharge) V ESD ESD voltage (Air discharge) ±15 ±8 kv Storage & operating temperature range T STG,T J -55~+15

3 Electrical Characteristics (T J =25 ) UBT2A5L2 (Marking: B 5U) Parameter Symbol Condition Min. Typ. Max. Unit Reverse stand-off voltage V RWM 5 V Reverse breakdown voltage V BR I BR =1mA V Reverse leakage current I R V R =5V each I/O pin.5 μa Clamping voltage (tp=8/2μs) V C I PP =1A 9.8 V Clamping voltage (tp=8/2μs) V C I PP =A 15 V Vdc,f=1MHz Off state junction capacitance C J Between I/O.8 pf pins and Off state junction capacitance C J Vdc,f=1MHz Between I/O pins.4 pf Typical Characteristics Curves Figure 1. Pulse Waveforms Figure 2. Capacitance vs. Reverse Voltage % of Peak Power Current t r Peak value Ipp Waveform Parameters: t r =8µs t d =2µs t d =t I PP / t-time (μs) 25 Junction Capacitance (pf) F=1MHz Reverse Voltage (V) Figure. Forward Voltage vs. Forward Current 25 Clamping Voltage (V) Waveform Parameters: t r =8µs t b =2µs I PP -Peak Pulse Current (A)

4 4 Applications Information USB 2. USB PORT SDD2A5L1 SDD2A5L1 USB CONTROLLER SDD2A5L1 USB. PTC SMD1812P11TF SMD85P11TF SSTX+ SSTX- Device IC SSRX+ SSRX- SDD2A5L1

5 5 Recommended Soldering Conditions Reflow Soldering T P Ramp-up t P Critical Zone T L to T P T L T S max t L Temperature T S min t S Preheat Ramp-down 25 t 25 to Peak Time Recommended Conditions Profile Feature Average ramp-up rate (T L to T P ) Preheat -Temperature Min (T S min ) -Temperature Max (T S max ) -Time (min to max) (ts) Pb-Free Assembly /second max seconds T S max to T L -Ramp-up Rate Time maintained above: -Temperature (T L ) -Time (t L ) /second max seconds Peak Temperature (T P ) 2 Time within 5 of actual Peak Temperature (t P ) Ramp-down Rate Time 25 to Peak Temperature 2-4 seconds /second max. 8 minutes max.

6 Dimensions (SOT-2) G E F A Symbol Dimension Millimeters Inches 2 1 B Min. Max. Min. Max. H I C A B J.9 (X).8 (X) D C D E F G.95.7 H I Recommended Soldering Pad Layout J Packaging Tape Symbol Dimension (mm) W 8.±. P 4.±.1 ød P P1 P2 K P1 4.±.1 P2 2.±.1 E D Φ1.55±.1 D1 Φ1.±.5 B B F W E 1.75±.1 F.5±.1 A A ød1 t A.1±.1 A 2.1±.1 B 2.75±.1 B.5±.1 K 1.1±.1 t.2±.5 Reel D Φ178.±2. D2 D2 Φ1. W1 9.5 D W1 Quantity: PCS

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