AQxxC-01FTG Series. TVS Diode Array (SPA Diodes) General Purpose ESD Protection - AQxxC-01FTG SD-C Series Series. RoHS Pb GREEN.
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1 General Purpose ESD Protection - AQxxC-1FTG SD-C Series Series AQxxC-1FTG Series RoHS Pb GREEN Description The bidirectional AQxxC series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The AQxxC series can safely absorb repetitive ESD strikes at ±3kV (contact discharge, IEC 1--) without performance degradation and safely dissipate 3A (AQ5C) of /μs induced surge current (IEC 1--5) with very low clamping voltages. Pinout and Functional Block Diagram 1 Features ESD, IEC 1--, ±3kV contact, ±3kV air EFT, IEC 1--, A (5/5ns) Lightning, 3A (/ as defined in IEC 1--5 nd edition) AQ5C Low clamping voltage PPAP capable Low leakage current Small SOD33 package fits 5 footprints AEC-Q11 qualified Moisture Sensitivity Level(MSL -1) Halogen free, lead free and RoHS compliant Applications Switches / Buttons Test Equipment / Instrumentation Point-of-Sale Terminals Medical Equipment Notebooks / Desktops / Servers Computer Peripherals CAN Bus protection Automotive applications Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Revision: 7/19/1
2 Absolute Maximum Ratings Notes: Symbol Parameter Value Units P pk Peak Pulse Power ( =/μs) 5 W T OP Operating Temperature - to 15 C T STOR Storage Temperature -55 to 15 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. AQ5C Electrical Characteristics (T OP =5ºC) 1μA 5. V =1μA. V Reverse Leakage Current V BR =5V 1. μa =/µs, Fwd 1. V =1A, t P =/μs, Fwd 1.5 V Dynamic Resistance R DYN =1ns, I/O to Ground.31 Ω =/µs 3. A IEC 1-- (Contact Discharge) ±3 kv IEC 1-- (Air Discharge) ±3 kv Diode Capacitance 1 C I/O-I/O Reverse Bias=V, f=1mhz pf AQ1C Electrical Characteristics (T OP =5ºC) 1μA 1. V =1μA 13.3 V Reverse Leakage Current V BR =1V 1. μa =/µs, Fwd 1.5 V =1A, t P =/μs, Fwd 3. V Dynamic Resistance R DYN =1ns, I/O to Ground.1 Ω =/µs 17. A IEC 1-- (Contact Discharge) ±3 kv IEC 1-- (Air Discharge) ±3 kv Diode Capacitance 1 C D-GND Reverse Bias=V, f=1mhz 1 pf Revision: 7/19/1
3 AQ15C Electrical Characteristics (T OP =5ºC) 1μA 15. V =1μA 1.7 V Reverse Leakage Current V BR =15V 1. μa =/µs, Fwd. V =/µs, Fwd 31. V Dynamic Resistance R DYN =1ns, I/O to Ground. Ω =/µs 1. A IEC 1-- (Contact Discharge) ±3 kv IEC 1-- (Air Discharge) ±3 kv AQC Electrical Characteristics (T OP =5ºC) 1μA. V =1μA.7 V Reverse Leakage Current V BR =V 1. μa =/µs, Fwd 3. V =5A, =/µs, Fwd. V Dynamic Resistance R DYN =1ns, I/O to Ground. Ω =/µs 7. A IEC 1-- (Contact Discharge) ±3 kv IEC 1-- (Air Discharge) ±3 kv AQ3C Electrical Characteristics (T OP =5ºC) 1μA 3. V =1μA. V Reverse Leakage Current V BR =3V 1. μa =/µs, Fwd 5. V =5A, =/µs, Fwd. V Dynamic Resistance R DYN =1ns, I/O to Ground. Ω =/µs 5. A IEC 1-- (Contact Discharge) ±3 kv IEC 1-- (Air Discharge) ±3 kv Note: 1. Parameter is guaranteed by design and/or component characterization..transmission Line Pulse (TLP) with 1ns width, ns rise time, and average window t1=7ns to t= 9ns Revision: 7/19/1
4 Capacitance vs. Bias 1 1 Capacitance (pf 1 1 AQ5C SD5C AQ1C SD1C SD15C AQ15C SDC AQC AQ3C SD3C Bias Voltage (V Power Derating Curve /μs Pulse Waveform % of Rated Power Ambient Temperature - T A ( o C) Percent of 11% 1% 9% % 7% % 5% % 3% % 1% % Time (μs) AQ5C Transmission Line Pulsing(TLP) Plot AQ1C Transmission Line Pulsing(TLP) Plot Revision: 7/19/1
5 Temperature TVS Diode Array (SPA Diodes) AQ15C Transmission Line Pulsing(TLP) Plot AQC Transmission Line Pulsing(TLP) Plot AQ3C Transmission Line Pulsing(TLP) Plot Product Characteristics Lead Plating Lead Material Lead Coplanarity Substrate material Body Material Flammability Matte Tin Copper Alloy. inches (.1mm) Silicon Molded Compound UL Recognized compound meeting flammability rating V Soldering Parameters Reflow Condition Pre Heat - Temperature Min (T s(min) ) 15 C - Temperature Max (T s(max) ) C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP - Time (min to max) (t s ) 1 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T L T S(max) Preheat t L Ramp-down T S(max) to T L - Ramp-up Rate Reflow - Temperature (T L ) (Liquidus) 17 C 3 C/second max - Temperature (t L ) 15 seconds Peak Temperature (T P ) +/-5 C T S(min) 5 t S time to peak temperature Time Time within 5 C of actual peak Temperature ( ) seconds Ramp-down Rate C/second max Time 5 C to peak Temperature (T P ) minutes Max. Do not exceed C Revision: 7/19/1
6 c. D b TVS Diode Array (SPA Diodes) Part Numbering System Ordering Information Part Number Package Min. Order Qty. Automotive Grade TVS Diode Arrays (SPA Diodes) Voltage Bidirectional Number of Channels AQ ** C 1 F T G G= Green T= Tape & Reel Package F: SOD33 AQ5C-1FTG SOD33 3 AQ1C-1FTG SOD33 3 AQ15C-1FTG SOD33 3 AQC-1FTG SOD33 3 AQ3C-1FTG SOD33 3 Part Marking System G * 1 Blank: Blank: SD5C-1FTG AQ5C-1FTG 1: 1: SD1C-1FTG AQ1C-1FTG : : SD15C-1FTG AQ15C-1FTG 3: 3: SDC-1FTG AQC-1FTG : : SD3C-1FTG AQ3C-1FTG Package Dimensions -SOD33 E E1 L1.5 A1 A A Recommended Solder Pad 1. SOD33 Symbol Millimeters Inches Min Max Min Max A A A b c D E E L Unit: mm Revision: 7/19/1
7 General Purpose ESD Protection - SD-C AQxxC Series Embossed Carrier Tape & Reel Specification SOD33 Symbol Millimeters Cpmponent Orientation in Tape,Ref.,Ref. A 1.3min/1.max B.9+/-.1 W.+.3/-.1 D D1 ø1.min/ø1.5max E 1.75+/-.1 E - F 3.5+/-.5 P.+/-.1 P.+/-.1 P1.+/-.5 K 1.15min/1.5max T.5+/-.13 Pin1 mm TAPE AND REEL,Ref. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at Revision: 7/19/1
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