G H I All Dimensions in millimeter Portable electronics Cellular handsets and accessories.

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1 LITE-ON SEMICONDUCTOR BIDIRECTIONAL ESD PROTECTION DIODES STAND-OFF VOLTAGE Volts POWER DISSIPATION - 35 WATTS GENERAL DESCRIPTION Electro Static Discharge ( ESD ) protection diodes in ultra small SMD Plastic packages designed to protect one signal line from the damage caused by ESD and other transients. SOD323 SOD323 FEATURES Bidirectional ESD protection of one line. Max. peak pulse power : Ppp = 35W at tp = 8/2 us ESD protection>25kvper MIL-STD-883C, Method 315-6:Class3 IEC , level 4 ( ESD ), >15KV ( air ) ; >8KV ( contact ). Qualified to AEC-Q11 Rev_C F Detail X DIM. MIN. MAX. A B.25.4 C.1.25 D E F APPLICATION Computers and peripherals Communication system Notebooks. Desktops & Servers. B H G I C G H I All Dimensions in millimeter Portable electronics Cellular handsets and accessories. PIN A SSIGNMENT 1 Cathode MECHANICAL DATA 2 Cathode Case Material: "Green" molding compound UL flammability classification 94V- (No Br.Sb, Cl) Terminals: Lead Free Plating (Matte Tin Finish) Component in accordance to RoHs 211/65/EU MAXIMUM RATINGS (Tj= 25 unless otherwise noticed) Rating Symbol Value Unit Peak pulse Power ( 8/2us Waveform) PPPM 35 W Peak Pulse Current ( 8/2us Waveform) IPP 15 A Operating Junction Temperature Range TJ -55 to + 15 Storage Temperature Range Tstg -55 to + 15 Soldering Temperature, t max = 1s TL 26 ELECTRICAL CHARACTERISTICS (Tj= 25 unless otherwise noticed) Parameter Symbol Conditions MIn Max Unit Reverse standoff voltage VDRM V Reverse leakage current IRM VDRM = 12 V ua Breakdown voltage VBR IR = 1 ma V Diode capacitance CJ VR = V, f = 1MHz pf Clamping voltage VCL IPP = 15A ( 8/2us ) V REV. 4, FEB-216, KSIR23

2 12 1% Ipp: 8us 1% 9% Percent of Peak Pulse Current (%) 4 e -1 5% Ipp: 2us Time (us) Percent of Peak Pulse Current % 1% tr =.7 ~1 ns 3 ns 6 ns Time (ns) Figure 1. 8/2 us pulse waveform according to IEC Figure 2. ESD pulse waveform according to IEC T J =25, tp (us) = 8/2 us exponentially decay waveform Ppp Ppp (25 ) Peak pulse Power (W) Capacitance (pf) Pulse Time (us) Figure 3. Power Dissipation versus Pulse Time T J =25, f=1mhz, Vosc=1V Reverse Voltage (V) Figure 5. Typical Junction Capactiance ) ) Ppp / Ppp (25 IR / IR ( e Junction Temperature ( ) Figure 4. Peak pulse power versus TJ Junction Temperature ( ) Figure 6. Reverse Leakage Current versus TJ

3 I/O1 +/-8KV ESD Contact discharge Figure 7. ESD Test Configuration Figure 8. Clamped +8 kv ESD voltage waveform Figure 9. Clamped -8 kv ESD voltage waveform

4 Marking & Orientation WBC WBC Note: Marking is none direction Packaging Information DEVICE Q'TY/REEL REEL DIA. (INCH) Q'TY/BOX Q'TY/CARTON K/18K SOD-323 Soldering Pad Layout

5 Legal Disclaimer Notice Important Notice and Disclaimer LSC reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use. LSC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does LSC assume any liability for application assistance or customer product design. LSC does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of LSC. LSC products are not authorized for use as critical components in life support devices or systems without express written approval of LSC.

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