PARAMETER SYMBOL TESD5V0V4UA UNIT Marking code on the device

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Basil McBride
6 years ago
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accordance to WEEE 22/96/EC Halogen-free according to IEC 61249-2-21 APPLICATIONS USB 2. / 3. / 3.1 High Definition Multi-Media Interface(HDMI 1.3 /1.4 / 2.

MECHANICAL DATA Case: 251P1 Molding compound meets UL 94 V- flammability rating Moisture sensitivity level: level 1, per J-STD-2 Packing code with suffix

1 V WM =5V,.8pF ESD Protection Array FEATURES Meet IEC61-4-2(ESD) ±17kV(air), ±12kV(contact) Working Voltage: 5V Compliant to RoHS directive 211/65/EU and in accordance to WEEE 22/96/EC Halogen-free according to IEC APPLICATIONS USB 2. / 3. / 3.1 High Definition Multi-Media Interface(HDMI 1.3 /1.4 / 2.) KEY PARAMETERS PARAMETER VALUE UNIT P PPSM 95 W I PP 5 A V WM 5 V V (BR) at I R = 1 ma 6 V V C at I PP = 5 A 19 V Package 251P1 Configuration Single dice MECHANICAL DATA Case: 251P1 Molding compound meets UL 94 V- flammability rating Moisture sensitivity level: level 1, per J-STD-2 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per J-STD-2 Meet JESD 21 class 1A whisker test Polarity: As marked Weight: 3.59 mg (approximately) ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL TESD5VV4UA UNIT Marking code on the device 24A Rated random recurring peak Impulse power dissipation (tp=8/2μs waveform) P PPSM 95 W Peak impulse current (tp=8/2μs waveform) I PP 5 A ESD per IEC (Air) ESD per IEC (Contact) Junction temperature range T J -55 to +125 C Storage temperature range T STG -55 to +125 C V ESD ±17 ±12 kv 1 Version:A175

2 ELECTRICAL SPECIFICATIONS (T A = 25 C unless otherwise noted) PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT Forward voltage per diode (1) I R = 1 ma V (BR) V Rated working standoff voltage V WM V Reverse current (1) Clamping voltage (2) Clamping voltage (2) Junction capacitance Junction capacitance Notes: 1. Pulse test with PW=3 ms 2. tp=8/2μs waveform V R = 5 V I PP = 1 A I PP = 5 A 1 MHz, V R = V 1 MHz, V R = V (between I/O pins ) I R µa V C V V C V C J pf C J pf ORDERING INFORMATION PART NO. PACKING CODE PACKING CODE SUFFIX PACKAGE PACKING TESD5VV4UA (Note 1) RD G 251P1 3K / 7" Reel Notes: 1. Whole series with green compound EXAMPLE EXAMPLE P/N PART NO. PACKING CODE PACKING CODE SUFFIX DESCRIPTION TESD5VV4UA RDG TESD5VV4UA RD G Green compound 2 Version:A175

TLP Current(A) Junction Capacitance CJ(pF) Peak Impulse Current IPP(%) Peak Impulse Current IPP(%) TESD5VV4UA CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted) Fig.

3 TLP Current(A) Junction Capacitance CJ(pF) Peak Impulse Current IPP(%) Peak Impulse Current IPP(%) TESD5VV4UA CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted) Fig. 1 8/2μs pulse waveform Fig. 2 ESD pulse waveform according to IEC according to IEC % Ipp ; 8 μs e -t 5% Ipp ; 2 μs t (μs) t r =.7ns to 1ns t(ns) Fig. 3 TLP I-V Curve Fig. 4 Typical Junction Capacitance TLP Volts(V) Reverse Voltage (V) 3 Version:A175

4 Junction Capacitance CJ(pF) TESD5VV4UA CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted).6 Fig. 5 Typical Junction Capacitance (between I/O pins ) Reverse Voltage (V) 4 Version:A175

PACKAGE OUTLINE DIMENSION 251P1 DIM. Unit (mm) Unit (inch) Min Max Min Max A.5.65.

5.2 L.3.425.12.17 SUGGESTED PAD LAYOUT DIM. Unit (mm) Unit (inch) Typ. Typ. A 1.

5 PACKAGE OUTLINE DIMENSION 251P1 DIM. Unit (mm) Unit (inch) Min Max Min Max A A A b b D E e.5.2 L SUGGESTED PAD LAYOUT DIM. Unit (mm) Unit (inch) Typ. Typ. A B.5.2 C.2.8 D E F G.4.16 H Version:A175

6 Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version:A175

200mW, V High Voltage SMD Switching Diode

200mW, V High Voltage SMD Switching Diode 200mW, 120-250V High Voltage SMD Switching Diode FEATURES Low power loss, high efficiency Ideal for automated placement High surge current capability Compliant to RoHS directive 2011/65/EU and in accordance