AQ4022 Series 1.3pF, 15A Discrete TVS Diode

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1 Lightning Surge Protection- SP4022 AQ4022 Series AQ4022 Series 1.3pF, 15A Discrete TVS Diode RoHS Pb GREEN Description The AQ4022 series integrates low capacitance steering diodes with one or two avalanche breakdown diodes for unidirectional or bidirectional protection, respectively, to protect against ESD and lightning induced surge events. These components can safely absorb up to 15A per IEC nd edition (t p =8/20μs without performance degradation and a minimum ±30kV ESD per IEC International Standard. The low loading capacitance and high surge capability make it ideal for protecting telecommunication ports such as xdsl and other high voltage, high speed legacy interfaces. Pinout Features Pin 1 Pin 2 ESD, IEC , ±30kV contact, ±30kV air EFT, IEC , 40A (5/50ns Lightning, IEC nd edition, 15A (t P =8/20μs Low capacitance of 1.3pF (@ V R =0V Low leakage current Unidirectional and bidirectional configuration Small SOD323 package fits 0805 footprints AEC-Q101 Qualified Moisture Sensitivity Level(MSL -1 Halogen free, lead free and RoHS compliant Cathode polarity for unidirectional only Functional Block Diagram Applications 1 1 xdsl Interfaces RS-232 RS-485 Power Ports Security Equipment Instrumentation Medical Equipment Computers and Peripherals CAN Bus protection Automotive applications 2 2 Unidirectional Bidirectional AQ FTG SP FTG SP FTG SP FTG-C AQ FTG-C SP FTG-C Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Lightning Surge Protection- SP4022 AQ4022 Series Absolute Maximum Ratings Symbol Parameter Value Units Peak Current (t p =8/20μs 15 A P Pk Peak Pulse Power (t p =8/20μs 500 W T OP Operating Temperature -40 to 150 C T STOR Storage Temperature -55 to 150 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =25ºC Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM I R 1μA with Pin 1 to Pin 2 12 V Breakdown Voltage V BD I T =1mA with Pin 1 to Pin V Leakage Current I LEAK V R =12V with Pin 1 to Pin μa =1A, t p =8/20µs, Fwd 19 V Clamp Voltage 1 V C =2A, t p =8/20µs, Fwd 20 V =10A, t p =8/20µs, Fwd 28 V =15A, t p =8/20µs, Fwd 33 V Dynamic Resistance 2 R DYN TLP t p =100ns, Pin 1 to Pin Ω ESD Withstand Voltage 1 V ESD IEC (Contact Discharge ±30 kv IEC (Air Discharge ±30 kv Diode Capacitance 1 C D Reverse Bias=0V, f=1mhz, Pin 1 to Pin pf Note: 1Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP test setting : Std.TDR(50Ω,tp=100ns, tr=0.2ns ITLP and VTLP averaging window: start 1=70ns to end t2=80ns 8/20μs Pulse Waveform Capacitance vs. Reverse Bias (Pin 1 to Pin 2 Percent of 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% Capacitance (pf % Time (μs Bias Voltage (V

3 Temperature Clamping Voltage vs. Peak Pulse Current (Pin 1 to Pin 2 Transmission Line Pulsing (TLP Plot (Pin 1 to Pin Clamp Voltage (V C TLP Current (A Peak Pulse Current- (A TLP Volts (V Soldering Parameters Reflow Condition - Temperature Min (T s(min 150 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max 200 C - Time (min to max (t s secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max T S(min t S Preheat t L Ramp-down Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L seconds 25 time to peak temperature Time Peak Temperature (T P /-5 C Time within 5 C of actual peak Temperature (t p seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 260 C

4 c 0.2 D b Part Marking System Product Characteristics AQ FTG SP FTG Lead Plating Lead Material Matte tin Copper Alloy Lead Coplanarity Substrate material Body Material inches (0.102mm Silicon Molded Compound AQ FTG-C SP FTG-C 12C 1 2 UL Recognized compound meeting Flammability flammability rating V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Part Numbering System Automotive Grade TVS Diode Arrays (SPA Diodes Series Number of Channels AQ F T G C G= Green T= Tape & Reel Package F: SOD323 Blank = Unidirectional C= Bidirectional Ordering Information Part Number Package Marking Min. Order Qty. AQ FTG SOD AQ FTG-C SOD323 12C 3000 Package Dimensions -SOD323 E A1 A2 SOD323 Symbol Millimeters Inches Min Max Min Max A A A E1 A b c L Recommended Solder Pad D E E L Unit: mm

5 Embossed Carrier Tape & Reel Specification SOD323 Symbol Millimeters Component Orientation in Tape A /-0.10 B /-0.10 W /-0.10 D D1 0.45min/1.15max E /-0.10 E2 - F 3.50+/-0.10 P /-0.10 P 4.00+/-0.10 P /-0.05 K /-0.10 T /-0.02 Pin1 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at

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