5.0SMDJxxS Series, Single Chip Design
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1 5.SMDJxxS Series, Single Chip Design RoHS Pb e3 Description The 5.SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Agency Approvals AGENCY AGENCY FILE NUMBER E23531 Ratings and Thermal Characteristics (T A =25 O C unless otherwise noted Parameter Symbol Value Unit Peak Pulse Power Dissipation at T L =25 O C by 1/µs P PPM 5 W Waveform (Fig.2(Note 1(Note 2 Power Dissipation on Infinite Heat Sink at T L =5 O C P D 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3 I FSM 3 A Instantaneous Forward Voltage at A for Unidirectional V F 3.5 V Only Operating Temperature Range T J -65 to 15 C Storage Temperature Range T STG -65 to 175 C Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient R θjl 15 C/W R θja 75 C/W Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above T J (initial =25 O C per Fig Mounted on copper pad area of.31x.31 (8. x 8.mm to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only,duty cycle=4 per minute maximum. Functional Diagram For surface mounted applications to optimize board space Low profile package Typical failure mode is short from over-specified voltage or current Whisker test is conducted based on JEDEC JESD21A per its table 4a and 4c IEC ESD 3kV(Air, 3kV (Contact ESD protection of data lines in accordance with IEC EFT protection of data lines in accordance with IEC Built-in strain relief Glass passivated chip junction Very fast response time Excellent clamping capability Applications Low incremental surge resistance Typical I R less than 1μA when V BR min>12v High temperature to reflow soldering guaranteed: 26 C/1sec V T J = V C x (1+αT x (T J - 25 (αt:temperature Coefficient, typical value is.1% Plastic package is flammability rated V- per Underwriters Laboratories Meet MSL level1, per J-STD-2, LF maximun peak of 26 C Matte tin lead free plated Halogen free and RoHS compliant Pb-free E3 means 2 nd level interconnect is Pb-free and the terminal finish material is tin(sn (IPC/ JEDEC J-STD-69A.1 Bi-directional TVS devices are ideal for the protection of I/O Interfaces, V CC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Cathode Anode Uni-directional
2 Electrical Characteristics (T A =25 C unless otherwise noted Part Number (Uni Part Number (Bi Marking Reverse Stand off Voltage Breakdown Voltage V BR I T UNI BI (Volts MIN MAX Test Current I T (ma Clamping Voltage V I pp (V Peak Pulse Current I pp (A Reverse Leakage I (µa 5.SMDJ6.AS 5.SMDJ6.CAS 5PAB 5BAB X 5.SMDJ6.5AS 5.SMDJ6.5CAS 5PAE 5BAE X 5.SMDJ7.AS 5.SMDJ7.CAS 5PAF 5BAF X 5.SMDJ7.5AS 5.SMDJ7.5CAS 5PAG 5BAG X 5.SMDJ8.AS 5.SMDJ8.CAS 5PAK 5BAK X 5.SMDJ8.5AS 5.SMDJ8.5CAS 5PAM 5BAM X 5.SMDJ9.AS 5.SMDJ9.CAS 5PAP 5BAP X 5.SMDJ1AS 5.SMDJ1CAS 5PAR 5BAR X 5.SMDJ11AS 5.SMDJ11CAS 5PAT 5BAT X 5.SMDJ12AS 5.SMDJ12CAS 5PAV 5BAV X 5.SMDJ13AS 5.SMDJ13CAS 5PAX 5BAX X 5.SMDJ14AS 5.SMDJ14CAS 5PAZ 5BAZ X 5.SMDJ15AS 5.SMDJ15CAS 5PBE 5BBE X 5.SMDJ16AS 5.SMDJ16CAS 5PBG 5BBG X 5.SMDJ17AS 5.SMDJ17CAS 5PBK 5BBK X 5.SMDJ18AS 5.SMDJ18CAS 5PBM 5BBM X 5.SMDJ2AS 5.SMDJ2CAS 5PBP 5BBP X 5.SMDJ22AS 5.SMDJ22CAS 5PBR 5PBR X 5.SMDJ24AS 5.SMDJ24CAS 5PBT 5BBT X 5.SMDJ26AS 5.SMDJ26CAS 5PBV 5BBV X 5.SMDJ28AS 5.SMDJ28CAS 5PBX 5BBX X 5.SMDJ3AS 5.SMDJ3CAS 5PBZ 5BBZ X For bidirectional type having of 1 volts and less, the I R limit is double. Agency Approval I-V Curve Characteristics Uni-directional Bi-directional Vc VBR VR VF V Vc VBR VR VRVBR Vc V P PPM Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- voltage that can be applied to the TVS without operation V BR Breakdown Voltage -- voltage that flows though the TVS at a specified test current (I T Clamping Voltage -- Peak voltage measured across the TVS at a specified m (peak impulse current V C I R V F Reverse Leakage Current -- Current measured at Forward Voltage Drop for Uni-directional
3 Ratings and Characteristic Curves (T A =25 C unless otherwise noted Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS P PPM -Peak Pulse Power (KW 1 5kW at 1/µs, 25 C TJ initial = Tamb Time t d -Pulse Width (ms Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform Peak Pulse Power (P PP or Current (I PP Derating in Percentage % T J - Initial Junction Temperature (ºC I PPM - Peak Pulse Current, % I RSM 15 5 td tr=1µsec Peak Value IPPM Half Value IPPM 2 IPPM ( TJ=25 C Pulse Width(td is defined as the point where the peak current decays to 5% of IPPM 1/µsec. Waveform as defined by R.E.A t-time (ms Figure 5 - Typical Junction Capacitance Figure 6 - Typical Transient Thermal Impedance Cj(pF Uni -direc onal Bi-direc onal V=V Uni -direc onal V=VR Bi- direc onal V=V VBR -Reverse Breakdown Voltage(V Transient Thermal Impedance ( C/W T -Pulse Duration (s P
4 Temperature (T TVS Diodes Figure 7 - Non-Repetitive Peak Forward Surge Current Uni-Directional Only Figure 8 - Peak Forward Voltage Drop vs Peak Forward Current (Typical Values IFSM - Peak Forward Surve Current(A I F -Peak Forward Current(A Number of Cycles at 6 Hz V F -Peak Forward Voltage(V Soldering Parameters Reflow Condition Lead free assembly t p Pre Heat Physical Specifications Weight Case Polarity - Temperature Min (T s(min 15 C - Temperature Max (T s(max 2 C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T A to peak.7 ounce,.21 grams 3 C/second max T S(max to T A - Ramp-up Rate 3 C/second max - Temperature (T A (Liquidus 217 C Reflow - Time (min to max (t s 6 15 seconds Peak Temperature (T P 26 +/-5 C Time within 5 C of actual peak Temperature (t p 2 4 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 26 C JEDEC DO214AB. Molded plastic body over glass passivated junction Color band denotes positive end (cathode except Bidirectional. T P T L T s(max T s(min 25 C t s Preheat t 25 C to Peak Environmental Specifications High Temp. Storage HTRB Temperature Cycling Ramp-up Time (t JESD22-A13 JESD22-A18 JESD22-A14 t L Critical Zone T L to T P Ramp-down MSL JEDEC-J-STD-2, Level 1 H3TRB JESD22-A11 Terminal Matte Tin-plated leads, Solderable per JESD22-B12 RSH JESD22-A111
5 Dimensions DO-214AB (SMC J-Bend Cathode Band (for Uni-directional products only Dimensions Inches Millimeters Min Max Min Max A C A B C B D D H E F G E J G K F L H I J K I L Solder Pads Packaging Options (all dimensions in mm Part number Component Package Quantity Packaging Option Packaging Specification 5.SMDJxxS DO-214AB 3 Tape & Reel - 16mm tape/13 reel EIA STD RS-481 Part Numbering System Part Marking System 5.SMDJ xx C A S DESIGN CODE 5% V BR VOLTAGE TOLERANCE BI-DECTIONAL VOLTAGE SERIES F XXX YMXXX Cathode Band (for Uni-directional products only Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Tape and Reel Specification.157 (4..63 (16. Cathode.315 (8..59 DIA (1.5 Cover tape.8 (2.2 Arbor Hole Dia (33 Dimensions are in inches (and millimeters..65 (16.4 Direction of Feed
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