AG303-63PCB. Product Features. Product Description. Functional Diagram. Applications. Specifications (1) Typical Performance (1)

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1 AG-6 Product Features DC 6 MHz. db 9 MHz + dbm 9 MHz +6 dbm 9 MHz Single Voltage Supply Internally matched to Robust V ESD, Class C Lead-free/green/RoHS-compliant SOT-6 package Applications Mobile Infrastructure CATV / FTTX WLAN / ISM RFID WiMAX / WiBro Product Description The AG-6 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 9 MHz, the AG-6 typically provides. db gain, +6 dbm OIP, and + dbm PdB. The device combines dependable performance with consistent quality to maintain MTTF values exceeding years at mounting temperatures of + C and is housed in a lead free/green/rohs-compliant SOT-6 industry standard SMT package. The AG-6 consists of a Darlington-pair amplifier using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG-6 will work for other various applications within the DC to 6 GHz frequency range such as CATV and WiMAX. Functional Diagram RF IN 6 Function Pin No. Input Output/Bias 6 Ground,,, RF OUT Specifications () Parameter Units Min Typ Max Operational Bandwidth MHz DC 6 Operational Temperature o C - + Test Frequency MHz 9 Gain db. Input Return Loss db Output Return Loss db Output PdB dbm + Output IP () dbm +. Output IP dbm + Noise Figure db. Test Frequency MHz 9 Gain db Output PdB dbm +.6 Output IP () dbm +. Device Voltage V. Device Current ma Typical Performance () Parameter Units Typical Frequency MHz 9 9 S db S db S db Output PdB dbm Output IP dbm Noise Figure db..... Test conditions:. T = ºC, Supply Voltage = + V, Rbias =., System.. OIP measured with two tones at an output power of - dbm/tone separated by MHz. The suppression on the largest IM product is used to calculate the OIP using a : rule. Absolute Maximum Rating Parameter Storage Temperature DC Voltage RF Input Power (continuous) Thermal Resistance, Rth For 6 hours MTTF Junction Temperature Rating - to + C +. V + dbm C/W +77 C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. AG-6G AG-6PCB Description Standard tape / reel size = pieces on a 7 reel (lead-free/green/rohs-compliant SOT-6 Package) 7 MHz Fully Assembled Eval. Board TriQuint Semiconductor, Inc Phone FAX: info-sales@tqs.com Web site: Page of August 9

2 PdB (dbm) Output Power (dbm) Output Power (dbm) OIP (dbm) OIP (dbm) S, S (db) Device Current (ma) AG-6 Typical Device RF Performance Supply Bias = + V, R bias =., I cc = ma Frequency MHz 9 9 S db S db S db Output PdB dbm Output IP dbm Noise Figure DB Test conditions: T = ºC, Supply Voltage = + V, Device Voltage =. V, Rbias =., Icc = ma typical, System.. OIP measured with two tones at an output power of - dbm/tone separated by MHz. The suppression on the largest IM product is used to calculate the OIP using a : rule.. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Return Loss 6 I-V Curve S S - 6 Optimal operating point.... Device Voltage (V) Output IP vs. Frequency Output IP vs. Frequency... -C +C +C 6... Output Power / Gain vs. Input Power frequency = 9 MHz Output Power / Gain vs. Input Power frequency = MHz.... Gain Output Power Input Power (dbm) Gain Output Power Input Power (dbm) - TriQuint Semiconductor, Inc Phone FAX: info-sales@tqs.com Web site: Page of August 9

3 PdB (dbm) OIP (dbm) OIP (dbm) PdB (dbm) OIP (dbm) OIP (dbm) AG-6 Typical Device RF Performance (cont d) Supply Bias = +6 V, R bias =, I cc = ma Output IP vs. Frequency Output IP vs. Frequency... -c +c +c Typical Device RF Performance Supply Bias = + V, R bias =, I cc = ma Output IP vs. Frequency Output IP vs. Frequency... -c +c +c TriQuint Semiconductor, Inc Phone FAX: info-sales@tqs.com Web site: Page of August 9

4 AG-6 Vcc Icc = ma Application Circuit R Bias Resistor C Bypass C. µf RF IN C Blocking AG-6 L RF Choke C Blocking RF OUT Recommended Component Values Reference Designator 9 9 L nh nh 6 nh 7 nh nh nh nh C, C, C. µf pf pf 6 pf 6 pf 6 pf 9 pf. The proper values for the components are dependent upon the intended frequency of operation.. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. Value / Type Size L 9 nh wirewound inductor 6 C, C 6 pf chip capacitor 6 C. F chip capacitor 6 C Do Not Place R. % tolerance Recommended Bias Resistor Values Supply R value Size Voltage V. ohms 6 6 V ohms 7 V ohms V ohms 9 V 7 ohms V 6 ohms V ohms The proper value for R is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of + V. A % tolerance resistor is recommended. Typical Device Data S-Parameters (V device = +. V, I CC = ma, T = C, calibrated to device leads) Freq (MHz) S (db) S (ang) S (db) S (ang) S (db) S (ang) S (db) S (ang) Device S-parameters are available for download from the website at: TriQuint Semiconductor, Inc Phone FAX: info-sales@tqs.com Web site: Page of August 9

5 AG-6 Mechanical Information This package is lead-free/green/rohs-compliant. It is compatible with both lead-free (maximum 6 C reflow temperature) and leaded (maximum C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper. Outline Drawing Product Marking The component will be marked with a J designator followed by a two-digit numeric lot code on the top surface of the package. JXX Tape and reel specifications for this part are located on the website in the Application Notes section. MSL / ESD Rating ESD Rating: Class C Value: Passes V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD-A ESD Rating: Class IV Value: Passes V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD-C MSL Rating: Level at +6 C convection reflow Standard: JEDEC Standard J-STD- Land Pattern Mounting Config. Notes. Ground / thermal vias are critical for the proper performance of this device. Vias should use a.mm (# /. ) diameter drill and have a final plated thru diameter of. mm (. ).. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink.. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.. RF trace width depends upon the PC board material and construction. 6. Use oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. TriQuint Semiconductor, Inc Phone FAX: info-sales@tqs.com Web site: Page of August 9