Features. DC GHz GHz GHz DC GHz GHz GHz GHz DC - 4 GHz GHz Supply Current (Icq) ma

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1 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz Typical Applications The HMC311ST9(E) is ideal for: Cellular / PCS / 3G Fixed Wireless & WLAN CATV & Cable Modem Microwave Radio Functional Diagram Features P1 Output Power: +1. m Output IP3: +31. m Gain: 1 Ohm I/O s Industry Standard SOT9 Package Included in the HMC-DK1 Designer s Kit General Description Electrical Specifications, Vs= V, Rbias= Ohm, T A = + C Gain Gain Variation Over Temperature Return Loss Input / Output The HMC311ST9(E) is a GaAs InGaP Heterojunction Bipolar Transistor (HBT) Gain Block MMIC SMT DC to GHz amplifier. Packaged in an industry standard SOT9E, the amplifier can be used as either a cascadable Ohm gain stage or to drive the LO of HMC mixers with up to +1. m output power. The HMC311ST9(E) offers 1 of gain and an output IP3 of +31. m while requiring only ma from a +V supply. The Darlington feedback pair used results in reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components. Parameter Min. Typ. Max. Units DC - 1. GHz GHz. -. GHz DC -. GHz. -. GHz. -. GHz DC -. GHz. -. GHz. -. GHz Reverse Isolation DC - GHz Output Power for 1 Compression (P1) Output Third Order Intercept (IP3) Noise Figure DC -. GHz. -. GHz. -. GHz DC - 1. GHz GHz. -. GHz. -. GHz DC - GHz. -. GHz Supply Current (Icq) 7 ma Note: Data taken with broadband bias tee on device output / C / C / C m m m m m m m 1 Information For price, furnished delivery, by Analog and to Devices place is believed orders: to Analog be accurate Devices, and reliable. Inc., However, One Technology For price, Way, delivery, P.O. Box and to 9, place Norwood, orders: Analog MA -9 Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other Phone: Order online One at Technology Way, P.O. Box 9, Norwood, MA -9 rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any Phone: Order online at Application patent or patent rights Support: of Analog Phone: Devices. 1--ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1--ANALOG-D

2 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz Broadband Gain & Return Loss Gain vs. Temperature RESPONSE () S1 S11 S Input Return Loss vs. Temperature RETURN LOSS () C + C - C Reverse Isolation vs. Temperature GAIN () C + C - C Output Return Loss vs. Temperature RETURN LOSS () C + C - C Noise Figure vs. Temperature REVERSE ISOLATION () NOISE FIGURE () C + C - C + C + C - C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9, Norwood, MA -9 Phone: Order online at Application Support: Phone: 1--ANALOG-D

3 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz P1 vs. Temperature 1 Psat vs. Temperature 1 P1 (m) C + C - C Power 1 GHz Pout (m), GAIN (), PAE (%) INPUT POWER (m) Pout Gain PAE Output IP3 vs. Temperature IP3 (m) C + C - C Psat (m) C + C - C Power GHz Pout (m), GAIN (), PAE (%) INPUT POWER (m) Pout Gain PAE Gain, Power, OIP3 & Supply Current vs. Supply 1 GHz GAIN (), P1 (m), Psat (m), IP3 (m) Vs (Vdc) Gain P1 Psat IP3 7 3 Icq (ma) Icq 3 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9, Norwood, MA -9 Phone: Order online at Application Support: Phone: 1--ANALOG-D

4 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz Absolute Maximum Ratings Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vcc = +3.9V) Outline Drawing + m Junction Temperature 1 C Continuous Pdiss (T = C) (derate.1 mw/ C above C) Thermal Resistance (junction to lead).3 W 191 C/W Storage Temperature - to +1 C Operating Temperature - to + C ESD Sensitivity (HBM) Class1A, Passed V NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-1S OR EQUIVALENT.. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: % MATTE TIN. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS. DIMENSIONS ARE IN INCHES [MILLIMETERS]. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.1mm PER SIDE.. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 311 HMC311ST9 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [] H311 HMC311ST9E RoHS-compliant Low Stress Injection Molded Plastic % matte Sn MSL1 XXXX [1] Max peak reflow temperature of 3 C [] Max peak reflow temperature of C [3] -Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9, Norwood, MA -9 Phone: Order online at Application Support: Phone: 1--ANALOG-D

5 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz Pin Descriptions Pin Number Function Description Interface Schematic 1 RFIN Application Circuit This pin is DC coupled. An off chip DC blocking capacitor is required. 3 RFOUT RF output and DC Bias for the output stage., GND These pins and package bottom must be connected to RF/ DC ground. Note: 1. Select Rbias to achieve Icq using equation below, Rbias > Ohm.. External blocking capacitors are required on RFIN and RFOUT. Icq = Vs - 3. Rbias Recommended Component Values Component Frequency (MHz) L1 7 nh nh 1 nh 1 nh 1 nh. nh 3.3 nh 3.3 nh C1, C.1 µf pf pf pf pf pf pf pf For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9, Norwood, MA -9 Phone: Order online at Application Support: Phone: 1--ANALOG-D

6 HMC311ST9 / 311ST9E v.17 MMIC AMPLIFIER, DC - GHz Evaluation PCB List of Materials for Evaluation PCB 313 [1] Item J1 - J J3 - J Description PCB Mount SMA Connector DC Pin C1, C Capacitor, Pkg. C3 C C R1 L1 U1 PCB [] pf Capacitor, Pkg. pf Capacitor, 3 Pkg.. µf Capacitor, Tantalum Resistor, Pkg. Inductor, 3 Pkg. HMC311ST9(E) 73 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [] Circuit Board Material: Rogers 3 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Analog Devices upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9, Norwood, MA -9 Phone: Order online at Application Support: Phone: 1--ANALOG-D