HMC471MS8G / 471MS8GE. Features OBSOLETE. DC GHz GHz GHz GHz GHz

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1 v1.65 Typical Applications The HMC471MSG / HMC471MSGE is a dual RF/IF gain block & LO or PA driver: Cellular / PCS / 3G Fixed Wireless & WLAN CATV, Cable Modem & DBS Microwave Radio & Test Equipment Functional Diagram P1 Output Power: +2 m Gain: 2 Output IP3: +34 m Supply (Vs): +6V to +V. mm 2 Ultra Small Lead MSOP General Description Electrical Specifications, Vs=. V, Rbias= 3 Ohm, T A = +25 C The HMC471MSG & HMC471MSGE are SiGe HBT Dual Channel Gain Block MMIC SMT amplifi ers covering DC to 5 GHz. These versatile products contain two gain blocks, packaged in a single lead plastic MSOP, for use as either separate cascadable 5 Ohm RF/IF gain stages, LO or PA drivers or with both amplifi ers combined utilizing external hybrids to create a high linearity driver amplifi er. Each amplifi er in the HMC471MSG(E) offers 2 of gain, +2 m P1 with a +34 m output IP3 at 5 MHz while requiring only ma from a single positive supply. The combined dual amplifi er circuit delivers up to +21 m P1 with +36 m OIP3 for specifi c application bands through 4 GHz. Parameter Min. Typ. Max. Units Gain DC - 1. GHz GHz GHz GHz GHz Gain Variation Over Temperature DC - 5 GHz.. / C Input Return Loss DC - 2. GHz GHz GHz DC - 1. GHz 13 Output Return Loss GHz GHz GHz 5 Reverse Isolation DC - 5 GHz 2 Output Power for 1 Compression (P1) Output Third Order Intercept (IP3) (Pout= m per tone, 1 MHz spacing) Noise Figure Features.5-1. GHz GHz GHz GHz GHz.5-1. GHz GHz GHz GHz GHz DC - 4 GHz GHz Supply Current (Icq) ma Note: Data taken with broadband bias tee on device output. All specifi cations refer to a single amplifi er m m m m m m m m m - 52 One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D

2 v1.65 Broadband Gain & Return Loss Gain vs. Temperature RESPONSE () S21 5 S11 S Input Return Loss vs. Temperature Output Return Loss vs. Temperature RETURN LOSS () Reverse Isolation vs. Temperature REVERSE ISOLATION () GAIN () RETURN LOSS () Noise Figure vs. Temperature NOISE FIGURE () Data shown is of a single amplifi er. One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D - 53

3 v1.65 P1 vs. Temperature P1 (m) Output IP3 vs. Temperature IP3 (m) Vcc vs. Icc Over Temperature for Fixed Vs= V, RBIAS= 51 Ohms Icc (ma) Vcc (Vdc) Psat vs. Temperature Psat (m) Gain, Power & OIP3 vs. Supply Voltage for Constant Icc= 5 MHz Gain (), P1 (m), Psat (m), IP3 (m) Gain P1 Psat IP Vs (Vdc) Cross Channel Isolation PATH ISOLATION () INPUT1-OUTPUT2 INPUT2-OUTPUT Data shown is of a single amplifi er One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D

4 v1.65 Gain* GAIN () Reverse Isolation* REVERSE ISOLATION () Output P1* P1 (m) Input & Output Return Loss * RETURN LOSS () Output IP3* IP3 (m) Output Psat* Psat (m) INPUT RETURN LOSS OUTPUT RETURN LOSS * Measurements shown are of both channels with GHz splitter/combiners on input & output (see application circuit for balanced operation). One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D - 55

5 v1.65 Absolute Maximum Ratings Collector Bias Voltage (Vcc) Outline Drawing +6. Vdc Collector Bias Current (Icc) 1 ma RF Input Power (RFIN)(Vcc = +4.2 Vdc) + m Junction Temperature 15 C Continuous Pdiss (T = 5 C) (derate 32.6 mw/ C above 5 C) 2. W Thermal Resistance (junction to ground paddle) 3.7 C/W Storage Temperature -65 to +15 C Operating Temperature -4 to +5 C ESD Sensitivity (HBM) Class 1A ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.25mm PER SIDE. 5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H471 HMC471MSG Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H471 HMC471MSGE RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 C [2] Max peak refl ow temperature of 26 C [3] 4-Digit lot number XXXX - 56 One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D

6 v1.65 Pin Descriptions Pin Number Function Description Interface Schematic 1 RFIN1 This pin is DC coupled. An off chip DC blocking capacitor is required. RFOUT1 RF output and DC Bias (Vcc1) for the output stage. 2, 3, 6, 7 N/C 4 RFIN2 No connection. These pins may be connected to RF ground. Performance will not be affected. This pin is DC coupled. An off chip DC blocking capacitor is required. 5 RFOUT2 RF output and DC Bias (Vcc2) for the output stage. Ground Paddle GND Ground paddle must be connected to RF/DC ground. One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D - 57

7 v1.65 Application Circuit for Balanced Operation Note: 1. External blocking capacitors are required on RFIN and RFOUT. 2. RBIAS provides DC bias stability over temperature. Recommended Bias Resistor Values for Icc= 75 ma, Rbias= (Vs - Vcc) / Icc Supply Voltage (Vs) 6V V 1V V RBIAS VALUE 11 Ω 3 Ω 62 Ω 1 Ω RBIAS POWER RATING 1/4 W 1/2 W 1/2 W 1 W Recommended Component Values for Key Application Frequencies Frequency (MHz) Component L1, L2 27 nh 56 nh 1 nh 1 nh 15 nh.2 nh 6. nh C4, C5, C, C1.1 μf 1 pf 1 pf 1 pf 1 pf 1 pf 1 pf - 5 One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D

8 v1.65 Evaluation PCB List of Materials for Evaluation PCB 115 [1] Item J1 - J4 J5 - J Description PCB Mount SMA Connector DC Pins L1, L2 Inductor, 42 Pkg. C1, C 2.2 μf Capacitor, Tantalum C2, C7 1 pf Capacitor, 42 Pkg. C3, C6 1 pf Capacitor, 42 Pkg. C4, C5, C, C1 Capacitor, 42 Pkg. R1, R2 Resistor, 21 Pkg. U1 HMC471MSG / HMC471MSGE PCB [2] 12 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 435 The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 5 ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. One Technology Way, P.O. Box, Norwood, MA 262- Phone: Order online at 2 Alpha Road, Chelmsford, MA 1 Phone: Fax: Application Support: Phone: 1--ANALOG-D - 5