Typical Performance 1. Absolute Maximum Ratings

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1 Device Features +5V/215mA at operating bias condition Gain = MHz P1dB = MHz OIP3 = 42.1dBm 16dBm/tone at 2400MHz LTE 20M ACLR = 19.1dBm Output Power at 2400MHz Lead-free/Green/RoHS-compliant SOT89 SMT package Product Description The BT302 is a high performance and a high dynamic range amplifier in a low cost surface mount package(sot-89) with a RoHScompliant, that incorporates reliable heterojunction-bipolar-transistor (HBT) devices fabricated with InGaP/GaAs technology. This device is designed for use where high linearity is required and features high ACLR and P1 performance with low consumption current(215ma) and requires a few external matching components, DC blocking capacitors on the In/Output pin and a bypass capacitor and a RF choke for the out port. Applications Base station /Repeaters Infrastructure/Small Cell Commercial/Industrial/Military wireless system LTE / WCDMA /CDMA Wireless Infrastructure Application Circuits 1 Parameter Frequency Unit MHz Gain db S db S db OIP dbm P1dB dbm LTE 20M ACLR dbm WCDMA ACLR dbm Noise Figure db 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω 2 OIP3 _ measured on two tones with a output power 16dBm/ tone, F2 F1 = 1 MHz.. *ACLR Channel Power measured at -50dBc. - LTE set-up: 3GPP LTE, FDD E-TM3.1, 20MHz BW, ±5MHz offset, PAR Prob. - WCDMA set-up: 3GPP WCDMA, TM1+64DPCH, +5MHz offset, PAR 9.78 at 0.01% Prob. Min. Typical Max. Unit Bandwidth MHz I (Vcc&Vbias=5V) ma V CC /V bias 5.0 V R TH 19.5 C/W *External matching circuit: Refer to application circuit for each frequency. Absolute Maximum Ratings Parameter Rating Unit Operating Case Temperature -40 to +105 C Storage Temperature -55 to +155 C Junction Temperature 220 C Operating Voltage +6.0 V Supply Current 550 ma Input RF Power 24 dbm *Operation of this device above any of these parameters may result in permanent damage. 1

2 V-I Characteristics Typical Device Data S-parameters (Vc=5V, Ic=215mA, T=25 C) 2

3 (Vdevice = 5.0V, I c = 215mA, T = 25 C, calibrated to device leads) S-Parameter Freq S11 S11 S21 S21 S12 S12 S22 S22 [MHz] [Mag] [Ang] [Mag] [Ang] [Mag] [Ang] [Mag] [Ang]

4 Application Circuit: 915 MHz Schematic Diagram BOM Remark C uF C nF C3 C2 C1 Vcc C pF C pF L1 C pF RFin C4 C6 RFout C pF L3 U1 L2 C7 C5 C pF L nH Coil L nH L nH U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt ind(l3) and the input pin of BT mm. 3. Distance between the edge of the series ind(l2) and the output pin of BT mm. 4. Distance between the edge of the shunt cap(c7) and the output pin of BT mm. Figure about the reference position of components 4

5 5

6 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 6

7 Application Circuit: 1960 MHz RFin C4 C7 Schematic Diagram BOM Remark C uF C nF Vcc C3 C2 C1 L1 C6 RFout U1 C5 C8 C pF C pF C pF C pF C pF C pF L nH Coil U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt ind(c7) and the input pin of BT mm. 3. Distance between the edge of the shunt cap(c8) and the output pin of BT mm. Figure about the reference position of components 7

8 8

9 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 9

10 Application Circuit: 2140 MHz RFin C4 C7 Schematic Diagram BOM Remark C uF C nF Vcc C3 C2 C1 L1 C6 RFout U1 C5 C8 C pF C pF C pF C pF C pF C pF L nH Coil U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt ind(c7) and the input pin of BT mm. 3. Distance between the edge of the shunt cap(c8) and the output pin of BT mm. Figure about the reference position of components 10

11 11

12 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 12

13 Application Circuit: 2400 MHz RFin C4 C7 Schematic Diagram BOM Remark C uF C nF Vcc C3 C2 C1 L1 C6 RFout U1 C5 C8 C pF C pF C pF C pF C pF C pF L nH Coil U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt ind(c7) and the input pin of BT mm. 3. Distance between the edge of the shunt cap(c8) and the output pin of BT mm. Figure about the reference position of components 13

14 14

15 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 15

16 Application Circuit: 2600 MHz RFin C4 C7 Schematic Diagram BOM Remark C uF C nF Vcc C3 C2 C1 L1 C6 RFout U1 C5 C8 C pF C pF C pF C pF C pF C pF L nH Coil U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt ind(c7) and the input pin of BT mm. 3. Distance between the edge of the shunt cap(c8) and the output pin of BT mm. Figure about the reference position of components 16

17 17

18 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 18

19 Application Circuit: 3500 MHz RFin C4 C7 Schematic Diagram BOM Remark C uF C nF Vcc C3 C2 C1 L1 C6 RFout U1 C5 C8 C pF C pF C pF C pF C pF C pF L nH Coil U1 SOT89 BT302 Note: 1. Distance between the edge of the series cap(c6) and the input pin of BT mm. 2. Distance between the edge of the shunt cap(c7) and the input pin of BT mm. 3. Distance between the edge of the shunt cap(c8) and the output pin of BT mm. Figure about the reference position of components 19

20 20

21 3GPP WCDMA 1FA ACLR ( 50dBc) 3GPP LTE TM3.1 20MHz ACLR ( 50dBc) 21

22 PCB Land Pattern PCB Mounting Note : All dimension _ millimeters PCB lay out _ on BeRex website 22

23 Package Marking Tape & Reel SOT89 Packaging information: Tape Width (mm): 12 Reel Size (inches): 7 YY = Year, WW = Working Week, XX = Wafer No. Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1C Passes <2000V Human Body Model (HBM) JEDEC Standard JESD22-A114B MSL Rating: Standard: Level 1 at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F 23

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