Typical Performance 1. Absolute Maximum Ratings. Parameter

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1 Device Features Typical Isolation = 23 db Typical Insertion Loss = 0.4 db MSL 3 moisture rating Lead-free/RoHS-compliant SOIC-8 Plastic Package With exposed back side ground pad Product Description BeRex s Divider BD19B is designed for PCS, WCDMA & TD-SCDMA band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS-compliant with SOIC-8 surface mount package. It can be used without back side ground soldering. (This may degrade the performance at the high frequency edge.) Typical Performance 1 Parameter Min Typical Max Unit Frequency Range MHz Insertion Loss db Isolation db IRL(S11) db ORL(S22/S33) db Amplitude Balance db Phase Balance deg *All specifications apply to the following test conditions, 1. Device performance _ measured on BeRex E/B at 25 C, 50ohm system. 2. Insertion Loss: Above 3.0dB. 3. Back side ground _ soldered. Applications Base station Infrastructure Commercial/Industrial/Military wireless system Absolute Maximum Ratings Parameter Rating Input Power 1W CW dbm Storage Temperature -55 to +155 C Operating Temperature -40 to +85 C Operation of this device above any of these parameters may result in permanent damage. Evaluation Board Drawing Function Block Diagram Pins 1,3,4,6 and 7 must be DC and RF grounded. 1

2 Typical Test Data With Back Side Ground Soldering Parameters Unit PCS, WCDMA & TD-SCDMA Frequency Range MHz Insertion Loss db Isolation db IRL(S11) db ORL(S22,S33) db Phase Diff. deg Amplitude Balance db Without Back Side Ground Soldering Parameters Unit PCS, WCDMA & TD-SCDMA Frequency Range MHz Insertion Loss db Isolation db IRL(S11) db ORL(S22,S33) db Phase Diff. deg Amplitude Balance db

3 Insertion Loss vs. Frequency Isolation vs. Frequency IRL vs. Frequency ORL vs. Frequency Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering 3

4 Package Outline Drawing 4

5 Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting 0.047"(1.20) RF In 0.018"(0.45) 0.157"(3.98) 0.076"(1.92) 0.040"(1.01) RF Out1 RF Out "(0.76) 0.198"(5.02) Note : All dimension _ millimeters PCB lay out _ on BeRex website Package Marking Tape & Reel Packaging information: YY = Year, WW = Working Week, XX = Wafer No. SOIC8 SOIC8-Part orientation Direction of feed Tape Width (mm): 12 Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) 5

6 MSL / ESD Rating MSL Rating: Standard: Level 3 at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F 6

Typical Performance 1. Absolute Maximum Ratings. Parameter

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