Preliminary Datasheet

Transcription

1 Product Description The is an absorptive SPDT 50Ω matched RF switch supporting bandwidths up to 6GHz. Its high linearity performance across the temperature range makes it ideally suited for use in 3G/4G/5G wireless infrastructure and 802. a/n/ac/ax applications where high power and excellent performance is required. The is designed with robust ESD protection circuits at all pins and packaged in an industry standard, fully RoHS-compliant, 6-lead, 3mm x 3mm TQFN package. The does not require blocking capacitors. If DC is presented at the RF port, add a blocking capacitor. A functional block diagram is shown in Figure. Block Diagram RF 2 ESD Applications 50Ω 4 CTRL RFC 7 5 LS ESD 50Ω 6 VDD Figure Functional Block Diagram Wireless 3G/4G/5G Infrastructure WLAN 802. a/n/ac/ax ESD RF2 Package Type Device Features 6-Lead 3 x 3 x 0.75mm, TQFN Package Figure 2 Package Type Output frequency range : 50 MHz to 6.0 GHz Supply Voltage : 2.7V to 3.6V ESD, HBM : RF pins : All pins except RF pins Constant impedance during switching transition : Return loss 0dB Operating temperature range : -40 C C Low Insertion Loss : 2.35GHz : 3.5GHz : 4.9GHz High Isolation - RFC to RFx : 2.35GHz : 3.5GHz : 4.9GHz - RFx to RFx : 2.35GHz : 3.5GHz : 4.9GHz High Input db Compression : 2.35GHz : 3.5GHz : 4.9GHz High IIP3 : 2.35GHz : 3.5GHz : 4.9GHz Switching Time : 550ns 6-lead TQFN package : 3.0mm x 3.0mm x 0.75mm All other trademarks are the property of their respective owners. 208 BeRex Ver. 0.2

2 Electrical Specifications Typical conditions are at VDD = 3.3V, T A = 25 C, LS/CTRL Low = 0V, LS/CTRL High = 3.3V, Z L = 50Ω, Excluding SMA Connector and PCB loss (), unless otherwise noted. Table Electrical Specifications - 50Ω Parameter Path Condition Min Typ Max Unit Operating Frequency MHz Insertion Loss Isolation Isolation Return Loss (Active Port) RFx - RFx GHz 2GHz 3GHz 4GHz 5GHz 6GHz GHz 2GHz 3GHz 4GHz 5GHz 6GHz GHz 2GHz 3GHz 4GHz 5GHz 6GHz RFC, RF, RF2 50MHz 6GHz 5 db db db db Return Loss (Terminated Port) Return Loss during switching transition RFC, RF, RF2 50MHz 6GHz 5 db RFC, RF, RF2 50MHz 6GHz 0 db Input PdB 2.35GHz 3.5GHz 4.9GHz dbm Input IP3 (2) 2.35GHz 3.5GHz 4.9GHz dbm Input IP2 (2) 2.35GHz 3.5GHz 4.9GHz dbm 2 nd Harmonic (3) 2.35GHz 3.5GHz 4.9GHz dbc 3 rd Harmonic (3) 2.35GHz 3.5GHz 4.9GHz dbc Switching Time 50% control to 90% RF 50% control to 0% RF ns Settling Time 50% control to 90% RF 50% control to 0% RF ns () Excluding SMA Connector and PCB loss. (2) Tone Power is 8dBm and Tone spacing is 20KHz. (3) Tone Power is 8dBm. 2 All other trademarks are the property of their respective owners. 208 BeRex Ver. 0.2

3 VDD LS CTRL Product Description Table 2 Pin Descriptions No. Pin Name Descriptions RF 2 (Top View) 2 RF2 2 RF RF Port 7 RFC RF Common Port RF2 RF2 Port 3 Exposed Pad RFC Figure 3 Pin Description 4 CTRL Digital Control Logic Input 5 LS 6 VDD Supply Voltage,3,4,5,6,8,9,0, 2,3 Logic Select (Definition for the CTRL pin, See Table3) Ground Pad Exposed Pad Ground Table 3 Control Truth Table LS 0 0 CTRL RFC-RF RFC-RF2 0 OFF ON ON OFF 0 ON OFF OFF ON Table 4 Operating Ranges Parameter Symbol Min Typ Max Unit Supply Voltage VDD V Supply Current IDD μa Digital Input Control (LS/CTRL) Table 5 Absolute Maximum Ratings High V Low V Operating Temperature Range To C RF Input Power, CW (Active Port) 2.35GHz, 3.5GHz, 4.9GHz (any port) RF Input Power, CW (Terminated Port) 2.35GHz, 3.5GHz, 4.9GHz (RF, RF2 port) PMax,Active dbm PMax,Term dbm Parameter Symbol Min Max Unit Supply Voltage VDD V Digital Input Voltage LS/CTRL V Maximum Input Power, CW (+25 C) - - Input PdB dbm ESD Storage Temperature range C RF pins V HBM All pins V CDM All pins V All other trademarks are the property of their respective owners. 208 BeRex 3 Ver. 0.2

4 Typical Performances - 50Ω Typical conditions are at VDD = 3.3V, T A = 25 C, LS/CTRL Low = 0V, LS/CTRL High = 3.3V, Z L = 50Ω, Excluding SMA Connector and PCB loss, unless otherwise noted. Figure 4 Insertion Loss vs VDD (RFC - RF) Figure 5 Insertion Loss vs VDD (RFC - RF2) Figure 6 Insertion Loss vs Temp (RFC - RF) Figure 7 Insertion Loss vs Temp (RFC - RF2) Figure 8 Return Loss vs VDD (RFC, On State Figure 9 Return : RF ON vs RF2 ON All other trademarks are the property of their respective owners. 208 BeRex 4 Ver. 0.2

5 Typical Performances - 50Ω Typical conditions are at VDD = 3.3V, T A = 25 C, LS/CTRL Low = 0V, LS/CTRL High = 3.3V, Z L = 50Ω, Excluding SMA Connector and PCB loss, unless otherwise noted. Figure 0 Return Loss vs Temp (RFC) Figure Return Loss vs Temp (RF, RF2) Figure 2 Terminated Port Return Loss Figure 3 Terminated Port Return Loss vs Temp (RF) Figure 4 Isolation vs VDD (RFC to RFx) Figure 5 Isolation vs Temp (RFC to RFx) * Extrapolated data is the actual performance of part excluding the resonance of the Evaluation board. All other trademarks are the property of their respective owners. 208 BeRex 5 Ver. 0.2

6 Typical Performances - 50Ω Typical conditions are at VDD = 3.3V, T A = 25 C, LS/CTRL Low = 0V, LS/CTRL High = 3.3V, Z L = 50Ω, Excluding SMA Connector and PCB loss, unless otherwise noted. Figure 6 Isolation vs VDD (RFx to RFx) Figure 7 Isolation vs Temp (RFx to RFx) All other trademarks are the property of their respective owners. 208 BeRex 6 Ver. 0.2

7 Evaluation Board [Top view] [Bottom view] Figure 8 Evaluation Board Layout COPPER : oz (0.035mm), Top Layer RO4003C Er : 3.38 RO4003C / 0.305mm COPPER : oz (0.035mm), Inner Layer FR-4 Er : 4.5~4.8 FR-4 / 0.36mm FINISH THICKNESS :.55T COPPER : oz (0.035mm), Inner Layer FR-4 Er : 4.5~4.8 FR-4 / 0.73mm COPPER : oz (0.035mm), Bottom Layer Figure 9 Evaluation Board PCB Layer Information All other trademarks are the property of their respective owners. 208 BeRex 7 Ver. 0.2

8 CTRL C4 DNI R C3 should be placed near the device. LS VDD C5 DNI kω C DNI C2 DNI C3 00pF U J 6 C6 uf RF SMA3 CTRL LS VDD 2 2 RF RF2 SMA2 RF RFC R2 DNI RFC SMA Figure 20 Evaluation Board Schematic Table 6 Bill of Material - Evaluation Board 50Ω No. Ref Des Part Qty Part Number Remark C3 CAP pF J 50V C3 should be placed rear the 2 C6 CAP 608 uf J 50V 3 R RES 608 J Kohm 4 C, C2 2 CAP 608 DNI 5 R2 RES 608 DNI 6 C4, C5 2 CAP 005 DNI 7 J 6 Pin Header 8 RFC, RF, RF2 3 SMA_END_LAUNCH 9 U All other trademarks are the property of their respective owners. 208 BeRex 8 Ver. 0.2

9 Package Outline Drawing [ Top View ] [ Bottom View ] [ Side View ] Figure 2 Package Outline Drawing Figure 22 Recommended Land Pattern All other trademarks are the property of their respective owners. 208 BeRex 9 Ver. 0.2

10 Tape & Reel Packaging information : Figure 23 Tape & Reel Tape Width (mm) : 2 Reel Size (inches) : 7 Device Cavity Pitch (mm) : 8 Device Per Reel : 000EA Package Marking BS6420 : YY : Year WW : Work Week XX : Wafer Lot Number Figure 24 Package Marking All other trademarks are the property of their respective owners. 208 BeRex 0 Ver. 0.2

11 Lead plating finish 00% Tin Matte finish (All BeRex products undergoes a hour, 50 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating ESD Rating : Value : Test : Standard : Class2 Passes < 2000V Human Body Model (HBM) JEDEC Standard JESD22-A4B ESD Rating : Value : Test : Standard : ClassC3 Passes < 000V Charged Device Model (CDM) JEDEC Standard JESD22-C0F Caution : ESD Sensitive Appropriate precautions in handling, packaging and testing devices must be observed. Proper ESD procedures should be followed when handling the device. MSL Rating : Standard : MSL at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F All other trademarks are the property of their respective owners. 208 BeRex Ver. 0.2