Features OBSOLETE. Isolation DC GHz db

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1 Typical Applications Features The is ideal for: Cellular / 4G Infrastructure WiMAX, WiBro & Fixed Wireless Automotive Telematics Mobile Radio Test Equipment Functional Diagram Input P1dB: Vdd = High Third Order Intercept: +62 Positive Control: +3 to +8 V Low Insertion Loss:.4 db MSOP8G Package: 14.8 mm 2 General Description The is a high power SPDT switch in an 8-lead MSOPG package for use in transmit-receive applications which require very low distortion at high input signal power levels. The device can control signals from DC to 4 GHz. The design provides exceptional intermodulation performance; > + third order intercept at bias. RF1 and RF2 are refl ective shorts when OFF. On-chip circuitry allows single positive supply operation from +3 Vdc to +8 Vdc at very low DC current with control inputs compatible with CMOS and most TTL logic families. Electrical Specifications, T A = + C, Vctl = /Vdd, Vdd = (Unless Otherwise Stated), Ohm System Insertion Loss Parameter Frequency Min. Typ. Max. Units DC - 1. GHz.4.6 db DC - 2. GHz.6.8 db DC GHz db DC - 3. GHz db DC - 4. GHz db Isolation DC - 4. GHz 26 db Return Loss (On State) Input Power for.1db Compression Input Power for 1dB Compression Input Third Order Intercept (Two-tone input power = + each tone) Switching Characteristics DC - 1. GHz DC - 2. GHz DC - 3. GHz DC - 4. GHz Vdd = Vdd = Vdd = Vdd = Vdd = Vdd = GHz.1-2. GHz.1-3. GHz.1-4. GHz trise, tfall (1/9% RF) ton, toff (% CTL to 1/9% RF).1-4. GHz.1-4. GHz DC - 4. GHz Alpha Road, Chelmsford, MA 1824 Phone: Fax: db db db db ns ns

2 Insertion Loss vs. Temperature Isolation INSERTION LOSS (db) Insertion Loss vs. Vdd INSERTION LOSS (db) Return Loss RETURN LOSS (db) C - C 5 6 INPUT RETURN LOSS OUTPUT RETURN LOSS ISOLATION (db) Isolation vs. Vdd ISOLATION (db) RF1 to RF2 Isolation ISOLATION (db) RF1 RF RF1 ON RF2 OFF RF1 OFF RF2 ON Alpha Road, Chelmsford, MA 1824 Phone: Fax:

3 Input P1dB vs. Vdd Input P.1dB vs. Vdd P1dB () Input P1dB vs. Vdd = P1dB () Input IP3 vs. Tone Vdd = Input IP3 vs. Tone Vdd = Input IP3 vs. Tone Vdd = IP3 () + C - C P.1dB () IP3 () IP3 () Alpha Road, Chelmsford, MA 1824 Phone: Fax:

4 Input IP3 vs. Temperature 27 Tones, Vdd = Input IP3 vs. Temperature 27 Tones, Vdd = IP3 () Input IP3 vs. Temperature 27 Tones, Vdd = IP3 () + C - C + C - C IP3 () + C - C Input P1dB vs. Vdd Input P.1dB vs. Vdd Input IP3 vs. Tone Vdd = P.1dB () P1dB () IP3 () Alpha Road, Chelmsford, MA 1824 Phone: Fax:

5 Bias Voltage & Current Control Voltages & Currents Vdd (V) Truth Table Control Input (Vctl) Absolute Maximum Ratings Signal Path State A B RFC to RF1 RFC to RF2 High Low Off On Low High On Off RF Input Power (Vdd =, Ohm source & load impedances) Supply Voltage Range (Vdd) (Vctl = V) +39 (T = +85 C) -.2 to +9V Control Voltage Range (A & B) -.2 to Vdd +.5V Channel Temperature 1 C Continuous Pdiss (T = 85 C) (derate mw/ C above 85 C) W Thermal Resistance (Channel to ground paddle) Typical Idd (μa) C/W Storage Temperature -65 to +1 C Operating Temperature - to +85 C ESD Rating Class 1A HBM Note: DC blocking capacitors are required at ports RFC, RF1 and RF2. Their value will determine the lowest transmission frequency. State Vdd = (μa) Vdd = (μa) Vdd = (μa) Low ( to +.2V).5 2 High (Vdd ±.2V) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Alpha Road, Chelmsford, MA 1824 Phone: Fax:

6 Outline Drawing Package Information NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE. 5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] [2] H784 RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak refl ow temperature of 2 C Alpha Road, Chelmsford, MA 1824 Phone: Fax:

7 Pin Descriptions Pin Number Function Description Interface Schematic 1 A See truth table and control voltage table. 2 B See truth table and control voltage table. 3, 5, 8 RFC, RF1, RF2 Typical Application Circuit This pin is DC coupled and matched to Ohms. Blocking capacitors are required. 4 Vdd Supply Voltage 6, 7 GND Package bottom must also be connected to PCB RF ground. Notes: 1. Set logic gate and switch Vdd = to and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd of +3 to +8 Volts applied to the CMOS logic gates and to pin 4 of the RF switch. 3. DC Blocking capacitors are required for each RF port as shown. Capacitor value determines lowest frequency of operation. 4. Highest RF signal power capability is achieved with V set to. The switch will operate properly (but at lower RF power capability) at bias voltages down to. - 2 Alpha Road, Chelmsford, MA 1824 Phone: Fax:

8 Evaluation Circuit Board List of Materials for Evaluation PCB [1] Item J1 - J3 J4 - J7 C1 - C3 C4 R1 - R3 U1 PCB [2] Description PCB Mount SMA RF Connector DC Pin 1 pf capacitor, 2 Pkg. 1 KpF capacitor, 3 Pkg. 1 Ohm Resistor, 2 Pkg. T/R Switch Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 43 The circuit board used in the fi nal application should be generated with proper RF circuit design techniques. Signal lines at the RF port should have ohm impedance and the package ground leads and package bottom should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon request. Alpha Road, Chelmsford, MA 1824 Phone: Fax: