Features. = +25 C, With 0/-5V Control, 50 Ohm System. Parameter Frequency Min. Typ. Max. Units GHz GHz

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1 Typical Applications The is ideal for: Fiber Optics & Broadband Telecom Microwave Radio & VSAT Military Radios, Radar, & ECM Test Instrumentation Functional Diagram Features High Isolation: 1 GHz 2 GHz Low Insertion Loss: 1 GHz 2 GHz Fast Switching: 6 ns Non-Reflective Design 16 Lead Ceramic 3x3 mm SMT Package: 9mm 2 General Description The is a general purpose broadband high isolation non-reflective GaAs MESFET SPDT switch in a ceramic 3x3 mm leadless surface mount package. Covering DC to 28. GHz, the switch offers over 4 isolation and less than 2 insertion loss at midband. The wide bandwidth, fast switching, and compact size make this absorbtive SPDT ideal for miliitary ew/ecm and test equipment applications. The switch operates using complementary negative control voltage logic lines of -5/V and requires no bias supply. Electrical Specifications, T A = +25 C, With /-5V Control, 5 Ohm System Insertion Loss Isolation Parameter Frequency Min. Typ. Max. Units DC - 1. GHz GHz GHz DC - 1. GHz GHz GHz Return Loss On State DC GHz 17 Return Loss RF1, RF2 Input Power for 1 Compression Off State Input Third Order Intercept (Two-Tone Input Power= +7 m Each Tone) Switching Characteristics trise, tfall (1/9% RF) ton, toff (5% CTL to 1/9% RF) DC - 1. GHz GHz GHz DC -.5 GHz GHz 2 DC -.5 GHz GHz DC GHz m m m ns ns 1

2 Insertion Loss Return Loss INSERTION LOSS () C +85 C -4 C Isolation Between Ports RFC and RF1/RF2 ISOLATION () RF1 RF2 RETURN LOSS () Isolation Between Ports RF1 and RF2 ISOLATION () RFC RF1,RF2 ON RF1,RF2 OFF RF1 PATH ON RF2 PATH ON Input P1 and P.1 Compression Point 3 Input Third Order Intercept Point 55 INPUT P1 AND P.1 (m) P1 P.1 INPUT IP3 (m) C +85 C -4 C

3 Absolute Maximum Ratings Control Voltages RF Input Power (A,B = V/-5V) Control Voltage Range (A & B) Hot Switch Power Level (A,B = V/-5V) +25 m +5.V to -7.5V +22 m Channel Temperature 15 C Continuous Pdiss (T=85 C) (derate 3.3 mw/ C above 85 C) (Insertion Loss Path) Thermal Resistance (Insertion Loss Path) Continuous Pdiss (T=85 C) (derate 5.6 mw/ C above 85 C) (Terminated Path) Thermal Resistance (Terminated Path).215 W 32 C/W.363 W 179 C/W Storage Temperature -65 to +15 C Operating Temperature -4 to +85 C ESD Sensitivity (HBM) Class 1A State Low High Truth Table Bias Condition to 1 ua Max. 3 ua Typ. to 1 ua Typ. (±.5V) Control Input Signal Path State A B RFC to RF1 RFC to RF2 High Low On Off Low High Off On ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 3

4 Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA. 2. LEAD AND GROUND PADDLE PLATING: GOLD FLASH OVER NICKEL. 3. DIMENSIONS ARE IN INCHES (MILLIMETERS). 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED.5MM DATUM C 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] [1] H547 Alumina, White Gold over Nickel MSL3 XXXX [1] Max peak reflow temperature of 26 C [2] 4-Digit lot number XXXX 4

5 Pin Descriptions Pin Number Function Description Interface Schematic 1, 5, 9, 12, 16 N/C 2, 4, 6, 8, 13, 15 GND 3, 7, 14 RFC, RF1, RF2 This pin should be connected to PCB RF ground to maximize isolation Package bottom has exposed metal paddle that must also be connected to PCB RF ground. This pin is DC coupled and matched to 5 Ohm. Blocking capacitors are required if RF line potential is not equal to V. 1 B See truth table and control voltage table. 11 A See truth table and control voltage table. 5

6 Evaluation PCB List of Materials for Evaluation PCB EVAL1- [1] Item J1 - J3 J4 - J6 R1 - R2 U1 PCB [2] Description PCB Mount SRI SMA Connector DC Pin 1 Ohm Resistor, 63 Pkg. SPDT Switch Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 435 The circuit board used in the application should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 5 Ohm impedance and the package ground leads and package bottom should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon request. 6