mmw to THz ultra high data rate radio access technologies

Transcription

1 mmw to THz ultra high data rate radio access technologies Dr. Laurent HERAULT VP Europe, CEA LETI Pierre Vincent Head of RF IC design Lab, CEA LETI

2 Outline mmw communication use cases and standards mmw CEA LETI mmw communication challenges THz communication challenges Summary & conclusions 19th January

3 Wireless HD 19th January

4 WIGIG applications Kiosk, P2P Forecasted market: - 2 million chipsets by 2015 (ADI Research) - 1 billion chipsets by 2020 (NICTA) Wireless Display Cordless Computing WLAN Other potential applications: fine localization, chip to chip, board to board (connector replacement), etc 19th January

5 Redefining Home Networks with mmwave BS/CS/Digital Terrestrial Analog Signal Digitally Stored TV Program (Compressed) Digitally Stored TV Program (Compressed) Internet Access Fast synchronization HD Uncompressed Digital Stream Femto base station on the ceiling & Backbone Low power, short range 1m 1 to 10 Gbps link UC1 Multiple Data Streams Internet HDD Home Server / Router TV Monitor UC2 HD-DVD Player TV Monitor Digital Media Adaptor No penetration through walls (High Security) Ultra High-Speed Stream HD Video 2 to 6 Gbps Medium range 10m 19th January

6 Other Gbps wireless standards : Uncompressed Audio & Video streaming Up to 3Gbps over 30m In the unlicensed GHz band Commercial products by Amimon : Short range Photo & Video transfer Up to 560Mbps over 15m In the GHz band Antenna is replaced by a specific coupler (close proximity) (CameraJet, Wireless USB, Wireless 1394 ) Compressed 1080p Video transfer, Data transfer Up to 1024Mbps (480Mbps historical limit) In the GHz band 19th January

7 mmw Gbps wireless standards : Uncompressed Audio & Video streaming, multimedia kiosk, P2P link, multi Gbps WLAN Up to 6.8Gbps 4 60GHz Active discussions with WiFi Alliance Uncompressed Audio & Video streaming Up to 7.1Gbps 4 60GHz Future evolutions: 10 28Gbps 19th January

8 Technology LETI Need of versatile and reconfigurable chip architecture to satisfy multiple markets with a single packaging solution P2P, Wireless display, cordless computing & WLAN Internet access Multiple set of range and data rate 1 to 3m, 10m) Single carrier (priority) and OFDM (compatibility) 1 to 8 paths antenna array High volume & Low cost Single chip on advance 65 nm CMOS Bulk & SOI Low form factor 3D packaging (organic, silicon interposer) Low Power efficient RFFE & digital processing Digital compensation of RF impairments Leti s tester Verigy Address manufacturability Testability with standard industrial equipment at silicon and packaging level 19th January

9 Leti developments Two 60GHz developments have been implemented and tested. Frequency domain: Industrial partner STM Objectives: Demonstration of 3.8Gbps OFDM 60GHz wireless link at 3meters using standard CMOS 65nm RFFE Roller with industrial HTCC package Time domain: Industrial partner Nokia Objectives: Merge UWB power efficient architecture and high performances 65nm SOI High Resistivity substrate technology to provide 0,5m, 2.5Gbps very low power and cost solution Concept «Explore & Share» 19th January

10 60GHz WiHD industrial module 13.5*8.5mm² Industrial HTCC 3.8Gbps, 3 meters, single IPD glass antenna 3 Chips on CMOS standard 65nm : RFFE, PA et Digital BB. Transceiver chip 3.3x2.8mm² Flip chip CMOS PA 1.0X0.7mm² TX antenna ADC/DAC Digital BB CMOS 65 HTCC module (13.5x8.5mm²) RX antenna 19th January

11 60GHz RFFE architecture Sliding IF architecture TX mode: 474 mw + 700mW external CMOS PA RX mode: 530 mw State of the art: 3 ISSCC papers 2010 & 2011 PPA Mixer Baseband input I (50 ) 60GHz RF output (50 ) 36MHz External Ref. 60GHz RF input (50 ) 40GHz LO 40GHz LO LNA 20GHz 0 /90 and 40GHz PLL Mixer 20GHz LO GHz LO 5 th order I2C, Registers, Channel selection, Power management 3 rd order Baseband input Q (50 ) Baseband output Q (50 ) Baseband output I (50 ) 19th January

12 WiHD Digital Base Band processing WiHD specification need Digital compensation of RF impairments: IQ mismatch Time and frequency offset Common phase noise 12mm 26 mm CMOS 65nm 2.53GHz 9bit ADC & DAC Mux & Dmux 320MHz Digital clock HRP & LRP modem 19th January

13 60GHz Wireless demonstration Compliant with WiHD HRP2 modulation OFDM 16QAM 3.8Gbps 4 channels, Single Antenna, Up to 3m TX RX 19th January

14 Time Domain 60GHz transceiver IR UWB at 60GHz will offer new uses cases for device to device communications 2.5Gbps (RFFE +DBB): TX 30mW, RX 70mW Range 0.5m meter single antenna Scalable data rate from 100Mbps to 2.5Gbps Integrated 4dBi 60GHz Antenna (thanks to SOI 65nm HR process) Very low cost (standard package) 2mm x 3.5mm Pulse Generator PA TX 60GHz UWB TX Data input Signal shaping RF output Re-generation RF input LNA Synchronization managment Detection, analogue base band, digitization RX Data output RX antenna 60GHz UWB RX TX antenna 19th January

15 mmw challenge: long range backhauling Explore mmw spectrum for larger bandwith for backhauling Mobile data explosion Video becoming major content Target: > 1Gbps data Range from 250 to 1000m BW from 500Mhz to 1GHz Carrier from 30GHz to 90GHz 19th January

16 Other challenges: 70 80GHz outdoor Private networks Enterprise LAN extensions Fiber extensions Fiber backup Diversity Connections 19th January

17 mmw long range communications challenges Spectrum allocation mmw outdoor channel models Antennas: directionality Increasing antenna and RF efficiencies High gain power amplifier Digital BB CMOS implementation Low power, area & cost effective solutions 19th January

18 Terahertz Transition region between Electronics and Photonics: λ = 1mm 0,1mm Measurement instrumentation is scarce and expensive THz communications: spectrum not yet allocated above 0,3THz THz electronics limited by the device performance (Ft, Fmax) IEEE WPAN Terahertz Interest Group (started from 2008) 19th January

19 THz chip to chip communication Target: replace high speed wired links that requires complex networking in a limited area. Terahertz advantages: wide bandwidth allows to provide tens of Gb/s data rate for chip to chip or intra chip communication Smaller antenna size reducing die area and cost 19th January

20 To conclude mmw communications require high performance components implementing radio access technologies: CEA LETI is developing prototypes. Some key challenges Spectrum allocation Propagation Antennas design: directionality, beamforming RFFE, including high gain PA Digital BB Energy efficiency Versatile and reconfigurable ICs covering several standards CMOS implementation (CMOS bulk or SOI (65nm, 28nm)) Area & cost effective solutions 19th January

21 Publications 2 papers at ISSCC 10 A 17.5 to 20.94GHz and 35 to 41.88GHz PLL in 65nm CMOS for Wireless HD applications. A 53 68GHz 18dBm Power Amplifier with 8 combined ways in standard 65nm CMOS. ISSCC 11 A 65nm CMOS fully integrated transceiver module for 60GHz Wireless HD applications Journal JSSC 10 A 60GHz Power Amplifier with 14.5dBm Saturation Power and 25% Peak PAE in CMOS 65nm SOI Journal JSSC 12 accepted A 65nm CMOS fully integrated transceiver module for 60GHz Wireless HD applications EuCAP 10 European Conference on Antennas and Propagation 60 GHz Antennas in HTCC and Glass Technology SIRF 2011 A 60 GHz UWB impulse radio transmitter with integrated antenna in CMOS65nm SOI technology IEEE CNCC 2010 (Consumer Communications and Networking Conference ) A wirelesshd Baseband Development under RF and Implementation Constraints, 19th January

22 Thanks for your attention