Status and Challenges for Multibeam DW lithography. L. PAIN CEA - LETI Silicon Technology Department

Transcription

1 Status and Challenges for Multibeam DW lithography L. PAIN CEA - LETI Silicon Technology Department

2 Outline Introduction Challenges Current program status KLA-TENCOR MAPPER Demonstration capability IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

3 Electron beam direct write lithography A mature technology since 1960! High resolution capability l = Several options Single beams Multi-columns Multi-beams 2-5d/w R&D 1w/2-5h Small serie 10wph/module Production Tech Arena Lithography maskless for DW L. Pain et al 10 October

4 MULTIBEAM Benefits and doubts Benefits Resolution/Flexibility Economical gain Industrial capability Industrial compatibility Doubts Industrial maturity Technology maturity Timing for industry Strong industrial partnership & commitment Data treatment (speed & integrity) Infrastructure Tech Arena Lithography maskless for DW L. Pain et al 10 October

5 Outline Introduction Challenges Current program status KLA-TENCOR MAPPER Demonstration capability IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

6 Multibeam technology challenges Performances reliability Performances reliability Speed Integrity Volume EPC SW Performances reliability RLS trade off 30µC/cm² 5kV MAPPER 40µC/cm² 75kV KLA RBEL CDU 10% Contamination Accuracy Alignment Stictching Writing strategy Thermal control Track interface Contamination Delay management reliability Tech Arena Lithography maskless for DW L. Pain et al 10 October

7 Outline Introduction Challenges Demonstration capability Current program status KLA-TENCOR MAPPER IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

8 KLA-Tencor REBL: Reflective Electron Beam Lithography Digital Pattern Generator KV Reflective eoptics Massively parallel exposure using > 10 6 beams Digital Pattern Generator Chip (DPG) Projection Optics EXB Filter Illumination Optics Electron Gun Fabricated in 65nm CMOS Spatially modulates flood electron beam TDI (Temporal Dose Integration) Gray level exposure for precision edge placement Source brightness requirements reduced by orders of magnitude Demag Optics Optical Wafer Registration No exposure of resist Capable of using existing registration marks as in mix & match lithography Multiple Wafer Linear Stage Targeting 100wph lithography at 16nm HP with CoO equivalent to 193i litho Tech Arena Lithography maskless for DW L. Pain et al 10 October

9 REBL Optics Roadmap Col 1: Retired Col 3: On lithography test stage In assembly In development Tech Arena Lithography maskless for DW L. Pain et al 10 October

10 REBL Current Status We have demonstrated nm HP grayscale lithography 75kV writing in TDI mode on a moving stage with dose gray scaling Current work focuses on further resolution improvement, then swath stitching into larger print areas Tech Arena Lithography maskless for DW L. Pain et al 10 October

11 Outline Introduction Challenges Current program status KLA-TENCOR MAPPER Demonstration capability Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

12 Technology overview 13,260 beams in 26mm x 26mm Electron source Collimator lens Aperture array Condensor lens array Beam Blanker array Beam Stop array Beam Deflector array Projection lens array Each beam consists of 7 x 7 sub-beams Tech Arena Lithography maskless for DW L. Pain et al 10 October

13 1st picture od pre-production LETI 1st installation on-going at LETI site Key milestones Delivery June/13 Q4/13 : stage & handling qualification DEC/JAN : 1st exposures Tech Arena Lithography maskless for DW L. Pain et al 10 October

14 Outline Introduction Challenges Demonstration capability Current program status KLA-TENCOR MAPPER IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

15 Learning curve on MAPPER pre-alpha Tool Learning on preventive maintenance plan Main Illumination Optic (MILO) swap on quarterly basis Projection Optic System (POS) upgrade Stage instabilities : sensors, knife edge Regular progress on resolution performances Tech Arena Lithography maskless for DW L. Pain et al 10 October

16 Best resolution with 5kV reference process Asterix S04 Champion resolution Latest results with PoR 18nm hp F6 Beam F7 F8 F9 F10 D=80 µc/cm2 G1 G3 G5 G7 G9 Tech Arena Lithography maskless for DW L. Pain et al 10 October

17 Resist sensitivity status Resist sensitivity on 5kV for 20nm node A 5kV 28nm dense L/S & Contact D0=20µC/Cm² D0=36µC/Cm² C D0=30µC/Cm² D0=61µC/Cm² LS design Dose to size (µc/cm²) Expo latitude (µc/cm²/nm) LWR 32/ / / / Tech Arena Lithography maskless for DW L. Pain et al 10 October

18 Circuit cut demonstration Brickwall 26nm hp CD 26nm Contact 24nm hp CD 26nm Metal 1 24nm hp CD 26nm 18nm hp 22nm hp 22nm hp Tech Arena Lithography maskless for DW L. Pain et al 10 October

19 AFTER ETCH AFTER LITHO Etch demonstration CONT 32-Pitch 64nm CD contact -1.5nm after etch Tech Arena Lithography maskless for DW L. Pain et al 10 October

20 Focus on resolution for 90 & 65nm node Resolution & high throughput potential pcar - 14µC/cm² ncar - 8µC/cm² pcar - 12µC/cm² ncar - 8µC/cm² pcar - 18µC/cm² Tech Arena Lithography maskless for DW L. Pain et al 10 October

21 Outline Introduction Challenges Current program status KLA-TENCOR MAPPER Demonstration capability IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

22 LETI MAPPER IMAGINE consortium 1 module 1 10wph 10 clustered modules 10wph/module Tech Arena Lithography maskless for DW L. Pain et al 10 October

23 IMAGINE environment PLATFORM ASSESSMENT Technology assessment Qualify MATRIX generation EPC Get tool format concensus Validate data flow Qualify EPC strategy PROCESS 100% resist partner tests Push process capabilities OUTGASSING Test resist partners Work on contamination INTEGRATION Demonstrate CMOS process flow compatibility Tech Arena Lithography maskless for DW L. Pain et al 10 October

24 Consortium outlook Active participation for IMAGINE program status 18 Dec 2012 L. Pain Tech Arena Lithography maskless for DW L. Pain et al 10 October

25 IMAGINE roadmap Tech Arena Lithography maskless for DW L. Pain et al 10 October

26 Outline Introduction Challenges Current program status KLA-TENCOR MAPPER Demonstration capability IMAGINE consortium Conclusion Tech Arena Lithography maskless for DW L. Pain et al 10 October

27 SO WHAT? Demonstrated target Multibeam will come Cost advantages Resolution potential Scalability perspectives Introduction timing depends The QUESTIONS When? Which level of performance? The answer Tech Arena Lithography maskless for DW L. Pain et al 10 October

28 Acknowledgments KLA TENCOR for data on RBEL program IMAGINE consortium The IMAGINE partners THE key for development success Specific bilateral work shared inside IMAGINE Joint activities with TELA Innovation Links with E-Beam initiative MAPPER Lithography Delft site Full time local assignees LETI team Tech Arena Lithography maskless for DW L. Pain et al 10 October