Trends in Advanced Packaging Technologies An IMAPS UK view

Transcription

1 Trends in Advanced Packaging Technologies An IMAPS UK view Andy Longford Chair IMAPS UK PandA Europe IMAPS UK IeMRC Interconnection event December

2 International Microelectronics And Packaging Society Everything in electronics between the chip and the system

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4 Membership IMAPS is the largest Microelectronic packaging society in the world! Individual 2453 Corporate 287 Int'l Affiliates 1136 Students 287 TOTALS 4163 Data; February 2008 Trend is increasing membership

5 IMAPS UK Membership Individual 50 Corporate (33 x 2) 66 Academics 4 Students 2 Life members 8 TOTALS 130 Data September 2008 Trend is increasing membership IMAPS UK is a registered Charity organisation with an aim to interface Industry with Academia IMAPS UK is a member of the UK Electronics Alliance(UKEA) working as a Trade Association to support development of the UK industry

6 IMAPS Future

7 Packaging Trends The Packaging market Packaging in Europe Trends in Technology Values Volumes Courtesy FICO NL December PandA Europe

8 IC Package units growth 2007 = 151 bn CAGR: 9.55% 2012 = 261 bn Since the end of 2001, annual IC unit shipments have grown an astounding 120% from 68.5 billion in 2001 to billion in Source - Electronic Trends DCA WLP QFN DFN FBGA BGA QFP SOT TSOP SO CC PGA DIP December 2008 PandA Europe 8

9 Package Market Summary From a 70% increase Volumes CAGR = 9.55% Value CAGR = 11.46% Average price is up 8.61%... Cost of packaging will increase December 2008 PandA Europe 9

10 Package Technology Drivers ITRS Roadmaps Market Pull or envelope push Effect of package parameters Fabrication Infrastructure (design support?) Time to Markets Ways to lower cost.the Grand Challenge is Cost and who pays? December 2008 PandA Europe 10

11 Package Types: 1. Plastic IC Packages 2. Leadless IC 3. Discretes 4. Opto 5. Advanced (Embedded & TSV) 6. Ceramics and Metal can 7. MEMS (Cavity Plastic) 8. Custom (App Specific) December PandA Europe

12 Package Market shares 1% 3% 1% 1% 24% 31% 20% 19% 2007 = 188 bn units 2012 = 295 bn units package types 1% 3% 1% 2% 9% 38% 26% Source Electronic Trends / PandA 20% IC plast IC leadless Discrete Opto Adv pkg Cer & Met MEMs Custom December 2008 PandA Europe 12

13 Packaging in Europe Advanced Packaging SiP & WLP MEMs PhotoVoltaics Opto s December 2008 PandA Europe 13

14 Market generators Sector Innovation Design Manufacturing Utilisation Aerospace USA Europe Europe USA Automotive Europe Europe Asia Europe Broadcast Europe USA Asia Europe Communications Europe USA USA USA Computing USA USA Asia USA Consumer Asia Asia Asia Asia Industrial Europe USA Asia Asia Medical USA Europe Europe Europe Military Europe USA Europe USA Security Europe USA USA USA Source EPN / PandA December 2008 PandA Europe 14

15 Packaging Market in Europe Application Driven... Non Commercial Security, Medical, etc. Military Aerospace Hermetic, Hi Rel Advanced designs Phones, Sensors Inherently Low Volume Typically. HIGH VALUE December 2008 PandA Europe 15

16 The European (Packaging) process Application design (ASP) Prototype Pre production Outsource Production Export Designs Courtesy MENTOR December PandA Europe

17 Europe s Packaging Need Smaller Faster Cheaper...but what are the defining trends? Capability Infrastructure of: Design...Mentor, Synopsis, Cadence, etc. all developing package design software based on SiP Will add significant cost...but achieve 1st time success Assembly...New expertise is developing to address technology issues of advanced packaging Institutes (IMEC, Fhg IZM, etc.) offer cost effective programmes Equipment...Europe continues to lead in design and supply of machinery to support new technology EVG, ASM, STS all offering WLP/TSV developments Facilities... Limited large scale options, but a range of specialised units continue to provide necessary services. Development of volumes require outsourcing December 2008 PandA Europe 17

18 Trends in packaging Technology Values Volumes Locations December 2008 PandA Europe 18

19 Development of Chip substrate Technology Units/lot Leadframes & Substrates KK K PDIP Logic ICs RF & ASIC Ceramic SOIC SmartCard PWB QFP TECHNOLOGY OVERLAP BGA Sensors QFN(MLF) CUSTOM WLP CSP Pb-free Memory

20 Development of Advanced Packaging Technology KK Units/lot Wafer & PWB technology Memory TECHNOLOGY OVERLAP CUSTOM WLP SmartCard CoC K PWB BGA CSP COB DCA Flip Chip Pb-free

21 Trends in Packaging 1 st Generation LF & TAB 2 nd Generation BGA 3 rd Generation 3D SiP 4 th Generation Opto/MEMS IC TCP TBGA MCP Stacked Die PiP PoP IC Wireless Interconnect Package Size PLCC QFP PBGA FCBGA Memory Stack BB + Memory CPU + Cache Memory Optical Interconnect aeps (Embedded Active & Passive) DIP SOJ SOP EPS (Embedded Discrete) Stacked EDS EPS (Passive Circuit) Resistor Ta 2 O 5 capacitor Inductor PI capacitor IPD/AIC EDS EDSi MCM EDS MEMS Devices WLCSP awlp awlp (w/ Heat Slug /Shield) awlp (w/ Active Die & Passive) awlpop source Jisso December 2008 PandA Europe 21

22 Emerging (Advanced) Technology Heterogeneous Integration to Maximize Utilization of Thickness Dimension Assembly + Assembly + Substrate Assembly + IC (WLCSP) PiP (Package in package) EPS (Embedded Passive in Substrate) IPD (Integrated Passive Device) PoP (Package on package) EDS (Embedded Die in Substrate) awlp (Fan out WLCSP) Assembly + System (Wireless Connectivity Modules) TSV Via Last (Through Silicon Via) December 2008 PandA Europe source ASE Group 22

23 TSV Trends Courtesy ASE Group >2014 CMOS Image Sensor (Sensor + DSP + RAM) Thickness Interconnect Minimum Pitch Dimension (µm) FC Solder Bump Pitch Au Stud FC Bump Pitch ITRS 65 nm Min Global Metal Pitch Via Last 3D Stacked DRAM/Flash Via Size: µm 5-30 µm 5 µm Logic (CPU + Cache Memory) Baseband Via First RF Power DRAM / NVM Cache Memory Multi-level 3D IC (CPU + Cache + DRAM + Analog + RF + Sensor + I/O) December 2008 PandA Europe 23 Sensor Sensor Analog CPU I/O I/O 2 µm Source EMC 3D & ASE Data Vertical Device on CMOS

24 Market trends : 1. Values 2. Volumes December 2008 PandA Europe 24

25 Package Market Downturn Criteria: Recent Forecast Changes due to Economic pressures... Market Uncertainties No investment in new equipment Packaging lags IC build Latest Estimates: 2009 Flat to down 5% 2010 back on track 7 8% growth? December 2008 PandA Europe 25

26 Packaging Trends? TO & DIP will not die Source Prismark December 2008 PandA Europe 26

27 Package Market Values bn $ 8 Market $ bn bn IC Plast IC Leadless Discrete Opto Adv Pkg Cer & Met MEMs Custom December 2008 PandA Europe 27

28 Advanced IC Packages 12.5 bn 13bn 2012 source Philips/Gartner December 2008 PandA Europe 28

29 Package Market volumes = 188 bn units Source Electronic Trends / PandA = 295 bn units IC plast IC leadless Discrete Opto Adv pkg Cer & Met MEMs Custom December 2008 PandA Europe 29

30 Sub- Contract packaging trend Source of Assembly, Test and Material Revenue Revenue by End Application Revenue by PackageType Source ASE Group December 2008 PandA Europe 30

31 IMAPS Future Technology Bill Bottoms

32 IMAPS Future Technology To Survive we are going to have to expand the portfolio of the society We have to move up the pyramid IMAPS Traditionally Very Strong in this region

33 New Initiatives for IMAPS? Lab on a Chip Solar LED Packaging Materials Nano

34 What are the Implications For the Future of Micro Electronic Packaging? Embed passive and active die are here now. In the next few years they will be in almost high density products This changes the way PCB shop will do business Will PCB shop become assemblers Will the assemblers become PCB shops If we do move into the age of replication what happens to the massive factories we have now? Do we stop chasing low cost labor? Will today's assemblers have to open outlets in shopping malls? What will be the future of Pick and Place machine manufactures and today's passive component manufactures?

35 How Does IMAPS Stay Relevant On line capabilities: As travel becomes more expensive we will need to move to more on line events Utilise more of the IknowMicroelectronics IMAPS on line library Develop key interest groups. Develop better communications between Organisations, Chapters and Regions Develop University contacts.. Student Paper awards Publishing opportunities

36 future directions Everything about Chips in Systems? UK is still about the Hybridisation of Sensors Industrial / Military Medical Electronics Optical interconnection Energy Scavenging

37 R&D? Innovation = New designs New processes New technologies = Research Innovate for Development = the bridge between innovation and cost - Cost reduction - Manufacturability - Functionality - Standardisation 37 PandA Europe

38 Time to Market Research 5 years typical to working innovation typically 3 years funded in EU 1 2 years seeding Development Minimum 3 5 years SoP 1 2 possible Typically 5 years (Automotive qualification etc ) IDEA gestation 15 years! 38 PandA Europe

39 future directions... Everything about Chips in Systems? IMAPS (in Europe) is still about the Hybridisation of Sensors Industrial / Military Medical Electronics Optical interconnection Energy Scavenging IMAPS Nordic 15 September PandA Europe

40 future initiatives... Linking Industry to Academia... Provide a vehicle to support NOW technology in Microelectronic packaging and interconnection Skills Academy To get Graduates into Industry Collaborative development programmes Industry Related themes Joint working groups and events with other organisations UKEA, xktn, NMI and Government interaction. IMAPS Nordic 15 September PandA Europe

41 .. involved with Interconnection Microelectronics Packaging International Microelectronics And Packaging Society (IMAPS) Everything in electronics between the chip and the system!

42 Thank you for your attention International Microelectronics And Packaging Society Everything in electronics between the chip and the system